JP2000269630A - Wiring device and manufacture of wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring device which is superior in wiring density and in which an insulating coating is not damaged or is broken and to provide a method for manufacturing a wring board through the use of the wiring device. SOLUTION: In a wiring device, an insulating coating wire is laid on an insulating board with adhesive and bonded. In a part where the insulating coating wire 1 crosses, the output of an ultrasonic oscillator 121 is set to be a range which is 0.3 times to 0.5 times as much as the output of the ultrasonic oscillator 121 in a part where the insulating coating wire 1 does not cross, or the pressing force of a stylus 101 is set to be the range which is 0.4 times to 0.6 times of the pressing force of the stylus 101 in a part where the insulating coating wire 1 does not cross, or to be the range which is 0.4 times to 0.8 times of the output of the ultrasonic oscillator 121 in the part where the insulating coating wire 1 does not cross. The wiring device having a sequence, where the pressing force of the stylus 101 is set to be the range where the insulating coating wire 1 does not cross to be the range, which is 0.4 times to 0.8 times as much as the pressing force of the stylus 101, in the part where the insulating coating wire 1 crosses is used and the insulating coating wire 1 is bonded and fixed on the insulating board 3 with adhesive and a necessary wiring pattern is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring device for forming an insulated wire as a circuit on an insulating substrate with an adhesive, and a method of manufacturing a wiring board using the same.

[0002]

2. Description of the Related Art A multi-wire wiring board is manufactured by forming a wiring pattern by placing an insulating-coated electric wire on an insulating substrate provided with an adhesive and simultaneously bonding the wires. As shown in FIG. 7, such a multi-wire wiring board has a head portion 10 at each end of a cylindrical sheath portion 11.
And the slip ring 12 are attached, and the sheath 11
The cylindrical part of the two bearings (upper bearing 131, lower bearing 13
In 2), a motor 133 for rotating and supporting the head mounting portion 13 and rotating the head portion 10 in the circumferential direction of the sheath portion 11 is attached to the head mounting portion 13.
Is mounted on the Y-axis moving gantry 15 so as to be able to move up and down by the vertical moving means 151, and the Y-axis moving gantry 1
5 is provided so that it can move in the Y direction parallel to the ground,
An X-axis moving table 1 that can move in the X direction that is parallel to the ground and that is orthogonal to the Y direction and that fixes the insulating substrate 3 with adhesive.
The stylus 101 reaching the tip of the head 10 and the stylus 1 are provided in the cylinder of the sheath 11.
Oscillation coil 11 for ultrasonic vibration around 01
1 is provided, and a slip ring 1
2, an insulated wire 1 is passed through the cylinder of the sheath 11 and supplied to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head section 10. 10
5 is provided with a cutter 104 for cutting the insulated wire 1 at a required length. Further, near the stylus chip 105, a torque is applied in a direction of pressing the stylus chip 105 against the insulating substrate 3 with the adhesive. The position, the length, the position and angle of the corner of the wiring pattern of the wiring pattern to which the torque motor 102 to be generated is attached and which is prepared in advance to fix the insulated wire 1, and the insulated wire 1
From the data of the position where the end of the fixing is completed, the moving amount of the Y-axis moving base 15, the moving amount of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121,
2, the operation of the cutter 104, etc. are calculated, the insulated wire 1 is adhered and fixed on the insulated substrate 3 with an adhesive, and a wiring device containing a sequence for forming a necessary wiring pattern is used. , And a wiring pattern is formed.

[0003] The manner in which wiring is performed by using this wiring apparatus will be described. In the apparatus shown in Fig. 7, an insulated wire 1 is pulled out to the tip of a stylus 101, and a stylus tip 1 is drawn.
05 wire guide groove (not shown)
And start the numerical controller that executes the sequence, the numerical controller starts the first wiring data, that is,
From the data of the starting position, length, the position of the corner portion of the wiring pattern of the wiring pattern, the angle, and the position where the fixing of the insulated wire 1 is finished, Y
The amount of movement of the axis moving gantry 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121,
The output of the torque motor 102, the operation of the cutter 104, and the like are calculated, and the head unit 10 is driven by driving the Y-axis
When the X-axis moving table 14 to which the insulating substrate 3 with adhesive is fixed is driven in the direction to move to the position where the insulated wire 1 is first fixed in the X direction and stopped, the vertical moving means 15
1, the head unit 10 is lowered to a predetermined position so that the stylus 101 contacts the insulating substrate 3 with the adhesive, and the DC power applied to the ultrasonic oscillator 121 and the torque motor 10
When the insulated wire 1 is fixed to the starting point of the wiring by the pressing force applied by Step 2, an AC signal is applied to the ultrasonic oscillator 121 to start transmitting ultrasonic vibration to the stylus 101, and the Y-axis is moved according to the wiring data. The gantry 15 and the X-axis moving table 14 are driven to put the insulated wire 1 in the shape of the wiring pattern, and the stylus 101
When the adhesive on the adhesive-attached insulating substrate 3 and the adhesive applied to the surface of the insulated wire 1 are activated and adhered and fixed by the ultrasonic vibration, the corner portion 4 of the wiring pattern is formed. , Y-axis moving base 15 and X-axis moving table 14
Is stopped, and only the head unit 10 is rotated by the motor 133 to rotate by a required angle calculated from the wiring data, and the Y-axis moving base 15 and the X-axis moving table 14 are rotated.
Is driven to continue the bonding and fixing, and based on the length calculated from the wiring data, the cutter 104 at the end point of the wiring and the stylus 10 are moved.
One distance before, the cutter 104 is driven to cut the insulated wire 1, and the Y-axis moving gantry 15 and the X-axis moving table 14 are driven to the cut point to bond and fix the wire to the end point. Then, the head unit 10 is raised to the original position by driving the vertical moving unit 151, the next wiring data is read, and this is repeated. When all the wirings are completed, the vertical moving unit 151 is driven to drive the original wiring data. , The Y-axis moving base 15 and the X-axis moving table 14 are driven to move the head unit 10 to the reference position of the wiring device, and the numerical controller stops the sequence. In this way,
For the first time, the adhesive-attached insulating substrate 3 can be removed, and the process can be shifted to the subsequent steps.

[0004] Since the insulated wire 1 is fixed to the insulating substrate 3 with the adhesive in this manner, the insulated wire 1 can be fixed so as to intersect with each other.
A circuit having a higher density can be formed as compared with a method in which an unnecessary portion of a copper foil is removed by etching to form a circuit, or a circuit is formed only in a necessary portion by plating.

[0005]

However, in recent years,
It is required to form a wiring having a higher density than such a high-density wiring, and the diameter of the insulated wire has to be changed from 0.15 mm to 0.10 mm. When the insulated wire is used with a small diameter as described above, when the insulated wire is crossed, the insulated wire 1 is already fixed even though the stylus vibrates vertically. Since it is fixed so as to get over the insulated wire 1, it does not become perpendicular to the stylus at that location, and a large force is applied in the oblique direction of the insulated wire 1 so that the insulated coating may be damaged or disconnected. There are issues.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wiring apparatus which is excellent in wiring density and does not break or break the insulation coating, and a method for manufacturing a wiring board using the wiring apparatus. .

[0007]

SUMMARY OF THE INVENTION A wiring apparatus according to the present invention is a wiring apparatus for placing an insulated wire on an insulating substrate with an adhesive and simultaneously bonding the insulated wire. At a crossing point, there is a sequence in which the output of the ultrasonic oscillator 121 is 0.3 to 0.5 times the output of the ultrasonic oscillator 121 at a point where the insulated wire 1 does not cross. I do.

At the place where the insulated wires 1 intersect, the output of the ultrasonic oscillator 121 is 0.3 to 0.1 times the output of the ultrasonic oscillator at the place where the insulated wire 1 does not intersect.
Instead of setting the range to five times, the pressing force of the stylus 101 at the place where the insulated wire 1 intersects is set to 0.
It is characterized by having a sequence of 4 to 0.6 times.

Further, at the place where the insulated wire 1 intersects, the output of the ultrasonic oscillator 121 is connected to the insulated wire 1.
Of the output of the ultrasonic oscillator 121 at the point where the.
Instead of outputting 3 times to 0.5 times, at the place where the insulated wire 1 intersects, the output of the ultrasonic oscillator 121 is
Ultrasonic oscillator 12 at a place where the insulated wire 1 does not intersect
The output of the stylus is 0.4 times to 0.8 times the output of 1 and the pressing force of the stylus at the place where the insulated wire 1 intersects, and the pressing force of the stylus at the place where the insulated wire 1 does not cross. It has a sequence of 0.4 times to 0.8 times.

[0010] Further, by using such a wiring device, an insulated wire can be bonded and fixed on an insulating substrate with an adhesive to form a required wiring pattern.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 6, in a wiring device according to the present invention, a head portion 10 and a slip ring 12 are attached to respective ends of a cylindrical sheath portion 11, and the sheath portion 11 is provided. A motor 133 for rotating and supporting the cylindrical portion of the head mounting portion 13 with two bearings (upper bearing 131 and lower bearing 132), and rotating the head portion 10 in the circumferential direction of the sheath portion 11 in the head mounting portion 13. Is mounted on the Y-axis moving gantry 15 so as to be able to move up and down by the vertical moving means 151, and the Y-axis moving gantry 15 is provided so as to be movable in the Y direction parallel to the ground, It can move in the X direction parallel to the ground and perpendicular to the Y direction,
Further, an X-axis moving table 14 for fixing the insulating substrate 3 with adhesive is provided.
0, a stylus 101 is provided, and an oscillation coil 111 for ultrasonic vibration is provided around the stylus 101. An ultrasonic oscillator 121 is connected to the oscillation coil 111 via a slip ring 12, and a sheath portion is provided. 1
Insulating wire 1 is passed through the inside of the cylinder 1 and the head 1
The stylus tip 105 of the stylus 101 is supplied to the stylus tip 105 by a feeder 103 of a zero, and a cutter 104 is provided near the stylus tip 105 for cutting the insulated wire 1 at a required length. Is mounted with a torque motor 102 for generating a torque in the direction of pressing the stylus chip 105 against the adhesive-attached insulating substrate 3. From the data of the position and angle of the corner of the pattern and the position where the insulated wire 1 is fixed, the Y-axis moving
5, the amount of movement of the X-axis moving table 14, the sheath 11
, The output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, and the like, and the insulated wire 1 is adhered and fixed on the insulated substrate 3 with an adhesive.
This is a wiring device containing a sequence for forming a necessary wiring pattern, and most of the conventional wiring devices can be used as they are.

Here, the insulated wire 1 prepared in advance is used.
The amount of movement of the Y-axis moving base 15, the X-axis moving table 14, and the position, length, and position and angle of the corner of the wiring pattern of the wiring pattern It is a numerical control device using a computer system that calculates the movement amount of the sheath 11, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, and the like. The drive circuit of the Y-axis moving base 15, the drive circuit of the X-axis moving table 14, the rotation drive circuit of the sheath 11, the output control circuit of the ultrasonic oscillator 121, the output drive circuit of the torque motor 102, and the cutting by the cutter 104 are performed. An electromagnetic lever drive circuit is connected and drives each mechanism.

The feature of the present invention is that a magnet 116 provided in the middle of the stylus 101 and a Hall element 115 provided in the head unit 10 near the stylus 101 make the magnet 1
By detecting the position of the stylus 101, the position of the stylus 101 is detected, as shown in FIG.
From the output at the position 1, the influence of the ultrasonic vibration was removed by a differentiating circuit, and as shown in FIG. 2, irregularities on the surface of the insulating substrate with the adhesive traced by the stylus 101 were detected and found in advance. When the threshold value near the limit at which breakage or disconnection of the insulation-covered electric wire does not occur, the magnitude of the output signal of the ultrasonic oscillator 121 controlled from the table speed signal is changed. An electronic switch is provided for switching to control the magnitude of the output signal of the ultrasonic oscillator 121 with a signal having a constant duty cycle,
The magnitude of the output signal of the ultrasonic oscillator 121 at that time is
Ultrasonic oscillator 121 controlled from table speed signal
Are set so as to output 0.3 to 0.5 times the magnitude of the output signal.

Similarly, the output of the position of the stylus 101 is detected, and as shown in FIG. 3, the output of the stylus is used to remove the influence of the ultrasonic vibration by a differentiating circuit, and as shown in FIG. 101 detects the irregularities on the surface of the insulating substrate with the adhesive traced, and outputs the output applied to the torque motor 102 when a predetermined threshold value is reached at which breakage or disconnection of the insulation-coated electric wire does not occur. To
A limiter circuit is provided at the output of the division circuit that divides the table speed signal by the magnitude of the change in the output of the height of the irregularities traced by the stylus 101, instead of controlling the table speed signal by adding a constant value. An electronic switch for switching to control with the output power is provided, and at the place where the insulated wire crosses, the stylus pressing force is 0.4 to 0.6 times the stylus pressing force at the place where the insulated wire does not cross.
You may make it double.

Furthermore, by using these two methods at the same time, the output of the ultrasonic oscillator at the place where the insulated wire crosses is 0.4 times the output of the ultrasonic oscillator at the place where the insulated wire does not cross. Times to 0.8 times, and at the place where the insulated wire crosses,
The pressing force of the stylus at a place where the insulated wires do not intersect can be 0.4 to 0.8 times the pressing force.

With such a wiring device, a multi-wire wiring board can be manufactured by bonding and fixing an insulated wire on an insulating substrate with an adhesive to form a necessary wiring pattern. As the insulated wire, a wire in which an insulating coating is formed on a metal wire can be used in the same manner as a normal multi-wire wiring board, and a copper wire, an aluminum wire,
Iron wires or those plated with nickel, gold, cobalt or the like can be used. Among them, copper wires having a diameter of 0.04 to 0.10 mm have high flexibility and easily form corner portions of a wiring pattern. In addition, it is preferable because it is inexpensive, and it is preferable that the insulating coating formed on the surface is made of epoxy resin or polyimide resin because of its excellent heat resistance and durability in consideration of being used as a wiring board. Can be repeated about 5 to 30 times by applying a polyimide varnish thinly and curing it at a high temperature to obtain a required thickness.
It is preferable to apply an adhesive to the surface of the insulating coating in order to increase the adhesive strength with the adhesive, and the resin of the adhesive is made of epoxy resin, polyimide resin or epoxy resin modified with polyimide. It is preferable to use a varnish that has been applied and dried to such an extent that it is not completely cured.

The adhesive of the insulating substrate with the adhesive includes a usual adhesive,
It can be made of epoxy resin, polyimide resin or epoxy resin modified with polyimide. However, in order to form a wiring board, after the insulated wire 1 as a wiring pattern is bonded and fixed, it does not move as much as possible from the fixed position. When laying, it must satisfy the conflicting property of flowing to fill the insulated wire as much as possible. In practice, it is preferable to use a specially manufactured adhesive, and its thickness is also 0. .03-0.1
6 mm can be selected as needed. An insulating substrate used for a normal wiring board, an insulating substrate in which glass cloth is impregnated with an epoxy resin or a polyimide resin can be used, and an insulating substrate having an inner circuit board in which an inner circuit is formed in an inner layer thereof. It can also be used. The insulating substrate with an adhesive may be a substrate obtained by applying the above-mentioned adhesive in a varnish state to the above-mentioned insulating substrate, heating and drying it to make it into a semi-cured state. Is laminated on an insulating substrate and used as an adhesive film formed into a semi-cured support film.

[0018]

Examples 1 and 2 and Comparative Examples 1 to 4 (Wiring device) As shown in FIG. 6, a head portion 10 and a slip ring 12 are attached to respective ends of a cylindrical sheath portion 11. The cylindrical portion of the sheath portion 11 is rotatably supported by the head mounting portion 13 by two bearings (an upper bearing 131 and a lower bearing 132).
A motor 133 for rotating the head in the circumferential direction of the sheath portion 11 is mounted, and the head mounting portion 13 is mounted on a Y-axis moving gantry 15 so as to be able to move up and down by a vertical moving means 151, and the Y-axis moving gantry 15 is mounted on the ground. An X-axis moving table 14 is provided so as to be movable in the Y direction parallel to the ground, is movable in the X direction parallel to the ground and is orthogonal to the Y direction, and fixes the insulating substrate 3 with the adhesive. A stylus 101 extending to the tip of the head unit 10 and an oscillation coil 111 for ultrasonic vibration are provided around the stylus 101 in the cylinder 11. Sound wave generator 1
The insulated wire 1 is passed through the cylinder of the sheath 11 and supplied to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head 10, and the insulation is provided near the stylus tip 105. A cutter 104 for cutting the covered electric wire 1 to a required length is provided, and a torque motor 102 for generating a torque in a direction to press the stylus chip 105 against the adhesive-attached insulating substrate 3 is attached near the stylus chip 105. The Y-axis movement is performed based on the data of the position, length, position of the corner portion of the wiring pattern of the wiring pattern, the angle, and the position where the fixing of the insulated wire 1 is completed, which are prepared in advance. The moving amount of the gantry 15, the moving amount of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, and the torque Output of over data 102, cutter 10
4 is a wiring device containing a sequence for calculating the operation of step 4, bonding and fixing the insulated wire 1 on the adhesive-attached insulating substrate 3, and forming a necessary wiring pattern. Is provided with a magnet 116, and a Hall element 115 is provided in the head unit 10 near the magnet 116, and the position of the magnet 116 is detected, and as shown in FIG. Stylus 1
01 is provided with a comparison circuit for detecting the unevenness of the surface being traced and comparing it with a preset threshold value to eliminate the influence of the ultrasonic vibration. The signal obtained by digitally converting the table speed signal driving the signal (output of 30 Vp-p when a straight portion is wired) is switched to a signal having a constant duty cycle, and the signal of the ultrasonic oscillator is changed by the signal. Drive the output, stylus 1
At the point where the position of 01 becomes smaller by shooting, the apparatus is switched so that the output of the ultrasonic oscillator is driven by a signal obtained by digitally converting the original table speed signal.

(Insulating substrate with adhesive) Insulating substrate 3 with adhesive
As an adhesive, a 0.3 μm thick I-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.)
S-U01 (manufactured by Hitachi Chemical Co., Ltd., product name) 12
Roll-laminated at a temperature of 0 ° C. was used.

(Insulated Wire) The insulated wire 1 is made of a copper wire having a diameter of 80 μm and Pyre-
Applying ML-RC5057 (trade name, manufactured by DuPont) and drying at 350 ° C. for 8 minutes was repeated,
m of HAW-2 which is an adhesive.
16D (trade name, manufactured by Hitachi Chemical Co., Ltd.)
Drying at 200 ° C. for 1 minute was repeated to obtain a layer having a thickness of 15 μm.

(Manufacture of Wiring Board) Using such a wiring apparatus, a multi-wire wiring board was manufactured as follows. When the insulated wire 1 is pulled out to the tip of the stylus 101, sandwiched between wire guide grooves (not shown) provided at the tip of the stylus tip 105, and a numerical control device for executing a sequence is started, the numerical control device is started. Initial wiring data, that is, one set of insulated wires 1
The amount of movement of the Y-axis moving base 15, the X-axis moving table 14, and the position, length, and position and angle of the corner of the wiring pattern of the wiring pattern , The rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, and the like.
Is moved in the Y direction by driving the Y-axis moving base 15 and in the X direction by driving the X-axis moving table 14 to which the insulating substrate with adhesive 3 is fixed, to the position where the insulated wire 1 is first fixed. When stopped, the head unit 10 is lowered to a predetermined position by the vertical moving unit 151 so that the stylus 101 contacts the insulating substrate 3 with the adhesive, and the DC power applied to the ultrasonic oscillator 121 and the pressing force applied by the torque motor 102. When the insulated wire 1 is fixed to the starting point of the wiring by pressure, an AC signal is applied to the ultrasonic oscillator 121 to start transmitting ultrasonic vibrations to the stylus 101, and the Y-axis moving base 15 and the X-axis moving according to the wiring data. The table 14 is driven to put the insulated wire 1 in the shape of the wiring pattern, and the insulating substrate with adhesive is applied by ultrasonic vibration of the stylus 101. When the above adhesive and the adhesive applied to the surface of the insulated wire 1 are activated and bonded and fixed to form the corner portion 4 of the wiring pattern, the Y-axis moving base 15 and the X-axis moving table are used. When the driving of the head 14 is stopped and only the head unit 10 is rotated by the motor 133 to rotate by a necessary angle calculated from the wiring data, the Y-axis moving base 15 and the X-axis moving table 14 are driven to bond and rotate.
The fixation is continued, and before the distance between the cutter 104 and the stylus 101 at the end point of the wiring from the length calculated from the wiring data,
The cutter 104 is driven to cut the insulated wire 1, and the Y-axis moving base 15 and the X-axis moving table 14 are cut to the cut position.
Is driven to perform bonding and fixing to the end point of the wiring, drive the vertical movement means 151 to raise the head unit 10 to the original position, read out the next wiring data, and repeat this, and repeat all the wiring. When the line is finished, the head unit 10 is raised to the original position by driving the vertical moving unit 151, and the Y-axis moving base 15 and the X-axis moving table 14 are driven to move the head unit 10 to the reference position of the wiring device. Moved and the numerical controller stopped the sequence. At the intersection, the magnitude of the output signal of the ultrasonic oscillator 121 is 5 Vp-p to 30 V
It was set to be pp. Next, the insulating substrate 3 with the adhesive was removed, a hole was made in a place where the insulated coated electric wire was to be connected by a drill machine, and the inner wall of the hole was metallized by plating to obtain a multi-wire wiring board.

(Characteristics of Wiring Board) As a result, as shown in Table 1, when the ultrasonic output is 5 Vp-p or less, wire floating occurs at the double intersection, and the ultrasonic output is 25 Vp-p.
In the above, wire deformation and wire breakage occur, and at a triple intersection, wire floating occurs when the ultrasonic output is 5 Vp-p or less, and wire deformation and wire breakage occurs when the ultrasonic output is 20 Vp-p or more. Occurred. From this, it was possible to manufacture a multi-wire wiring board having no defect at the intersection where the ultrasonic output was in the range of 10 to 15 Vp-p.

[0023]

[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Ultrasonic output Double intersection point Triple Intersection (Vp-p) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Example 1 10 ○ ○ Example 2 15 ○ ○ 比較 Comparative Example 1 5 △ △ Comparative Example 2 20 ○ × Comparative Example 3 25 × × Comparative Example 4 30 × × ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ━━ △: Wire floating, ○: No wire deformation, ×: Large wire deformation or disconnection

Examples 3 to 5, Comparative Examples 5 to 8 Using the same wiring device as in Example 1, the magnet 116 provided in the middle of the stylus 101 and the head 1 near the magnet 116 were provided.
0 and the Hall element 115 provided in the
By detecting the position of No. 6, the irregularities on the surface traced by the stylus 101 are detected as shown in FIG. 4, and as shown in FIG. By adjusting the rotation speed of the torque motor 102,
The pressure was set to 10 to 80 g, and the sequence was returned to 80 g after passing the intersection. Using this wiring apparatus, a wiring board was produced in the same manner as in Example 1. The results are as shown in Table 2. At the place of double intersection, if the pressing force by the torque motor is 20 g or less, wire floating occurs, and if the pressing force by the torque motor is 70 g or more, wire deformation or wire breakage occurs. When the pressing force was 20 g or less, wire floating occurred, and when the pressing force by the torque motor was 60 g or more, wire deformation or wire breakage occurred.

[0025]

[Table 2] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Pressing force Double intersection location Triple intersection (G) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Example 3 30 ○ ○ Example 4 40 ○ ○ Example 5 50 ○ ○ 比較 Comparative Example 5 10 △ △ Comparative Example 6 20 △ △ Comparative Example 7 60 ○ × Comparative Example 8 70 × × ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ━━━━━ △: Wire floating, ○: No wire deformation, ×: Large wire deformation or disconnection From the above results, at the intersection, the applied pressure was 30 to
In the range of 50 g, a multi-wire wiring board having no defect could be manufactured.

Examples 6 to 20, Comparative Examples 9 to 37 Using the same wiring device as in Example 1, the magnet 116 provided in the middle of the stylus 101 and the head 1 near the magnet 116 were used.
0 and the Hall element 115 provided in the
By detecting the position of No. 6, irregularities on the surface traced by the stylus 101 are detected as shown in FIG. 5, and as shown in FIG. The magnitude of the output signal of the ultrasonic oscillator 121 controlled from the table speed signal is changed by the ultrasonic oscillator 12
An electronic switch for switching the output signal of the ultrasonic oscillator 121 so as to be controlled by a signal having a constant duty cycle of 1 is provided.
The magnitude of the output signal of 1 is set to 5 Vp-p to 30 Vp-p, and is set so as to return to 30 Vp-p after passing the intersection, and as shown in FIG. When the rotation speed has reached, the rotation speed of the torque motor 102 is adjusted so that the pressing force becomes 10 to 80 g, and the sequence returns to 80 g after passing the intersection.

The results are shown in Table 3. At the point of double intersection, if the pressing force by the torque motor is 20 g or less, wire floating occurs, and the pressing force by the torque motor becomes 7 g.
At 0 g or more, wire deformation or wire breakage occurs. At triple intersections, wire lifting occurs when the force applied by the torque motor is 20 g or less, and wire deformation or wire breakage occurs when the force applied by the torque motor is 60 g or more. did.

[0028]

[Table 3] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Pressing force Ultrasonic output Double intersection Triple intersection (g) (Vp-p) 実 施 Implementation Example 6 40 15 ○ ○ Example 7 40 20 ○ ○ Example 8 40 25 ○ ○ Example 9 40 30 ○ ○ Example 10 50 10 ○ ○ Example 11 50 15 ○ ○ Example 12 50 20 ○ ○ Example 13 50 25 ○ ○ Example 14 50 30 ○ ○ Example 15 60 10 ○ ○ Example 16 60 15 ○ ○ Example 17 60 20 ○ ○ Example 18 70 10 ○ ○ Example 19 70 15 ○ ○ Example 20 80 10 ○ ○ ──────────────────────────────────── Ratio Comparative Example 9 10 5 △ △ Comparative Example 10 10 10 △ △ Comparative Example 11 10 15 △ △ Comparative Example 12 10 20 △ △ Comparative Example 13 10 25 △ △ Comparative Example 14 10 30 △ △ Comparative Example 15 20 5 △ △ Comparative Example 16 20 10 △ △ Comparative Example 17 20 15 △ △ Comparative Example 18 20 20 △ △ Comparative Example 19 20 25 △ △ Comparative Example 20 20 30 △ △ Comparative Example 21 30 5 △ △ Comparative Example 22 30 10 △ △ Comparative Example 23 405 △ △ Comparative Example 24 40 10 △ ○ Comparative Example 25 50 5 △ △ Comparative Example 26 605 Δ △ Comparative Example 27 60 25 ○ × Comparative Example 28 60 30 × × Comparative Example 29 70 5 △ △ Comparative Example 31 70 20 × × Comparative Example 32 70 25 × × Comparative Example 33 70 30 × × Comparative Example 34 805 △ △ Comparative Example 35 80 20 ○ × Comparative Example 36 80 25 × × Comparative Example 37 80 30 × × △ △: Floating wire, ○: No deformation of wire , ×: Large wire deformation or disconnection

[0029]

As described above, according to the present invention, a wiring device which is excellent in wiring density and does not break or break the insulation coating, and a wiring board is manufactured using the wiring device. A method can be provided.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a characteristic portion of a wiring device used in an embodiment of the present invention.

FIG. 2 is a diagram showing a sequence used in one embodiment of the present invention.

FIG. 3 is a block diagram showing a characteristic portion of a wiring device used in another embodiment of the present invention.

FIG. 4 is a diagram showing a sequence used in another embodiment of the present invention.

FIG. 5 is a diagram showing a sequence used in still another embodiment of the present invention.

FIG. 6 is a side view of a wiring device showing a conventional example of the present invention.

FIG. 7 is a side view of a wiring device showing an embodiment of the present invention.

FIG. 8 is a diagram showing a sequence used in a conventional example.

FIG. 9 is a block diagram showing a related-art part related to one embodiment of the present invention.

FIG. 10 is a block diagram showing a related-art part related to another embodiment of the present invention.

[Explanation of symbols]

1. Insulated wire 3. 9. Insulating substrate with adhesive Head section 11. Sheath 12. Slip ring 13. Head mounting part 15. Y-axis moving base 101. Stylus 102. Torque motor 103. Feeder 104. Cutter 105. Stylus tip 111. Oscillation coil 112. X axis moving table 115. Hall element 116. Magnet 121. Ultrasonic oscillator 131. Upper bearing 132. Lower bearing 133. Rotation motor 151. Vertical movement mechanism

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Atsushi Takahashi 1500 Ogawa, Oji, Shimodate-shi, Ibaraki F-term in the Shimodate Plant of Hitachi Chemical Co., Ltd. DD65 FF30 GG08

Claims (5)

[Claims] A wiring device for applying an insulated wire on an insulated substrate with an adhesive and simultaneously bonding the insulated wire, wherein an ultrasonic oscillator (121) is used at a place where the insulated wire (1) intersects. ) Is 0.3 times or more of the output of the ultrasonic oscillator (121) at a place where the insulated wire (1) does not cross.
A wiring device having a sequence for outputting 0.5 times. 2. A wiring device for placing an insulated wire on an insulated substrate with an adhesive and simultaneously bonding the insulated wire, wherein a stylus (1) is provided at a location where the insulated wire (1) intersects.
01) is 0.4 times to 0.1 times the pressing force of the stylus (101) at a place where the insulated wire (1) does not intersect.
A wiring device having a sequence of six times. 3. A wiring device for placing an insulated wire on an insulating substrate with an adhesive and simultaneously bonding the insulated wire, wherein an ultrasonic oscillator (121) is used at a place where the insulated wire (1) intersects. ) Is from 0.4 times the output of the ultrasonic oscillator (121) at a place where the insulated wire (1) does not intersect.
When the output is 0.8 times and the insulated wire (1) intersects, the pressing force of the stylus (101) is reduced by the stylus (1) at the portion where the insulated wire (1) does not intersect.
A wiring apparatus having a sequence of 0.4 to 0.8 times the pressing force of 01). 4. A magnet (116) is provided in the middle of a stylus (101) to detect a location where an insulated wire (1) intersects, and a Hall element (115) is mounted on a head (10) near the stylus. The stylus (10) is provided based on the positional relationship between the magnet (116) and the Hall element (115).
The wiring apparatus according to any one of claims 1 to 3, wherein 1) detects irregularities on the surface of the insulating substrate with adhesive traced by (1). 5. The wiring device according to claim 1, wherein the insulated wire (1) is adhered and fixed on an adhesive-attached insulating substrate (3) by using the wiring device according to claim 1. A method for manufacturing a wiring board, comprising forming a pattern.