JP2002344112A - Wiring device and method of manufacturing highly densely multi-wired wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring device that can increase the supply amount of a wire by only detecting wire crossing sections, and to provide a method of manufacturing a multi-wired wiring board on which wires can be laid at a high density without causing failures, such as large wire deformation, etc. SOLUTION: The wiring device is constituted by adding a height detecting section which detects the height of a stylus and a control section which controls the supply amount of an insulated and covered wire to the conventional wring device. When the height detecting section detects a wire crossing section from the height change of the stylus, the amount of the wire is increased to 1.1 to 1.5 times the amount supplied when no wire crossing section exists based on the signal of the control section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring device and a method for manufacturing a high-density multi-wire wiring board using the same.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for smaller, lighter, and faster electronic devices, and the density of printed wiring boards including multiple wires has been increasing. A multi-wire wiring board is manufactured by forming a wiring pattern by attaching an insulating coating wire on an adhesive-attached insulating substrate and simultaneously bonding the insulating coated wires. In the production of such a multi-wire wiring board, a head portion including an ultrasonic oscillator, a slip ring, an oscillation coil, a torque motor, a stylus, a feeder, and the like,
A wiring device including an X-axis moving table, a rotating mechanism, a vertical moving mechanism, a Y-axis moving mechanism having a head mounting portion, and the like is used.

[0003] As a general method of wiring an insulated wire, first, a stylus is pressed from above to fix an end of the insulated wire to an insulative substrate with an adhesive. In this state, the adhesive is heated and activated by applying ultrasonic vibration to the stylus, and the insulating coated wire is bonded to the insulating substrate. By moving the stylus in the wiring direction while applying pressure and vibrating in this manner, wiring of the insulated wire is continuously performed.

Then, as shown in FIG. 4, when the new insulated wire reaches the wire intersection where it intersects with the already-bonded wire, the stylus is pushed up by the already-bonded wire to bond the insulated wire in the first half of the intersection, and the crossover occurs. In the latter half of the section, the stylus descends to bond the insulated wire.

[0005]

When wiring is performed as described above, a downward force due to ultrasonic vibration or stylus pressure and a lateral force due to the speed of the wiring are applied to the insulated wire, and the combined process proceeds. Force is applied diagonally. Further, since the conventional wiring device does not have a function of changing the wire feed amount at the wire crossing portion, the wire feeding device does not have the wire crossing as shown in FIG. Wiring is performed while keeping the amount constant.

As a result, at the wire intersection, the bonded wire is deformed or broken by being crushed by the new insulated wire, and the new insulated wire is also stretched and deformed, particularly in the latter half of the wire intersection, as shown in FIG. Disconnection as shown. Therefore, the conventional wiring device cannot cope with a dramatic increase in the number of multiple intersections, that is, a further increase in the density of the multi-wire wiring board.

In view of the above, the present invention provides a wiring device capable of increasing the wire feeding amount only at a wire intersection, and a high-density wiring using the same, which is free from problems such as wire breakage and large wire deformation. To provide a method for manufacturing a multi-wire wiring board capable of performing the following.

[0008]

In order to solve the above-mentioned problems, a wiring device according to the present invention is provided with a height detecting unit for detecting a stylus height in a wiring device used for manufacturing a conventional multi-wire wiring board. And a control unit for controlling the feed amount of the insulated wire, and when the height detecting unit detects a wire crossing portion by a height displacement of the stylus height, the wire feeding amount is changed by a signal from the control unit. It is characterized in that it is increased in a range of 1.1 times to 1.5 times as compared with the case where there is no copy.

Here, the wire feed amount indicates an amount represented by wire feed amount / table moving amount × 100.

Further, by manufacturing a multi-wire wiring board using the above-described wiring device, it is possible to solve the problem of wire wiring due to an insufficient wire feeding amount at a wire intersection.

Hereinafter, embodiments of the present invention will be described in detail.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a wiring apparatus according to the present invention is an ultrasonic oscillator 113 which emits ultrasonic waves by passing a direct current through an oscillation coil 106, and is transmitted from an ultrasonic oscillator 113. A stylus 1 that vibrates in response to an ultrasonic wave and has a pressing force applied by a torque motor 102
01, a stylus tip 104 attached to the tip of the stylus 101 and fixing the insulating coating wire 114 on the insulating substrate with adhesive, a feeder 103 for supplying the insulating coating wire 114 to the stylus chip 104, and insulating after the wiring is completed. Cutter 105 for cutting sheath wire 114, magnet 116, and slip ring 10
7 and the insulating substrate with the adhesive are attached,
An X-axis moving table 112 installed below the head unit for fixing and moving in parallel in the direction opposite to the wiring direction when wiring is performed, and a rotation mechanism 109 for rotating and moving the head unit up and down. , A vertical movement mechanism 110, and a Y-axis movement mechanism 111 having a head mounting section 108, a wiring device including at least a height detection section 115 that constantly detects the height of the stylus. The height detector 115 used here is preferably a non-contact Hall sensor, such as a contact type or non-contact type height detector, although not particularly limited. The height detecting unit 115, the feeder 103, the X-axis moving table 112, and the X-axis moving table speed detector 118 include a control unit including a feed amount command circuit for controlling the wire feed amount as shown in FIG. 117. (The connection with the feeder 103 is not shown in FIG. 1.)

As a method of manufacturing a multi-wire wiring board using the wiring apparatus of the present invention configured as described above, first, an adhesive layer for wiring and fixing an insulated wire is attached to an insulating resin substrate. Form. The insulating resin substrate used here may be a multilayer board provided with an inner layer circuit in advance by a method such as etching. The method for forming the adhesive layer may be directly applied and dried as in the case of spray coating, roll coating, dip coating, etc., or hot roll lamination of a film adhesive may be used. Not done.

Thereafter, the insulation-coated wire is wired and fixed. The insulated wire used in the present invention is obtained by coating a conductor metal wire such as copper to a desired thickness with a thermosetting resin or the like, and further coating it with an adhesive from above, but is generally used. There is no particular limitation as long as it is satisfied. The wiring is performed while the stylus 101 and the stylus tip 104 are vibrated and pressed by the ultrasonic transmitter 113 and the torque motor 102 as described above. If there is no wire crossing, the table speed signal is converted into a digital signal by a conventional control circuit as shown in FIG. Wiring.

On the other hand, at the wire intersection, the insulated wire and the stylus 101 are pushed up by the bonded wire, and the height detecting unit 1 attached to the stylus 101 is moved.
15 detects the stylus height signal at that time, and this signal enters the control unit 117. In the control unit 117 shown in FIG. 3, a signal in the latter half of the wire intersection is extracted via a differentiating circuit or the like of the feed amount command circuit. When the signal voltage exceeds the threshold value set in the threshold circuit, a switching signal is transmitted, and the switch is switched from the control circuit when there is no wire intersection to the control circuit via the amplifier circuit. Take the place. This is transmitted to the feeder 103 as a signal from the control unit 117, and the wire feed amount is set to 1.
It increases in the range of 1 to 1.5 times. Therefore, the force applied to the wire at the intersection is reduced, and the wiring and the fixing can be continuously performed without causing a problem such as disconnection or deformation.

After the completion of the wiring, a protective layer for protecting the insulated wire is formed to complete the multi-wire wiring board. A thermosetting resin, a photocuring resin, or the like is used for this protective layer, but is not particularly limited.

Hereinafter, the present invention will be described in more detail with reference to Examples.

[0018]

EXAMPLE 1 Using the wiring apparatus of the present invention, the relationship between the wire feeding amount and the adhesiveness of the insulated wire at multiple intersections was examined.
Wire feed rate is 10% in the range of 80% to 170%
The value was evaluated in increments. Table 1 shows the results.

[0019]

[Table 1]

From Table 1, it is preferable that the wire feed amount is set to 110 to 150% with respect to the initial setting at the double and triple intersections, and that the wire feed amount is increased to 150% or more at the double and triple intersections. It turns out that insufficient wire welding occurs, which is not preferable.

Example 2 Next, a multi-wire wiring board was prepared using the wiring apparatus of the present invention.

As an insulating substrate with an adhesive, a thickness of 0.3 mm
I-671 (manufactured by Hitachi Chemical Co., Ltd., trade name)
An adhesive material, AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 80 μm, which was roll-laminated at a temperature of 120 ° C. was used. In addition, the insulation coated wire is made of a copper wire having a diameter of 80 μm and Py which is a polyimide resin.
re-ML-RC5057 (trade name, manufactured by DuPont) was applied and dried at 350 ° C. for 8 minutes.
The coating was repeated until a thickness of 3 μm was reached, HAW-216D (trade name, manufactured by Hitachi Chemical Co., Ltd.) as an adhesive was applied to the surface, and drying was performed at 200 ° C. for 1 minute. Was used.

The insulating substrate with adhesive and the insulated wire are set in the wiring apparatus of the present invention, and the wire feed amount at the intersection is set to 110% of the initial setting. A multi-wire wiring board was created in the sequence returning to the setting. FIG. 2 shows the bonding sequence at this time.

In the multi-wire wiring board prepared in Example 2 above, no problems such as disconnection and deformation of the wires were observed.

Although the present invention has been described with reference to the embodiments, it should be understood that the description is not intended to limit the present invention. From this disclosure, various alternative embodiments, examples, and operation techniques not described herein will be apparent to those skilled in the art. Therefore, the technical scope of the present invention is determined only by the matters specifying the invention according to the claims that are appropriate from the above description.

[0026]

As described above, by manufacturing a multi-wire wiring board using the wiring apparatus of the present invention, in bonding of wire intersections, high density without deformation or disconnection of the bonded wire and the new insulated wire is obtained. It has become possible to provide a multi-wire wiring board.

[Brief description of the drawings]

FIG. 1 is a side view showing one embodiment of a wiring device for a multi-wire wiring board of the present invention.

FIG. 2 is a sequence of a wiring device used in an embodiment of the present invention.

FIG. 3 is an example of a wire feed control block diagram of the wiring apparatus of the present invention.

FIG. 4 is a partially enlarged three-dimensional view showing a double or triple intersection of a wire.

FIG. 5 is a partially enlarged three-dimensional view showing a broken wire at a wire intersection.

FIG. 6 is a sequence of a conventional wiring device.

FIG. 7 is a block diagram of a wire feeding control of the conventional wiring device.

[Explanation of symbols]

1. Bonded wire 2. New insulated wire 3. Start point 4. Corner part 5. Wire breakage 6. Wire intersection 101. Stylus 102. Torque motor 103. Feeder 104. Stylus tip 105. Cutter 106. Oscillation coil 107. Slip ring 108. Head mounting part 109. Rotation mechanism 110. Vertical movement mechanism 111. Y-axis moving mechanism 112. X-axis moving table 113. Ultrasonic oscillator 114. Insulated wire 115. Height detector 116. Magnet 117. Control unit 118. X axis moving table speed detector

Continuation of front page (72) Inventor Masami Kashiwazaki 1500 Ogawa, Oji, Shimodate-shi, Ibaraki F-term in Hitachi Chemical Industry Co., Ltd. Shimodate Office (reference) 5E343 BB24 BB69 CC01 DD65 GG11

Claims (3)

[Claims] 1. A wiring device used for manufacturing a multi-wire wiring board for forming a wiring pattern by laying and fixing an insulating coated wire on an insulating substrate with an adhesive, and detecting a stylus height. A detection unit, and a control unit for controlling the amount of feeding of the insulated wire; when the height detection unit detects a wire intersection by a height displacement of the stylus height, the wire feeding is performed by a signal from the control unit. A wiring device wherein the amount increases in a range of 1.1 times to 1.5 times as much as the case where there is no wire intersection. 2. The wiring apparatus according to claim 1, wherein the height detecting section is a hall sensor. 3. A method for manufacturing a multi-wire wiring board, wherein wiring is performed using the wiring apparatus according to claim 1.