JPH103632A - Magnetic head suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make excellent a following property of a slider for waviness on a magnetic disk surface, to make possible stable operation answering to miniaturization and thinning and to make possible easily controlling impedance. SOLUTION: This suspension 100 is constituted so as to provide a gimbals suspension 120 loading the slider loading a magnetic head and provided with sufficiently low regidity required for that the slider follows waviness vibration on the disk surface and a load beam 110 supporting the gimbals suspension 120 and provided with the sufficiently high rigidity required for imparting prescribed weight to the slider loading the magnetic head. In such a case, wiring layers (131a, 131b) consisting of plural conductive thin films for connecting the magnetic head part with a read/write circuit of a magnetic disk device are provided along one surface of the gimbals suspension 120 (consisting of flexer). Then, the wiring layers (131a, 131b) consisting of respective conductive thin films are provided with insulative resin layers 132a, 132b in the shapes along the shapes of respective wiring layers 131a, 131b on the gimbals suspension 120 side surface of the wiring layers 131a, 131b, and the wiring layers 131a, 131b are overlapped by double layers or above at least in a part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head suspension for a magnetic disk.

[0002]

2. Description of the Related Art Conventionally, a magnetic head suspension which is used in a magnetic disk device and supports a magnetic head for writing data to a disk or reading data from a disk is composed of a load beam 610, a mount plate 650, and a magnetic head as shown in FIG. It comprises a pal suspension 620 and a slider 640 on which a magnetic head (not shown) is mounted at the tip of the gimbal suspension 610. The load beam 610 has sufficiently high rigidity to apply a predetermined load to the slider 640 mounted with the magnetic head, and the gimbal suspension 620 is necessary for the slider 640 mounted with the magnetic head to follow the undulation of the disk surface. Has sufficiently low rigidity. The magnetic head suspension 600 applies a pressing load to a slider 640 on which a magnetic head is mounted as a whole.
In a magnetic disk drive, the slider comes into contact with the disk while the disk is stopped, and the slider flies at a position where the buoyancy generated between the slider and the disk by rotation of the disk and the pressing load by the magnetic head suspension balance. I do. In this state, writing and reading are performed by the magnetic head. Slider 640
Is electrically connected to the read / write (Reed / Write) circuit of the magnetic disk drive via a tube-coated conductive wire routed and arranged on a magnetic head suspension. The tube coating conductor 630 is fixed to the load beam and the mount plate by the fixing claws 631.

[0003] In recent years, the miniaturization and thinning of magnetic disk devices have progressed, and the spacing between disks has become narrower. As a result, the miniaturization and thinning of sliders and magnetic heads have been promoted. However, in the conventional magnetic head suspension shown in FIG.
With the downsizing and thinning of the tube 40, the tube-coated conductor becomes relatively large with respect to the slider and the magnetic head suspension, and the load due to the rigidity of the tube-coated conductor 630 follows the swell of the slider on the disk surface. There has been a problem in that the wire is lowered or the tube coating conductor 630 comes into contact with the disk surface to break the wire.

On the other hand, the structure of the magnetic head mounted on the slider 640 has changed from a monolithic structure in which the coil is manually wound by integral machining to a composite in which the coil is manually wound by split machining. According to the method, inductive for forming a coil for writing and reading has become mainstream. Further, in response to a demand for an increase in the storage capacity of a magnetic disk drive, a high-density magnetic head (MR (Magneto-Resistive)) is used.
Use of the head is progressing. However, this MR head is read-only, and the slider must be equipped with a write-only thin film head in addition to the MR head.
Two to four lead wires are required to connect the magnetic head mounted on the slider to the electric circuit in the magnetic disk drive. As a result, the problem of deterioration of the follow-up characteristic to the undulation on the disk surface due to the rigidity of the tube-coated conductor and the problem of disconnection due to the contact of the tube-coated conductor are further exacerbated.

[0005] As a method for dealing with such a problem,
In place of the tube-coated conductor, a flexible film in which a plurality of conductors are coated with an insulating resin is used to make an electrical connection between the magnetic core and the magnetic head suspension, and the flexible film allows a desired connection. A magnetic head suspension capable of providing a damping action is disclosed in Japanese Patent Laid-Open No. 1-162221.
No. 2 discloses this. In addition, an insulating layer is formed on the load beam or cymbal suspension instead of the tube-coated conductor, and an electric conductive path is formed on this insulating layer. No extra load is applied to the slider, and it is excellent against undulation on the disk surface. Japanese Patent Application Laid-Open No. HEI 6-124558 discloses a magnetic head suspension that has excellent followability and can suppress vibration of the magnetic head suspension.

However, in order to transmit a small sense current picked up by the MR head to an electronic circuit of the drive without attenuating or delaying the signal, an electric conduction path formed on a gimbal suspension is required. The importance of the design of the load impedance of the signal wiring is increasing together with the followability of the slider to the disk surface. The load impedance of the wiring is often caused by the capacitance component determined by the distance and the facing area between the wiring and the ground and the dielectric constant of the insulating layer interposed between the wiring and the ground. This will cause a delay when the signal passes through the upper electric conduction path, but the material that forms the suspension requires a spring that has the ability to follow the disk surface of the slider. In addition, since an iron-based material such as stainless steel is mainly used, the stainless steel and an electric conduction path existing on the stainless steel via an insulator form a capacitor serving as a base for forming a load capacitance. Because of this,
From the viewpoint of load capacity formation, it is necessary to make the insulating layer thicker, and in addition to the miniaturization of the electric conduction path itself, there is a restriction that the insulating layer must be made thicker without lowering the springiness of the gimbal suspension itself. There is.

The magnetic head suspensions disclosed in Japanese Patent Application Laid-Open Nos. 1-162212 and 1-162212 cannot cope with this. Also,
JP-A-1-162212 and JP-A-1-162221
In the magnetic head suspension disclosed in Japanese Patent Publication No.
A load beam made of a thin metal plate such as stainless steel (SUS304) and an insulating layer made of an insulating resin are fixedly formed on almost the entire surface of one surface of the gimbal suspension. When thermal deformation occurs, a stress load is applied from the insulating layer to the gimbal suspension, which has a problem of adversely affecting the ability of the slider to follow the undulation of the magnetic disk surface.

Further, when computer processing is performed on a high-definition image in which access to a disk is sequential, the data transfer rate between disk controllers and between controller hosts is limited by the access time such as seek time and rotation wait time. In some cases, the total performance of image processing is degraded. In order to transfer these large amounts of data at high speed, recently, 40-
60 Mbit / sec is becoming mainstream, and at present, it is in the stage of being practically used up to about 100 Mbit / sec. In other words, there has been a demand for a device capable of transmitting a minute sense current picked up from a slider by a suspension wiring without attenuating it.

[0009]

As described above, a magnetic head suspension for a magnetic disk drive is described as follows.
There is a need for a slider that is excellent in followability of the slider to the waviness of the magnetic disk surface and that can operate stably in response to miniaturization and thinning. In particular, there has been a demand for a device capable of easily performing stable impedance control for high-speed small signal transmission. Under such circumstances, the present invention provides a magnetic disk drive that is excellent in followability of a slider to waviness of a magnetic disk surface, can operate stably in response to miniaturization and thinning, and can easily perform impedance control. To provide a magnetic head suspension for use.

[0010]

A magnetic head suspension according to the present invention has a gimbal suspension having a sufficiently low rigidity necessary for mounting a slider on which a magnetic head is mounted and for allowing the slider to follow undulating vibration of a disk surface. And a load beam that supports the gimbal suspension and has a sufficiently high rigidity required to apply a predetermined load to a slider on which the magnetic head is mounted. A wiring layer made of a plurality of conductive thin films for connecting the magnetic disk drive and a read / write circuit is provided along one surface of the gimbal suspension. The wiring layer made of each conductive thin film is a gimbal of the wiring layer. An insulating resin layer is provided on the side surface of the suspension in a shape following the shape of each wiring layer, and Wiring layer in at least a part is characterized in that the overlapping of two or more layers without electrically shorted. In the above, a plurality of wiring layers having different widths and lengths are provided, and the second wiring layer is formed on the first wiring layer with respect to at least a part of the first wiring layer. Along the wiring locus and so as to cover the first wiring layer. Further, the insulating resin layer on the gimbal suspension (spring) side of each wiring is characterized by being made of an electrodeposition adhesive material, and the insulating resin layer on the gimbal suspension (spring) side of each wiring is It is characterized by comprising at least two or more kinds of insulating materials including an electrodeposition adhesive material. Also, in the above,
At least one of the wiring layer and the insulating resin layer is formed by transfer.

[0011]

According to the magnetic head suspension of the present invention having such a structure, the slider is excellent in following the undulation of the magnetic disk surface, and can operate stably in response to miniaturization and thinning. And impedance control can be easily performed. More specifically, a wiring layer made of a plurality of conductive thin films for connecting a magnetic head portion to a read / write circuit of a magnetic disk drive is provided along one surface of a gimbal suspension (made of a flexure). This is achieved by providing an insulating resin layer on the side surface of the gimbal suspension in a shape that conforms to the shape of each wiring layer, and at least partially overlapping two or more wiring layers. doing. Specifically, by having a plurality of wiring layers having different widths and lengths, and
This is achieved by providing the second wiring layer along the wiring trace of the first wiring layer and covering the first wiring layer with respect to a part of the wiring layer.

The insulating resin layer on the gimbal suspension (spring) side of each wiring is made of an electrodeposition adhesive material, so that it can be formed relatively easily by electrodeposition. Spring)
The insulating resin layer on the side is made of at least two or more kinds of insulating materials including an electrodeposition adhesive material, so that the degree of freedom of material selection is further increased. In addition, since at least one of the wiring layer and the insulating resin layer is formed by transfer, the manufacturing thereof is simplified.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a magnetic head suspension according to the present invention will be described below with reference to FIG. FIG. 1A is a plan view showing a schematic configuration of a magnetic head suspension according to an embodiment, and FIG. 1B is a side view of the magnetic head suspension shown in FIG. 1A, and FIG. Is a cross-sectional view of the wiring layer, and shows a cross section taken along line A1-A2 in FIG. FIG. 2 is an exploded view for explaining constituent members of the magnetic head suspension shown in FIG. 1 and 2
Medium, 100 is a magnetic head suspension, 110 is a load beam, 110a is a tip, 120 gimbal suspension, 120a is a tip, 130 is a wiring part, 131
a, 131b are wiring layers (conductive thin films), 132a, 132
b is an insulating resin, 132A is a photosensitive resin, 132B is an electrodeposition adhesive, 140 is a slider, 150 is a mount plate, and 151 is a hole. The magnetic head suspension 100 according to the present embodiment is a magnetic head suspension for a magnetic disk device, which is excellent in followability of the slider to the undulation of the magnetic disk surface, can operate stably in response to miniaturization and thinning, and As shown in FIG. 1A, the impedance can be easily controlled. As shown in FIG. 1A, a load beam 110, a gimbal suspension 120 supported on the load beam 110, and a mount plate 150 for fixing the load beam to the apparatus. And a slider 140 mounted on the gimbal suspension 120 and mounted with a magnetic head. A conductive surface connecting the magnetic head and the circuit of the device is provided on one surface above the gimbal suspension 120 as shown in FIG. Layer 131 made of conductive thin film
a and 131b are replaced with insulating resins 132a and 132b, respectively.
, And are provided so as to be partially multilayered.

The gimbal suspension 120 has a sufficiently low rigidity required for mounting a slider 140 on which a magnetic head (not shown) is mounted and for allowing the slider 140 to follow the undulating vibration of the disk surface. , Made of stainless steel (SUS304) having a thickness of 20 μm.
In order to connect to a write circuit (not shown), a wiring 130 made of a plurality of conductive thin films is provided. The wiring layer made of each conductive thin film has an insulating resin layer provided on the side of the gimbal suspension of the wiring layer in a shape following the shape of each wiring layer, and as shown in FIG. Two or more layers overlap. As shown in FIG. 1A, the distal end 1 of the gimbal suspension 120
Reference numeral 20a protrudes from the distal end 110a of the load beam 110, and a slider 140 having a magnetic head is mounted on the distal end 120a.

The load beam 110 supports the gimbal suspension 120 and has a sufficiently high rigidity required to apply a predetermined load to the slider on which the magnetic head is mounted. The mount plate 140 is for fixing the load beam to the magnetic disk drive by the hole 141, and is made of 75 μm thick stainless steel (SUS304). The mount plate 140 has a thickness of 300 μm.
Made of stainless steel (SUS304).

First, the configuration of the wiring section 130 formed on the gimbal suspension will be described. Wiring section 130 made of a conductive thin film connecting the magnetic head and the circuit of the device
As shown in FIG. 1C, the insulating resin 132a and the wiring layer 131 are sequentially arranged from the gimbal suspension 120 side.
a, the insulating resin 132b, the wiring layer 131b, and two wiring layers are overlapped. The insulating resin 132a is formed only under the wiring layer 131a, and the insulating resin 132b is formed only under the wiring layer 131b. There is no insulating layer in a region where no wiring layer exists. That is, the region where the surface of the gimbal suspension 120 is covered with the insulating layer 132 is only the region where the wiring layer is formed. Therefore,
In the magnetic head suspension 100 of the present embodiment, the area in which the surface of the gimbal suspension 120 is covered by the insulating layer is significantly larger than that of the conventional magnetic head suspension in which the conductive layer is formed in a predetermined pattern via the insulating layer. It has been reduced. Therefore, the thermal expansion coefficient of the gimbal suspension 120 and the insulating layers 132a, 132
Even if the thermal expansion coefficient of the gimbal suspension 120 is different from that of the conventional one, the stress load due to the thermal deformation from the insulating layer 132 to the gimbal suspension 120 is extremely small,
The followability of the slider 140 to the undulation of the magnetic disk surface is superior to that of the conventional one. Further, if the wiring layer 131b on the wiring layer 131a is assigned as a ground wiring layer, a structure as a strip line which provides a shielding effect against signals passing through the wiring layer 131a is made possible. In this case, it is possible to transfer data at high speed without being affected by noise. FIG.
(B) (a) shows the wiring under the slider 140, and even in this part, the first wiring layer 131a
The lower insulating resin 132b is formed to be fine and thin, and the width of the second wiring layer 131b is larger than that of the first wiring layer 131a.
In addition, if the lower insulating resin 132b is formed thicker than the insulating resin 132a, the first wiring layer 131a is used as a signal line, and the second wiring layer 131b is used as a ground line, it is particularly affected by noise. It can be difficult.
The positional relationship between the two figures is shown in the direction A3 in FIG. 2A and the direction A3 in FIGS. 2B and 2A. FIG. 2B and FIG.
2A and 2B are enlarged and simplified in FIG. 2B and FIG. 2B.

The wiring layers 131a and 131b are made of a 0.05 mm thick copper (Cu) thin film formed by plating. The wiring layer is not limited to this, and is formed by plating or the like, silver, gold, nickel, chromium, zinc, tin,
Platinum or the like may be used. The film thickness needs to be as small as possible in a range that does not increase the electric resistance excessively, and it is necessary to make the film as thin as possible in order to achieve a thin film. The insulating resins 132a and 132b use an electrodepositable adhesive material (hereinafter, referred to as an electrodeposited adhesive material).
As shown in (c), the insulating resins 132a and 132b are each a photosensitive resin (specifically, a polyimide resin having heat resistance) in order from the gimbal suspension side.
132A and an electrodepositable adhesive material (hereinafter referred to as an electrodeposited adhesive material) 132B. The electrodeposition adhesive material 1
32B has both an adhesive function and an insulating function. In addition, although the photosensitive resin 132A of this example was used,
It is not particularly limited to this. For example, photosensitive resin 132A
Alternatively, a thermosetting resin may be used.

Here, a modified example of the configuration of the wiring section 130 formed on the gimbal suspension and having two wiring layers will be briefly described with reference to FIG. First, Modification 1 will be described. FIG. 3A is a cross-sectional view illustrating a first modification, and the insulating resins 132a, 132a, and 1b in FIG.
32b is made of an electrodeposition adhesive material 132B, and the insulating resin has both an adhesive function and an insulating function between the gimbal suspension and the wiring.

Next, a second modification will be described. FIG. 3 (b)
Is a cross-sectional view showing Modification Example 2, in which the insulating resin 132a in FIG. 1C and the photosensitive resin (specifically, a heat-resistant polyimide-based resin) 132A are sequentially arranged from the gimbal suspension side. Consisting of an adhesive material 132B,
The insulating resin 132b is formed of an electrodeposition adhesive material 132B. The electrodeposition adhesive material 132B is
It has both an adhesive function and an insulating function. Also,
Although the photosensitive resin 132A of this modification is used, the invention is not limited to this. For example, a thermosetting resin may be used instead of the photosensitive resin 132A.

The electrodeposition adhesive material may be any material which exhibits tackiness at room temperature or by heating. Examples of the polymer used include anionic or cationic synthetic polymer resins having tackiness. Can be. As the anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin alone, or as a mixture of any combination of these resins Can be used. Further, the above-mentioned anionic synthetic resin may be used in combination with a crosslinkable resin such as a melamine resin, a phenol resin and a urethane resin. In addition, as the cationic synthetic polymer resin, an acrylic resin, an epoxy resin, a urethane resin, a polybutadiene resin, a polyamide resin, a polyimide resin, or the like can be used alone or as a mixture of any combination thereof. Further, the above cationic synthetic polymer resin and a crosslinkable resin such as a polyester resin and a urethane resin may be used in combination. Further, in order to impart tackiness to the above-mentioned polymer resin, a rosin-based, terpene-based, or petroleum-based resin for imparting tackiness can be added as necessary. The polymer resin is subjected to an electrodeposition method in a state of being solubilized in water or neutralized by an alkaline or acidic substance in a production method described later, or in a water-dispersed state. That is, the anionic synthetic polymer resin is neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine, and diisopropanolamine, and with an inorganic alkali such as ammonia and potassium hydroxide. The cationic synthetic polymer resin is neutralized with an acid such as acetic acid, formic acid, propionic acid, and lactic acid. Then, the polymer resin solubilized in the neutralized water is used in a state of being diluted with water as a water dispersion type or a solution type. In addition, for the purpose of enhancing the reliability of the adhesive material such as insulation and heat resistance, a known thermosetting resin having a thermopolymerizable unsaturated bond such as a blocked isocyanate is added to the polymer resin, and heat treatment is performed. The adhesive material may be cured. Of course, if a resin having a polymerizable unsaturated bond (for example, an acrylic group, a vinyl group, an allyl group, or the like) is added in addition to the thermosetting resin, the adhesive material can be cured by electron beam irradiation.
In addition to the above, as the adhesive material, not only a thermoplastic resin but also an adhesive resin which loses adhesiveness after being cured by a thermosetting resin may be used as long as it exhibits adhesiveness at room temperature or by heating. Further, those containing an organic or inorganic filler may be used in order to increase the strength of the coating film. Further, the adhesive material may be an electrodepositable adhesive material which exhibits fluidity at normal temperature or when heated.

When the electrical insulation function and the adhesion function of the stainless (SUS304) and copper (Cu) wirings are divided into different materials, a photosensitive resin or a thermosetting resin is used as the resin having the electrical insulation function. is there. As a photosensitive resin, a novolak resin, a quinonediazide-based material as a substance that promotes dissolution by light irradiation to a polyimide resin,
Those to which substances such as nitrobenzylsulfonic acid ester type and dihydropyridine type are added can be mentioned.
Further, as the photosensitive resin, a novolak resin or a polyimide resin having a substituent in the resin that promotes dissolution by light irradiation can be used. Further, a known thermosetting resin having a thermopolymerizable unsaturated bond such as a blocked isocyanate is added to the photosensitive resin, and the resin can be cured by heat treatment. Of course, besides the thermosetting resin, polymerized unsaturated bonds (for example, acrylic group, vinyl group,
If a resin having an allyl group) is added to the photosensitive resin, the resin can be cured by electron beam irradiation.

The magnetic head suspension 10 of this embodiment
0 is the load beam 110, gimbal suspension 110, slider 140, mount plate 150
Are prepared and assembled.

Hereinafter, the gimbal suspension 12 of the present embodiment shown in FIG.
0 will be described with reference to FIG. First, in order to manufacture a transfer master for transferring the wiring layer 131 onto the gimbal suspension 120 (made of flexure) of the magnetic head suspension 100, a photoresist layer is applied on a conductive substrate 210 as a transfer substrate. hand,
A predetermined region of the photoresist layer is exposed using a predetermined pattern plate (not shown), and a desired resist pattern 220 is formed through a development process. (FIG. 4 (a))
As the conductive substrate 210, at least a surface having conductivity is sufficient, and a conductive metal plate such as aluminum, copper, nickel, iron, stainless steel, or titanium, or a glass plate, polyester, polycarbonate, polyimide, A resin film made of a resin film such as polyethylene or acrylic and having a conductive thin film formed on the surface of the insulating substrate can also be used. Further, in order to improve the printing durability as an original plate, a thin film of chromium, ceramic Kanigen (manufactured by Kanigen, Ni + P + SiC) or the like may be formed on the surface of the conductive substrate. The thickness of this thin film is 0.1 to 1.0.
It is preferably about μm. An exposed portion 211 of the surface of the conductive substrate 210 which is not covered with the resist layer is a portion where a wiring layer is formed. Next, a conductive layer 231 is formed on the exposed portion by a plating method. (FIG. 4B) Next, an adhesive layer (insulating resin layer) 232 is formed on the conductive layer 231 by an electrodeposition method. (FIG. 4C) Thereby, the conductive layer 231 and the adhesive layer (insulating resin layer) are formed.
The transfer original plate 240 provided with the transfer pattern layer 230, which is a laminate with the H.232, is obtained. On the other hand, a stainless steel (SUS304) 120A for the gimbal suspension 120 (made of flexure) is prepared, and the photosensitive resin 260 is applied to the surface on which the wiring layer is provided, and then dried. (FIG. 4 (d)) As an application method, a curtain coat, a screen coat, a roll coat, or the like can be used in the case of in-line processing, and a spin coat, curtain coat, screen coat, or the like can be used in the case of single-wafer processing. Next, the transfer original plate 240 is made of an insulating resin layer 232 made of stainless steel 12.
It is press-bonded so as to be in contact with the 0 A photosensitive resin 260 side.
(FIG. 4E) This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. In the case where the adhesive layer 232 exhibits tackiness or adhesiveness by heating, thermocompression bonding can be performed. Next, the conductive substrate 210 is separated from the stainless steel material 120A, and the conductive layer 231 is transferred onto the stainless steel material 120A (FIG. 4F). The photosensitive resin 260 is transferred using the transferred conductive layer 231 as a mask. After exposure and development, the photosensitive resin 260 and the adhesive layer 23 are formed only under the wiring pattern 131a made of the conductive layer 231.
2 is formed. (FIG. 4
(G))

Next, obtained by the process of FIG.
Wiring layer 131 formed on the stainless material 120A
The photosensitive resin 260 is applied to the entire upper surface and dried. (FIG. 4 (h)) The coating method can be performed in the same manner as in the step of FIG. 4 (d). After this,
4 (a) to 4 (c) are repeated to obtain again a transfer master 240A provided with a transfer pattern layer 230A which is a laminate of the conductive layer 231 and the adhesive layer 232. (FIG. 4 (i)) In the case of the transfer master 240A, the transfer master 240 (FIG.
The widths of the conductive layer 231 and the adhesive layer 232 are made wider than those shown in FIG. Next, the transfer original plate 240A is pressed in the same manner as in FIG. 4E so that the adhesive layer 232 contacts the photosensitive resin 260 side of the stainless steel material 120A, and then the conductive substrate 210 is peeled from the stainless steel material 120A. Then, the conductive layer 231 is transferred onto the stainless steel material 120A.
(FIG. 4 (j)) Then, the photosensitive resin 260 is exposed using the transferred conductive layer 231 as a mask, and after being subjected to a development process, the photosensitive resin 260 is exposed only under the wiring pattern 131b composed of the transferred conductive layer 231. An insulating resin layer 132b composed of 260 and an adhesive layer 232 is formed. (FIG. 4 (k)) In this manner, two wiring layers are formed on the stainless steel material 120A.
It can be formed in layers.

Thereafter, although not shown in the figure, a plating resist is formed on the entire surface of the stainless steel material 120A formed by laminating two wiring layers by a method shown in FIG. Ni / Au plating is performed on the wiring layer exposed from the resist.
A can be formed into a predetermined shape by etching to obtain a gimbal suspension 120 having two wiring layers. The Ni / Au plating on the wiring layer is a process for electrical connection between the slider on which the magnetic head is mounted and the gimbal suspension and for electrical connection from the gimbal suspension to the control unit. Is not particularly limited. For example, any surface treatment may be performed for the purpose of bonding and connecting a signal from a magnetic head such as a noble metal plating such as Pd or Ag to wiring on a gimbal suspension.

In FIG. 4H, without applying the photosensitive resin 260, the transfer original 240a is pressed so that the adhesive layer 232 is in contact with the photosensitive resin 260a side of the stainless steel material 120A, and the conductive layer 231 is made of stainless steel. The insulating resin layer composed of only the adhesive layer 232 may be formed only under the wiring pattern 131a composed of the transferred conductive layer 231 after being transferred onto the material 120A.

Next, the insulating resin 13 shown in FIG.
A method of manufacturing a gimbal suspension using a thermosetting resin instead of the photosensitive resin 132A of 2a and 132b will be described with reference to FIG. First, in the same manner as in FIGS. 4A to 4C, the transfer original plate 340 provided with the transfer pattern layer 330, which is a laminate of the conductive layer 331 and the adhesive layer 332, is manufactured. (FIG. 5 (a)) On the other hand, a stainless material (SUS304) 370A for the gimbal suspension 120 is prepared, and a varnish-like thermosetting resin 360 is applied to the surface on which the wiring layer is provided, and then prebaked. I do. (FIG. 5B) Thereafter, the transfer original plate 340 is pressed so that the adhesive layer 332 is in contact with the thermosetting resin 360 side of the stainless material 370A. (FIG. 5C) This pressure bonding may be performed by any method such as roller pressing, plate pressing, and vacuum pressing. Thereafter, the conductive substrate 310 is peeled off from the stainless steel material 370A, and the conductive layer 331 is transferred onto the stainless steel material 370A (FIG. 5D). Resin 3
60 is removed by wet etching, and an insulating resin layer 332a composed of a thermosetting resin 360 and an adhesive layer 332 is formed only under the wiring pattern 331a composed of the transferred conductive layer 331. (FIG. 5 (e))

Next, obtained by the step of FIG.
The conductive layer 331 formed on the stainless material 370A
A thermosetting resin 360 is applied to the entire surface of the wiring pattern 331a made of and then prebaked. (FIG. 5 (f)) The coating method can be performed in the same manner as in the step of FIG. 4 (d). After this,
4 (a) to 4 (c) are repeated to obtain a transfer original plate 340A provided with a transfer pattern layer 330A which is a laminate with the conductive layer 331a and the adhesive layer 332 again. (FIG. 5 (g)) In the case of the transfer master 340A, the transfer master 340 (FIG.
The widths of the conductive layer 331 and the adhesive layer 332 are wider than those in FIG. Next, the transfer original plate 340A is pressure-bonded so that the adhesive layer 332 contacts the thermosetting resin 360 of the stainless steel material 370A. (FIG. 5 (h)) The pressure bonding can be performed in the same manner as in the step of FIG. 5 (c). Next, the conductive substrate 310 is peeled off from the stainless material 370A, and the conductive layer 331 is transferred onto the stainless material 370A (FIG. 5 (i)), and the thermosetting resin 360 is transferred using the transferred conductive layer 331 as a mask. Is removed by wet etching, and the wiring layer 3 including the transferred conductive layer 331 is removed.
An insulating resin layer 332b composed of a thermosetting resin 360 and an adhesive layer 332 is formed below 31b. (FIG. 5 (j))

Thereafter, although not shown, Ni / Au plating is applied only to a predetermined portion of the wiring layer and the stainless material 370A is etched into a predetermined shape in the same manner as in the step of FIG. Gimbal suspension 3 with layers
20 can be obtained. In FIG. 5F, a gimbal suspension 120 having two wiring layers may be obtained by using a photosensitive resin instead of the thermosetting resin 360 and performing the same processing as the processing shown in FIG. good.

In the method shown in FIGS. 4 and 5, after the wiring layer is formed on the stainless steel material, the stainless steel material is etched to have a predetermined shape. And a wiring layer may be formed thereon.

[0031]

As described above, by providing a fine wiring layer in multiple layers on one surface of the gimbal suspension as described above, the slider is excellent in following up the undulation of the magnetic disk surface, and is small and thin. Accordingly, it is possible to provide a magnetic head suspension for a magnetic disk drive, which can perform stable operation in accordance with the trend and facilitate impedance control.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a magnetic head suspension according to an embodiment.

FIG. 2 is a diagram showing a development view and the like of a magnetic head suspension of the embodiment.

FIG. 3 is a diagram showing a modification of the wiring layer of the gimbal suspension in the magnetic head suspension of the embodiment.

FIG. 4 is a manufacturing process diagram of a gimbal suspension in the magnetic head suspension of the embodiment.

FIG. 5 is a manufacturing process diagram of a gimbal suspension in the magnetic head suspension of the embodiment.

FIG. 6 is a schematic view for explaining a conventional magnetic head suspension.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Magnetic head suspension 110 Load beam 110a Tip 120 Gimbal suspension 120a Tip 130 Wiring 131a, 131b Wiring layer (conductive thin film) 132a, 132b Insulating resin 132A Photosensitive resin 132B Electrodeposited adhesive layer 140 Slider 150 Mounting plate 151 Hole Part 120A stainless steel (SU
S304) 210 conductive substrate 220 photoresist layer 220A resist pattern 230, 230A transfer pattern layer 231 conductive layer 232 adhesive layer 240, 240A transfer master 260 photosensitive resin 310 conductive substrate 320 photoresist layer 330, 330A transfer pattern layer 331 Conductive layer 331a, 331b Wiring layer 332 Adhesive layer 332a, 332b Insulating resin layer 340, 340A Transfer original plate 360 Thermosetting resin 370A Stainless steel (SU
S304)

Claims (6)

[Claims] 1. A gimbal suspension having a sufficiently low rigidity required for mounting a slider on which a magnetic head is mounted and following the waviness of the disk surface, and supporting the gimbal suspension, What is claimed is: 1. A magnetic head suspension for a magnetic disk drive, comprising: a load beam having a sufficiently high rigidity required to apply a predetermined load to a mounted slider, wherein the magnetic head unit is connected to a read / write circuit of the magnetic disk drive. The wiring layer made of a plurality of conductive thin films is provided along one surface of the gimbal suspension, and the wiring layer made of each conductive thin film is formed on the side of the gimbal suspension of the wiring layer along the shape of each wiring layer. And an insulating resin layer is provided, and at least a part of the wiring layers overlaps at least two layers. A magnetic head suspension characterized in that: 2. The magnetic head suspension according to claim 1, comprising a plurality of wiring layers having different widths and lengths. 3. The first wiring layer according to claim 1, wherein at least a part of the first wiring layer has a second wiring layer along a wiring trace of the first wiring layer and covers the first wiring layer. A magnetic head suspension characterized by being provided as follows. 4. A magnetic head suspension according to claim 1, wherein the insulating resin layer on the gimbal suspension side of each wiring is made of an electrodeposition adhesive material. 5. The magnetic head suspension according to claim 1, wherein the insulating resin layer on the gimbal suspension side of each wiring is made of at least two or more kinds of insulating materials including an electrodeposition adhesive material. 6. The magnetic head suspension according to claim 1, wherein at least one of the wiring layer and the insulating resin layer is formed by transfer.