JPH04118985A - Manufacture of printed circuit board - Google Patents

Abstract

PURPOSE:To secure an unfixed insulated wire, to deeply bury its terminated end to prevent the insulated wire from moving, and to eliminate a conducting malfunction by drawing the insulated wire in contact with the end of a stylus to a wire guide, returning the stylus to the unfixed wire, and adhering the unfixed part by an ultrasonic vibration. CONSTITUTION:An ultrasonic vibration is applied to the surface of an adhesive layer provided on an insulating board 5 while pressing an insulated wire 3 to be secured. A cutter 6 is extended at a desired position to cut the insulated wire. Thereafter, a cylinder 2 is mounted at the center of a wire guide 1, a piston is moved down by the air to press the wire to a lower part. Thus, the wire 3 in contact with the end of a stylus 4 is pulled to the guide 1 side, the end of the stylus 4 is brought into contact with the unfixed insulated wire to be adhered. An entire head is returned to the original 5mm from the cut position on the secured wire 3, and the position of the stylus 4 is matched to the initial position of the unfixed part. The unfixed wire is adhered by ultrasonic vibration.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the manufacture of electrical circuit boards, in particular electrical circuit boards using insulated electricity.

[Conventional technology]

Japanese Patent No. 1066233 and Japanese Patent No. 1343340 are methods for manufacturing electrical circuit boards using insulated wires, and these methods require cutting the insulated wires at predetermined locations and then gluing the unbonded insulated wires. Moreover, since the unbonded length is as long as about 1.31 mm, it is impossible to cut immediately after a part of the corner, which causes the problem of overshooting through holes and via holes in the electric circuit board.

This is shown in Figure 2. The insulated wire is covered with adhesive, and the insulated substrate is also coated with adhesive on its surface. The insulated wire is pressed while applying active energy with a stylus that vibrates with ultrasonic waves. The starting and ending points of the insulated wire that will be fixed will be the through-holes and pie-holes of the electrical circuit board. At the starting point, the insulated wire is pressed and fixed at a predetermined position, so there is no problem with positioning, but at the end point, the insulated wire is canted depending on the mechanical position of the force, wire guide, and stylus, as shown in Figure 2. After this, approximately 1.3++n of unbonded insulated wire remains. For this reason, approximately 1.3-
Must be cut in front. Also, for this reason, 1
Even if you cut it right after the corner like the pattern, it will take about 1.
Since the length was 3+++I11, high-density wiring requiring a shorter length could not be achieved.

Furthermore, in the method of cutting before the corner and turning the corner, the m-edge wire comes off from the groove of the stylus, and the predetermined pattern cannot be obtained.

The method shown in Figure 3 was considered as a way to solve this problem, by changing the mounting position of the cutter to the back of the stylus on the non-sealing side, and changing the stylus from the Chinese style to the Six style. Changed to To explain according to the diagram, the stylus vibrating with ultrasonic waves presses and fixes the insulated t & I (Fig. 3 (a)), then stops the ultrasonic vibrations approximately 0.4a+11 before the end point, and the insulated wire Stop gluing. The insulated wires are not glued and just rest on the insulated substrate (
In this state, the wire is moved to the end point while drawing out the insulated wire (Fig. 3(b)). At that position, the cutter lowers and cants the insulated wire (Figure 3 ((:))).

After this, both the stylus and cutter will rise and cut the insulation into wire 1.
The fixation of the wood is completed (Figure 3 (d)). By this method, the stopping distance before the end point is reduced from 1.3gAl+ to 0.4m.
II and short (because the stylus has six types,
The insulated wire no longer comes off the stylus.

However, as shown in Figure 3(d), the end of the cut insulated wire is not glued or there is a risk that the end may move due to a very small amount of glue. It is not connected to the via hole, resulting in poor continuity. Since the terminal end of the insulated wire is not fixed in this way, there is a problem in that the insulated wire moves.

[Problem to be solved by the invention]

Japanese Patent No. 1066233 and Japanese Patent No. 134334
The method shown in No. 0 requires that the length of the unbonded insulated wire after cutting the insulated wire is about 1.3 mm long, and that the insulated wire will come out of the groove of the stylus when turning the corner after canting before the corner. There is a problem that the insulated wire comes off and the predetermined pattern cannot be glued.As an improvement to these problems, there is a change in the cutter position and stylus hole method.In this case, there is a problem that the insulated wire moves because the end of the insulated wire is not fixed. there were.

In order to fix the unfixed part of the insulated wire end, the present invention: 1) pulls the insulated wire that is in contact with the tip of the stylus toward the wire guide; (2) returns the stylus to the unfixed insulated wire part; 3) I Bond the unfixed parts using sonic vibration.

The above-mentioned ideas provide a method for fixing unfixed parts.

[Means for solving problems].

In order to fix the unfixed portion of the insulated wire, it is necessary to melt and bond the adhesive of the insulated wire and the adhesive of the insulated substrate in the unfixed portion by vibration of the stylus. This requires three steps. One is to pull the ink-painted electric wire at the tip of the stylus toward the wire guide so that the tip of the stylus can come into contact with the unfixed insulated wire and be bonded. For this purpose, a cylinder is installed in the center of the wire guide, and the piston is lowered by air, placing the insulation wire at the bottom. As a result, the insulated wire that was in contact with the stylus tip is pulled toward the wire guide side (the fourth Figure (b)).

Two, bank the stylus position to the first position of the unfixed part. The stylus position is moved by approximately 0.4 degrees (Fig. 4(c)), and the software is additionally modified for this purpose. Next, a subroutine for movement of 0.4+u+ will be added. The contents of this subroutine are to calculate the inverse vector of the direction vector in which the insulated wire has been fixed, and to instruct a moving distance of 0.4 -, and to call a subroutine at a lower level.

The next third step is Step 7, which uses ultrasonic vibration to bond the unfixed insulated wires.The final step includes deeply burying the end of the unfixed insulated wire, and The parts are fixed even more firmly, and the insulated wires no longer move freely.

As a means for this purpose, in the VT system shown in Japanese Patent No. 1343340, a moving distance of 0.41 is specified in a subroutine at the start part of the normal insulated wire (ultrasonic signal ON, signal ON for stylus pressing, etc.). Then, the insulated wire will be adhesively fixed to the end. Deep embedding at the terminal end can be performed by instructing the full ultrasonic signal to be ON, specifying the duration (approximately 300 to 500 m5), and calling a subroutine at a lower level.

〔Example〕

FIG. 1 is a schematic diagram of the present invention, in which the insulated &i3 is passed through the wire guide l and through the hole of the stylus 4 on the insulated substrate 5.
There is a through hole in the center of the wire guide 1, which is shown to be fixed on top, and an air cylinder 2 is placed therein. 5CPC (trade name) is used as this air cylinder, and when F is supplied, the piston in the cylinder 2 lowers and the wire 3 is passed through the through hole. Make a pushing motion. Similar to the conventional device (Japanese Patent No. 1343340), the stylus 4 is fixed on the insulated substrate 5 while applying υ sonic vibration to the insulated wire 3.
11. Insulating coating polyimide thickness 2 μm, adhesive layer polymerized nylon etc. 1101 J thick An adhesive sheet fettle resin 150 μm thick is applied to the surface of the insulating substrate 5 [Effects of the invention] According to the present invention, unfixed insulated wire portions are fixed and terminal portions are fixed. By embedding deeply, the insulated wire is prevented from moving,
It is possible to eliminate conduction defects.

[Brief explanation of drawings]

Figure 1 is a schematic diagram showing the principle of the present invention, Figures 2 (a) to (
e) is a side view showing the fixing method of the present invention, FIGS. 3(a) and (b) are side views and top views showing the conventional fixing method, and FIGS. 4(a) to (d) are the conventional fixing method. A side view showing a fixing method. Explanation of symbols 1 Wire guy 3 Insulated wire 5 Insulated substrate air cylinder stylus scanner Figure (a) (b) Figure (c) (d) Figure (e) Figure (a) Overshoot should be b) Figures (a) (C) (b) (d)

Claims (1)

[Claims] 1. A stylus (4) that vibrates with ultrasonic waves and an insulated wire (
3) Wire guide (1) and wire guide (
1) attached to the side of the pneumatic wire guide (1)
The insulated substrate (5) has an air cylinder (2) that is deeply inserted into the insulated wire (3) and can pull the insulated wire (3), and a cutter (6) that cuts the insulated wire (3) to a desired length.
The insulated wire (3) is pressed onto the surface of the adhesive layer (9) provided on the surface of the insulated wire (3) while applying ultrasonic vibration to fix it, and the cutter (6) is extended at a desired location to cut the insulated wire, Next, the air cylinder (2) is deeply inserted into the wire guide (1), and then the entire head returns to its original position within 5 mm from the cut point over the fixed insulated wire (3), and then the insulated wire (3) is inserted again. 3) Printed wiring board manufacturing equipment that controls fixing.