JP2000269629A - Wiring device and manufacture of wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve wiring density by providing a sequence which settles a wiring speed at the intersection of insulating coated electric wire to some magnification within specified range of the wiring speed at any point without intersection. SOLUTION: A magnet 116 and a Hall element 115 are used to detect the position of the magnet 116 so that the position of a stylus 101 is detected, and from the output for the position of stylus 101, a point where the height of stylus 101 significantly changes is detected with a differential circuit. A sequence is provided, wherein the rough on the surface of an adhesive insulating substrate 3 which is traced with the stylus 101 is detected, and the moving speed of a Y-axis moving stage 15 and that of X-axis moving table 14 are lowered for control. The sequence lowers the speed to 2.0-5.5 m/minute at the intersection of the insulating coated electric wire 1, which is 0.35-0.8 times that of the wiring speed at location which has no intersection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring device and a method for manufacturing a wiring board using the same.

[0002]

2. Description of the Related Art A multi-wire wiring board is manufactured by forming a wiring pattern by placing an insulating-coated electric wire on an insulating substrate provided with an adhesive and simultaneously bonding the wires.

In such a multi-wire wiring board, as shown in FIG. 3, a head portion 10 and a slip ring 12 are attached to respective ends of a cylindrical sheath portion 11, and the cylindrical shape of the sheath portion 11 is formed. The portion is rotatably supported on the head mounting portion 13 by two bearings (an upper bearing 131 and a lower bearing 132), and a motor 133 for rotating the head portion 10 in the circumferential direction of the sheath portion 11 is mounted on the head mounting portion 13. The head mounting portion 13 is attached to the Y-axis moving gantry 15 so as to be able to move up and down by the vertical moving means 151, and the Y-axis moving gantry 15 is provided so as to be movable in the Y direction parallel to the ground, and is parallel to the ground. An X-axis moving table 14 is provided, which can be moved in the X direction orthogonal to the Y direction and fixes the insulating substrate 3 with the adhesive, and the cylinder of the sheath 11 extends to the tip of the head 10. A stylus 101 and an oscillation coil 111 for ultrasonic vibration are provided around the stylus 101, and an ultrasonic oscillator 121 is connected to the oscillation coil 111 via a slip ring 12. , The insulated wire 1 is passed through the feeder 103 of the head unit 10 and supplied to the stylus tip 105 at the tip of the stylus 101. The insulated wire 1 is cut to a required length near the stylus tip 105. A cutter 104 is provided, and a torque motor 102 for generating a torque in a direction of pressing the stylus chip 105 against the adhesive-attached insulating substrate 3 is attached near the stylus chip 105. Where to start fixing, the length, the position of the corner of the wiring pattern of the wiring pattern, From the data of the degree and the position where the insulated wire 1 is completely fixed, the moving amount of the Y-axis moving base 15, the moving amount of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the torque motor The output of 102, the operation of the cutter 104, etc. are calculated,
The wiring pattern is formed by using a wiring device in which a sequence for forming the required wiring pattern by bonding and fixing the insulated wire 1 on the adhesive-attached insulating substrate 3 is formed.

[0004] The manner in which wiring is performed using this wiring apparatus will be described. In the apparatus shown in Fig. 3, the insulated wire 1 is pulled out to the tip of the stylus 101, and the stylus tip 1 is pulled out.
05 wire guide groove (not shown)
And start the numerical controller that executes the sequence, the numerical controller starts the first wiring data, that is,
From the data of the starting position, length, the position of the corner portion of the wiring pattern of the wiring pattern, the angle, and the position where the fixing of the insulated wire 1 is finished, Y
The amount of movement of the axis moving gantry 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121,
The output of the torque motor 102, the operation of the cutter 104, and the like are calculated, and the head unit 10 is driven by driving the Y-axis
When the X-axis moving table 14 to which the insulating substrate 3 with adhesive is fixed is driven in the direction to move to the position where the insulated wire 1 is first fixed in the X direction and stopped, the vertical moving means 15
1, the head unit 10 is lowered to a predetermined position so that the stylus 101 contacts the insulating substrate 3 with the adhesive, and the DC power applied to the ultrasonic oscillator 121 and the torque motor 10
When the insulated wire 1 is fixed to the starting point of the wiring by the pressing force applied by Step 2, an AC signal is applied to the ultrasonic oscillator 121 to start transmitting ultrasonic vibration to the stylus 101, and the Y-axis is moved according to the wiring data. The gantry 15 and the X-axis moving table 14 are driven to put the insulated wire 1 in the shape of the wiring pattern, and the stylus 101
When the adhesive on the adhesive-attached insulating substrate 3 and the adhesive applied to the surface of the insulated wire 1 are activated and adhered and fixed by the ultrasonic vibration, the corner portion 4 of the wiring pattern is formed. , Y-axis moving base 15 and X-axis moving table 14
Is stopped, and only the head unit 10 is rotated by the motor 133 to rotate by a required angle calculated from the wiring data, and the Y-axis moving base 15 and the X-axis moving table 14 are rotated.
Is driven to continue the bonding and fixing, and based on the length calculated from the wiring data, the cutter 104 at the end point of the wiring and the stylus 10 are moved.
One distance before, the cutter 104 is driven to cut the insulated wire 1, and the Y-axis moving gantry 15 and the X-axis moving table 14 are driven to the cut point to bond and fix the wire to the end point. Then, the head unit 10 is raised to the original position by driving the vertical moving unit 151, the next wiring data is read, and this is repeated. When all the wirings are completed, the vertical moving unit 151 is driven to drive the original wiring data. , The Y-axis moving base 15 and the X-axis moving table 14 are driven to move the head unit 10 to the reference position of the wiring device, and the numerical controller stops the sequence. In this way,
For the first time, the adhesive-attached insulating substrate 3 can be removed, and the process can be shifted to the subsequent steps.

[0005] Since the insulated wire 1 is fixed to the insulating substrate 3 with the adhesive in this manner, the insulated wire 1 can be fixed so as to intersect with each other.
A circuit having a higher density can be formed as compared with a method in which an unnecessary portion of a copper foil is removed by etching to form a circuit, or a circuit is formed only in a necessary portion by plating.

[0006]

However, in recent years,
It is required to form a wiring having a higher density than such a high-density wiring, and the diameter of the insulated wire has to be changed from 0.15 mm to 0.10 mm.

[0007] When the insulated wire is used with a small diameter, the insulated wire 1 is already fixed even when the stylus vibrates vertically when the insulated wire 1 is crossed. Since the wire is fixed so as to get over the insulated wire 1, it does not become perpendicular to the stylus at that point, and a large force is applied in the oblique direction of the insulated wire 1 to break or break the insulated wire. There is also a problem that there is.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wiring device which is excellent in wiring density and does not break or break the insulation coating, and a method for manufacturing a wiring board using the wiring device. .

[0009]

SUMMARY OF THE INVENTION A wiring apparatus according to the present invention is a wiring apparatus for placing an insulated wire on an insulating substrate with an adhesive and simultaneously bonding the insulated wire. At a crossing point, there is a sequence in which the wiring speed is set to 0.35 to 0.8 times the wiring speed at a non-crossing point.

[0010] In addition, the wiring speed at the place where the three times cross is
It is preferable that the speed is 0.35 to 0.5 times the wiring speed at a place where the wire does not intersect.

Further, when the double crossing point and the triple crossing point are located on the same substrate, the cloth at the position where the wiring crosses three times faster than the wiring speed at the double crossing point. It is preferable to have a sequence for reducing the linear velocity.

In addition, by using such a wiring device, a required wiring pattern can be formed by bonding and fixing an insulated wire on an insulating substrate with an adhesive.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 2, in a wiring apparatus according to the present invention, a head portion 10 and a slip ring 12 are attached to respective ends of a cylindrical sheath portion 11, and the sheath portion 11 is provided. A motor 133 for rotating and supporting the cylindrical portion of the head mounting portion 13 with two bearings (upper bearing 131 and lower bearing 132), and rotating the head portion 10 in the circumferential direction of the sheath portion 11 in the head mounting portion 13. Is mounted on the Y-axis moving gantry 15 so as to be able to move up and down by the vertical moving means 151, and the Y-axis moving gantry 15 is provided so as to be movable in the Y direction parallel to the ground, It can move in the X direction parallel to the ground and perpendicular to the Y direction,
Further, an X-axis moving table 14 for fixing the insulating substrate 3 with adhesive is provided.
0, a stylus 101 is provided, and an oscillation coil 111 for ultrasonic vibration is provided around the stylus 101. An ultrasonic oscillator 121 is connected to the oscillation coil 111 via a slip ring 12, and a sheath portion is provided. 1
Insulating wire 1 is passed through the inside of the cylinder 1 and the head 1
The stylus tip 105 of the stylus 101 is supplied to the stylus tip 105 by a feeder 103 of a zero, and a cutter 104 is provided near the stylus tip 105 for cutting the insulated wire 1 at a required length. Is mounted with a torque motor 102 for generating a torque in the direction of pressing the stylus chip 105 against the adhesive-attached insulating substrate 3. From the data of the position and angle of the corner of the pattern and the position where the insulated wire 1 is fixed, the Y-axis moving
5, the amount of movement of the X-axis moving table 14, the sheath 11
, The output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, and the like, and the insulated wire 1 is adhered and fixed on the insulated substrate 3 with an adhesive.
This is a wiring device containing a sequence for forming a necessary wiring pattern, and most of the conventional wiring devices can be used as they are.

Here, the insulated wire 1 prepared in advance
Of the Y-axis moving base 15 and the moving amount of the X-axis moving table 14 from the data of the position where fixing is started, the length, the position and angle of the corner portion of the wiring pattern, and the position where fixing of the insulated wire 1 is finished. , The rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the cutter 1
It is a numerical control device using a computer system that calculates the operation of 04, etc., and outputs the driving circuit of the Y-axis moving gantry 15, the driving circuit of the X-axis moving table 14, and the rotation driving of the sheath 11 A circuit, an output control circuit of the ultrasonic oscillator 121, an output drive circuit of the torque motor 102, and an electromagnetic lever drive circuit for cutting by the cutter 104 are connected, and drive respective mechanisms.

The feature of the present invention is that the magnet 116 provided in the middle of the stylus 101 and the Hall element 115 provided in the head unit 10 near the stylus 101 make the magnet 1
The position of the stylus 101 is detected by detecting the position of the stylus 101, and from the output of the position of the stylus 101, a point where the height of the stylus 101 greatly changes is detected by a differentiating circuit, and as shown in FIG. 1. A sequence having a sequence for detecting irregularities on the surface of an insulating substrate with an adhesive traced by 101 and controlling the moving speed of the Y-axis moving base 15 and / or the moving speed of the X-axis moving table 14 to be reduced. It is.

With such a wiring apparatus, a multi-wire wiring board can be manufactured by bonding and fixing an insulated wire on an insulating substrate with an adhesive to form a necessary wiring pattern.

In this case, as the insulated wire, a wire in which an insulating coating is formed on a metal wire can be used in the same manner as a normal multi-wire wiring board, and a copper wire, an aluminum wire, an iron wire, Alternatively, those plated with nickel, gold, cobalt, or the like can be used. As the metal wire, a copper wire having a diameter of 0.04 to 0.10 mm is preferable because it has high flexibility, easily forms a corner portion of the wiring pattern, and is inexpensive.

The insulating coating formed on the surface of the metal wire is preferably made of an epoxy resin or a polyimide resin because heat resistance and durability are excellent in consideration of use as a wiring board.

In general, the insulation-coated electric wire can be coated with a thin varnish such as a polyimide varnish and cured at a high temperature about 5 to 30 times to obtain a required thickness.

In order to increase the adhesive strength of the insulating substrate 3 with the adhesive, it is preferable to apply an adhesive to the surface of the insulating coating, and the resin of the adhesive is epoxy resin, polyimide resin or polyimide resin. It is preferable to be composed of an epoxy resin modified with, applied as a varnish,
It is preferable to use one that has been dried to such an extent that it is not completely cured.

The adhesive of the insulating substrate with the adhesive includes a usual adhesive,
It can be made of epoxy resin, polyimide resin or epoxy resin modified with polyimide. However, in order to form a wiring board, after the insulated wire 1 as a wiring pattern is bonded and fixed, it does not move as much as possible from the fixed position. When laying, it must satisfy the conflicting property of flowing to fill the insulated wire as much as possible. In practice, it is preferable to use a specially manufactured adhesive, and its thickness is also 0. .03-0.1
6 mm can be selected as needed.

As the insulating substrate, an insulating substrate which is used for a normal wiring board and which is obtained by impregnating a glass cloth with an epoxy resin or a polyimide resin can be used, and has an inner layer circuit board having an inner layer circuit formed therein. An insulating substrate can also be used.

As the insulating substrate with an adhesive, a substrate obtained by applying the above-mentioned adhesive in a varnish state to the above-mentioned insulating substrate, heating and drying to make a semi-cured state can be used. This adhesive is semi-cured to form a support film and is used as an adhesive film laminated on an insulating substrate.

[0024]

Examples and Comparative Examples (Wiring device) As shown in FIG. 2, a head portion 10 and a slip ring 12 are attached to respective ends of a cylindrical sheath portion 11, and the sheath portion 11 The cylindrical portion is rotatably supported on the head mounting portion 13 by two bearings (an upper bearing 131 and a lower bearing 132).
A motor 133 for rotating the head in the circumferential direction of the sheath portion 11 is mounted, and the head mounting portion 13 is mounted on a Y-axis moving gantry 15 so as to be able to move up and down by a vertical moving means 151, and the Y-axis moving gantry 15 is mounted on the ground. An X-axis moving table 14 is provided so as to be movable in the Y direction parallel to the ground, is movable in the X direction parallel to the ground and is orthogonal to the Y direction, and fixes the insulating substrate 3 with the adhesive. A stylus 101 extending to the tip of the head unit 10 and an oscillation coil 111 for ultrasonic vibration are provided around the stylus 101 in the cylinder 11. Sound wave generator 1
The insulated wire 1 is passed through the cylinder of the sheath 11 and supplied to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head 10, and the insulation is provided near the stylus tip 105. A cutter 104 for cutting the covered electric wire 1 to a required length is provided, and a torque motor 102 for generating a torque in a direction to press the stylus chip 105 against the adhesive-attached insulating substrate 3 is attached near the stylus chip 105. The Y-axis movement is performed based on the data of the position, length, position of the corner portion of the wiring pattern of the wiring pattern, the angle, and the position where the fixing of the insulated wire 1 is completed, which are prepared in advance. The moving amount of the gantry 15, the moving amount of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, and the torque Output of over data 102, cutter 10
4 and the like, the insulation-covered electric wire 1 is bonded and fixed on the adhesive-attached insulating substrate 3 to improve the conventional wiring device in which a sequence for forming a necessary wiring pattern is stored.

Further, according to this sequence, the position, length, position and angle of the corner portion of the wiring pattern of the wiring pattern prepared in advance, and the position where the fixing of the insulating coated electric wire 1 end are prepared. From the data of
The computer calculates the amount of movement of the Y-axis moving base 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, and the like. Using a numerical controller using the system, the output circuit includes a drive circuit for the Y-axis moving base 15, a drive circuit for the X-axis movement table 14, a rotation drive circuit for the sheath 11, an output control circuit for the ultrasonic oscillator 121, An output drive circuit of the motor 102 and an electromagnetic lever drive circuit for cutting by the cutter 104 are connected, and drive respective mechanisms.

The improved parts are the magnet 116 provided in the middle of the stylus 101 and the head unit 10 near the magnet 116.
And the Hall element 115 provided in the
, The position of the stylus 101 is detected, and from the output of the position of the stylus 101, a point where the height of the stylus 101 greatly changes is detected by a differentiating circuit, and as shown in FIG. Detects the irregularities on the surface of the insulating substrate with adhesive traced by
A switching sequence is provided in which the moving speed of the axis moving base 15 and / or the moving speed of the X-axis moving table 14 are controlled to be reduced.

The wiring speed at a place where no intersection occurs is 5.5 m /
And at intersections, it was lowered to 2.0-5.5 m / min. (Insulation-coated electric wire) Insulation-coated copper wire is a copper wire having a diameter of 80 μm and Pyre-ML-RC505 which is a polyimide resin.
7 (manufactured by DuPont, trade name), and repeatedly dried at 350 ° C. for 8 minutes, applied to a thickness of 23 μm,
HAW-216D (trade name, manufactured by Hitachi Chemical Co., Ltd.) as an adhesive was applied to the surface, and dried at 200 ° C. for 1 minute, and a layer having a thickness of 15 μm was used. (Insulating Substrate with Adhesive) As an insulating substrate with adhesive, I-671 having a thickness of 0.3 mm (trade name, manufactured by Hitachi Chemical Co., Ltd.) and AS-U01 having a thickness of 80 μm as an adhesive were used.
(Product name, manufactured by Hitachi Chemical Co., Ltd.) roll-laminated at a temperature of 120 ° C. was used. (Wiring) Using this wiring device, the insulated wire 1 is pulled out to the tip of the stylus 101 and is sandwiched between wire guide grooves (not shown) provided at the tip of the stylus tip 105, and the sequence is executed. When the numerical controller starts, the numerical controller starts to fix the first wiring data, that is, the position, the length, the position of the corner of the wiring pattern of the wiring pattern, the angle, and From the data at the position where the insulated wire 1 is fixed, the moving amount of the Y-axis moving base 15 and the X-axis moving table 1
4, the rotation angle of the sheath 11, the ultrasonic oscillator 121
, The output of the torque motor 102, the operation of the cutter 104, and the like, and the head unit 10 drives the Y-axis moving base 15 to move the X-axis moving table 14 on which the adhesive-attached insulating substrate 3 is fixed in the Y direction. When the head unit 10 is driven and moved in the X direction to a position where the insulated wire 1 is first fixed and stopped, the head unit 10 is moved to a predetermined position by the vertical moving unit 151 so that the stylus 101 comes into contact with the insulating substrate 3 with adhesive. When the insulated wire 1 is fixed to the starting point of the wiring by the DC power applied to the ultrasonic oscillator 121 and the pressing force applied by the torque motor 102, an AC signal is applied to the ultrasonic oscillator 121 and the stylus 101 is At the same time as starting to transmit the sonic vibration, the Y-axis moving
5 and the X-axis moving table 14 are driven to put the insulated wire 1 in the shape of the wiring pattern, and the adhesive on the insulated substrate 3 with the adhesive and the insulated wire 1 is applied by the ultrasonic vibration of the stylus 101. When the corners 4 of the wiring pattern are formed by activating and bonding with the adhesive applied on the surface to form the corners 4 of the wiring pattern, the driving of the Y-axis moving base 15 and the X-axis moving table 14 is stopped and the head 10 Only motor 1
When rotated by 33 and required angle calculated from the wiring data, the Y-axis moving base 15 and the X-axis moving table 14 are driven to continue bonding and fixing, and from the length calculated from the wiring data. Before the distance between the cutter 104 and the stylus 101 at the end point of the wiring, the cutter 104 is driven to cut the insulated wire 1, and the Y-axis moving gantry 1 is moved to the cut position.
5 and the X-axis moving table 14 are driven to perform bonding / fixing to the end point of the wiring, and the vertical moving means 151 is driven to raise the head unit 10 to the original position, read out the next wiring data, and Repeat this and finish all wiring,
By driving the vertical moving means 151, the head unit 1 is returned to the original position.
0 was increased, the Y-axis moving base 15 and the X-axis moving table 14 were driven to move the head unit 10 to the reference position of the wiring device, and the numerical controller stopped the sequence.

At this time, the wiring speed decreased at the place where the insulated wires crossed.

Next, the insulating substrate 3 with the adhesive is removed, a hole is cut out at the place to be connected, so that the insulated wire 1 is cut, the hole is electrolessly plated, and the connection is made by a through hole. Boards were manufactured.

As a result, Table 1 shows the relationship between the wiring speed and the occurrence of a defect at the double intersection, and Table 2 shows the relationship between the wiring speed and the occurrence of the defect at the triple intersection. Table 3 shows the relationship between the wiring speed and the occurrence of defects at the intersections where the double intersection and the triple intersection are in the same substrate.

[0031]

[Table 1] ○: No wire lifting, no disconnection, ×: Large wire deformation or disconnection

[0032]

[Table 2] ○: No wire lifting, no disconnection, ×: Large wire deformation or disconnection

[0022]

[Table 3]

[0033]

As described above, the present invention provides a wiring apparatus which is excellent in wiring density and does not break or break the insulation coating, and a method for manufacturing a wiring board using the wiring apparatus. be able to.

[Brief description of the drawings]

FIG. 1 is a diagram showing a sequence used in one embodiment of the present invention.

FIG. 2 is a side view showing a wiring device used in one embodiment of the present invention.

FIG. 3 is a side view showing a conventional wiring apparatus.

[Explanation of symbols]

1. Insulated wire 3. 9. Insulating substrate with adhesive Head part 101. Stylus 102. Torque motor 103. Feeder 104. Cutter 105. Stylus tip 11. Sheath part 111. Oscillation coil 115. Hall element 116. Magnet 12. Slip ring 121. Ultrasonic oscillator 13. Head mounting part 131. Upper bearing 132. Lower bearing 133. Motor 14. X-axis moving table 15. Y-axis moving base 151. Vertical moving means

Continuation of the front page (72) Inventor Masami Kashiwazaki 1500 Ogawa, Oji, Shimodate-shi, Ibaraki F-term in Hitachi Chemical Industry Co., Ltd. Shimodate Plant (reference) 5E343 DD65 FF30 GG11

Claims (4)

[Claims] 1. A wiring device for applying an insulated wire on an insulated substrate with an adhesive and simultaneously bonding the insulated wire. A wiring apparatus having a sequence for making the wiring speed 0.35 to 0.8 times the wiring speed at the time of wiring. 2. A wiring speed at a place where an insulated wire crosses three times is 0.35 to 0.5 of a wiring speed at a place where the insulation-covered wire does not cross.
2. The method according to claim 1, further comprising a doubling sequence.
The wiring device according to item 1. 3. The wiring of a portion where wiring is performed three times faster than the wiring speed of a portion where the double crossing is performed when the double crossing and the triple crossing are in the same substrate. The wiring apparatus according to claim 1, further comprising a sequence for reducing a speed. 4. An insulated wire (1) is fixed to an insulating substrate (3) with an adhesive in the form of a circuit using the wiring device according to any one of claims 1 to 3. Method of manufacturing wiring boards.