TWI561324B - Method and apparatus for dispensing flux-free solder on a substrate - Google Patents

Method and apparatus for dispensing flux-free solder on a substrate

Info

Publication number
TWI561324B
TWI561324B TW102121334A TW102121334A TWI561324B TW I561324 B TWI561324 B TW I561324B TW 102121334 A TW102121334 A TW 102121334A TW 102121334 A TW102121334 A TW 102121334A TW I561324 B TWI561324 B TW I561324B
Authority
TW
Taiwan
Prior art keywords
substrate
free solder
dispensing flux
dispensing
flux
Prior art date
Application number
TW102121334A
Other languages
English (en)
Chinese (zh)
Other versions
TW201408409A (zh
Inventor
Heinrich Berchtold
Rene Betschart
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of TW201408409A publication Critical patent/TW201408409A/zh
Application granted granted Critical
Publication of TWI561324B publication Critical patent/TWI561324B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/025—Bits or tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01971—Cleaning, e.g. oxide removal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW102121334A 2012-07-05 2013-06-17 Method and apparatus for dispensing flux-free solder on a substrate TWI561324B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.

Publications (2)

Publication Number Publication Date
TW201408409A TW201408409A (zh) 2014-03-01
TWI561324B true TWI561324B (en) 2016-12-11

Family

ID=49578377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102121334A TWI561324B (en) 2012-07-05 2013-06-17 Method and apparatus for dispensing flux-free solder on a substrate

Country Status (11)

Country Link
US (2) US9339885B2 (https=)
JP (1) JP6150205B2 (https=)
KR (1) KR102136896B1 (https=)
CN (1) CN103521871B (https=)
CH (2) CH706712A1 (https=)
DE (1) DE102013105931A1 (https=)
FR (1) FR2992879B1 (https=)
IT (1) ITAN20130119A1 (https=)
MX (1) MX362114B (https=)
MY (1) MY175176A (https=)
TW (1) TWI561324B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
CN108326390B (zh) * 2017-01-17 2021-03-23 白光株式会社 熔融控制装置及计算机可读存储介质
DE102019103140A1 (de) 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
CN110190001B (zh) * 2019-06-05 2020-11-03 扬州扬杰电子科技股份有限公司 一种轴向二极管的加工工艺

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US5421504A (en) * 1991-12-13 1995-06-06 Spirig; Ernest Soldering device and solder dispenser
US20040035907A1 (en) * 2000-05-24 2004-02-26 Radeck Stephanie Elisabeth Anna Apparatus and method for dispensing solder
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
US20090140028A1 (en) * 2007-11-30 2009-06-04 Nordson Corporation Soldering tip, soldering iron, and soldering system
US20090145950A1 (en) * 2007-12-07 2009-06-11 Kui Kam Lam Dispensing solder for mounting semiconductor chips
JP2011051007A (ja) * 2009-09-04 2011-03-17 Japan Unix Co Ltd 超音波はんだ付け装置
US20110204126A1 (en) * 2010-02-23 2011-08-25 Schott Solar Ag Method and apparatus for applying solder to a work piece
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
JPS57188832A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Soldering method
JPS6334269Y2 (https=) * 1981-05-28 1988-09-12
US4577398A (en) 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4709849A (en) 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JPS6450595A (en) 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
CH680176A5 (https=) * 1989-11-14 1992-06-30 Esec Sa
JPH04178266A (ja) * 1990-11-08 1992-06-25 Apollo Seiko Kk はんだゴテのコテ先構造
JPH0745646A (ja) 1993-07-28 1995-02-14 Hitachi Ltd はんだ塗布装置
EP0752294B1 (de) 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
JP2844330B2 (ja) * 1996-05-09 1999-01-06 黒田電気株式会社 超音波ハンダ付方法及び装置
DE59708121D1 (de) 1997-01-08 2002-10-10 Esec Trading Sa Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
JP3319740B2 (ja) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ ロウ材塗布装置
JP4080326B2 (ja) 2002-12-27 2008-04-23 キヤノンマシナリー株式会社 ろう材供給ノズル
JP2006315043A (ja) * 2005-05-13 2006-11-24 Toko Inc リフロー溶接装置
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
JP2008296265A (ja) * 2007-06-01 2008-12-11 Canon Inc はんだ付け装置
JP5411542B2 (ja) * 2008-10-27 2014-02-12 和仁 鬼頭 溶接装置
US20110272452A1 (en) 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
JP5498879B2 (ja) * 2010-07-09 2014-05-21 本田技研工業株式会社 半田付け装置及び方法
CH705035B1 (de) * 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US5421504A (en) * 1991-12-13 1995-06-06 Spirig; Ernest Soldering device and solder dispenser
US20040035907A1 (en) * 2000-05-24 2004-02-26 Radeck Stephanie Elisabeth Anna Apparatus and method for dispensing solder
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
US20090140028A1 (en) * 2007-11-30 2009-06-04 Nordson Corporation Soldering tip, soldering iron, and soldering system
US20090145950A1 (en) * 2007-12-07 2009-06-11 Kui Kam Lam Dispensing solder for mounting semiconductor chips
JP2011051007A (ja) * 2009-09-04 2011-03-17 Japan Unix Co Ltd 超音波はんだ付け装置
US20110204126A1 (en) * 2010-02-23 2011-08-25 Schott Solar Ag Method and apparatus for applying solder to a work piece
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece

Also Published As

Publication number Publication date
DE102013105931A1 (de) 2014-01-09
CH706738B1 (de) 2017-05-15
FR2992879A1 (fr) 2014-01-10
CN103521871A (zh) 2014-01-22
MX362114B (es) 2019-01-07
JP6150205B2 (ja) 2017-06-21
CH706712A1 (de) 2014-01-15
CN103521871B (zh) 2016-12-28
KR102136896B1 (ko) 2020-07-23
US9339885B2 (en) 2016-05-17
CH706738A2 (de) 2014-01-15
MX2013007925A (es) 2014-01-17
US20140008421A1 (en) 2014-01-09
US20160256949A1 (en) 2016-09-08
JP2014014868A (ja) 2014-01-30
MY175176A (en) 2020-06-12
ITAN20130119A1 (it) 2014-01-06
TW201408409A (zh) 2014-03-01
KR20140005784A (ko) 2014-01-15
FR2992879B1 (fr) 2016-12-16

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