SG10201402540YA - Device for dispensing and distributing flux-free solder on a substrate - Google Patents
Device for dispensing and distributing flux-free solder on a substrateInfo
- Publication number
- SG10201402540YA SG10201402540YA SG10201402540YA SG10201402540YA SG10201402540YA SG 10201402540Y A SG10201402540Y A SG 10201402540YA SG 10201402540Y A SG10201402540Y A SG 10201402540YA SG 10201402540Y A SG10201402540Y A SG 10201402540YA SG 10201402540Y A SG10201402540Y A SG 10201402540YA
- Authority
- SG
- Singapore
- Prior art keywords
- dispensing
- substrate
- free solder
- distributing flux
- distributing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0661—Oscillating baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH01224/13A CH708278A1 (en) | 2013-07-08 | 2013-07-08 | Device for applying and spreading of solder to a substrate. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201402540YA true SG10201402540YA (en) | 2015-02-27 |
Family
ID=52106425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201402540YA SG10201402540YA (en) | 2013-07-08 | 2014-05-22 | Device for dispensing and distributing flux-free solder on a substrate |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9889516B2 (en) |
| JP (1) | JP6358428B2 (en) |
| KR (1) | KR102231320B1 (en) |
| CN (1) | CN104275564B (en) |
| CH (2) | CH708278A1 (en) |
| DE (1) | DE102014108842A1 (en) |
| FR (1) | FR3008015B1 (en) |
| HK (1) | HK1201230A1 (en) |
| MX (1) | MX341260B (en) |
| MY (1) | MY179517A (en) |
| SG (1) | SG10201402540YA (en) |
| TW (1) | TWI626109B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017195159A1 (en) * | 2016-05-13 | 2017-11-16 | Marna Engineering As | Material melting device |
| JP2020061508A (en) * | 2018-10-12 | 2020-04-16 | 株式会社パラット | Soldering device and nozzle for soldering device |
| JP7207152B2 (en) * | 2019-05-16 | 2023-01-18 | 株式会社デンソー | SLEEVE SOLDERING APPARATUS AND ELECTRONIC DEVICE MANUFACTURING METHOD |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2754395A (en) * | 1951-11-01 | 1956-07-10 | Union Carbide & Carbon Corp | Inert gas shielded arc welding torch |
| US2761049A (en) * | 1953-09-28 | 1956-08-28 | Union Carbide & Carbon Corp | Water cooled sigma guide tube |
| US3112392A (en) * | 1960-10-20 | 1963-11-26 | Hobart Brothers Co | Micro wire gun and cable assembly |
| US3674914A (en) * | 1968-02-09 | 1972-07-04 | Photocircuits Corp | Wire scribed circuit boards and method of manufacture |
| US4577398A (en) | 1984-09-07 | 1986-03-25 | Trilogy Computer Development Partners, Ltd. | Method for mounting a semiconductor chip |
| US4709849A (en) | 1985-11-27 | 1987-12-01 | Fry Metals, Inc. | Solder preform and methods employing the same |
| DE3851901T2 (en) * | 1987-01-26 | 1995-04-13 | Hitachi Ltd | Welding a wire. |
| US4934309A (en) * | 1988-04-15 | 1990-06-19 | International Business Machines Corporation | Solder deposition system |
| US5201453A (en) * | 1991-09-30 | 1993-04-13 | Texas Instruments Incorporated | Linear, direct-drive microelectronic bonding apparatus and method |
| GB9126530D0 (en) * | 1991-12-13 | 1992-02-12 | Spirig Ernest | Soldering device |
| JPH07221141A (en) * | 1994-02-03 | 1995-08-18 | Matsushita Electric Ind Co Ltd | Ultrasonic wire bonding device |
| JP2986677B2 (en) * | 1994-06-02 | 1999-12-06 | 富士通株式会社 | Ultrasonic thermocompression bonding equipment |
| EP0752294B1 (en) * | 1995-07-01 | 2000-06-21 | Esec Sa | Method and apparatus for applying liquid solder |
| EP0852983B1 (en) | 1997-01-08 | 2002-09-04 | ESEC Trading SA | Brazing parts forming device used for soft soldering of semiconductor chips |
| US6180891B1 (en) * | 1997-02-26 | 2001-01-30 | International Business Machines Corporation | Control of size and heat affected zone for fine pitch wire bonding |
| US5783008A (en) * | 1997-03-31 | 1998-07-21 | Ford Global Technologies, Inc. | Apparatus and method for embedding conductors in a non-planar substrate |
| JP2000269630A (en) | 1999-03-17 | 2000-09-29 | Hitachi Chem Co Ltd | Wiring device and manufacture of wiring board using the same |
| SG91867A1 (en) * | 2000-05-24 | 2002-10-15 | Casem Asia Pte Ltd | Improved apparatus and method for dispensing solder |
| JP2003100791A (en) * | 2001-09-26 | 2003-04-04 | Sony Corp | Multi-stage bump forming method |
| DE10160228A1 (en) * | 2001-12-07 | 2003-06-18 | Hesse & Knipps Gmbh | Kreuztransducer |
| SG106126A1 (en) * | 2002-03-08 | 2004-09-30 | Esec Trading Sa | Method and apparatus for dispensing solder on a substrate |
| TWI230102B (en) * | 2002-03-27 | 2005-04-01 | Matsushita Electric Ind Co Ltd | Component mounting method, component mounting apparatus, and ultrasonic bonding head |
| JP4080326B2 (en) * | 2002-12-27 | 2008-04-23 | キヤノンマシナリー株式会社 | Brazing material supply nozzle |
| JP2004356241A (en) * | 2003-05-28 | 2004-12-16 | Nidec Tosok Corp | Solder nozzle |
| EP2014406A3 (en) * | 2004-11-02 | 2010-06-02 | HID Global GmbH | Relocation device, contacting device, delivery system, relocation and contacting unit production facility and a transponder unit |
| CN101185986A (en) * | 2007-11-23 | 2008-05-28 | 哈尔滨工业大学 | Ultrasound wave and melt pole electrical arc compound welding method |
| US7735715B2 (en) | 2007-12-07 | 2010-06-15 | Asm Assembly Automation Ltd | Dispensing solder for mounting semiconductor chips |
| JP5257749B2 (en) * | 2008-04-03 | 2013-08-07 | 日立金属株式会社 | Low melting point metal supply equipment |
| JP5425733B2 (en) | 2010-08-27 | 2014-02-26 | 株式会社日立ハイテクインスツルメンツ | Solder application method and solder application apparatus |
| CH705035B1 (en) | 2011-05-23 | 2016-03-31 | Esec Ag | Method for dispensing solder on a substrate and method for mounting a semiconductor chip. |
-
2013
- 2013-07-08 CH CH01224/13A patent/CH708278A1/en not_active Application Discontinuation
-
2014
- 2014-05-12 CH CH00708/14A patent/CH708335B1/en not_active IP Right Cessation
- 2014-05-22 SG SG10201402540YA patent/SG10201402540YA/en unknown
- 2014-05-30 KR KR1020140065913A patent/KR102231320B1/en active IP Right Grant
- 2014-06-11 TW TW103120120A patent/TWI626109B/en active
- 2014-06-18 JP JP2014125777A patent/JP6358428B2/en active Active
- 2014-06-20 MY MYPI2014701706A patent/MY179517A/en unknown
- 2014-06-24 DE DE102014108842.5A patent/DE102014108842A1/en active Pending
- 2014-07-01 FR FR1456280A patent/FR3008015B1/en not_active Expired - Fee Related
- 2014-07-03 US US14/323,420 patent/US9889516B2/en active Active
- 2014-07-07 MX MX2014008335A patent/MX341260B/en active IP Right Grant
- 2014-07-08 CN CN201410322893.1A patent/CN104275564B/en active Active
-
2015
- 2015-02-13 HK HK15101654.8A patent/HK1201230A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014108842A1 (en) | 2015-01-08 |
| HK1201230A1 (en) | 2015-08-28 |
| MX341260B (en) | 2016-08-09 |
| CH708335A2 (en) | 2015-01-15 |
| CN104275564A (en) | 2015-01-14 |
| KR102231320B1 (en) | 2021-03-24 |
| US9889516B2 (en) | 2018-02-13 |
| MY179517A (en) | 2020-11-09 |
| JP2015016505A (en) | 2015-01-29 |
| CH708278A1 (en) | 2015-01-15 |
| CH708335B1 (en) | 2017-11-15 |
| MX2014008335A (en) | 2015-05-27 |
| KR20150006343A (en) | 2015-01-16 |
| FR3008015A1 (en) | 2015-01-09 |
| TW201503985A (en) | 2015-02-01 |
| US20150008249A1 (en) | 2015-01-08 |
| JP6358428B2 (en) | 2018-07-18 |
| FR3008015B1 (en) | 2019-05-03 |
| CN104275564B (en) | 2018-05-25 |
| TWI626109B (en) | 2018-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PL2972133T3 (en) | Method and apparatus for dispensing a viscous material on a substrate | |
| EP2993660A4 (en) | Flexible substrate, display device, and method for bonding electronic device onto flexible substrate | |
| EP2958710A4 (en) | Devices and methods for bending a tab on a container | |
| HK1205592A1 (en) | A semiconductor device and an electronic device | |
| TWI560814B (en) | Semiconductor component having a lateral semiconductor device and a vertical semiconductor device | |
| EP2956836A4 (en) | Electronic device having a detachable tablet | |
| SG10201400757VA (en) | Device for dispensing adhesive on a substrate | |
| EP3078442A4 (en) | Solder supply device | |
| GB201301370D0 (en) | Dispensing device | |
| GB2521843B (en) | An applicator for aligning a screen protector on a portable electronic device with a screen | |
| GB2581306B (en) | Substrate for a communication device | |
| EP3074080A4 (en) | A device for dispensing and spreading a liquid | |
| EP3085484A4 (en) | Solder supply device | |
| EP3078441B8 (en) | Solder supply device | |
| EP3074081A4 (en) | A device for dispensing and applying a liquid | |
| SG11201509621VA (en) | Device and method for coating a substrate | |
| PT2810546T (en) | Device for dispensing individual seeds | |
| PL2832509T3 (en) | Activation module for a coating device with coating device | |
| PL3420142T3 (en) | Device for compacting a substrate | |
| GB201409246D0 (en) | Holding mechanism for a display device | |
| HK1201230A1 (en) | Device for dispensing and distributing flux-free solder on a substrate | |
| TWI561324B (en) | Method and apparatus for dispensing flux-free solder on a substrate | |
| GB201504094D0 (en) | A device for atomising a liquid | |
| EP3041041A4 (en) | Package for accommodating electronic component, and electronic device | |
| EP3071006A4 (en) | Substrate processing device and dispensing head |