JP5488886B2 - Manufacturing method of multi-wire wiring board - Google Patents

Manufacturing method of multi-wire wiring board Download PDF

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JP5488886B2
JP5488886B2 JP2009248802A JP2009248802A JP5488886B2 JP 5488886 B2 JP5488886 B2 JP 5488886B2 JP 2009248802 A JP2009248802 A JP 2009248802A JP 2009248802 A JP2009248802 A JP 2009248802A JP 5488886 B2 JP5488886 B2 JP 5488886B2
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adhesive
insulating substrate
wiring
wire
wiring board
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JP2011096822A (en
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俊介 貫名
淳 高橋
洋志 山口
雅広 加藤
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Description

本発明は、必要な配線パターンに絶縁電線を用いたマルチワイヤ配線板の製造方法に関する。   The present invention relates to a method for manufacturing a multi-wire wiring board using an insulated wire as a necessary wiring pattern.

近年、電子機器の機能化に伴い、プリント配線板にも配線密度の向上が強く要求されてきている。この要求を満足する配線板の一つに、絶縁板または内層回路板にプリプレグを重ねたものの上に、接着剤層を形成し、絶縁電線の上から、超音波振動を加えながら接着剤層を活性化し、絶縁電線を必要な形状に固定し(以下布線と称す)、接続の必要な箇所に、絶縁電線を切断するように穴をあけ、その穴内をめっきなどで金属化し、製造するマルチワイヤ配線板がある。これは絶縁電線を用いているため同一平面での交差配線が可能となり、さらに多層化もできるので、配線密度の向上が容易となっている。   In recent years, with the functionalization of electronic devices, printed wiring boards have been strongly required to improve wiring density. On one of the wiring boards that satisfy this requirement, an adhesive layer is formed on the prepreg on the insulating board or inner circuit board, and the adhesive layer is applied to the insulated wire while applying ultrasonic vibration. Activated, fixed insulated wires in the required shape (hereinafter referred to as wiring), drilled holes to cut the insulated wires at the places where connection is required, and metalized the holes by plating etc. There is a wiring board. Since insulated wires are used, cross wiring on the same plane is possible, and further multilayering is possible, so that it is easy to improve wiring density.

このようなマルチワイヤ配線板は、図1に示すように、円筒状の鞘部11のそれぞれの端部にヘッド部10とスリップリング12とが取り付けられ、その鞘部11の円筒の部分を2つの軸受(上軸受131,下軸受132)でヘッド取付部13に回転支持させている。そのヘッド取付部13にはヘッド部10を鞘部11の円周方向に回転させるモータ133が取り付けられ、ヘッド取付部13は上下移動手段151によって上下に移動できるようにY軸移動架台15に取り付けられ、そのY軸移動架台15は地面に垂直なY方向に移動できるように設けられている。また、地面と平行でY方向と直交するX方向に移動でき、かつ接着剤付絶縁基板3を固定させるX軸移動テーブル14が設けられている。   As shown in FIG. 1, in such a multi-wire wiring board, a head portion 10 and a slip ring 12 are attached to respective end portions of a cylindrical sheath portion 11, and a cylindrical portion of the sheath portion 11 is divided into 2 parts. The head mounting portion 13 is rotatably supported by two bearings (upper bearing 131 and lower bearing 132). A motor 133 that rotates the head portion 10 in the circumferential direction of the sheath portion 11 is attached to the head attachment portion 13, and the head attachment portion 13 is attached to the Y-axis moving gantry 15 so that it can be moved up and down by the vertical movement means 151. The Y-axis moving gantry 15 is provided so as to be movable in the Y direction perpendicular to the ground. In addition, an X-axis moving table 14 that is movable in the X direction parallel to the ground and orthogonal to the Y direction and that fixes the insulating substrate with adhesive 3 is provided.

鞘部11の円筒内には、ヘッド部10の先端までとどくスタイラス101と、そのスタイラス101の周囲には超音波振動させるための発振コイル111が設けられ、発振コイル111にはスリップリング12を介して超音波発振器121が接続され、鞘部11の円筒内には、絶縁被覆電線1が通されている(特許文献1参照)。絶縁被覆電線1は、ヘッド部10のフィーダ103によってスタイラス101の先端のスタイラスチップ105に供給され、スタイラスチップ105の近くにはその絶縁被覆電線1を必要な長さで切断するカッタ104が設けられ、さらに、スタイラスチップ105の近くにはスタイラスチップ105を接着剤付絶縁基板3に押圧する方向にトルクを発生するトルクモータ102が取り付けられている。   In the cylinder of the sheath portion 11, a stylus 101 that reaches the tip of the head portion 10 and an oscillation coil 111 for ultrasonic vibration are provided around the stylus 101, and the oscillation coil 111 is provided with a slip ring 12 interposed therebetween. The ultrasonic oscillator 121 is connected, and the insulation-coated electric wire 1 is passed through the cylinder of the sheath portion 11 (see Patent Document 1). The insulated wire 1 is supplied to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head unit 10, and a cutter 104 is provided near the stylus tip 105 to cut the insulated wire 1 to a required length. Furthermore, a torque motor 102 that generates torque in a direction in which the stylus chip 105 is pressed against the insulating substrate 3 with an adhesive is attached near the stylus chip 105.

また予め準備された絶縁被覆電線1を固定し始める位置、長さ、配線パターンの配線パターンのコーナ部の位置、角度、および絶縁被覆電線1を固定し終わる位置のデータから、Y軸移動架台15の移動量、X軸移動テーブル14の移動量、鞘部11の回転角度、超音波発振器121の出力、トルクモータ102の出力、カッタ104の動作などを算出し、絶縁被覆電線1を接着剤付絶縁基板3上に接着・固定して、必要な配線パターンを形成するシーケンスが納められた布線装置を用いて、配線パターンを形成している。   Further, the Y-axis moving gantry 15 is determined based on the position, length, the position of the corner of the wiring pattern of the wiring pattern, the angle, and the position at which the insulation-coated electric wire 1 is fixed. Of the X-axis movement table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, etc. A wiring pattern is formed by using a wiring device in which a sequence for forming a necessary wiring pattern is accommodated and fixed on the insulating substrate 3.

この布線装置を用いて、布線する様子を説明すると、図1記載の装置で、絶縁被覆電線1をスタイラス101の先端にまで引っぱり出し、スタイラスチップ105の先端に設けられたワイヤガイド溝(図示せず)に挟み、保持している。次にシーケンスを実行する数値制御装置をスタートすると、数値制御装置が最初の布線データ、すなわち、1組の絶縁被覆電線1を固定し始める位置、長さ、配線パターンの配線パターンのコーナ部の位置、角度、および絶縁被覆電線1を固定し終わる位置のデータから、Y軸移動架台15の移動量、X軸移動テーブル14の移動量、鞘部11の回転角度、超音波発振器121の出力、トルクモータ102の出力、カッタ104の動作などを算出し、ヘッド部10をY軸移動架台15を駆動してY方向に、接着剤付絶縁基板3を固定したX軸移動テーブル14を駆動してX方向に、絶縁被覆電線1を最初に固定する位置まで移動して停止する。   The state of wiring using this wiring device will be described. With the device shown in FIG. 1, the insulated coated electric wire 1 is drawn to the tip of the stylus 101, and a wire guide groove ( (Not shown) and held. Next, when the numerical control device that executes the sequence is started, the numerical control device starts the first wiring data, that is, the position, length, and wiring pattern corner portion of the wiring pattern at which one set of the insulated wire 1 starts to be fixed. From the data of the position, the angle, and the position where the insulation-coated electric wire 1 is fixed, the amount of movement of the Y-axis moving base 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, The output of the torque motor 102, the operation of the cutter 104, etc. are calculated, the head unit 10 is driven in the Y direction by driving the Y axis moving base 15, and the X axis moving table 14 to which the insulating substrate 3 with adhesive is fixed is driven. In the X direction, the insulation covered electric wire 1 is moved to a position where it is first fixed and stopped.

さらに上下移動手段151によって、スタイラス101が接着剤付絶縁基板3に接するように所定の位置までヘッド部10を降ろし、超音波発振器121に加えた直流電力とトルクモータ102により加えられた押圧力によって布線の始点に絶縁被覆電線1を固定する。また同時に、超音波発振器121に交流信号を加え、スタイラス101に超音波振動を伝え始めるとともに、布線データに従って、Y軸移動架台15とX軸移動テーブル14を駆動して配線パターンの形状に絶縁被覆電線1をはわせてゆくとともに、スタイラス101の超音波振動によって接着剤付絶縁基板3上の接着剤と絶縁被覆電線1の表面に塗布された接着剤を活性化して接着・固定する。また、配線パターンのコーナ部を形成するときは、超音波出力及びスタイラス圧力の調整を行いながらY軸移動架台15とX軸移動テーブル14の駆動を停止してヘッド部10のみをモータ133により回転させ、布線データから算出した必要な角度に回転する(特許文献2参照)。   Further, the vertical movement means 151 lowers the head unit 10 to a predetermined position so that the stylus 101 is in contact with the insulating substrate 3 with adhesive, and the direct current power applied to the ultrasonic oscillator 121 and the pressing force applied by the torque motor 102 are used. The insulation-coated electric wire 1 is fixed to the starting point of the wiring. At the same time, an AC signal is applied to the ultrasonic oscillator 121 to start transmitting ultrasonic vibrations to the stylus 101, and the Y-axis moving base 15 and the X-axis moving table 14 are driven according to the wiring data to insulate the wiring pattern shape. While covering the covered electric wire 1, the ultrasonic wave of the stylus 101 activates the adhesive on the insulating substrate 3 with adhesive and the adhesive applied to the surface of the insulating covered electric wire 1 to bond and fix. Further, when forming the corner portion of the wiring pattern, the driving of the Y-axis moving base 15 and the X-axis moving table 14 is stopped while adjusting the ultrasonic output and the stylus pressure, and only the head portion 10 is rotated by the motor 133. And rotate to a necessary angle calculated from the wiring data (see Patent Document 2).

さらにY軸移動架台15とX軸移動テーブル14を駆動して接着・固定を継続し、布線データから算出した長さから布線の終点のカッタ104とスタイラス101の距離分前に、カッタ104を駆動して絶縁被覆電線1を切断し、切断した箇所までY軸移動架台15とX軸移動テーブル14を駆動して、布線の終点まで接着・固定を行う。さらに上下移動手段151を駆動して元の位置までヘッド部10を上げ、次の布線データを読み出し、さらにこれを繰り返し、すべての布線を終わると、上下移動手段151を駆動して元の位置までヘッド部10を上げる。次にY軸移動架台15とX軸移動テーブル14を駆動して、布線装置の基準位置までヘッド部10を移動し、数値制御装置がシーケンスを停止する。このようにして、初めて、接着剤付絶縁基板3を取り外すことができ、また同様に接着剤付絶縁基板3を裏返して同様の工程を行なうことで両面に回路を形成することができ、その後の工程に移ることが出来る。   Further, the Y-axis moving gantry 15 and the X-axis moving table 14 are driven to continue the bonding and fixing, and the cutter 104 is moved by the distance between the ending point of the wiring 104 and the stylus 101 from the length calculated from the wiring data. To drive the Y-axis moving base 15 and the X-axis moving table 14 to the cut position, and bond and fix to the end point of the wiring. Further, the vertical movement means 151 is driven to raise the head unit 10 to the original position, the next wiring data is read, this is repeated, and when all the wiring is completed, the vertical movement means 151 is driven to return to the original position. Raise the head unit 10 to the position. Next, the Y-axis moving base 15 and the X-axis moving table 14 are driven to move the head unit 10 to the reference position of the wiring device, and the numerical controller stops the sequence. In this way, for the first time, the insulating substrate 3 with adhesive can be removed, and similarly, the circuit can be formed on both sides by turning the insulating substrate 3 with adhesive and performing the same process. You can move on to the process.

このようにして、絶縁被覆電線1を接着剤付絶縁基板3に固定するので、絶縁被覆電線1が交差するように固定することができる(特許文献3,4参照)。故に、通常の配線板のように、銅箔の不要な箇所をエッチング除去して回路を形成したり、必要な箇所にのみめっきで回路を形成する方法に比べて、密度の高い配線回路を形成できる。   Thus, since the insulated wire 1 is fixed to the insulating substrate 3 with adhesive, it can be fixed so that the insulated wire 1 intersects (see Patent Documents 3 and 4). Therefore, like a normal wiring board, a circuit is formed by etching away unnecessary portions of copper foil, or a dense wiring circuit is formed compared to a method of forming a circuit by plating only at a necessary portion. it can.

特開平11−150353号公報JP-A-11-150353 特開2000−174419号公報JP 2000-174419 A 特開2000−269629号公報JP 2000-269629 A 特開2000−269630号公報JP 2000-269630 A

ところが、近年では、このような高密度の配線よりもさらに薄厚で高密度配線、生産性の向上が求められており、リードタイムを確保するために布線速度を2倍、例えばそれまでの21.2mm/sから42.4mm/sへと倍速にすることが求められている。また、接着剤付絶縁基板3の厚みも薄型化し、例えばそれまでの0.2mmから0.06〜0.1mmへと変更した場合の対応が求められている。   However, in recent years, there has been a demand for improvement in productivity with a thinner and denser wiring than such high-density wiring, and in order to secure lead time, the wiring speed has been doubled, for example, 21 so far. It is required to increase the speed from 2 mm / s to 42.4 mm / s. Moreover, the thickness of the insulating substrate with adhesive 3 is also reduced, and for example, a countermeasure is required when the thickness is changed from 0.2 mm to 0.06 to 0.1 mm.

布線速度を倍速化すると、スタイラスと接着剤付絶縁基板3との接触時間が短くなることで、接着剤付絶縁基板3上の接着剤と絶縁被覆電線1の表面に塗布された接着剤との超音波振動による活性化が低下し、絶縁被覆電線1が固定されずに剥離したり、剥離しなくても固定が弱いためにさらにその上を乗り越えるように絶縁被覆電線1が固定されるときに引っ張られて固定位置がずれたりするという課題がある。   When the wiring speed is doubled, the contact time between the stylus and the insulating substrate with adhesive 3 is shortened, so that the adhesive on the insulating substrate with adhesive 3 and the adhesive applied to the surface of the insulated coated electric wire 1 When the insulation-coated electric wire 1 is fixed so that the insulation-coated electric wire 1 is not fixed and peeled without being fixed, or the fixing is weak even if it is not peeled, so that it can be further moved over. There is a problem that the fixed position is shifted by being pulled by the.

さらに、接着剤付絶縁基板3の両面に絶縁被覆電線1を配線する場合、片面の配線回路形成後、他面の配線回路を形成しようとしたとき、片面に形成した絶縁被覆電線1による凹凸によりその凹凸周辺部の接着剤付絶縁基板3とX軸移動テーブル14の間に空隙が発生し、スタイラスがその箇所に配線を行なおうとしたとき、接着剤付絶縁基板3とX軸移動テーブル14の間の空隙による接着剤付絶縁基板3の反発力の低下が顕著になり、超音波振動が減衰し、接着剤付絶縁基板3上の接着剤と絶縁被覆電線1の表面に塗布された接着剤の活性化が低下し、絶縁被覆電線1が固定されずに剥離するという課題がある。   Furthermore, when the insulated coated electric wire 1 is wired on both surfaces of the insulating substrate 3 with adhesive, when forming the wired circuit on the other side after forming the wired circuit on one side, the unevenness due to the insulated coated electric wire 1 formed on one side is caused. When a gap is generated between the insulating substrate 3 with adhesive and the X-axis moving table 14 around the unevenness, and the stylus tries to perform wiring at that location, the insulating substrate 3 with adhesive and the X-axis moving table 14 Decrease in the repulsive force of the insulating substrate with adhesive 3 due to the gap between the two, the ultrasonic vibration is attenuated, and the adhesive applied to the insulating substrate 3 with adhesive and the surface of the insulated coated electric wire 1 is applied. There is a problem that the activation of the agent is lowered, and the insulation-coated electric wire 1 is peeled without being fixed.

本発明は、上記課題を解決し、配線密度に優れ、布線速度を倍速にし、かつ接着剤付絶縁基板を薄型化しても絶縁被覆電線が接着剤付絶縁基板より剥離が発生しにくい、マルチワイヤ配線板の製造方法を提供することを目的とする。   The present invention solves the above-mentioned problems, has excellent wiring density, doubles the wiring speed, and even if the insulating substrate with adhesive is made thinner, the insulation-coated electric wire is less likely to be peeled off than the insulating substrate with adhesive. It aims at providing the manufacturing method of a wire wiring board.

上記課題に鑑み本発明者らは鋭意検討の結果、接着剤付絶縁基板をテーブル上に密着さ
せながらワイヤ布線を行なうことで上記課題を解決することを見出し、本発明に至った。
本発明は、以下に関する。
(1) 最外層として接着層を有する接着剤付絶縁基板に、超音波振動により前記接着層を溶融させながら、ワイヤを布線するマルチワイヤ配線板の製造方法において、テーブルが吸引孔を有する吸引テーブルであり、テーブルと接着剤付絶縁基板との間に、少なくともフォーム基材と表面フィルムとからなる下敷シートで、スリットまたは孔を有する下敷シートを、前記表面フィルムが接着剤付絶縁基板側となるように配設し、前記接着剤付絶縁基板を吸引固定によりテーブル上に密着させながらワイヤ布線を行なうことを特徴とするマルチワイヤ配線板の製造方法
(2) 表面フィルムの厚さが10〜100μmである前記()に記載のマルチワイヤ配線板の製造方法。
) 表面フィルムが多孔質フィルムである前記()又は()に記載のマルチワイヤ配線板の製造方法。
) 下敷シートが、複数の孔を有する前記()〜()のいずれかに記載のマルチワイヤ配線板の製造方法。
) 下敷シートの孔の位置が、吸引テーブルの吸引孔と同位置にある、前記()〜()のいずれかに記載のマルチワイヤ配線板の製造方法。
) 下敷シートの複数の孔の直径が、2〜4mmである前記()又は()に記載のマルチワイヤ配線板の製造方法。
) 下敷シートの複数の孔の直径が、吸引テーブルの吸引孔の直径に対して100〜150%である前記()に記載のマルチワイヤ配線板の製造方法。
) 表面フィルムがポリエチレンフィルムまたはポリオレフィンフィルムである前記()〜()のいずれかに記載のマルチワイヤ配線板の製造方法。

In view of the above problems, as a result of intensive studies, the present inventors have found that the above problems can be solved by performing the wiring while keeping the adhesive-attached insulating substrate in close contact with the table, and have reached the present invention.
The present invention relates to the following.
(1) In a method of manufacturing a multi-wire wiring board in which a wire is laid while melting the adhesive layer by ultrasonic vibration on an insulating substrate with an adhesive having an adhesive layer as the outermost layer, the suction of the table having suction holes It is a table, and is an underlay sheet comprising at least a foam base material and a surface film between the table and the insulating substrate with an adhesive. A method of manufacturing a multi-wire wiring board, wherein wiring is performed while the insulating substrate with adhesive is closely attached to a table by suction and fixing .
(2 ) The manufacturing method of the multi-wire wiring board as described in said ( 1 ) whose thickness of a surface film is 10-100 micrometers.
( 3 ) The manufacturing method of the multi-wire wiring board as described in said ( 1 ) or ( 2 ) whose surface film is a porous film.
( 4 ) The manufacturing method of the multi-wire wiring board according to any one of ( 1 ) to ( 3 ), wherein the underlying sheet has a plurality of holes.
( 5 ) The method for producing a multi-wire wiring board according to any one of ( 1 ) to ( 4 ), wherein the position of the hole in the underlay sheet is at the same position as the suction hole of the suction table.
( 6 ) The manufacturing method of the multi-wire wiring board as described in said ( 4 ) or ( 5 ) whose diameter of the some hole of an underlay sheet | seat is 2-4 mm.
( 7 ) The method for manufacturing a multi-wire wiring board according to ( 5 ), wherein the diameter of the plurality of holes of the underlay sheet is 100 to 150% with respect to the diameter of the suction holes of the suction table.
( 8 ) The manufacturing method of the multi-wire wiring board in any one of said ( 1 )-( 7 ) whose surface film is a polyethylene film or a polyolefin film.

本発明によって、布線速度の倍速化及び接着剤付絶縁基板の薄型化による超音波振動の減衰を低減でき、絶縁被覆電線が接着剤付絶縁基板から剥離したり、ずれたりすることなく高密度配線を行うことが出来る、マルチワイヤ配線板の製造方法を提供することが可能となった。   According to the present invention, attenuation of ultrasonic vibration due to doubled wiring speed and thinning of the insulating substrate with adhesive can be reduced, and the insulation-coated electric wire has a high density without peeling or shifting from the insulating substrate with adhesive. It has become possible to provide a method for manufacturing a multi-wire wiring board capable of wiring.

従来例の布線装置を示す側面図である。It is a side view which shows the wiring apparatus of a prior art example. 本発明における下敷シートを使用した場合の布線装置を示す側面図である。It is a side view which shows the wiring apparatus at the time of using the base sheet in this invention. 本発明の実施例に用いた下敷シート形状を示す上面図である。It is a top view which shows the underlay sheet | seat shape used for the Example of this invention. 本発明の実施例に用いた下敷シート形状を示す上面図である。It is a top view which shows the underlay sheet | seat shape used for the Example of this invention. マルチワイヤ配線板製造の布線工程を示す模式図である。It is a schematic diagram which shows the wiring process of multi-wire wiring board manufacture.

本発明のマルチワイヤ配線板の製造方法は、最外層として接着層を有する接着剤付絶縁基板に、超音波振動により前記接着層を溶融させながら、ワイヤ(絶縁被覆電線)を布線するマルチワイヤ配線板の製造方法において、前記接着剤付絶縁基板をテーブル上に密着させながらワイヤ布線を行なうことを特徴とする。
以下、図面を用いて本発明のマルチワイヤ配線板の製造方法を詳細に説明する。
たとえば、本発明のマルチワイヤ配線板の製造方法において、図2のように接着剤付絶縁基板3とX軸移動テーブル14の間に超音波振動を効率よく絶縁被覆電線1に伝え、接着剤付絶縁基板3上の接着剤と絶縁被覆電線1の表面に塗布された接着剤を活性化させ、絶縁被覆電線1が剥離することなく接着剤付絶縁基板3上に固定できることを目的とした下敷シート16を配設することが好ましい。また、本発明で使用される下敷シートは、超音波振動による接着剤の活性化を低下させないためにスタイラスと接着剤付絶縁基板3の間の反発力を有することが好ましい。
The method of manufacturing a multi-wire wiring board according to the present invention is a multi-wire in which a wire (insulating coated electric wire) is laid on an insulating substrate with an adhesive having an adhesive layer as an outermost layer while melting the adhesive layer by ultrasonic vibration. In the method for manufacturing a wiring board, wiring is performed while the insulating substrate with adhesive is brought into close contact with a table.
Hereinafter, the manufacturing method of the multi-wire wiring board of this invention is demonstrated in detail using drawing.
For example, in the method for manufacturing a multi-wire wiring board according to the present invention, ultrasonic vibrations are efficiently transmitted between the insulating substrate 3 with adhesive and the X-axis moving table 14 as shown in FIG. An underlay sheet for the purpose of activating the adhesive on the insulating substrate 3 and the adhesive applied to the surface of the insulating coated electric wire 1 so that the insulating coated electric wire 1 can be fixed on the insulating substrate 3 with adhesive without peeling off 16 is preferably disposed. Moreover, it is preferable that the underlay sheet used in the present invention has a repulsive force between the stylus and the insulating substrate 3 with adhesive so as not to lower the activation of the adhesive due to ultrasonic vibration.

さらに接着剤付絶縁基板3の両面に配線回路を形成する場合、表面の絶縁被覆電線1による凹凸の凹凸周辺部の接着剤付絶縁基板3と下敷シート16の間に空隙を発生させないように下敷シート表面が凹凸に追従することが好ましい。   Furthermore, when forming a wiring circuit on both surfaces of the insulating substrate 3 with adhesive, the underlay is made so as not to generate a gap between the insulating substrate 3 with adhesive and the underlay sheet 16 in the peripheral portion of the unevenness by the insulating coated wire 1 on the surface. It is preferable that the sheet surface follows the unevenness.

また、接着剤付絶縁基板3を均一に密着させることで、密着不足による接着剤付絶縁基板3と下敷シートの間の空隙が発生しない形態であることが好ましい。密着させる方法としては吸引固定、圧着、間に媒介を介しての接着等の方法があるが、作業効率の面で、吸引を止めれば簡単に接着剤付絶縁基板3を剥がすことのできる吸引固定が好ましい。吸引固定は、テーブルが吸引孔を有する吸引テーブルを用いて行うことが好ましい。
本発明で用いる下敷シートは、少なくともフォーム基材と表面フィルムからなり、前記表面フィルムが接着剤付絶縁基板3側となるように前記下敷シートを配設することが好ましい。また、図3,4のように前記下敷シートはテーブル202に設けられた吸引孔と同位置にスリットまたは孔を有することが好ましい。
Moreover, it is preferable that it is the form which the space | gap between the insulating board | substrate 3 with an adhesive agent and an underlay sheet | seat does not generate | occur | produce by contact | adhering insufficiently by making the insulating board | substrate 3 with an adhesive contact | adhere uniformly. There are methods such as suction fixation, pressure bonding, and adhesion via a medium as a method of close contact, but in terms of work efficiency, suction fixation that allows the insulating substrate 3 with adhesive to be easily peeled off if suction is stopped. Is preferred. The suction fixation is preferably performed using a suction table having a suction hole in the table.
The underlay sheet used in the present invention is preferably composed of at least a foam base material and a surface film, and the underlay sheet is preferably disposed so that the surface film is on the insulating substrate with adhesive 3 side. 3 and 4, the underlying sheet preferably has a slit or a hole at the same position as the suction hole provided in the table 202.

上記フォーム基材としては、通常、超音波振動を減衰させないために反発力のある硬いものが好ましく、例えば、材質としてはアクリル系樹脂、ポリスチレン系樹脂、ウレタン樹脂などが好ましい。また、フォーム基材の厚みは、0.5〜1.0mmが好ましい。市販品としては、VHB−Y−4910J(住友3M株式会社製、製品名、アクリル系樹脂)などが挙げられる。
また、必要に応じ、接着剤付絶縁基板3上に固定された絶縁被覆電線1の凹凸を吸収するために、ゲル状もしくは液状のフォーム基材、材質としては例えば水などの液体からなる例えば洗顔フォーム、整髪フォームなどのようにしたフォーム基材を使用しても良い。
In general, the foam substrate is preferably a hard material having a repulsive force so as not to attenuate the ultrasonic vibration. For example, an acrylic resin, a polystyrene resin, a urethane resin, or the like is preferable. The thickness of the foam substrate is preferably 0.5 to 1.0 mm. Examples of commercially available products include VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name, acrylic resin).
Further, if necessary, in order to absorb the unevenness of the insulated coated electric wire 1 fixed on the insulating substrate 3 with adhesive, a gel-like or liquid foam base material, for example, a face washing made of a liquid such as water, for example, is used. A foam base material such as foam or hair-styling foam may be used.

前記表面フィルムは接着剤付絶縁基板3に固定された絶縁被覆電線1の凹凸を前記フォーム基材にて吸収するために、適度な厚みのものが好ましく、具体的には10〜80μmが好ましく、20〜60μmがより好ましく、25〜40μmが特に好ましい。また、材質としてはポリエチレン系フィルムなどのポリオレフィンフィルム、ポリフッ化ビニル系フィルムなどが好ましい。市販品としては、ポーラムPH40(株式会社トクヤマ製、製品名)、テドラフィルム(デュポン株式会社製、製品名)、TPXフィルム(三井化学株式会社製、製品名)、サンマップ(日東電工株式会社製、製品名)などが挙げられる。
なお、前記表面フィルムは多孔質フィルムであることが好ましく、ポリエチレン系多孔質フィルムである、ポーラムPH40(株式会社トクヤマ製、製品名)、サンマップ(日東電工株式会社製、製品名)などが好ましい。表面フィルムとして多孔質フィルムを用いる場合には、厚さが20μm程度厚くてもそれ以外のフィルムと同等の効果を得ることができる。したがって、多孔質フィルムの好ましい厚みとしては、10〜100μmが好ましく、20〜80μmがより好ましく、25〜60μmが特に好ましい。
The surface film preferably has an appropriate thickness in order to absorb the unevenness of the insulated coated electric wire 1 fixed to the insulating substrate with adhesive 3 by the foam base material, specifically, 10 to 80 μm is preferable. 20-60 micrometers is more preferable and 25-40 micrometers is especially preferable. The material is preferably a polyolefin film such as a polyethylene film or a polyvinyl fluoride film. Commercially available products include Porum PH40 (manufactured by Tokuyama Corporation, product name), Tedra film (manufactured by DuPont Co., Ltd., product name), TPX film (manufactured by Mitsui Chemicals, Inc., product name), Sunmap (Nitto Denko Corporation) Product name).
The surface film is preferably a porous film, and is preferably a polyethylene-based porous film such as Porum PH40 (manufactured by Tokuyama Corporation, product name), Sunmap (manufactured by Nitto Denko Corporation, product name) and the like. . When a porous film is used as the surface film, effects equivalent to those of other films can be obtained even if the thickness is about 20 μm. Accordingly, the preferred thickness of the porous film is preferably 10 to 100 μm, more preferably 20 to 80 μm, and particularly preferably 25 to 60 μm.

前記下敷シートのスリットまたは孔は、接着剤付絶縁基板3を均一に吸引し、下敷シートに固定することで絶縁被覆電線1の凹凸を吸収させ、空隙を発生させないために、布線装置のX軸移動テーブル14上の吸引孔と同位置に設けることが好ましい。また、前記下敷シートのスリットまたは孔は、複数存在することが好ましい。
また、前記下敷シートのスリットまたは孔は、吸引する接着剤付絶縁基板3を変形させないために径を4mm以下にすることが好ましく、また効率よく吸引を行なうために下敷シートの孔の直径は、2mm以上が好ましい。さらに、前記下敷シートの孔の直径は、2〜3mmがより好ましい。
The slit or hole in the underlay sheet absorbs the insulating substrate 3 with adhesive evenly and fixes it to the underlay sheet so as to absorb the irregularities of the insulated coated electric wire 1 and not generate a gap. It is preferably provided at the same position as the suction hole on the shaft moving table 14. Moreover, it is preferable that there are a plurality of slits or holes in the underlying sheet.
Further, the slit or hole of the underlay sheet preferably has a diameter of 4 mm or less so as not to deform the insulating substrate with adhesive 3 to be sucked, and the diameter of the hole of the underlay sheet for efficient suction is as follows: 2 mm or more is preferable. Furthermore, as for the diameter of the hole of the said base sheet, 2-3 mm is more preferable.

吸引テーブルであるX軸移動テーブルの吸引孔の直径は、特に制限はないが、通常、下敷シートの孔の直径以下である。よって、下敷シートの孔の直径は、吸引テーブルの吸引孔の直径に対して100〜150%であることが好ましく、例えば、吸引テーブルの吸引孔の直径が2mmであれば、下敷シートの孔の直径は、2〜3mmが良い。   The diameter of the suction hole of the X-axis moving table which is a suction table is not particularly limited, but is usually equal to or smaller than the diameter of the hole in the underlay sheet. Accordingly, the diameter of the hole in the underlay sheet is preferably 100 to 150% with respect to the diameter of the suction hole in the suction table. For example, if the diameter of the suction hole in the suction table is 2 mm, The diameter is preferably 2 to 3 mm.

このようにX軸移動テーブル14上に上記下敷シートを設置することによって、絶縁被覆電線1を剥離することなく接着剤付絶縁基板3の両面に接着・固定して、必要な配線パターンを形成してマルチワイヤ配線板を製造することができる。   By installing the underlay sheet on the X-axis moving table 14 in this way, the insulating coated electric wire 1 is bonded and fixed to both surfaces of the insulating insulating substrate 3 without peeling off to form a necessary wiring pattern. Thus, a multi-wire wiring board can be manufactured.

このときの絶縁被覆電線には、通常のマルチワイヤ配線板と同様に、金属線に絶縁被覆を形成したものを用いることができ、金属線には、銅線、アルミニウム線、鉄線、あるいはこれらにニッケル、金、コバルトなどのめっきをしたものを用いることができる。金属線としては、直径0.04〜0.10mmの銅線が、可撓性が高く配線パターンのコーナ部を形成し易く、しかも安価なので好ましい。   In this case, the insulation-coated electric wire can be a metal wire with an insulation coating formed as in the case of a normal multi-wire wiring board. The metal wire can be a copper wire, an aluminum wire, an iron wire, or these. Those plated with nickel, gold, cobalt or the like can be used. As the metal wire, a copper wire having a diameter of 0.04 to 0.10 mm is preferable because it is highly flexible and can easily form a corner portion of a wiring pattern and is inexpensive.

金属線の表面に形成する絶縁被覆は、配線板として使用されることを考慮すれば、エポキシ樹脂やポリイミド樹脂で構成することが、耐熱性と耐久性に優れているので好ましい。絶縁被覆電線は、通常は、ポリイミドワニス等のワニスを薄く塗布して高い温度で硬化することを5〜30回位繰り返し、必要な厚さを得ることができる。   Considering that the insulating coating formed on the surface of the metal wire is used as a wiring board, it is preferable to use an epoxy resin or a polyimide resin because it is excellent in heat resistance and durability. Insulated coated electric wires can usually be obtained by applying a thin varnish such as polyimide varnish and curing at a high temperature about 5 to 30 times to obtain a required thickness.

本発明のマルチワイヤ配線板の製造方法は、最外層として接着層を有する接着剤付絶縁基板を使用する。接着剤付絶縁基板3の接着剤と絶縁被覆電線の接着力を高めるために、絶縁被覆電線の表面に接着剤を塗布することが好ましく、その接着剤の樹脂には、エポキシ樹脂、ポリイミド樹脂あるいはポリイミドで変性したエポキシ樹脂で構成することが好ましく、ワニスとして塗布して、完全には硬化しない程度に乾燥したものを用いることが好ましい。   The manufacturing method of the multi-wire wiring board of the present invention uses an insulating substrate with an adhesive having an adhesive layer as the outermost layer. In order to increase the adhesive force between the adhesive of the insulating substrate with adhesive 3 and the insulated coated electric wire, it is preferable to apply an adhesive to the surface of the insulated coated electric wire. The adhesive resin may be epoxy resin, polyimide resin or It is preferable to use an epoxy resin modified with polyimide, and it is preferable to use a varnish that has been dried to the extent that it is not completely cured.

接着剤付絶縁基板の接着剤には、通常のエポキシ樹脂、ポリイミド樹脂あるいはポリイミドで変性したエポキシ樹脂で構成することもできるが、配線板とするために、配線パターンとしての絶縁被覆電線1を接着・固定した後はその固定した位置からできるだけ移動しない性質と、布線するときにはできるだけ絶縁被覆電線を埋めるために流動するという相反する性質を満足しなければならず、実際には、専用に製造された接着剤を用いることが好ましく、その厚さも、0.05〜0.10mmと必要に応じて選択することができる。   The adhesive of the insulating substrate with adhesive can be made of ordinary epoxy resin, polyimide resin or epoxy resin modified with polyimide, but in order to form a wiring board, the insulating coated electric wire 1 as a wiring pattern is bonded.・ After fixing, it must satisfy the conflicting property that it does not move as much as possible from its fixed position and the conflicting property that it flows to fill the insulated wire as much as possible when it is wired. It is preferable to use an adhesive, and the thickness thereof can be selected as necessary from 0.05 to 0.10 mm.

絶縁基板には、通常の配線板に用いるガラス布にエポキシ樹脂、ポリイミド樹脂を含浸した絶縁基板を用いることができ、また、その内層に、内層回路を形成した内層回路板を有する絶縁基板を用いることもできる。   As the insulating substrate, an insulating substrate in which a glass cloth used for a normal wiring board is impregnated with an epoxy resin or a polyimide resin can be used, and an insulating substrate having an inner layer circuit board in which an inner layer circuit is formed is used as the inner layer. You can also

この接着剤付絶縁基板は、上記の絶縁基板に前述の接着剤をワニス状態にして塗布し、加熱・乾燥して半硬化状にしたものを用いることもできるが、通常は、前述の接着剤を半硬化状にしてポリエチレンテレフタレートフィルムなどの支持フィルム上に形成した接着剤フィルムとして、絶縁基板上にラミネートして用いる。
また、最外層として接着層を有する接着剤付絶縁基板としては、例えば、前記絶縁基板の表面に、プリプレグを、プレス等で積層し、さらに前記プリプレグ表面に、接着層を形成し、最外層として接着層を有するプリプレグ付基板としても良い。前記プリプレグとしては、GIA−671N(日立化成工業株式会社製、製品名)など、市販のものが使用できる。また、最外層の接着層としては、例えば、AS−U01(日立化成工業株式会社製、商品名)などで、形成することができる。
The adhesive substrate with adhesive can be applied to the above-mentioned insulating substrate in a varnish state and heated and dried to make it semi-cured. Is laminated on an insulating substrate as an adhesive film formed on a support film such as a polyethylene terephthalate film in a semi-cured state.
Moreover, as an insulating substrate with an adhesive having an adhesive layer as the outermost layer, for example, a prepreg is laminated on the surface of the insulating substrate with a press or the like, and an adhesive layer is further formed on the surface of the prepreg. A substrate with a prepreg having an adhesive layer may be used. A commercially available product such as GIA-671N (manufactured by Hitachi Chemical Co., Ltd., product name) can be used as the prepreg. The outermost adhesive layer can be formed by, for example, AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.).

(布線装置)
図2に示すように、円筒状の鞘部11のそれぞれの端部にヘッド部10とスリップリング12とが取り付けられ、その鞘部11の円筒の部分を2つの軸受(上軸受131,下軸受132)でヘッド取付部13に回転支持させ、そのヘッド取付部13にはヘッド部10を鞘部11の円周方向に回転させるモータ133が取り付けられ、ヘッド取付部13は上下移動手段151によって上下に移動できるようにY軸移動架台15に取り付けられ、そのY軸移動架台15は地面に垂直なY方向に移動できるように設けられ、地面と平行でY方向と直交するX方向に移動でき、かつ接着剤付絶縁基板3を固定させる、X軸移動テーブル14が設けられ、鞘部11の円筒内には、ヘッド部10の先端までとどくスタイラス101と、そのスタイラス101の周囲には超音波振動させるための発振コイル111が設けられ、発振コイル111にはスリップリング12を介して超音波発振器121が接続され、鞘部11の円筒内には、絶縁被覆電線1が通され、ヘッド部10のフィーダ103によってスタイラス101の先端のスタイラスチップ105に供給され、スタイラスチップ105の近くにはその絶縁被覆電線1を必要な長さで切断するカッタ104が設けられ、さらに、スタイラスチップ105の近くにはスタイラスチップ105を接着剤付絶縁基板3に押圧する方向にトルクを発生するトルクモータ102が取り付けられ、予め準備された、絶縁被覆電線1を固定し始める位置、長さ、配線パターンの配線パターンのコーナ部の位置、角度、および絶縁被覆電線1を固定し終わる位置のデータから、Y軸移動架台15の移動量、X軸移動テーブル14の移動量、鞘部11の回転角度、超音波発振器121の出力、トルクモータ102の出力、カッタ104の動作などを算出し、絶縁被覆電線1を接着剤付絶縁基板3上に接着・固定して、必要な配線パターンを形成するシーケンスが納められた従来の布線装置に改良をした。
(Wiring device)
As shown in FIG. 2, a head portion 10 and a slip ring 12 are attached to respective end portions of a cylindrical sheath portion 11, and the cylindrical portion of the sheath portion 11 is divided into two bearings (an upper bearing 131, a lower bearing). 132), a motor 133 that rotates and supports the head mounting portion 13 in the circumferential direction of the sheath portion 11 is mounted on the head mounting portion 13, and the head mounting portion 13 is moved up and down by the vertical movement means 151. It is attached to a Y-axis moving gantry 15 so that it can be moved to the Y-axis, and the Y-axis moving gantry 15 is provided so that it can move in the Y direction perpendicular to the ground, and can move in the X direction that is parallel to the ground and perpendicular to the Y direction. An X-axis moving table 14 is provided for fixing the insulating substrate 3 with adhesive, and the stylus 101 reaching the tip of the head portion 10 and the stylus 10 are provided in the cylinder of the sheath portion 11. Is provided with an oscillation coil 111 for ultrasonic vibration, and an ultrasonic oscillator 121 is connected to the oscillation coil 111 via a slip ring 12. Is passed to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head unit 10, and a cutter 104 is provided near the stylus tip 105 to cut the insulation coated electric wire 1 to a required length. A torque motor 102 that generates torque in a direction in which the stylus chip 105 is pressed against the insulating substrate 3 with adhesive is attached near the stylus chip 105, and the position and length at which the insulation coated electric wire 1 prepared in advance starts to be fixed. , The position and angle of the corner of the wiring pattern of the wiring pattern, and the position where the insulation covered electric wire 1 is fixed From the data, the amount of movement of the Y-axis moving gantry 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, etc. An improvement was made to a conventional wiring device in which a sequence for forming a necessary wiring pattern by bonding and fixing the insulated coated wire 1 on an insulating substrate 3 with an adhesive was contained.

また、このシーケンスによって、予め準備された、絶縁被覆電線1を固定し始める位置、長さ、配線パターンの配線パターンのコーナ部の位置、角度、および絶縁被覆電線1を固定し終わる位置のデータから、Y軸移動架台15の移動量、X軸移動テーブル14の移動量、鞘部11の回転角度、超音波発振器121の出力、トルクモータ102の出力、カッタ104の動作などを算出するのは、コンピュータシステムを用いた数値制御装置を用い、その出力に、Y軸移動架台15の駆動回路、X軸移動テーブル14の駆動回路、鞘部11の回転駆動回路、超音波発振器121の出力制御回路、トルクモータ102の出力駆動回路、カッタ104による切断を行う電磁レバー駆動回路が接続され、それぞれの機構を駆動している。   Further, from this sequence, data prepared in advance for the position and length at which the insulation-coated electric wire 1 starts to be fixed, the position of the corner of the wiring pattern of the wiring pattern, the angle, and the position at which the insulation-coated electric wire 1 is completely fixed are obtained. The movement amount of the Y-axis moving gantry 15, the movement amount of the X-axis movement table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104 are calculated. A numerical control device using a computer system is used, and the output includes a drive circuit for the Y-axis moving gantry 15, a drive circuit for the X-axis moving table 14, a rotation drive circuit for the sheath 11, an output control circuit for the ultrasonic oscillator 121, An output drive circuit of the torque motor 102 and an electromagnetic lever drive circuit for cutting by the cutter 104 are connected to drive each mechanism.

改良した箇所は、接着剤付絶縁基板3とX軸移動テーブルの間にフォーム基材と表面フィルムより構成される下敷シート16を配設することで、接着剤付絶縁基板3の両面に配線回路を形成する場合における表面の絶縁被覆電線1によって生じる凹凸の周辺部の接着剤付絶縁基板3と下敷シートの間の空隙を発生させないように下敷シート表面が凹凸に追従し、また接着剤付絶縁基板3を均一に吸引固定し、吸引不足による接着剤付絶縁基板3と下敷シートの間の空隙が発生させないようにし、スタイラスによる超音波振動を効率よく接着剤付絶縁基板3上の絶縁被覆電線1に伝え、接着剤付絶縁基板3上の接着剤と絶縁被覆電線1の表面に塗布された接着剤を活性化させ、絶縁被覆電線1が剥離することなく接着剤付絶縁基板3両面に固定できるようにしたものである。   The improved part is that a wiring sheet is provided on both sides of the insulating substrate 3 with adhesive by disposing an underlay sheet 16 composed of a foam base material and a surface film between the insulating substrate 3 with adhesive and the X-axis moving table. The surface of the underlay sheet follows the unevenness so as not to generate a gap between the insulating substrate 3 with adhesive and the underlay sheet in the peripheral portion of the unevenness caused by the insulation coated electric wire 1 on the surface, and insulation with adhesive The substrate 3 is uniformly sucked and fixed so that no gap is generated between the insulating substrate 3 with adhesive and the underlay sheet due to insufficient suction, and ultrasonic vibration by the stylus is efficiently applied to the insulated coated wire on the insulating substrate 3 with adhesive. 1 and activate the adhesive on the insulating substrate 3 with adhesive and the adhesive applied to the surface of the insulated wire 1 and fix it on both sides of the insulating substrate 3 without peeling off the insulated wire 1 Those who wear way.

(実施例1)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み40μmであるポリエチレン系多孔質フィルムのポーラムPH40(株式会社トクヤマ製、製品名)を貼り合わせたものを用いた。
また、形状として図4に示したようにテーブル202上の吸引孔203と同位置に前記吸引孔と同じ径である直径2mmの複数の孔を設けて、この吸引孔より吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
Example 1
(Underlay sheet)
VHB-Y-4910J (product name, manufactured by Sumitomo 3M Co., Ltd.) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm is used as a foam base material, and a polyethylene film having a thickness of 40 μm is used as a surface film. A porous porous film made of Porum PH40 (product name, manufactured by Tokuyama Corporation) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(布線)
上記下敷シートを使用した布線装置を用いて、図5に示すように、絶縁層1aを有する両面銅張り積層板である厚さ0.170mmのMCL−I−671(日立化成工業株式会社製、製品名)の表面に変性ポリイミドプリプレグからなる絶縁性樹脂層3aである厚さ30μmのGIA−671N(日立化成工業株式会社製、製品名)を重ねて加熱加圧により積層一体化し、厚さ70μmの接着性樹脂層2aを形成するAS−U01(日立化成工業株式会社製、商品名)を120℃の温度でロールラミネートし、最外層として接着層を有する接着剤付絶縁基板(プリプレグ付基板)を作製し、これに、上記布線装置を用いて、超音波振動により、芯線径65μmでポリイミド被覆層を有する絶縁被覆電線であるHAW(日立電線株式会社製、商品名)を敷設し、0.80mm間に2本の配線を行うテストパターン4aを布線速度42.4mm/sにて同一平面内に布線し固定した後、同様に裏返しにして表面の前記テストパターン4aと同位置に同じく前記テストパターン4aを布線速度42.4mm/sにて布線した。
(Wiring)
As shown in FIG. 5, using a wiring apparatus using the above-mentioned underlay sheet, MCL-I-671 (manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.170 mm, which is a double-sided copper-clad laminate having an insulating layer 1a. , Product name), GIA-671N (product name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 30 μm, which is an insulating resin layer 3a made of a modified polyimide prepreg, is stacked and integrated by heating and pressing, and the thickness is increased. AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) forming a 70 μm adhesive resin layer 2a is roll-laminated at a temperature of 120 ° C., and an insulating substrate with adhesive (substrate with prepreg) having an adhesive layer as the outermost layer HAW (manufactured by Hitachi Cable, Ltd., a product manufactured by Hitachi Cable Co., Ltd.), which is an insulated coated electric wire having a core coating diameter of 65 μm and a polyimide coating layer by ultrasonic vibration using the above wiring device ), And the test pattern 4a in which two wires are arranged between 0.80 mm is wired and fixed in the same plane at a wiring speed of 42.4 mm / s. Similarly, the test pattern 4a was wired at the same position as the pattern 4a at a wiring speed of 42.4 mm / s.

上記絶縁被覆銅線は、直径65μmの銅線に、ポリイミド樹脂であるPyre−ML−RC5057(デュポン社製、製品名)を塗布し、350℃で8分間乾燥することを繰り返し、20μmの厚さに塗布し、その表面に接着剤であるHAW−216D(日立化成工業株式会社製、製品名)を塗布し、200℃で1分間乾燥することを繰り返し13μmの厚さにしたものを用いた。   The insulation-coated copper wire is coated with Pire-ML-RC5057 (manufactured by DuPont, product name), which is a polyimide resin, on a copper wire having a diameter of 65 μm, and dried at 350 ° C. for 8 minutes to obtain a thickness of 20 μm. The adhesive was coated with HAW-216D (product name, manufactured by Hitachi Chemical Co., Ltd.) and dried at 200 ° C. for 1 minute for a thickness of 13 μm.

この結果、表1に示すように接着剤付絶縁基板3の表面及び裏面の布線において絶縁被覆電線1の剥離及び絶縁被覆電線1の固定位置のずれがないことを確認し、絶縁被覆電線1を接着剤付絶縁基板3の両面に接着・固定して、必要な配線パターンを形成することができた。   As a result, as shown in Table 1, it was confirmed that there was no peeling of the insulated coated electric wire 1 and displacement of the fixed position of the insulated coated electric wire 1 in the wiring on the front and back surfaces of the insulating substrate with adhesive 3. Was adhered and fixed to both surfaces of the insulating substrate 3 with adhesive, and a necessary wiring pattern could be formed.

(実施例2)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み25μmであるポリフッ化ビニルフィルムのテドラフィルム(デュポン株式会社製、製品名)を貼り合わせたものを用いた。
また、形状として図4に示したようにテーブル202上の吸引孔203と同位置に前記吸引孔と同じ径である直径2mmの複数の孔を設けて、この吸引孔より吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
(Example 2)
(Underlay sheet)
VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of the acrylic base material having a thickness of 1.0 mm is used as the foam base material. A vinyl fluoride film tedla film (product name, manufactured by DuPont Co., Ltd.) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(布線)
上記下敷を使用した布線装置を用いて、実施例1と同様にテストパターン4aの布線を行った。
この結果、表1に示すように接着剤付絶縁基板3の表面では接着剤付絶縁基板3からの絶縁被覆電線1の剥離及びずれの発生は無く、裏面にて絶縁被覆電線1の接着剤付絶縁基板3からの剥離又はずれが発生したがわずかであった。
(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

(実施例3)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み50μmであるポリオレフィンフィルムのTPXフィルム(三井化学株式会社製、製品名)を貼り合わせたものを用いた。
また、形状として図4に示したようにテーブル202上の吸引孔203と同位置に前記吸引孔と同じ径である直径2mmの複数の孔を設けて、この吸引孔より吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
(Example 3)
(Underlay sheet)
A VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyolefin having a thickness of 50 μm as a surface film A film in which a TPX film (manufactured by Mitsui Chemicals, product name) was bonded was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(布線)
上記下敷を使用した布線装置を用いて、実施例1と同様にテストパターン4aの布線を行った。
この結果、表1に示すように接着剤付絶縁基板3の表面では接着剤付絶縁基板3からの絶縁被覆電線1の剥離及びずれの発生は無く、裏面にて絶縁被覆電線1の接着剤付絶縁基板3からの剥離又はずれが発生したがわずかであった。
(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

(実施例4)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み100μmであるポリエチレン系多孔質フィルムのサンマップ(日東電工株式会社製、製品名)を貼り合わせたものを用いた。
また、形状として図4に示したようにテーブル202上の吸引孔203と同位置に前記吸引孔と同じ径である直径2mmの複数の孔を設けて、この吸引孔より吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
(Example 4)
(Underlay sheet)
VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyethylene having a thickness of 100 μm as a surface film A porous map with a sun map (product name, manufactured by Nitto Denko Corporation) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(布線)
上記下敷を使用した布線装置を用いて、実施例1と同様にテストパターン4aの布線を行った。
この結果、表1に示すように接着剤付絶縁基板3の表面では接着剤付絶縁基板3からの絶縁被覆電線1の剥離及びずれの発生は無く、裏面にて絶縁被覆電線1の接着剤付絶縁基板3からの剥離又はずれが発生したがわずかであった。
(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

(実施例5)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み50μmであるポリオレフィンフィルムのTPXフィルム(三井化学株式会社製、製品名)を貼り合わせたものを用いた。
また、形状として図3に示すようなテーブル202上の吸引孔203と同位置にスリット300を設けて、このスリットより吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
(Example 5)
(Underlay sheet)
A VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyolefin having a thickness of 50 μm as a surface film A film in which a TPX film (manufactured by Mitsui Chemicals, product name) was bonded was used.
Further, a slit 300 is provided at the same position as the suction hole 203 on the table 202 as shown in FIG. 3, and suction is performed through the slit, and the insulating substrate 3 with adhesive is fixed (adhered) to the table. .

(布線)
上記下敷を使用した布線装置を用いて、実施例1と同様にテストパターン4aの布線を行った。
この結果、表1に示すように接着剤付絶縁基板3の表面にて絶縁被覆電線1の剥離やずれが発生したが、わずかであり、また裏面では絶縁被覆電線1の接着剤付絶縁基板3からの剥離又はずれが発生した。
(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, the insulation-coated electric wire 1 was peeled or shifted on the surface of the insulating substrate 3 with adhesive. Separation or deviation from the surface occurred.

(実施例6)
(下敷シート)
フォーム基材として、厚み1.0mmであるアクリル系基材両側にアクリル系接着剤をもつVHB−Y−4910J(住友3M株式会社製、製品名)を使用し、表面フィルムとして厚み40μmであるポリエチレン系多孔質フィルムのポーラムPH40(株式会社トクヤマ製、製品名)を貼り合わせたものを用いた。
また、形状として図4に示したようにテーブル202上の吸引孔203と同位置(5cm格子)に前記吸引孔より1mm大きい直径3mmの複数の孔を設けて、この吸引孔より吸引を行い、テーブルに、接着剤付絶縁基板3を固定(密着)させた。
(Example 6)
(Underlay sheet)
VHB-Y-4910J (product name, manufactured by Sumitomo 3M Co., Ltd.) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm is used as a foam base material, and a polyethylene film having a thickness of 40 μm is used as a surface film. A porous porous film made of Porum PH40 (product name, manufactured by Tokuyama Corporation) was used.
In addition, as shown in FIG. 4, a plurality of holes having a diameter of 3 mm, which is 1 mm larger than the suction holes, are provided at the same position (5 cm grid) as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate 3 with adhesive was fixed (adhered) to the table.

(布線)
上記下敷を使用した布線装置を用いて、実施例1と同様にテストパターン4aの布線を行った。
この結果、表1に示すように接着剤付絶縁基板3の表面及び裏面で絶縁被覆電線1の接着剤付絶縁基板3からの剥離又はずれが発生したが、わずかであった。
(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, peeling or displacement of the insulation-coated electric wire 1 from the insulating substrate with adhesive 3 occurred on the front surface and the back surface of the insulating substrate with adhesive 3 but was slight.

Figure 0005488886
Figure 0005488886

(比較例1)
実施例1において、フォーム基材及び下敷シートを用いることなく布線装置を用いて実施例1と同様にテストパターン4aの布線を行った。
この結果、表2に示すように接着剤付絶縁基板3の表面では、絶縁被覆電線1の剥離やずれが無く良好であったが、裏面では布線途中に絶縁被覆電線1がスタイラスより外れ、エラーで布線装置が停止し、以後の布線をすることが出来なかった。
(Comparative Example 1)
In Example 1, the wiring of the test pattern 4a was performed in the same manner as in Example 1 using the wiring device without using the foam base material and the underlay sheet.
As a result, as shown in Table 2, on the surface of the insulating substrate 3 with adhesive, the insulation-coated electric wire 1 was good without peeling or shifting, but on the back surface, the insulation-coated electric wire 1 was detached from the stylus in the middle of wiring, The wiring device stopped due to an error, and subsequent wiring could not be performed.

(比較例2〜6)
実施例1〜5において、それぞれの下敷シートを用い、テーブルを吸引することなく布線装置を用いて実施例1と同様にテストパターン4aの布線を行った。
この結果、表2に示すように接着剤付絶縁基板3の表面では、絶縁被覆電線1の剥離やずれ無し又はわずかであったが、裏面では布線途中に絶縁被覆電線1がスタイラスより外れ、エラーで布線装置が停止し、以後の布線をすることが出来なかった。
(Comparative Examples 2-6)
In Examples 1-5, the wiring of the test pattern 4a was performed like Example 1 using the underlay sheet | seat and using the wiring apparatus, without attracting | sucking a table.
As a result, as shown in Table 2, on the surface of the insulating substrate 3 with adhesive, the insulation-coated electric wire 1 was not peeled off or shifted slightly, but on the back surface, the insulation-coated electric wire 1 was detached from the stylus in the middle of wiring, The wiring device stopped due to an error, and subsequent wiring could not be performed.

Figure 0005488886
Figure 0005488886

実施例1に示すように、表面フィルムとして厚み40μmであるポリエチレン系多孔質フィルム(ポーラムPH40;株式会社トクヤマ製、製品名)を使用し、テーブル上の吸引孔と同位置に、テーブルの吸引孔と同じ径である直径2mmの孔を複数設けた場合、テーブルに対する接着剤付絶縁基板の密着(固定)は十分であり、接着剤付絶縁基板の表面及び裏面の布線において、絶縁被覆電線の剥離及び絶縁被覆電線の固定位置のずれがないこと、絶縁被覆電線を接着剤付絶縁基板の両面に接着・固定して、必要な配線パターンを形成できることがわかった。
以上に説明したように、本発明によって、布線速度の倍速化及び接着剤付絶縁基板の薄型化による超音波振動の減衰を低減でき、絶縁被覆電線が接着剤付絶縁基板から剥離したり、ずれたりすることなく高密度配線を行うことが出来る、マルチワイヤ配線板を製造する方法を提供することが可能となった。
As shown in Example 1, a polyethylene-based porous film (Poram PH40; manufactured by Tokuyama Corporation, product name) having a thickness of 40 μm was used as the surface film, and the suction holes of the table were located at the same positions as the suction holes on the table. When a plurality of holes having a diameter of 2 mm, which is the same diameter as the above, are provided, the adhesion (fixing) of the insulating substrate with the adhesive to the table is sufficient, and the insulation-coated electric wire of the insulating coated electric wire is placed on the front and back wiring of the insulating substrate with the adhesive. It was found that there was no separation and displacement of the fixing position of the insulated coated electric wire, and the necessary wiring pattern could be formed by adhering and fixing the insulated coated electric wire to both surfaces of the insulating substrate with adhesive.
As described above, according to the present invention, attenuation of ultrasonic vibration due to double wiring speed and thinning of the insulating substrate with adhesive can be reduced, and the insulation-coated electric wire can be peeled off from the insulating substrate with adhesive, It has become possible to provide a method for manufacturing a multi-wire wiring board that can perform high-density wiring without shifting.

1a.絶縁層(または内層回路板)、 2a.接着性樹脂層、 3a.絶縁性樹脂層、 4a.0.8mm/2本テストパターン、
1.絶縁被覆電線、 3.接着剤付絶縁基板、 10.ヘッド部、 101.スタイラス、 102.トルクモータ、 103.フィーダ、 104.カッタ、 105.スタイラスチップ、 11.鞘部、 111.発振コイル、 115.ホール素子、 116.マグネット、 12.スリップリング、 121.超音波発振器、 13.ヘッド取付部、 131.上軸受、 132.下軸受、 133.モータ、 14.X軸移動テーブル、 15.Y軸移動架台、 16.下敷シート、151.上下移動手段、
201.下敷シート、 202.テーブル、 203.吸引孔、 300.スリット。
1a. Insulating layer (or inner layer circuit board), 2a. Adhesive resin layer, 3a. Insulating resin layer, 4a. 0.8mm / 2 test pattern,
1. 2. Insulated coated wire, 10. Insulated substrate with adhesive, Head part, 101. Stylus, 102. Torque motor, 103. Feeder, 104. Cutter, 105. Stylus tip, 11. Sheath, 111. Oscillating coil, 115. Hall element, 116. Magnet, 12. Slip ring, 121. Ultrasonic oscillator, 13. Head mounting portion, 131. Upper bearing, 132. Lower bearing, 133. Motor, 14. X-axis movement table, 15. Y-axis moving mount, 16. Underlay sheet, 151. Vertical movement means,
201. Underlay sheet, 202. Table, 203. Suction hole, 300. slit.

Claims (8)

最外層として接着層を有する接着剤付絶縁基板に、超音波振動により前記接着層を溶融させながら、ワイヤを布線するマルチワイヤ配線板の製造方法において、テーブルが吸引孔を有する吸引テーブルであり、テーブルと接着剤付絶縁基板との間に、少なくともフォーム基材と表面フィルムとからなる下敷シートで、スリットまたは孔を有する下敷シートを、前記表面フィルムが接着剤付絶縁基板側となるように配設し、前記接着剤付絶縁基板を吸引固定によりテーブル上に密着させながらワイヤ布線を行なうことを特徴とするマルチワイヤ配線板の製造方法。 In the method of manufacturing a multi-wire wiring board in which a wire is wired while melting the adhesive layer by ultrasonic vibration on an insulating substrate with an adhesive having an adhesive layer as an outermost layer, the table is a suction table having suction holes An underlay sheet comprising at least a foam base material and a surface film between the table and the insulating substrate with adhesive, and an underlay sheet having slits or holes, so that the surface film is on the insulating substrate side with adhesive A method of manufacturing a multi-wire wiring board, comprising: arranging and performing wire wiring while adhering the insulating substrate with adhesive to a table by suction fixation . 表面フィルムの厚さが10〜100μmである請求項に記載のマルチワイヤ配線板の製造方法。 The method for producing a multi-wire wiring board according to claim 1 , wherein the surface film has a thickness of 10 to 100 μm. 表面フィルムが多孔質フィルムである請求項又はに記載のマルチワイヤ配線板の製造方法。 The method for producing a multi-wire wiring board according to claim 1 or 2 , wherein the surface film is a porous film. 下敷シートが、複数の孔を有する請求項のいずれかに記載のマルチワイヤ配線板の製造方法。 The method for producing a multi-wire wiring board according to any one of claims 1 to 3 , wherein the underlay sheet has a plurality of holes. 下敷シートの孔の位置が、吸引テーブルの吸引孔と同位置にある、請求項のいずれかに記載のマルチワイヤ配線板の製造方法。 The method of manufacturing a multi-wire wiring board according to any one of claims 1 to 4 , wherein the position of the hole in the underlay sheet is at the same position as the suction hole of the suction table. 下敷シートの複数の孔の直径が、2〜4mmである請求項又はに記載のマルチワイヤ配線板の製造方法。 The method for manufacturing a multi-wire wiring board according to claim 4 or 5 , wherein the diameter of the plurality of holes in the underlay sheet is 2 to 4 mm. 下敷シートの複数の孔の直径が、吸引テーブルの吸引孔の直径に対して100〜150%である請求項に記載のマルチワイヤ配線板の製造方法。 The method for manufacturing a multi-wire wiring board according to claim 5 , wherein the diameter of the plurality of holes of the underlay sheet is 100 to 150% with respect to the diameter of the suction holes of the suction table. 表面フィルムがポリエチレンフィルムまたはポリオレフィンフィルムである請求項のいずれかに記載のマルチワイヤ配線板の製造方法。 The method for producing a multi-wire wiring board according to any one of claims 1 to 7 , wherein the surface film is a polyethylene film or a polyolefin film.
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