JP5381683B2 - Method for evaluating interlayer adhesion of a plurality of supports having an adhesive layer - Google Patents
Method for evaluating interlayer adhesion of a plurality of supports having an adhesive layer Download PDFInfo
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- JP5381683B2 JP5381683B2 JP2009289542A JP2009289542A JP5381683B2 JP 5381683 B2 JP5381683 B2 JP 5381683B2 JP 2009289542 A JP2009289542 A JP 2009289542A JP 2009289542 A JP2009289542 A JP 2009289542A JP 5381683 B2 JP5381683 B2 JP 5381683B2
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Description
本発明は、接着剤層を有する複数の支持体の接着剤層同士の層間接着性の評価方法に関し、主にマルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の層間接着性の評価方法に関する。 The present invention relates to a method for evaluating interlayer adhesion between adhesive layers of a plurality of supports having an adhesive layer, and a resin mainly used for an adhesive layer of a substrate and a wire adhesive layer in the production of a multi-wire wiring board. The present invention relates to a method for evaluating interlayer adhesion of a composition.
マルチワイヤ配線板は、基板上に接着剤層を設け、導体回路形成のための絶縁被覆ワイヤ（以下、ワイヤとも称する）を布線して固定し、スルーホールによって層間を接続したものであり、高密度な配線ができ、さらに特性インピーダンスの整合やクロストークの低減に有利なプリント配線板として知られている（例えば、特許文献１〜４参照）。 The multi-wire wiring board is a board in which an adhesive layer is provided on a substrate, an insulation-coated wire for forming a conductor circuit (hereinafter also referred to as a wire) is fixed by wiring, and the layers are connected by through holes, It is known as a printed wiring board that can form high-density wiring and is advantageous for matching characteristic impedance and reducing crosstalk (see, for example, Patent Documents 1 to 4).
マルチワイヤ配線板の製造において、ワイヤを接着剤層に布線し固定させる際には、超音波による布線装置が用いられ、高密度のマルチワイヤ配線板を製造するために、スタイラスチップの改良や、超音波発振器の改良などが行われている（例えば、特許文献５〜７参照）。
この布線装置では、ワイヤを順次布線ヘッドから送り出すと共に、スタイラスという治具に超音波と荷重をかけ、その先端部分でワイヤを基板の接着剤層に接触させ、その超音波振動による熱エネルギーによって基板の接着剤層とワイヤの最外層に形成された接着剤層を活性化し溶融接着させる。このためマルチワイヤ配線板の製造において、ワイヤの最外層に形成された接着剤層（以下、ワイヤ接着剤層と称する）と基板の接着剤層との間の接着性およびワイヤが交差した部分のワイヤ接着剤層同士の接着性が重要となる。
In the production of multi-wire wiring boards, an ultrasonic wiring device is used to wire and fix the wires to the adhesive layer, and the stylus chip is improved to produce high-density multi-wire wiring boards. In addition, improvements in ultrasonic oscillators have been made (see, for example,
In this wiring device, the wires are sequentially sent out from the wiring head, ultrasonic waves and a load are applied to a jig called a stylus, the wire is brought into contact with the adhesive layer of the substrate at the tip portion, and the thermal energy by the ultrasonic vibration is applied. As a result, the adhesive layer formed on the outermost layer of the wire and the adhesive layer of the substrate is activated and melt bonded. For this reason, in the manufacture of a multi-wire wiring board, the adhesiveness between the adhesive layer (hereinafter referred to as the wire adhesive layer) formed on the outermost layer of the wire and the adhesive layer of the substrate and the portion where the wires intersect The adhesion between the wire adhesive layers is important.
また、マルチワイヤ配線板を含むプリント配線板は、鉛フリーはんだ実装に対応するための耐熱性の要求や、高速信号に対応するための高周波化の要求が高まっている。このためマルチワイヤ配線板において基板の接着剤層およびワイヤ接着剤層に使用される樹脂組成物は、これらの要求に対応する特性のものを使用する必要がある。 In addition, printed wiring boards including multi-wire wiring boards are increasingly demanded of heat resistance to cope with lead-free solder mounting and high frequency to cope with high-speed signals. For this reason, it is necessary to use the resin composition used for the adhesive layer and the wire adhesive layer of the substrate in the multi-wire wiring board having characteristics corresponding to these requirements.
上記により基板の接着剤層およびワイヤ接着剤層に使用される樹脂組成物を改良する場合、特に、ワイヤ接着剤層に使用される樹脂組成物を改良する場合、従来は、ワイヤの最外層に当該樹脂組成物を塗布した後、布線を行い、基板の接着剤層とワイヤ接着剤層に使用される樹脂組成物との接着性の良否を判定している。
しかしながら、ワイヤへの樹脂組成物の塗布は、塗布された接着層の膜厚や焼付け度合の制御に熟練を要するため、ワイヤへの接着剤層の形成が煩雑であり、このため接着剤を塗布したワイヤの作製に長時間要し、接着性の評価に多くの時間と労力を要している。
In the case of improving the resin composition used for the adhesive layer and the wire adhesive layer of the substrate as described above, particularly when improving the resin composition used for the wire adhesive layer, conventionally, the outermost layer of the wire is used. After applying the resin composition, wiring is performed to determine whether the adhesiveness between the adhesive layer of the substrate and the resin composition used for the wire adhesive layer is good or bad.
However, since application of the resin composition to the wire requires skill in controlling the film thickness and baking degree of the applied adhesive layer, the formation of the adhesive layer on the wire is complicated, and therefore the adhesive is applied. It takes a long time to manufacture the wire, and much time and labor are required to evaluate the adhesion.
本発明の目的は、以上のような状況から、マルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の開発に際して、ワイヤへ樹脂組成物を塗布する作業を行うことなく、基板の接着剤層とワイヤ接着剤層の層間接着性の評価を短時間で容易にできる評価方法を提供することである。 The object of the present invention is to apply a resin composition to a wire in the development of a resin composition used for an adhesive layer and a wire adhesive layer of a substrate in the manufacture of a multi-wire wiring board from the above situation. An object of the present invention is to provide an evaluation method capable of easily evaluating the interlayer adhesion between the adhesive layer of the substrate and the wire adhesive layer in a short time without performing it.
本発明者らは、上記の目的を達成するために鋭意研究した結果、マルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の開発に際して、基板の接着剤層〔接着剤層(I-1)〕とワイヤの接着剤層〔接着剤層(II-1)〕が対向するように基板上に接着剤層を配置し、ワイヤ接着剤層側から超音波振動と荷重を与えたスタイラスチップの先端を押付けながら移動させ、基板の接着剤層（I-1）とワイヤ接着剤層(II-1)の接着剤が溶融接着可能な最大速度を評価することにより、基板の接着剤およびワイヤ接着剤層に使用された樹脂組成物の接着性を短時間で容易に評価できることを見出し、本発明を完成した。ここで、第１のワイヤ接着剤層（I-2）と第２のワイヤ接着剤層（II-2）の接着性についても一方の接着剤層（I-2）を基板に設けて同様に評価することが出来る。 As a result of diligent research to achieve the above-mentioned object, the present inventors have developed a substrate adhesive layer and a resin composition used for the wire adhesive layer in the production of a multi-wire wiring board. Place the adhesive layer on the substrate so that the layer [adhesive layer (I-1)] and the wire adhesive layer [adhesive layer (II-1)] face each other. Evaluate the maximum speed at which the adhesive of the substrate adhesive layer (I-1) and wire adhesive layer (II-1) can be melt-bonded by pressing and moving the tip of the stylus tip to which vibration and load are applied. Thus, it was found that the adhesiveness of the resin composition used for the adhesive of the substrate and the wire adhesive layer can be easily evaluated in a short time, and the present invention has been completed. Here, with respect to the adhesiveness of the first wire adhesive layer (I-2) and the second wire adhesive layer (II-2), the same adhesive layer (I-2) is provided on the substrate. Can be evaluated.
すなわち、本発明は、以下の層間接着性の評価方法を提供するものである。
１．接着剤付支持体Ａの接着剤層(I)と接着剤付支持体Ｂの接着剤層(II)が対向するように配置し、支持体Ｂ側から超音波振動と荷重を与えたスタイラスチップの先端を押付けながら移動させ、前記接着剤付支持体Ａの接着剤層(I)と前記接着剤付支持体Ｂの接着剤層(II)が溶融接着可能な最大速度を評価することにより、前記接着剤付支持体Ａの接着剤層(I)と前記接着剤付支持体Ｂの接着剤層(II)に使用される樹脂組成物の接着性を評価することを特徴とする層間接着性の評価方法。
２．前記接着剤付支持体Ａの接着剤層(I)がマルチワイヤ配線板の基板の接着剤層（I-1）に用いられる樹脂組成物、前記接着剤付支持体Ｂの接着剤層(II)がマルチワイヤ配線板のワイヤの接着剤層（II-1）に用いられる樹脂組成物であり、マルチワイヤ配線板製造用布線装置を用いて基板の接着剤層（I-1）とワイヤの接着剤層（II-1）に用いられる樹脂組成物の層間接着性を評価する請求項１に記載の層間接着性の評価方法。
３．前記接着剤付支持体Ａの接着剤層(I)がマルチワイヤ配線板の第１ワイヤの接着剤層（I-2）に用いられる樹脂組成物、前記接着剤付支持体Ｂの接着剤層(II)がマルチワイヤ配線板の第２ワイヤの接着剤層（II-2）に用いられる樹脂組成物であり、マルチワイヤ配線板製造用布線装置を用いてマルチワイヤ配線板の交叉する絶縁被覆ワイヤの接着剤層に用いられる樹脂組成物の層間接着性を評価する請求項１に記載の層間接着性の評価方法。
４．前記マルチワイヤ配線板製造用布線装置のスタイラスチップの先端が平坦である上記２又は３に記載の層間接着性の評価方法。
５．前記接着剤付支持体Ａの支持体が、導体回路を形成した両面板に絶縁層を形成した多層回路基板である上記１〜４のいずれかの層間接着性の評価方法。
６．前記接着剤付支持体Ｂの支持体が有機フィルムである請求項１〜５のいずれかに記載の層間接着性の評価方法。
That is, the present invention provides the following interlayer adhesion evaluation method.
1. A stylus chip that is arranged so that the adhesive layer (I) of the support A with adhesive and the adhesive layer (II) of the support B with adhesive are opposed to each other, and receives ultrasonic vibration and load from the support B side. The adhesive layer (I) of the adhesive-supported support A and the adhesive layer (II) of the adhesive-supported support B are evaluated for the maximum speed at which the adhesive layer can be melt bonded. Interlayer adhesion characterized by evaluating the adhesiveness of the resin composition used for the adhesive layer (I) of the support A with adhesive and the adhesive layer (II) of the support B with adhesive Evaluation method.
2. Resin composition in which the adhesive layer (I) of the support A with adhesive is used for the adhesive layer (I-1) of the substrate of the multi-wire wiring board, and the adhesive layer (II of the support B with adhesive) ) Is a resin composition used for the wire adhesive layer (II-1) of the multi-wire wiring board, and the substrate adhesive layer (I-1) and the wire using the wiring device for manufacturing the multi-wire wiring board. The interlayer adhesion evaluation method according to claim 1, wherein the interlayer adhesion of the resin composition used for the adhesive layer (II-1) is evaluated.
3. Resin composition in which the adhesive layer (I) of the support A with adhesive is used for the adhesive layer (I-2) of the first wire of the multi-wire wiring board, the adhesive layer of the support B with adhesive (II) is a resin composition used for the adhesive layer (II-2) of the second wire of the multi-wire wiring board, and the cross-insulation of the multi-wire wiring board using the wiring device for manufacturing the multi-wire wiring board The interlayer adhesion evaluation method according to claim 1, wherein the interlayer adhesion of the resin composition used for the adhesive layer of the coated wire is evaluated.
4). 4. The method for evaluating interlayer adhesion according to 2 or 3 above, wherein the tip of the stylus tip of the wiring device for manufacturing a multi-wire wiring board is flat.
5. 5. The method for evaluating interlayer adhesion according to any one of 1 to 4, wherein the support of the support A with adhesive is a multilayer circuit board in which an insulating layer is formed on a double-sided board on which a conductor circuit is formed.
6). Interlayer adhesion evaluation method according to any one of claims 1 to 5 support is an organic film of the adhesive with the support B.
本発明の層間接着性の評価方法をマルチワイヤ配線板における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の選択や組合せの評価に適用することより、熟練を有するワイヤへ樹脂組成物を塗布する作業を行うことなく、基板の接着剤層とワイヤ接着剤層の層間接着性の評価を短時間で容易に行うことができ、高性能のマルチワイヤ配線板の材料の開発を促進することができる。 By applying the evaluation method of interlayer adhesion of the present invention to the selection and combination evaluation of the resin composition used for the adhesive layer of the substrate and the wire adhesive layer in the multi-wire wiring board, the resin composition to the skilled wire Easily evaluate the interlaminar adhesion between the substrate adhesive layer and the wire adhesive layer in a short time without the need to apply materials, and promote the development of high-performance multi-wire wiring board materials can do.
以下、本発明について詳細に説明する。
本発明は、接着剤付支持体Ａの接着剤層(I)と接着剤付支持体Ｂの接着剤層(II)が対向するように配置し、支持体Ｂ側から超音波振動と荷重を与えたスタイラスチップの先端を押付けながら移動させ、支持体Ａの接着剤層(I)と支持体Ｂの接着剤層(II)が溶融接着可能な最大速度を評価することにより、支持体Ａの接着剤層(I)と支持体Ｂの接着剤層(II)に使用された樹脂組成物の接着性を評価する方法であり、主にマルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の選択やその組合せの開発に用いられるものである。
Hereinafter, the present invention will be described in detail.
The present invention is arranged so that the adhesive layer (I) of the support A with adhesive and the adhesive layer (II) of the support B with adhesive are opposed to each other, and ultrasonic vibration and load are applied from the support B side. The tip of the given stylus tip is moved while being pressed, and the maximum speed at which the adhesive layer (I) of the support A and the adhesive layer (II) of the support B can be melt bonded is evaluated. It is a method for evaluating the adhesiveness of the resin composition used for the adhesive layer (I) and the adhesive layer (II) of the support B, and mainly used for the production of multi-wire wiring boards. It is used for selection of a resin composition used for an adhesive layer and development of a combination thereof.
本発明の層間接着性の評価方法は上記のようにマルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の開発に主に用いられるものであり、マルチワイヤ配線板の製造において絶縁被覆ワイヤを用いて最終的に性能を確認されることになるが、樹脂組成物の開発段階においては支持体へ樹脂組成物を塗布した接着剤付支持体を用いて評価を行うことができる。
即ち本発明は、マルチワイヤ配線板の基板の接着剤層および絶縁被覆ワイヤの接着剤層に用いられる樹脂組成物の層間接着性を評価する方法であって、スタイラスチップを有するマルチワイヤ配線板製造用布線装置を用いることが好ましい。
The method for evaluating interlayer adhesion of the present invention is mainly used for the development of a resin composition used for an adhesive layer and a wire adhesive layer of a substrate in the production of a multi-wire wiring board as described above. In the production of wiring boards, the performance will be finally confirmed using an insulation-coated wire, but in the development stage of the resin composition, evaluation is performed using a support with an adhesive in which the resin composition is applied to the support. It can be performed.
That is, the present invention is a method for evaluating the interlayer adhesion of a resin composition used for an adhesive layer of a substrate of a multi-wire wiring board and an adhesive layer of an insulation-coated wire, and for producing a multi-wire wiring board having a stylus chip It is preferable to use a wiring device.
本発明では、説明図（図３）において接着剤付支持体Ａ（６）の接着剤層(I)に基板の接着剤層(I-1)又は第１ワイヤの接着剤層(I-2)に使用する樹脂組成物を用い、接着剤付支持体Ｂ（５）の接着剤層(II)にワイヤの接着剤層(II-1、II-2) に使用する樹脂組成物を用いることによって樹脂組成物の層間接着性の評価を行うことができる。
即ち、本発明において、接着剤付支持体Ａ（６）の接着剤層（I）に基板の接着剤層を接着剤層(I-1) に使用する樹脂組成物、接着剤付支持体Ｂ（５）の接着剤層(II)にワイヤの接着剤層を接着剤層(II-1)に使用する樹脂組成物を用いることによって基板とワイヤ間の樹脂組成物の接着性を評価することができ、接着剤付支持体Ａ（６）の接着剤層（I）に第１ワイヤの接着剤層(I-2)に使用する樹脂組成物、接着剤付支持体Ｂ（５）の接着剤層(II)に第２ワイヤの接着剤層(II-2) に使用する樹脂組成物を用いることによって交叉するワイヤ同士の接着性を評価することができる。
In the present invention, in the explanatory view (FIG. 3), the adhesive layer (I-1) of the substrate or the adhesive layer (I-2) of the first wire is applied to the adhesive layer (I) of the support A (6) with adhesive. The resin composition used for the wire adhesive layers (II-1 and II-2) is used for the adhesive layer (II) of the support B (5) with adhesive. The interlayer adhesion of the resin composition can be evaluated.
That is, in the present invention, the adhesive composition (I) of the support A (6) with the adhesive uses the adhesive layer (I) of the substrate as the adhesive layer (I-1), and the support B with the adhesive. Evaluating the adhesion of the resin composition between the substrate and the wire by using the resin composition using the wire adhesive layer as the adhesive layer (II-1) for the adhesive layer (II) of (5) Bonding of the resin composition used for the adhesive layer (I-2) of the first wire to the adhesive layer (I-2) of the support A (6) with adhesive and the support B (5) with adhesive By using the resin composition used for the adhesive layer (II-2) of the second wire as the agent layer (II), the adhesiveness between the crossing wires can be evaluated.
上記の場合、本発明の層間接着性の評価方法おける支持体Ａ（６）としてマルチワイヤ配線板が用いられ、導体回路を形成した両面板に絶縁層を形成した多層回路基板が好適に用いられる。
基板の導体回路は、ガラス布エポキシ樹脂銅張積層板やガラス布ポリイミド樹脂銅張積層板等を公知のエッチング法等により形成できる。必要に応じてこの導体回路は多層回路とすることもでき、また全く回路の無い基板を用いることもできる。
In the above case, a multi-wire wiring board is used as the support A (6) in the interlayer adhesion evaluation method of the present invention, and a multilayer circuit board in which an insulating layer is formed on a double-sided board on which a conductor circuit is formed is preferably used. .
The conductor circuit of the substrate can be formed of a glass cloth epoxy resin copper clad laminate, a glass cloth polyimide resin copper clad laminate or the like by a known etching method or the like. If necessary, this conductor circuit can be a multilayer circuit, or a substrate without any circuit can be used.
回路基板の表面に形成される絶縁層には絶縁樹脂組成物を繊維シート状補強基材に含浸・塗工し、Ｂステージ化して得られたプリプレグ、或いは繊維シート状補強基材を含まないＢステージ化した樹脂シートが好適に使用される。
絶縁層が形成された回路基板上に設けられる接着剤層は、アプリケーターを用いて樹脂組成物を塗布し、乾燥することにより形成することができる。
接着剤付支持体Ａの接着剤層（Ｉ）は、通常マルチワイヤ配線板で用いられている厚みと同じであることが好ましく、基板の接着剤層(I-1)の評価の場合５０〜１５０μｍ、ワイヤ接着剤層(I-2)の評価の場合１０〜２５μｍが好適である。
The insulating layer formed on the surface of the circuit board is impregnated and coated with an insulating resin composition on a fiber sheet-like reinforcing base material, and a prepreg obtained by forming a B-stage or a fiber sheet-like reinforcing base material is not included. A staged resin sheet is preferably used.
The adhesive layer provided on the circuit board on which the insulating layer is formed can be formed by applying a resin composition using an applicator and drying.
The adhesive layer (I) of the support A with adhesive is preferably the same as the thickness usually used in multi-wire wiring boards, and in the case of evaluation of the adhesive layer (I-1) of the substrate, 50 to In the case of evaluation of 150 μm and the wire adhesive layer (I-2), 10 to 25 μm is preferable.
本発明の層間接着性の評価方法における支持体Ｂとしては、ポリエチレンテレフタレートやポロプロピレン等の有機フィルムを使用することが好適であり、この場合には有機フィルムの接着剤が塗布されない面が離形処理を施してあることがより好ましい。スタイラスチップが直接接触する接着剤付支持体Ｂの支持体の剛性が高いと接着剤界面での溶融性が低下することや、離形処理により表面の摩擦力を低減することから、有機フィルムの片面に離形処理を施すことにより、スタイラスチップの移動を容易に行うことができるようになる。有機フィルム上に設けられる接着剤層は、アプリケーターを用いて樹脂組成物を塗布し、乾燥することにより形成することができる。この接着剤層(II)は、通常マルチワイヤ配線板で用いられている厚みと同じであることが好ましく、基板の接着剤層(I-1)との評価の場合、接着剤層(II-1)の厚さ５０〜１５０μｍが好適であり、ワイヤ接着剤層(I-2)との評価の場合、接着剤層(II-2)の厚さ１０〜２５μｍが好適である。
支持体Ａの接着剤層(I)と支持体Ｂの接着剤層(II)に用いる樹脂組成物は、同一樹脂組成物でも、異なる樹脂組成物でも良い。
As the support B in the interlayer adhesion evaluation method of the present invention, it is preferable to use an organic film such as polyethylene terephthalate or polypropylene, and in this case, the surface of the organic film not coated with the adhesive is released. More preferably, it has been treated. When the rigidity of the support of the adhesive-supported support B with which the stylus tip is in direct contact is high, the meltability at the adhesive interface decreases, and the surface frictional force is reduced by the release treatment. By performing the mold release process on one side, the stylus tip can be easily moved. The adhesive layer provided on the organic film can be formed by applying a resin composition using an applicator and drying. This adhesive layer (II) is preferably the same thickness as that usually used in multi-wire wiring boards, and in the case of evaluation with the adhesive layer (I-1) of the substrate, the adhesive layer (II- The thickness of 1) is preferably 50 to 150 μm, and in the case of evaluation with the wire adhesive layer (I-2), the thickness of the adhesive layer (II-2) is preferably 10 to 25 μm.
The resin composition used for the adhesive layer (I) of the support A and the adhesive layer (II) of the support B may be the same resin composition or different resin compositions.
次に本発明の図面を用いて層間接着性の具体的な評価方法を説明する。図１は支持体Ａに絶縁回路基板を用いた接着剤付支持体Ａの製造工程説明図、図２は支持体Ｂに有機フィルムを用いた接着剤付支持体Ｂの説明図、図３は本発明の層間接着性の評価方法の説明図であり、何れも断面図で示したものである。 Next, a specific method for evaluating interlayer adhesion will be described with reference to the drawings of the present invention. FIG. 1 is an explanatory diagram of a manufacturing process of a support A with an adhesive using an insulating circuit board for the support A, FIG. 2 is an explanatory diagram of a support B with an adhesive using an organic film for the support B, and FIG. It is explanatory drawing of the evaluation method of the interlayer adhesiveness of this invention, and all are shown with sectional drawing.
マルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる樹脂組成物の評価方法では、図１に示す（ａ）、（ｂ）および（ｃ）の工程を経て、絶縁回路基板に接着剤層を形成した接着剤付支持体Ａが製造される。
図１において、（ａ）は導体回路を予め設けた回路基板（１）を示す。この回路基板（１）は、ガラス布エポキシ樹脂銅張積層板やガラス布ポリイミド樹脂銅張積層板等を公知のエッチング法等により形成できる。必要に応じてこの導体回路は多層回路とすることもでき、また導体回路を全く無くすこともできる。
図１の（ｂ）は、回路基板（１）にアンダーレイ層として絶縁層（２）を形成した図である。この絶縁層は、通常のガラス布エポキシ樹脂やガラス布ポリイミド樹脂のＢステージのプリプレグ、あるいは、ガラス布を含まないＢステージの樹脂シート等が使用出来る。絶縁層（２）は、回路基板にプリプレグや樹脂シート等をラミネートした後、必要に応じて熱処理あるいは積層による硬化等を行うことにより形成される。
図１の（ｃ）は、絶縁層（２）を有する回路基板（１）に接着剤層（３）を形成した図である。基板の接着剤層(I-1)〜ワイヤ接着剤層(II-1)の評価であれば接着剤層（３）として基板の接着剤層(I-1)に用いる樹脂組成物を、ワイヤ接着剤層同士の評価であれば、ワイヤ接着剤層(I-2)に用いる樹脂組成物を接着剤層（３）として形成する。接着剤層（３）を形成する手法としては、前記樹脂組成物をスプレーコーティング、ロールコーティング、スクリーン印刷法等で絶縁基板に直接塗布し乾燥する方法等がある。
In the evaluation method of the resin composition used for the adhesive layer and the wire adhesive layer of the substrate in the manufacture of the multi-wire wiring board, the insulating circuit is obtained through the steps (a), (b) and (c) shown in FIG. A support A with an adhesive in which an adhesive layer is formed on a substrate is manufactured.
In FIG. 1, (a) shows a circuit board (1) provided with a conductor circuit in advance. The circuit board (1) can be formed of a glass cloth epoxy resin copper clad laminate, a glass cloth polyimide resin copper clad laminate or the like by a known etching method or the like. If necessary, this conductor circuit can be a multilayer circuit, or the conductor circuit can be completely eliminated.
FIG. 1B is a diagram in which an insulating layer (2) is formed as an underlay layer on the circuit board (1). As this insulating layer, a B-stage prepreg made of ordinary glass cloth epoxy resin or glass cloth polyimide resin or a B-stage resin sheet not containing glass cloth can be used. The insulating layer (2) is formed by laminating a prepreg, a resin sheet or the like on a circuit board and then performing heat treatment or curing by lamination as necessary.
FIG. 1C is a diagram in which an adhesive layer (3) is formed on a circuit board (1) having an insulating layer (2). For the evaluation of the adhesive layer (I-1) to the wire adhesive layer (II-1) of the substrate, the resin composition used for the adhesive layer (I-1) of the substrate is used as the adhesive layer (3). If it is evaluation of adhesive layers, the resin composition used for a wire adhesive layer (I-2) is formed as an adhesive layer (3). As a method for forming the adhesive layer (3), there is a method in which the resin composition is directly applied to an insulating substrate by spray coating, roll coating, screen printing or the like and dried.
図２は、ワイヤ接着剤層(II-1、II-2)に用いる樹脂組成物を有機フィルム（４）に接着剤層（３）として形成した場合の断面図である。この有機フィルム（４）には前記のように離形処理を施したものを使用することが好ましく、離形処理が施されていない面に接着剤層（３）を形成することがより好ましい。接着剤層（３）を形成する手法としては、前記樹脂組成物をスプレーコーティング、ロールコーティング、スクリーン印刷法等で有機フィルムに塗布し乾燥する方法等がある。 FIG. 2 is a cross-sectional view when the resin composition used for the wire adhesive layers (II-1 and II-2) is formed on the organic film (4) as the adhesive layer (3). The organic film (4) is preferably subjected to a release treatment as described above, and more preferably an adhesive layer (3) is formed on a surface not subjected to the release treatment. As a method for forming the adhesive layer (3), there is a method in which the resin composition is applied to an organic film by spray coating, roll coating, screen printing or the like and dried.
図３は本発明の層間接着性の評価方法の説明図（断面図）であり、接着剤付支持体Ｂ（５）が接着剤付支持体Ａ（６）の上に配置されており、その上に設置したスタイラスチップ（８）の先端を押付けながら移動させ、支持体Ａの接着剤層(I)と支持体Ｂの接着剤層(II)が溶融接着可能な最大速度を評価することにより、支持体Ａの接着剤層(I)と支持体Ｂの接着剤層(II)に使用された樹脂組成物の層間接着性を評価する。この層間接着性の評価は、図３に示すように、接着剤付支持体Ａ（６）をテーブル（７）の上に載せて行うことが好ましい。
即ち、図３において接着剤付支持体Ａ（６）をテーブル（７）上に固定し、接着剤付支持体Ｂ（６）を接着剤面が対向するように接着剤付支持体Ａ（６）の上に配置し、接着剤付支持体Ｂ（５）の支持体上面から一定の超音波振動と荷重を与えたスタイラスチップ（８）を押付けながら移動させる。その時、スタイラスチップ（８）の移動速度を変化させることにより、単位面積当りの発熱量を変化させ、移動速度とその移動速度での接着の可否を判定することによって、評価することができる。より速い移動速度（単位面積当りの発熱量が小さい）で接着が可能なものほど接着性が高いと評価する。
FIG. 3 is an explanatory view (cross-sectional view) of the evaluation method for interlayer adhesion according to the present invention, in which a support B (5) with an adhesive is disposed on a support A (6) with an adhesive. By evaluating the maximum speed at which the adhesive layer (I) of the support A and the adhesive layer (II) of the support B can be melt-bonded by pressing and moving the tip of the stylus tip (8) placed above. The interlayer adhesion of the resin composition used for the adhesive layer (I) of the support A and the adhesive layer (II) of the support B is evaluated. The evaluation of interlayer adhesion is preferably performed by placing the support A (6) with an adhesive on the table (7) as shown in FIG.
That is, in FIG. 3, the support A (6) with adhesive is fixed on the table (7), and the support A (6) with adhesive so that the adhesive surface faces the support B (6) with adhesive. The stylus tip (8) to which a certain ultrasonic vibration and load are applied is pressed and moved from the upper surface of the support B (5) with adhesive. At that time, by changing the moving speed of the stylus tip (8), the amount of heat generated per unit area can be changed, and the moving speed and whether or not bonding can be performed at the moving speed can be evaluated. It is evaluated that the higher the moving speed (the smaller the amount of heat generated per unit area) is, the higher the adhesiveness is.
なお、本発明の層間接着性の評価方法では、マルチワイヤ配線板の製造において使用されるものと同様のスタイラスチップを有する布線装置が使用されることが好ましい。
即ち、マルチワイヤ配線板は接着シートを有する多層回路基板上に接着剤付絶縁被覆電線を這わせて行くと同時に接着して製造してされるが、本発明の層間接着性の評価方法では、この多層回路基板が接着剤付支持体Ａとなり、接着剤付絶縁被覆電線に代えて接着剤付支持体Ｂを用いて、接着剤付支持体Ａの接着剤層(I)および接着剤付支持体Ｂの接着剤層(II)に使用された樹脂組成物の層間接着性を評価することになる。
この層間接着は、スタイラスチップの超音波振動により接着剤を加熱し、加圧することにより接着剤層に使用された樹脂組成物が融着することにより行われる。
マルチワイヤ配線板の製造において使用されるものと同様のスタイラスチップを有する布線装置が使用する場合の超音波振動は１０〜４０ｋＨｚの範囲とすることが好ましく、スタイラスチップの荷重を３０〜１５０ｇ程度とすることが好ましい。
In the interlayer adhesion evaluation method of the present invention, it is preferable to use a wiring device having a stylus chip similar to that used in the manufacture of a multi-wire wiring board.
That is, the multi-wire wiring board is manufactured by simultaneously bonding the insulated coated electric wire with adhesive on the multilayer circuit board having the adhesive sheet, but in the interlayer adhesive evaluation method of the present invention, This multilayer circuit board becomes a support A with an adhesive, and an adhesive layer (I) of the support A with an adhesive and a support with an adhesive are used by using a support B with an adhesive in place of an insulated coated electric wire with an adhesive. The interlayer adhesion of the resin composition used for the adhesive layer (II) of the body B will be evaluated.
This interlayer adhesion is performed by heating and pressurizing the adhesive by ultrasonic vibration of the stylus chip and fusing the resin composition used for the adhesive layer.
The ultrasonic vibration when a wiring apparatus having a stylus tip similar to that used in the manufacture of a multi-wire wiring board is used is preferably in the range of 10 to 40 kHz, and the load of the stylus tip is about 30 to 150 g. It is preferable that
マルチワイヤ配線板の製造においてワイヤの布線に用いられるスタイラスチップの先端は、ワイヤが動かないよう凹形状となっているが、本発明により接着剤層に使用された樹脂組成物の層間接着性を評価する場合には、スタイラスチップの先端が平坦であることが好ましい。
先端が凹形状となっているスタイラスチップで押付けた場合、接着剤付支持体Ｂの支持体との接触面積が小さく溶融接着性の差が顕著に現れないが、スタイラスチップの先端を平坦とすることにより接触面積が大きくなり、評価精度を高めることができる。
スタイラスチップ先端の大きさは０．３ｍｍ×０．３ｍｍ程度とすることが好ましい。
本発明の層間接着性の評価方法において、支持体Ａには、通常１００ｍｍ×５０ｍｍ程度であると評価時に扱い易い。
The tip of the stylus chip used for the wiring of the wire in the production of the multi-wire wiring board has a concave shape so that the wire does not move, but the interlayer adhesion of the resin composition used for the adhesive layer according to the present invention When evaluating the above, it is preferable that the tip of the stylus tip is flat.
When pressed with a stylus tip having a concave tip, the contact area between the support B with adhesive and the support is small, and no significant difference in melt adhesion appears, but the tip of the stylus tip is flattened. As a result, the contact area is increased and the evaluation accuracy can be increased.
The size of the tip of the stylus tip is preferably about 0.3 mm × 0.3 mm.
In the method for evaluating interlayer adhesion according to the present invention, the support A is usually about 100 mm × 50 mm and is easy to handle during evaluation.
支持体Ｂに有機フィルムを用いる場合、スタイラスチップの移動速度は、マルチワイヤ配線板の製造において使用される布線装置によるが、通常、１ｍｍ／秒程度以上でスタイラスチップを移動し、接着剤層（I）と接着剤層(II)の溶融接着が可能な最大速度を評価することが好ましい。
接着剤付支持体Ａの接着剤層（I）と接着剤付支持体Ｂの接着剤層(II)との溶融接着は、溶融接着されたであろう接着剤付支持体Ａの接着剤層（I）と接着剤付支持体Ｂの接着剤層（II）を支持体Ａ側が支持体Ｂ側の下になるように置いた後、支持体Ｂを持ち上げて支持体ＡとＢが剥がれないことを確認することにより容易に判断することができる。
When an organic film is used for the support B, the moving speed of the stylus tip depends on the wiring device used in the production of the multi-wire wiring board, but the stylus tip is usually moved at about 1 mm / second or more, and the adhesive layer It is preferable to evaluate the maximum speed at which (I) and the adhesive layer (II) can be melt bonded.
The melt adhesion between the adhesive layer (I) of the support A with adhesive and the adhesive layer (II) of the support B with adhesive is the adhesive layer of the support A with adhesive that would have been melt-bonded. After placing the adhesive layer (II) of (I) and the support B with adhesive so that the support A side is below the support B side, the support B is lifted and the supports A and B are not peeled off. It can be easily determined by confirming this.
なお、マルチワイヤ配線板の製造におけるスタイラスチップの移動速度は、本発明の層間接着性の評価方法で得られた最大速度とは直接には関係せずに、マルチワイヤ配線板の製造において使用された布線装置においてワイヤの接着剤層と基板の接着剤層又はワイヤの接着剤層同士が溶融接着し固定されるスタイラスチップ移動速度を選定する必要がある。
即ち、本発明の層間接着性の評価方法はマルチワイヤ配線板の製造における基板の接着剤層およびワイヤ接着剤層に用いられる最適の樹脂組成物やそのワニス濃度を選択するために行われるものであり、マルチワイヤ配線板の製造におけるスタイラスチップの具体的な移動速度は、本発明の層間接着性の評価方法で得られたスタイラスチップの移動速度の最大速度と相関するが、マルチワイヤ配線板を製造する際に本発明の層間接着性の評価方法とは別に確認する必要がある。
また、本発明の層間接着性の評価方法でスタイラスチップの先端の形状が異なるので、スタイラスチップ超音波振動や荷重についてもマルチワイヤ配線板を製造する場合とは異なり、スタイラスチップの先端の形状や各接着剤付支持体の特性に適した条件を選定する必要がある。
The moving speed of the stylus chip in the production of the multi-wire wiring board is not directly related to the maximum speed obtained by the interlayer adhesion evaluation method of the present invention, and is used in the production of the multi-wire wiring board. In the wiring apparatus, it is necessary to select a stylus tip moving speed at which the wire adhesive layer and the substrate adhesive layer or the wire adhesive layer are fused and fixed to each other.
That is, the interlayer adhesion evaluation method of the present invention is carried out in order to select the optimum resin composition and its varnish concentration used for the substrate adhesive layer and the wire adhesive layer in the production of the multi-wire wiring board. Yes, the specific moving speed of the stylus chip in the manufacture of the multi-wire wiring board correlates with the maximum moving speed of the stylus chip obtained by the interlayer adhesion evaluation method of the present invention. When manufacturing, it is necessary to confirm separately from the interlayer adhesion evaluation method of the present invention.
Further, since the shape of the tip of the stylus tip is different in the interlayer adhesion evaluation method of the present invention, the shape of the tip of the stylus tip and the stylus tip ultrasonic vibration and load are different from those in the case of manufacturing a multi-wire wiring board. It is necessary to select conditions suitable for the characteristics of each support with adhesive.
基板の接着剤層やワイヤの接着剤層に用いられる最適の樹脂組成物の選定に際して、従来の方法では、選定された樹脂組成物を塗布した基板と、選定された樹脂組成物を絶縁被覆ワイヤに塗布したワイヤを布線して層間接着性を用いて評価するが、絶縁被覆ワイヤへの樹脂組成物の塗布には熟練を要する作業が必要であり、一対の樹脂組成物の組合わせの評価に正味１０時間程度を要する。
これに対して本発明の方法では熟練を要する絶縁被覆ワイヤへの樹脂組成物の塗布の作業の代わりに、熟練を要さず容易に形成できる支持体へ塗布したものを使用することにより、一対の樹脂組成物の組合わせの評価を正味５時間程度で行うことが可能となるので、接着剤層に使用される樹脂組成物の選定が容易となり、該樹脂組成物の開発が促進される。
When selecting an optimal resin composition to be used for an adhesive layer of a substrate or an adhesive layer of a wire, in the conventional method, the substrate coated with the selected resin composition and the selected resin composition are insulated with a coated wire. The wire applied to the wire is laid out and evaluated using interlayer adhesion, but the application of the resin composition to the insulation-coated wire requires work that requires skill, and evaluation of the combination of a pair of resin compositions It takes about 10 hours to complete.
On the other hand, in the method of the present invention, instead of the operation of applying the resin composition to the insulation-coated wire requiring skill, a pair of materials coated on a support that can be easily formed without skill is used. Since the evaluation of the combination of the resin compositions can be performed in about 5 hours, selection of the resin composition used for the adhesive layer is facilitated, and development of the resin composition is promoted.
次に、下記の実施例により本発明を更に詳しく説明するが、本発明はこれらの記載に限定されるものではない。 Next, the present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these descriptions.
評価例１（従来の接着性評価方法１）
板厚０．１ｍｍのポリイミド基材両面銅張り積層板（日立化成工業（株）製、商品名：ＭＣＬ−Ｉ−６７１）の銅を一般的なエッチング工法により導体回路を形成し、ガラス布ポリイミドプリプレグ（日立化成工業（株）製、商品名：ＧＩＡ−６７１）を積層接着した絶縁層付２層回路板を支持体とし、その上にアプリケータを用いて約５０μmの厚みとなるようにフェノキシ樹脂系樹脂組成物の接着剤（日立化成工業（株）製、商品名：ＡＳ−Ｕ０１）を塗布し、塗布後の軟化点が約３０℃となるよう乾燥し、接着剤付積層板(Ａ１)を得た。
次に絶縁被覆ワイヤ（外形０．１２５ｍｍ、ポリイミド被覆）にエポキシ樹脂系樹脂組成物の接着剤（日立化成工業（株）製、ＨＡＷ２１６Ｄ）をワイヤ専用塗布機を用いて約１５μｍの厚みとなるように塗布し、塗布後の軟化点が約５５℃となるよう乾燥し、接着剤付絶縁被覆ワイヤ(Ａ２)を得た。
続いて、布線装置（日立化成工業（株）製、ＫＴ型布線機）を用いて、超音波振動（２５ＫＨｚ）と荷重(８０ｇ)を与えたスタイラスチップ（先端凹型）、上記の接着剤付積層板(Ａ１)と接着剤付絶縁被覆ワイヤ(Ａ２) が接着する最大速度を評価した結果、４０ｍｍ／秒であった。
Evaluation Example 1 (Conventional Adhesion Evaluation Method 1)
A conductor circuit is formed by a general etching method using copper of a polyimide base double-sided copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-I-671) having a thickness of 0.1 mm. Phenoxy (prepared by Hitachi Chemical Co., Ltd., trade name: GIA-671) is a phenoxy film having a thickness of about 50 μm using an applicator on the two-layer circuit board with an insulating layer laminated and bonded. A resin-based resin composition adhesive (manufactured by Hitachi Chemical Co., Ltd., trade name: AS-U01) is applied and dried so that the softening point after application is about 30 ° C. )
Next, an insulation coating wire (outer diameter 0.125 mm, polyimide coating) is coated with an epoxy resin resin composition adhesive (HAC216D, manufactured by Hitachi Chemical Co., Ltd.) using a wire-dedicated applicator so that the thickness is about 15 μm. And dried so that the softening point after application was about 55 ° C. to obtain an insulating coated wire (A2) with an adhesive.
Subsequently, using a wiring device (manufactured by Hitachi Chemical Co., Ltd., KT type wiring machine), a stylus chip (tip concave type) applied with ultrasonic vibration (25 KHz) and load (80 g), and the above adhesive As a result of evaluating the maximum speed at which the laminated plate (A1) and the insulating coated wire (A2) with adhesive were bonded, it was 40 mm / sec.
評価例２（従来の接着性評価方法２）
評価例１において、絶縁層付２層回路板の上に用いる接着剤をポリアミドイミド樹脂系樹脂組成物（日立化成コーテッドサンド（株）製、商品名：ＣＳＤ１７０Ｓ）とした接着剤付積層板(Ｂ１)と、絶縁被覆ワイヤに塗布する接着剤をポリアミドイミド樹脂系樹脂組成物（日立化成コーテッドサンド（株）製、商品名：ＣＳＤ１７０Ｗ）とした接着剤付絶縁被覆ワイヤ（Ｂ２）として、評価例１と同様、上記の接着剤付積層板(Ｂ１)と接着剤付絶縁被覆ワイヤ(Ｂ２)が接着する最大速度を評価した結果、２０ｍｍ／秒であった。
接着剤付積層板と接着剤付絶縁被覆ワイヤが接着する最大速度は、評価例１では４０ｍｍ／秒であったが、評価例２では約半減であった。
Evaluation Example 2 (Conventional Adhesion Evaluation Method 2)
In Evaluation Example 1, an adhesive used on a two-layer circuit board with an insulating layer is a polyamide-imide resin resin composition (manufactured by Hitachi Chemical Coated Sand Co., Ltd., trade name: CSD170S). Evaluation Example 1 as an insulation coated wire (B2) with an adhesive having a polyamideimide resin-based resin composition (trade name: CSD170W, manufactured by Hitachi Chemical Coated Sand Co., Ltd.) as the adhesive applied to the insulation coated wire Similarly to the above, the maximum speed at which the above-mentioned laminated plate with adhesive (B1) and the insulated coated wire with adhesive (B2) were adhered was 20 mm / second.
The maximum speed at which the laminated sheet with adhesive and the insulating coated wire with adhesive adhered was 40 mm / second in Evaluation Example 1, but about half in Evaluation Example 2.
実施例１
板厚０．１ｍｍのポリイミド基材両面銅張り積層板（日立化成工業（株）製、商品名：ＭＣＬ−Ｉ−６７１）の銅を一般的なエッチング工法により導体回路を形成し、ガラス布ポリイミドプリプレグ（日立化成工業（株）製、商品名：ＧＩＡ−６７１）を積層接着した絶縁層付２層回路板を支持体とし、アプリケータを用いて約５０μｍの厚みとなるようにフェノキシ樹脂系樹脂組成物の接着剤（日立化成工業（株）製、商品名：ＡＳ−Ｕ０１）塗布し、塗布後の軟化点が約３０℃となるよう乾燥し、接着剤付支持体Ｃ１を得た。
次に、片面離形処理を施した離形フィルム（帝人（株）製、商品名：Ａ−３１）を支持体とし、離形フィルムの離形未処理面に、アプリケータを用いて約１５μｍの厚みとなるようにエポキシ樹脂系樹脂組成物の接着剤（日立化成工業（株）製、商品名：ＨＡＷ２１６Ｄ）を塗布し、塗布後の軟化点が５５℃となるように乾燥し、接着剤付支持体Ｃ２を得た。
次に、評価例１と同様の布線装置を用いて、接着剤付支持体Ｃ１をテーブルに固定し、その上に接着剤面が対向するように接着剤付支持体Ｃ２上に配置し、接着剤付支持体Ｃ２の支持体上部から超音波振動（２５ＫＨｚ）と荷重８０ｇを与えたスタイラスチップ（先端平坦約０．１ｍｍ2）を押付けながら移動させ、接着剤同士が溶融接着可能な最大速度を評価した。接着剤同士が接着する最大速度を評価した結果、７ｍｍ／秒であった。
Example 1
A conductor circuit is formed by a general etching method using copper of a polyimide base double-sided copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-I-671) having a thickness of 0.1 mm. A phenoxy resin-based resin having a thickness of about 50 μm using an applicator with a prepreg (manufactured by Hitachi Chemical Co., Ltd., trade name: GIA-671) as a support, which is a two-layer circuit board with an insulating layer. The composition adhesive (manufactured by Hitachi Chemical Co., Ltd., trade name: AS-U01) was applied and dried so that the softening point after application was about 30 ° C. to obtain a support C1 with adhesive.
Next, a release film (trade name: A-31, manufactured by Teijin Ltd.) subjected to single-sided release treatment is used as a support, and about 15 μm using an applicator on the release-untreated surface of the release film. An epoxy resin resin composition adhesive (manufactured by Hitachi Chemical Co., Ltd., trade name: HAW216D) is applied so that the thickness of the adhesive becomes 55 ° C., and the adhesive is dried. A support C2 was obtained.
Next, using the same wiring apparatus as in Evaluation Example 1, the support C1 with adhesive is fixed to the table, and the adhesive is placed on the support C2 with the adhesive so that the adhesive surface faces the upper surface. The maximum speed at which the adhesive can be melt-bonded by pressing the stylus tip (flat tip approx. 0.1mm 2 ) applied with ultrasonic vibration (25KHz) and load 80g from the upper part of the support C2 with adhesive. Evaluated. As a result of evaluating the maximum speed at which the adhesives adhere to each other, it was 7 mm / second.
実施例２
実施例１において絶縁層付２層回路板の上に用いる接着剤をポリアミドイミド樹脂系樹脂組成物（日立化成コーテッドサンド（株）製、商品名：ＣＳＤ１７０Ｓ）とした接着剤付支持体Ｄ１と、離形フィルム上に塗布する接着剤をポリアミドイミド樹脂系樹脂組成物（日立化成コーテッドサンド（株）製、商品名：ＣＳＤ１７０Ｗ）とした接着剤付支持体Ｄ２として、実施例１と同様、接着剤同士が溶融接着可能な最大速度を評価した結果、３ｍｍ／秒であった。
実施例１では接着剤同士が接着する最大速度は７ｍｍ／秒であったが、実施例２では約半減であった。
また、評価例では、接着可能な最大速度の評価に約１０時間かかったが、実施例では、約５時間となり、評価の効率向上が可能であった。
Example 2
A support D1 with an adhesive in which the adhesive used on the two-layer circuit board with an insulating layer in Example 1 is a polyamide-imide resin-based resin composition (manufactured by Hitachi Chemical Coated Sand Co., Ltd., trade name: CSD170S); As in Example 1, as an adhesive support D2 in which the adhesive applied on the release film was a polyamide-imide resin resin composition (manufactured by Hitachi Chemical Coated Sand Co., Ltd., trade name: CSD170W) It was 3 mm / sec as a result of evaluating the maximum speed | velocity | rate which can mutually melt-bond.
In Example 1, the maximum speed at which the adhesives were bonded to each other was 7 mm / second, but in Example 2, it was about halved.
Further, in the evaluation example, it took about 10 hours to evaluate the maximum speed at which adhesion was possible, but in the example, it took about 5 hours, and the evaluation efficiency could be improved.
以上の実施例より、本発明の層間接着性の評価方法によれば、長時間の熟練した作業を要する絶縁被覆ワイヤへの樹脂組成物の塗布の作業が不要であり、基板の接着剤層やワイヤ接着剤層に用いられる樹脂組成物の選定を短時間で容易に行うことができることが分かる。
即ち、本発明の層間接着性の評価方法は、被覆ワイヤへ接着剤層を塗布したワイヤを用いた従来の評価方法による接着性と相対比較することが可能であり、信頼性を有するものであることが分かる。
From the above examples, according to the method for evaluating interlayer adhesion according to the present invention, there is no need to apply a resin composition to an insulating coated wire that requires a long and skilled work, It can be seen that the resin composition used for the wire adhesive layer can be easily selected in a short time.
That is, the interlayer adhesion evaluation method of the present invention can be compared with the adhesion by a conventional evaluation method using a wire in which an adhesive layer is applied to a coated wire, and has reliability. I understand that.
１．回路基板
２．絶縁層
３．接着剤層
４．有機フィルム
５．接着剤付支持体Ｂ
６．接着剤付支持体Ａ
７．テーブル
８．スタイラスチップ
1.
6). Support A with adhesive
7). Table 8. Stylus tip
Claims (6)
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