JP2012089204A - Flexure substrate with wiring, method for manufacturing flexure substrate with wiring, flexure with wiring, flexure with wiring with element and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexure substrate with wiring which has no disconnection failure and can be easily formed.SOLUTION: The flexure substrate with wiring has: a laminated wiring formation part having a first insulator layer, a first conductor layer formed on the first insulator layer, a second insulator layer formed on the first conductor layer, and a second conductor layer formed on the second insulator layer so as to overlap the first conductor layer in a thickness direction; and a terminal formation part formed at an end part of the wiring formation part to have a first terminal part arranged on the first insulator layer to be connected to the first conductor layer, and a second terminal part arranged on the first insulator layer to be connected to the second conductor layer. In the flexure substrate with wiring, a pillow part made of the same material as that of the first conductor layer and insulated from the first conductor layer is formed a connection region for connecting the second conductor layer and the second terminal part, and the second conductor layer and the second terminal are connected through a pillow part conductor layer formed on the pillow part.

Description

  The present invention relates to a flexure substrate with wiring that can be easily formed without disconnection failure.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. Therefore, higher functionality is also required for the flexure substrate with wiring (flexure) used in the HDD.

  The flexure substrate with wiring usually has a lead wiring composed of a pair of wirings and a write wiring composed of a pair of wirings. Conventionally, such a pair of wirings has been formed on the same surface of the insulating layer. On the other hand, a flexure substrate with wiring is known in which one wiring and the other wiring of a pair of wirings are laminated via an insulating layer for the purpose of increasing the density of wiring and lowering impedance (patent) Reference 1 FIG. 9).

In such a flexure substrate with wiring, one wiring and the other wiring are laminated via an insulating layer. However, in the terminal forming portion that connects to an external circuit, from the viewpoint of easy connection Both wirings are preferably formed on the same plane. Therefore, in the vicinity of the terminal forming portion, the height of the upper wiring is made equal to the height of the lower wiring.
However, when the upper wiring is simply aligned with the lower wiring, for example, when the upper wiring is lowered to the position of the lower wiring at an angle of 90 °, stress is applied to the corner of the wiring. There has been a problem that there is a possibility that disconnection or the like may occur due to concentration.
For such a problem, in Patent Document 2, a first conductor layer (upper wiring) and a second conductor layer (lower wiring), which are a pair of wirings, are arranged via a second insulating layer. In the connection region between the wiring formation portion and the terminal formation portion where the second conductor layer is disposed at the same height as the first conductor layer, the inclined structure in which the height of the second insulating layer gradually decreases ( It is disclosed that it has a slope. According to such a method, since no corner is formed in the wiring, disconnection or the like can be effectively prevented.
However, in order to form an insulating layer having such a slope, there is a problem that it is limited to an insulating layer made of a photosensitive material, and further, a complicated process such as exposure using a gradation mask is required. It was.
In addition, it is difficult to accurately form the slope angle of the slope.For example, in order to bring down the upper wiring to the position of the lower wiring in plan view as a result of variations in the slope inclination angle. There was a problem that the required distance (pulling down distance) varied.

JP 2004-133888 A JP 2009-129490 A

  The present invention has been made in view of the above problems, and has as its main object to provide a flexure substrate with wiring that can be easily formed without disconnection failure.

  In order to solve the above problems, the present invention provides a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, A laminated wiring forming portion having a second conductor layer formed on the second insulating layer so as to overlap the first conductor layer in the thickness direction, and formed at an end of the wiring forming portion; A terminal having a first terminal portion disposed on the first insulating layer and connected to the first conductor layer, and a second terminal portion disposed on the first insulating layer and connected to the second conductor layer. A wiring flexure substrate having a forming portion, wherein the connection region connecting the second conductor layer and the second terminal portion is formed of the same material as the first conductor layer, An insulated pillow portion is formed, and the second conductor layer and the second terminal portion include the pillow To provide a wiring with flexible substrate, characterized in that connected via a pillow portion conductive layer formed thereon.

According to the present invention, by having the pillow portion, the upper wiring from the second conductor layer to the second terminal portion has a stepped shape with two steps, that is, has two corners. It can be. For this reason, compared with the case of the upper wiring of the conventional stepped shape, the stress applied to one corner can be dispersed, and the occurrence of disconnection or the like can be prevented. Moreover, since the mechanical strength of the connection region is improved by the pillow portion, it is possible to prevent the occurrence of disconnection or the like.
Moreover, since the said pillow part consists of the same material as the said 1st conductor layer, it can form simultaneously with the said 1st conductor layer. For this reason, the pillow part can be easily formed. Furthermore, since the pillow part does not include a slope as shown in Patent Document 1, it is possible to accurately form a pillow part having a desired length, that is, a desired pull-down distance.
Thus, by having the said pillow part, there can be no disconnection defect and it can be formed easily.

  In this invention, it is preferable that the said pillow part is also formed in the said terminal formation part, and has a groove part in the said terminal formation part, and the said 2nd terminal part is arrange | positioned in the said groove part. This is because the second terminal portion can be excellent in connection reliability with solder.

  In the present invention, the first terminal portion has a first terminal portion metal layer and a third conductor layer formed on the first terminal portion metal layer, and the third conductor layer is the second terminal. Preferably, it is made of the same material as the portion and is insulated from the second terminal portion. When the pillow part is formed in the terminal forming part, the height of the pillow conductor layer formed on the pillow part and the height of the first terminal part can be aligned, and the solder in the terminal forming part can be aligned. This is because the connection can be made easy.

  In the present invention, it is preferable that a groove is formed in the first terminal metal layer. This is because the first terminal portion can have a groove portion and can be excellent in soldering.

  The present invention provides a flexure with wiring, including a flexure substrate with wiring.

  According to the present invention, by using the above-described flexure substrate with wiring, a flexure with wiring excellent in connection stability can be obtained.

  According to the present invention, there is provided a flexure with wiring, which has the above-described flexure with wiring, and an element mounted in an element mounting region of the flexure with wiring.

  According to the present invention, by using the above-described flexure with wiring, a flexure with wiring with an element excellent in connection stability can be obtained.

  The present invention also provides a hard disk drive including the above-described wiring-attached flexure with elements.

  According to the present invention, a hard disk drive having excellent stability can be obtained by using the above-described flexure with wiring with elements.

  The present invention provides a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, and the second insulating layer on the second insulating layer. A multilayer wiring forming portion having a first conductor layer and a second conductor layer formed so as to overlap in the thickness direction, and an end portion of the wiring forming portion, on the first insulating layer; A first terminal portion disposed and connected to the first conductor layer, and a terminal forming portion disposed on the first insulating layer and having a second terminal portion connected to the second conductor layer, and In the connection region that connects the second conductor layer and the second terminal portion, a pillow portion that is formed of the same material as the first conductor layer and is insulated from the first conductor layer is formed. The two conductor layers and the second terminal part are connected to each other through a pillow part conductor layer formed on the pillow part. A shear board manufacturing method comprising a pillow part forming step of simultaneously forming a first terminal part metal layer included in the pillow part, the first conductor layer, and the first terminal part. A method for manufacturing a substrate is provided.

  According to this invention, the said pillow part can be easily formed by having the said pillow part formation process. For this reason, it is possible to easily form a flexure substrate with wiring having no disconnection failure.

  The present invention has an effect of providing a flexure substrate with wiring that can be easily formed without disconnection failure.

It is a schematic plan view which shows an example of the flexure board | substrate with wiring of this invention. It is a schematic plan view which shows an example of the terminal formation part in this invention, and its vicinity. It is the sectional view on the AA line of FIG. FIG. 3 is a sectional view taken along line B-B in FIG. 2. It is CC sectional view taken on the line of FIG. It is a schematic sectional drawing which shows the other example of the terminal formation part in the present invention and its vicinity. It is a schematic sectional drawing which shows the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the pillow part in this invention. It is explanatory drawing explaining the pillow part in this invention. It is a schematic sectional drawing which shows the other example of the terminal formation part in the present invention and its vicinity. It is a schematic sectional drawing which shows the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is explanatory drawing explaining the other example of the terminal formation part in the present invention and its vicinity. It is a schematic sectional drawing which shows an example of the wiring formation part in this invention. It is process drawing which shows an example of the manufacturing method of the flexure board | substrate with wiring of this invention. It is the II sectional view taken on the line of FIG. It is a schematic plan view which shows an example of the flexure with wiring of this invention. It is a schematic plan view which shows an example of the flexure with an element | device wiring of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention.

The present invention relates to a flexure substrate with wiring, a flexure with wiring using the same, a flexure with wiring with elements and a hard disk drive, and a manufacturing method thereof.
Hereinafter, the flexure substrate with wiring, the manufacturing method of the flexure substrate with wiring, the flexure with wiring, the flexure with wiring with elements, and the hard disk drive of the present invention will be described in detail.

A. First, the flexure substrate with wiring of the present invention will be described.
The flexure substrate with wiring of the present invention includes a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, and the second insulating layer. A laminated wiring forming portion having a second conductor layer formed on the insulating layer so as to overlap with the first conductor layer in the thickness direction; and an end portion of the wiring forming portion. A first terminal portion disposed on one insulating layer and connected to the first conductor layer; and a terminal forming portion having a second terminal portion disposed on the first insulating layer and connected to the second conductor layer; A pillow portion that is formed of the same material as the first conductor layer and is insulated from the first conductor layer in the connection region that connects the second conductor layer and the second terminal portion. The second conductor layer and the second terminal portion are formed on the pillow portion. And it is characterized in that it is connected through the body layer.

Such a flexure substrate with wiring of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing an example of a flexure substrate with wiring according to the present invention. A flexure substrate with wiring 10 shown in FIG. 1 includes an element mounting region (gimbal portion) 20 formed at one tip portion, an external terminal forming portion 21 formed at the other tip portion, and the external terminal forming portion. 21 and a pair of wirings 3 (write wiring 3x and read wiring 3y) for connecting the gimbal part 20, and a terminal forming part 11 formed around the gimbal part 20 and connected to an element mounted on the gimbal part 20. It is what has.
FIG. 2 is a schematic plan view showing the terminal forming portion 11 formed in the periphery of the gimbal portion 20 of FIG. 1 and connected to the element mounted on the gimbal portion 20 and the vicinity thereof. 3 is a cross-sectional view taken along the line AA in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line BB in FIG. 5 is a cross-sectional view taken along the line CC of FIG.
6 and 7 are schematic sectional views showing the terminal forming portion 11 connected to the external circuit board in the external terminal forming portion 21 of FIG. 1 and the vicinity thereof.

As illustrated in FIG. 1 to FIG. 7, the flexure substrate with wiring 10 according to the present invention includes a laminated wiring forming portion 14 having the first conductor layer 3 a and the second conductor layer 3 b, and the wiring forming portion 14. Formed between the terminal forming part 11 formed at the end and having the first terminal part 3a ′ and the second terminal part 3b ′ and the wiring forming part 14 and the terminal forming part 11, the second conductor layer 3b And a connection region 12 for connecting the second terminal portion 3b '.
In the wiring forming portion 14, as shown in FIG. 5, the metal substrate 1, the first insulating layer 2a formed on the metal substrate 1, and the first conductor layer formed on the first insulating layer 2a. 3a, a second insulating layer 2b formed on the first conductor layer 3a, and a second conductor formed on the second insulating layer 2b so as to overlap the first conductor layer 3a in the thickness direction. It has the layer 3b and the cover layer 5 formed so that the said 2nd conductor layer 3b might be covered.
As shown in FIGS. 4 and 7, the first terminal portion 3 a ′ is disposed on the first insulating layer 2 a and includes a second terminal portion metal layer 3 aa connected to the first conductor layer 3 a. As shown in FIG. 3, the second terminal portion 3b 'is composed of a second terminal portion metal layer 3bb disposed on the first insulating layer 2a and connected to the second conductor layer 3b. .
In the connection region 12, as shown in FIGS. 3 and 6, a pillow portion 4 formed of the same material as the first conductor layer 3 a and insulated from the first conductor layer 3 a is formed. The second conductor layer 3b and the second terminal portion 3b ′ are connected via a pillow portion conductor layer 3b ″ formed on the pillow portion 4, and the second conductor layer 3b to the second terminal. The shape of the upper wiring up to the portion 3b ′ is twice the step between the second conductor layer 3b and the pillow portion conductor layer 3b ″ and the step between the pillow portion conductor layer 3b ″ and the second terminal portion 3b ′. It has a stepped shape of a step.

2 to 7, the wirings (write wiring and read wiring) are a pair of wirings constituted by the first conductor layer and the second conductor layer, respectively. Further, in the intermediate portion 13 between the wiring forming portion 14 and the connection region 12, the first conductor layer 3 a and the second conductor layer 3 b are branched in plan view in order to go to the terminal forming portion 11. . Furthermore, the seed layer 6 formed between the insulating layer and the conductor layer, the diffusion prevention layer 7 formed between the seed layer and the insulating layer, and the exposed surface of the conductor layer that is not covered by the cover layer The wiring plating layer 8 is formed on the substrate. In FIG. 2, the description of the cover layer and the wiring plating layer is omitted for ease of explanation.
6 and 7, the cover layer 5 is also formed at the terminal ends of the first and second terminal portions.

According to this invention, by having the said pillow part, the shape of the upper wiring from the said 2nd conductor layer to the said 2nd terminal part is made into the level | step difference of the said 2nd conductor layer and the pillow part conductor layer, and the said pillow part The conductor layer and the second terminal portion may have a two-step step shape.
For this reason, it is possible to have two corners from when the upper wiring is lowered onto the first insulating layer from the second insulating layer. As a result, the stress applied to one corner can be dispersed and the occurrence of disconnection or the like can be prevented as compared with the case of the conventional upper wiring of the step shape. Moreover, since the mechanical strength of the connection region is improved by the pillow portion, it is possible to more effectively prevent the occurrence of disconnection or the like.
Moreover, since the said pillow part consists of the same material as the said 1st conductor layer, it can form simultaneously with the said 1st conductor layer. For this reason, it is not necessary to add a separate process for forming the pillow part, or to use a complicated process such as the use of a photosensitive material or exposure using a gradation mask as in Patent Document 1 above. Can do. Therefore, the pillow part can be easily formed.
Furthermore, since the pillow part does not include a slope as shown in Patent Document 1, it is easy to form accurately at a desired length, that is, a desired pull-down distance, and is formed on such a pillow part. The pillow part conductor layer can also be excellent in pattern accuracy.
Thus, by having the said pillow part, there can be no disconnection defect and it can be formed easily.

  Further, in the method of forming an insulating layer including a slope as shown in Patent Document 1, there is a tendency that a stable slope formation requires a small slope angle, that is, a long pull-down distance as described above. is there. On the other hand, since the pillow part in this invention does not contain a slope, it is easy to make a pull-down distance short etc., and it can be made into a thing with a high freedom degree of design. As a result, it is possible to easily reduce the size and density of the wiring.

The flexure substrate with wiring of the present invention has at least a wiring forming portion, a connection region, and a terminal forming portion. Further, usually, an intermediate portion is provided between the wiring forming portion and the connection region.
Hereafter, each structure of the flexure board | substrate with wiring of this invention is demonstrated in detail.

1. Wiring forming portion The wiring forming portion used in the present invention includes the first insulating layer, the first conductor layer formed on the first insulating layer, and the second insulating layer formed on the first conductor layer. And a second conductor layer formed on the second insulating layer so as to overlap the first conductor layer in the thickness direction. 2 to 7 described above, the wiring forming portion 14 is a portion that is continuously formed with the terminal forming portion 11 through the connection region 12.
Hereinafter, the 1st insulating layer, the 1st conductor layer, the 2nd insulating layer, and the 2nd conductor layer which constitute such a wiring formation part are explained.

(1) 1st insulating layer The 1st insulating layer in this invention is normally formed on the metal substrate mentioned later, and insulates the said 1st conductor layer etc. and the said metal substrate.
The material for the first insulating layer is not particularly limited as long as it has a desired insulating property, and examples thereof include polyimide (PI).
The material of the first insulating layer may be a photosensitive material or a non-photosensitive material.
The thickness of the first insulating layer in the present invention is, for example, preferably in the range of 5 μm to 30 μm, and more preferably in the range of 10 μm to 20 μm.

(2) 1st conductor layer The 1st conductor layer in this invention is a layer formed on the said 1st insulating layer, and comprises a lower wiring with the 1st terminal part mentioned later.
The material for the first conductor layer is not particularly limited as long as it has a desired conductivity, and examples thereof include copper (Cu).
The thickness of the first conductor layer is preferably in the range of, for example, 4 μm to 18 μm, and more preferably in the range of 5 μm to 12 μm. If the thickness of the first conductor layer is too small, desired conductivity may not be obtained. If the thickness of the first conductor layer is too large, the rigidity of the printed circuit board may be increased. Because there is. On the other hand, the line width of the first conductor layer is preferably in the range of 10 μm to 300 μm, for example. If the line width of the first conductor layer is too small, it may not be possible to achieve a sufficiently low impedance. If the line width of the first conductor layer is too large, the printed circuit board will have a sufficiently high density. This is because there is a possibility that it cannot be achieved.

(3) Second Insulating Layer The second insulating layer in the present invention is a layer formed on the first conductor layer. Usually, a second insulating layer is formed so as to cover the first conductor layer. As for the material and thickness of the second insulating layer, the same material as that of the first insulating layer described above can be used. However, in order to reduce flexure warpage, the linear thermal expansion coefficient of the first insulating layer is usually used. Such materials having different properties are used. Such properties are appropriately set according to the type and thickness of the first insulating layer and other members.
The thickness of the second insulating layer formed on the first conductor layer (the distance from the top of the first conductor layer to the top of the second insulating layer) is, for example, in the range of 5 μm to 18 μm. preferable. If the thickness is too small, there is a possibility of deterioration of transmission characteristics and a short circuit due to pinholes. If the thickness is too large, the thickness of the entire printed circuit board may be increased.

(4) 2nd conductor layer The 2nd conductor layer in this invention is a layer formed on the said 2nd insulating layer, and comprises an upper wiring with the pillow part conductor layer and 2nd terminal part which are mentioned later. is there. In addition, the second conductor layer in the wiring forming portion is normally formed so as to overlap with the first conductor layer in the thickness direction.
Here, “overlapping in the thickness direction” means that both are arranged so as to overlap each other, and are arranged so as to overlap in plan view. Therefore, the second conductor layer is disposed so as to overlap the upper side of the first conductor layer, and the first conductor layer and the second conductor layer are disposed so as to overlap in plan view.
At this time, the first conductor layer and the second conductor layer may overlap at least partially in the thickness direction. The material and dimensions (thickness and line width) of the second conductor layer are the same as those of the first conductor layer described above.

2. Connection area | region The connection area | region in this invention is an area | region which connects the said 2nd conductor layer and the said 2nd terminal part, and has the said pillow part and a pillow part conductor layer.

(1) Pillow part The pillow part used for this invention is formed with the same material as the said 1st conductor layer, is insulated from the said 1st conductor layer, and is formed on the said 1st insulating layer. Is. In addition, it protrudes from the second insulating layer, that is, has a region in contact with the second insulating layer and not covered by the second insulating layer in plan view.

Further, the pillow portion in the present invention protrudes from the second insulating layer and is formed to have a stepped shape with the second insulating layer, and the upper wiring from the second conductor layer to the second terminal portion. Is not particularly limited as long as it can have a stepped shape with two steps, and as illustrated in FIG. 8, it is formed in a place not covered by the second insulating layer 2b. Although it may be, it is preferable that it is formed in a place partially covered by the second insulating layer 2b as shown in FIG. This is because the strength of the connection region in the present invention can be improved, and disconnection or the like is good and does not occur reliably.
In addition, about the code | symbol in FIG. 8, since it shows the same member as the thing of FIG. 3, description here is abbreviate | omitted.

  The shape of the pillow portion used in the present invention in a plan view may be any shape as long as it can stably support the above-described pillow portion conductor layer, for example, a rectangular shape as shown in FIG. Can do.

  The formation part of the pillow part in the present invention is not particularly limited as long as the pillow part is formed at least in the connection region, but is also formed in the terminal formation part. Is preferred. It is because the mechanical strength of the terminal forming part can be improved by forming the pillow part also on the terminal forming part.

The length in the wiring direction of the portion protruding from the second insulating layer of the pillow portion in the present invention, that is, the distance in plan view of the pillow portion conductor layer connecting the second conductor layer and the second terminal portion, The upper wiring from the second conductor layer to the second terminal portion is not particularly limited as long as it can have a stepped shape with two steps, specifically, It is preferable that the thickness be equal to or more than the thickness of the second insulating layer, that is, the distance from the surface of the pillow portion to the surface of the second insulating layer. Since the length in the wiring direction is within the above range, the shape of the upper wiring from the second conductor layer to the second terminal portion can be stably formed into a stepped shape having two steps. It is.
The upper limit of the length of the pillow portion is appropriately set according to the use of the flexure substrate with wiring of the present invention and is not particularly limited, but is usually about 160 μm. This is because if the length of the pillow portion is too long, it is difficult to make the flexure substrate with wiring compact.

The width of the pillow portion in the present invention is particularly limited as long as the upper wiring from the second conductor layer to the second terminal portion can have a stepped shape with two steps. As shown in FIG. 9, the width of the pillow 4 may be narrower than the width of the pillow conductor layer 3b ″. As shown in FIG. The width of the portion 4 may be wider than the width of the pillow portion conductor layer 3b ″.
When the width of the pillow portion is narrower than the width of the pillow portion conductor layer, the distance between adjacent conductor layers can be ensured, and the insulation reliability between the conductor layers can be ensured. If the width of the pillow portion conductor layer is wider than that of the pillow portion conductor layer, the pillow portion conductor layer can be stably placed on the pillow portion even when the positional accuracy of the stacked pillow portion conductor layers is shifted. This is because it can be formed.
Moreover, since the reference numerals in FIG. 9 indicate the same members as those in FIG. 2, the description thereof is omitted here.

In the present invention, when the pillow part is narrower than the width of the pillow part conductor layer, the width of the pillow part may be anything as long as the pillow part conductor layer can have a stable step shape, It is appropriately set according to the width and thickness of the pillow portion conductor layer.
Further, when the pillow part is wider than the width of the pillow part conductor layer, the width of the pillow part is appropriately set according to the use of the flexure substrate with wiring of the present invention. According to the purpose of stably forming the part conductor layer on the pillow part, it is preferably as wide as possible, but usually it is preferably wider within the range of 1 μm to 10 μm than the width of the pillow part conductor layer, It is preferably wide within a range of 5 μm to 10 μm. When the width of the pillow portion is within the above range, the flexure substrate with wiring of the present invention can be made compact, and stable even if the positional accuracy of the pillow conductor layer is slightly shifted. This is because a staircase shape can be obtained. Furthermore, it is because the above-mentioned effect can be exhibited. In addition, about an upper limit, the said pillow part should just be a width | variety which does not short-circuit with conductor layers, such as an adjacent 1st conductor layer, and is suitably set according to the kind etc. of the flexure board | substrate with wiring of this invention It is.

  Since the thickness of the pillow part used for this invention is the same material as the said 1st conductor layer, and since it forms simultaneously, it is normally comparable as the thickness of the said 1st conductor layer.

(2) Pillow part conductor layer The pillow part conductor layer used for this invention is formed on the said pillow part, and connects the said 2nd conductor layer and a 2nd terminal part.
Although the material and thickness which comprise such a pillow part conductor layer will not be specifically limited if the said 2nd conductor layer and a 2nd terminal part can be connected, Usually, the said pillow part Since the conductor layer is formed simultaneously with the formation of the second conductor layer and the second terminal portion, the conductor layer is made of the same material as the second conductor layer and has the same thickness.

  The width of the pillow portion conductor layer in the present invention is not particularly limited as long as it can stably connect the second conductor layer and the second terminal portion, and from the second conductor layer and the second terminal portion. Although it may be wide or narrow, it is generally on the same level as the second conductor layer and the second terminal portion.

3. Terminal formation part The terminal formation part in this invention is formed in the edge part of the said wiring formation part, is arrange | positioned on the said 1st insulating layer, The 1st terminal part connected with the said 1st conductor layer, and the said 1st insulation It is an area | region which has a 2nd terminal part arrange | positioned on a layer and connected with the said 2nd conductor layer.

  As such a terminal formation part, for example, it may be used for connection with an element mounted on the gimbal part. In the tail part, connection to an external circuit board, that is, used as the external terminal formation part. May be used.

The terminal forming portion in the present invention is such that the first terminal portion and the second terminal portion are formed on the non-opening portion of the first insulating layer as shown in FIGS. As illustrated in FIGS. 10 and 11, the first terminal portion 3a ′ and the second terminal portion 3b ′ are formed in the opening portion of the first insulating layer 2a and the metal substrate 1, and the flying lead May be formed.
Note that the reference numerals in FIGS. 10 and 11 indicate the same members as those in FIGS. 3 and 4, and thus description thereof is omitted here.

  The first insulating layer in the terminal forming portion has the same contents as those of the first insulating layer described in “1. Wiring forming portion”, and thus description thereof is omitted here.

(1) 2nd terminal part The 2nd terminal part in this invention is arrange | positioned on the said 1st insulating layer, is connected via the said 2nd conductor layer and the said pillow part conductor layer, and is exposed.

  The 2nd terminal part in this invention consists of the same material as the said 2nd conductor layer, is arrange | positioned on the said 1st insulating layer, and contains at least the 2nd terminal part metal layer connected with the said 2nd conductor layer. Further, the upper wiring from the second conductor layer to the second terminal portion is arranged so as to have a stepped shape with two steps.

  The thickness of the second terminal portion metal layer in the present invention is not particularly limited as long as the second terminal portion having a desired thickness can be formed, but usually the second terminal portion. Since the metal layer is formed of the same material and at the same time as the second conductor layer, it has the same thickness as the second conductor layer.

  The width of the second terminal portion metal layer in the present invention is not particularly limited as long as the second terminal portion having a desired width can be formed. For the use of the flexure substrate with wiring of the present invention, etc. It is set accordingly.

The surface shape of the second terminal portion metal layer in the present invention may be flat, but preferably has a groove. This is because the second terminal portion having the groove portion can be easily formed. Moreover, as a result of allowing solder to flow into the groove portion of the second terminal portion, it is possible to make the second terminal portion excellent in soldering and to improve connection reliability. Because.
Specifically, the second terminal portion metal layer having such a groove portion has a groove portion 24 that is a non-penetrating portion as illustrated in FIG. 12, or a through portion as illustrated in FIG. A certain groove portion 24 may be provided. In the present invention, it is particularly preferable that the groove portion is a through portion. This is because a groove having a wide contact area with the solder can be easily formed, and a second terminal portion excellent in soldering can be obtained. Moreover, it is because formation of the said groove part is easy.
12 (a) and 13 (a) are schematic plan views showing an example of the terminal forming portion and its vicinity, and FIGS. 12 (b) and 13 (b) respectively show FIG. 12 (a). It is the DD sectional view taken on the line of FIG. 13 and the EE sectional view taken on the line of FIG.
12 and 13 indicate the same members as those in FIGS. 2 and 3, and a description thereof will be omitted here.

In the present invention, as the second terminal portion metal layer in the case where the groove portion is a through portion, the groove portion 24 having a circular shape, an elliptical shape, a rectangular shape or the like in plan view is used as illustrated in FIG. As illustrated in FIG. 14, the groove portion 24 may be included, and the portion processed into a column shape may be used. In addition, the planar view shape of the columnar second terminal portion metal layer is not particularly limited, and examples thereof include a circular shape, an elliptical shape, and a rectangular shape.
14A is a schematic plan view showing an example of the terminal forming portion and the vicinity thereof, and FIG. 14B is a cross-sectional view taken along the line FF of FIG. 14A.
Moreover, since the reference numerals in FIG. 14 indicate the same members as those in FIGS. 2 and 3, the description thereof is omitted here.

The position of the second terminal metal layer on the first insulating layer in the present invention is a position that does not overlap with the first terminal in plan view, and the pillow conductor layer and the second terminal metal. There is no particular limitation as long as it can have a step between the layers.
Especially in this invention, when it has the pillow part which has a groove part in the said terminal formation part, it is preferable to arrange | position at least in the groove part of the said pillow part. This is because the second terminal portion metal layer can be formed in a concave shape, and the second terminal portion can be excellent in connection reliability.
In addition, as a groove part of the pillow part in which such a 2nd terminal part metal layer is arrange | positioned, although it may be a non-penetrating part normally illustrated in FIG. 15, as illustrated in FIG.16 and FIG.17. It is preferable that it is a through-hole. This is because the second terminal metal layer can have a wide contact area with the solder. Further, as a result, the second terminal portion can be made excellent in solder paste, and the connection reliability can be made excellent. Moreover, it is because formation of the said groove part is easy because the groove part of the said pillow part is a penetration part.
In addition, as a shape of the pillow part in case the said groove part is a penetration part, if the said 2nd terminal part metal layer can be arrange | positioned stably, it will not specifically limit, It has the said groove part It can be the same as that of the second terminal portion metal layer.
FIGS. 15A to 17A are schematic plan views showing an example of the terminal forming portion and the vicinity thereof, and FIGS. 15B to 17B are FIGS. 15A and 15B, respectively. It is the GG sectional view taken on the line of FIG. 17 (a), the HH sectional view, and the II sectional view.
Furthermore, the reference numerals in FIGS. 15 to 17 indicate the same members as those in FIGS. Moreover, in FIG. 15A-FIG. 17A, description of a pillow part conductor layer and a 2nd terminal part (2nd terminal part metal layer) is abbreviate | omitted for easy description.

(2) 1st terminal part The 1st terminal part in this invention connects with the said 1st conductor layer, and is exposed. Further, it is formed on the first insulating layer.
Here, being exposed means that it can be electrically connected to the solder, for example, can be electrically connected to the element and the external circuit board.

  Such a first terminal portion is made of the same material as that of the first conductor layer, and includes at least a first terminal portion metal layer disposed on the first insulating layer and connected to the first conductor layer. If it is, it will not specifically limit.

(A) 1st terminal part metal layer The 1st terminal part metal layer used for this invention is the same material as the said 1st conductor layer, and is formed simultaneously.

  The arrangement position of the first terminal portion metal layer is not particularly limited as long as it does not overlap with the second terminal portion in plan view, and as shown in FIG. May be formed on the non-opening of the first insulating layer, or may be formed on the opening of the first insulating layer as shown in FIG. .

  The thickness of the first terminal portion metal layer in the present invention is not particularly limited as long as the first terminal portion having a desired thickness can be formed. Since the metal layer is formed at the same time as the formation of the first conductor layer, the metal layer has the same thickness as the first conductor layer.

  The width of the first terminal portion metal layer in the present invention is not particularly limited as long as the first terminal portion having a desired width can be formed. For the use of the flexure substrate with wiring of the present invention, etc. It is set accordingly.

The surface shape of the first terminal portion metal layer in the present invention may be flat, but preferably has a groove. It is because it can be set as the 1st terminal part which has a groove part. As a result, the solder can be poured into the groove of the first terminal portion, the first terminal portion can be excellent in solder paste, and the connection reliability can be excellent. Because.
Moreover, it is a case where the 3rd conductor layer mentioned later is formed on the said 1st terminal part metal layer by the plating method etc., and it is set as the 1st terminal part which has the said 1st terminal part metal layer and a 3rd conductor layer. This is because the third conductor layer having the groove portion on the surface, that is, the first terminal portion having the groove portion on the surface can be easily formed, and the connection reliability can be improved.
In addition, as such a groove part, it can be made to be the same as that of the groove part of the pillow part as described in the term of the said "(1) 2nd terminal part."

(B) 1st terminal part Although the 1st terminal part used for this invention has the said 1st terminal part metal layer at least, it can have another layer as needed.
In the present invention, in particular, it is preferable to have a third conductor layer formed on the first terminal portion metal layer. This is because the mechanical strength of the first terminal portion can be improved by having the third conductor layer.
Moreover, when the pillow part and the pillow part conductor layer are formed in the terminal forming part, the height of the pillow part conductor layer and the height of the first terminal part can be aligned, and the solder connection in the terminal forming part This is because it can be made easy.

The material of the third conductor layer in the present invention is not particularly limited as long as it is a material that can electrically connect the first terminal portion and the solder, but the material constituting the second terminal portion metal layer. Are preferably the same. This is because the third conductor layer can be formed at the same time as the second terminal portion metal layer, and the third conductor layer can be easily formed.
In the case where the third conductor layer is made of the same material as the second terminal portion metal layer and is formed at the same time as the second terminal portion metal layer, the third conductor layer is the first conductor layer. In order to prevent a short circuit between the terminal portion and the second terminal portion, the terminal portion and the second terminal portion are formed so as to be insulated from the metal layer.

  The width of the third conductor layer in the present invention is not particularly limited as long as it can be stably formed on the first terminal metal layer, and is narrower than the width of the first terminal metal layer. It may be a thing, and the thing wider than the width | variety of the said 1st terminal part may be sufficient. When the width is smaller than the width of the first terminal metal layer, the distance between adjacent conductor layers can be narrowed, the density can be increased, and the physical adhesion can be improved due to the biting of the solder. And having a width larger than the width of the first terminal portion metal layer has an advantage that a terminal portion having a stable shape can be formed even when the positional accuracy of the third conductor is slightly shifted. Because.

  The thickness of the third conductor layer in the present invention is not particularly limited, but when the third conductor layer is formed at the same time in the step of forming the second terminal portion metal layer, the thickness of the third conductor layer is usually The thickness is the same as the thickness of the two-terminal metal layer.

  The formation position of the third conductor layer in the present invention is not particularly limited as long as it is formed on the first terminal portion. However, if necessary, the connection region, the intermediate portion, and the wiring formation are formed. It may be formed also in the part.

In this invention, it is preferable that the 3rd conductor layer in the said terminal formation part has a groove part. This is because the bonding area of the first terminal portion with the solder can be increased, and the connection reliability can be improved.
Such a groove can be the same as the groove in the first terminal metal layer. Further, it may be formed by a groove formed in the first terminal portion metal layer.

4). Intermediate part Next, the intermediate part in the present invention will be described. The intermediate portion in the present invention is a portion that is continuously formed between the wiring formation portion and the connection region described above.
Moreover, in the intermediate part in this invention, the said 1st conductor layer and the 2nd conductor layer are branching in order to arrange | position so that it may not overlap in planar view in the said connection area | region and a terminal formation part normally.

  In the present invention, when the first conductor layer and the second conductor layer overlapping in the thickness direction branch before the connection region, one of the first conductor layer and the second conductor layer is In plan view, it is preferably branched at a substantially right angle. This is because the desired impedance is easily obtained. In FIG. 2 which has already been described, the second conductor layer 3b is branched at a right angle in plan view with respect to the first conductor layer 3a. On the other hand, when one of the first conductor layer and the second conductor layer branches obliquely (for example, at 45 °) in plan view, the first conductor layer and the second conductor layer are , Some overlap, and some do not overlap. As a result, deviation from the target impedance may occur. Therefore, in the present invention, it is preferable that one of the first conductor layer and the second conductor layer is branched at a substantially right angle in plan view with respect to the other.

5. Flexure substrate with wiring The flexure substrate with wiring of the present invention has at least a wiring formation portion, a connection region, and a terminal formation portion, and usually has the intermediate portion.
In each region, the first insulating layer, the second insulating layer, the upper wiring (second conductor layer to pillow portion conductor layer to second terminal portion), and the lower wiring (first conductor layer to first conductor). Terminal portion) and a pillow portion, and usually the metal substrate 1 and the cover layer, but may have other configurations as necessary.
As such other configurations, as shown in FIGS. 3 and 4, the seed layer 6, the diffusion prevention layer 7, the wiring plating layer 8, the adhesion improving layer formed between the conductor layers, and the like are provided. Can be mentioned.

(A) Metal substrate The metal substrate in this invention supports the said 1st insulating layer and each member formed on it.
As a material of such a metal substrate, it is preferable to have desired conductivity and spring property, and examples thereof include stainless steel. The thickness of the metal substrate is, for example, preferably in the range of 10 μm to 30 μm, more preferably in the range of 15 μm to 25 μm.

In the present invention, as shown in FIG. 18, the metal substrate 1 is preferably formed so as not to overlap the first conductor layer 3a in the thickness direction. This is because it is possible to suppress the metal substrate from adversely affecting the electrical characteristics of the first conductor layer. The end portion of the first conductor layer and the end portion of the metal substrate are preferably separated by, for example, 10 μm or more in the horizontal direction orthogonal to the thickness direction.
In addition, about the code | symbol in FIG. 18, since it shows the member same as the thing of FIG. 3, description here is abbreviate | omitted.

(B) Cover layer The cover layer in this invention is formed in order to protect conductor layers, such as the said 1st conductor layer and a 2nd conductor layer.
In the present invention, by having the cover layer, attenuation of electrical signals and deterioration of the conductor layer can be suppressed.
Examples of the material for the cover layer include polyimide (PI). The material of the cover layer may be a photosensitive material or a non-photosensitive material. The material of the cover layer may be the same as or different from the first insulating layer 2a and the second insulating layer 2b described above.
The thickness of the cover layer in the present invention is preferably in the range of 3 μm to 30 μm, for example.

The formation region of the cover layer in the present invention is not particularly limited as long as it can stably protect the conductor layer. Usually, at least the first conductor layer and the second conductor layer are included. The first terminal part and the second terminal part are formed so as to be exposed.
In the present invention, the formation position of the cover layer is not particularly limited, but it is preferable to form the cover portion so as to cover the pillow portion conductor layer because the strength of the bent portion can be further increased. Moreover, it is because there exists an advantage that cost reduction can be attained by reducing the range which forms gold plating in the exposed part of a terminal.
In addition, the cover layer may be formed in the external terminal forming portion. However, because of the adhesion of the element (slider) in the element mounting area, the cover layer is usually in the element mounting area. 1 The cover layer is not formed on the insulating layer. For example, when the first terminal portion and the second terminal portion are used for connection to an external circuit in the external terminal forming portion, the cover layer is usually formed so that the terminal ends are not exposed. Can be.

  The method for forming the cover layer in the present invention is not particularly limited as long as the cover layer can be formed in a desired region. For example, a cover layer forming coating solution containing the material for the cover layer is used. After forming a coating film by coating and drying, a resist is arranged in a pattern on the coating film, and wet etching using an etching solution can be used. As the resist pattern, for example, a resist pattern having an opening in a region where the terminal portion is formed can be used. According to such a method, the cover layer exposes the terminal portion, covers the terminal end of the terminal portion in the external terminal forming portion, and exposes the terminal end of the terminal portion in the element mounting region. Can be formed by one patterning.

(C) Seed layer The seed layer in the present invention is formed between the insulating layer and the conductor layer, specifically, between the first and second conductor layers and the first and second insulating layers, or the first layer. 1 is a metal thin film layer formed between the insulating layer and the first terminal portion metal layer.
In the present invention, by including such a seed layer, conductor layers (first conductor layer, second conductor layer, etc.) can be easily formed on the insulating layer by electrolytic plating.
Such a seed layer is usually preferably a metal thin film layer containing Cu, for example. The thickness of the seed layer is, for example, in the range of 0.05 μm to 2.0 μm, and preferably in the range of 0.1 μm to 1.0 μm. Moreover, the formation method of a seed layer is not specifically limited, For example, sputtering method etc. can be mentioned.

(D) Diffusion prevention layer The diffusion prevention layer in the present invention is a metal thin film formed between the seed layer and the insulating layer, specifically, between the seed layer and the first and second insulating layers. Is a layer.
In the present invention, by having such a diffusion preventing layer, it is possible to suppress the material of the conductor layers such as the first and second conductor layers from diffusing into the first and second insulating layers.
As such a diffusion preventing layer, for example, a metal thin film layer containing Cr is preferable. The thickness of the diffusion preventing layer is, for example, in the range of 1.0 nm to 5.0 μm, and preferably in the range of 5.0 nm to 2.0 μm. Moreover, the formation method of a diffusion prevention layer is not specifically limited, For example, sputtering method etc. can be mentioned.

(E) Wiring plating layer The wiring plating layer in this invention is normally formed in the exposed surface which is not coat | covered with the said cover layer, an insulating layer, etc. among the surfaces of the above-mentioned conductor layer.
In this invention, it can suppress that the said conductor layer deteriorates by having a wiring plating layer in this way.
Examples of the material for the wiring plating layer include nickel (Ni) and gold (Au).

(F) Adhesion Improvement Layer The adhesion improvement layer in the present invention is formed between the conductor layers, specifically, the pillow part and the pillow part conductor layer, the first terminal part metal layer, the third conductor layer, and the like. Is.
In the present invention, by having such an adhesion improving layer, the conductor layer can be made excellent in adhesion. Moreover, as a result, it is because it can be made excellent in connection reliability by improving both adhesiveness. Furthermore, mechanical strength can be further improved by using a metal having a higher hardness and / or tensile strength than the metal constituting the conductor layer as the metal constituting the adhesion improving layer. Further, by having the adhesion improving layer, it is possible to prevent deterioration of the conductor layer previously formed by the etching solution.
The adhesion improving layer in the present invention is usually a metal plating layer, and specifically includes at least one metal selected from the group consisting of Cr, Ni, Zn, Pd, Ag, Sn, Ti, and Au. A metal plating layer can be mentioned, and among these, a Ni plating layer is preferable. This is because it is inexpensive and can exhibit sufficient adhesion. Examples of the method for forming the adhesion improving layer include an electrolytic plating method and an electroless plating method. Among them, the electrolytic plating method is preferable. Moreover, as thickness of the said adhesive improvement layer, it is preferable that it exists in the range of 0.05 micrometer-5.0 micrometers, for example, especially in the range of 0.1 micrometer-2.0 micrometers. This is because if the thickness of the adhesion improving layer is too small, sufficient adhesion may not be exhibited, and if the thickness of the adhesion improving layer is too large, electrical characteristics may be deteriorated. . The reason why the electrical characteristics are deteriorated is that the adhesion improving layer is usually inferior in conductivity to the first terminal part metal layer, the pillow part conductor layer, and the like.

B. Next, a method for manufacturing a flexure substrate with wiring will be described.
The method of manufacturing a flexure substrate with wiring of the present invention includes a first insulating layer, a first conductor layer formed on the first insulating layer, a second insulating layer formed on the first conductor layer, A laminated wiring forming portion having a second conductor layer formed on the second insulating layer so as to overlap the first conductor layer in the thickness direction, and formed at an end of the wiring forming portion; A terminal having a first terminal portion disposed on the first insulating layer and connected to the first conductor layer, and a second terminal portion disposed on the first insulating layer and connected to the second conductor layer. A wiring flexure substrate having a forming portion, wherein the connection region connecting the second conductor layer and the second terminal portion is formed of the same material as the first conductor layer, An insulated pillow part is formed, and the second conductor layer and the second terminal part are It is a manufacturing method of the flexure board | substrate with wiring connected via the pillow part conductor layer formed on the said pillow part, Comprising: The 1st contained in the said pillow part, the said 1st conductor layer, and the said 1st terminal part It has the pillow part formation process which forms a terminal part metal layer simultaneously.

The manufacturing method of such a flexure substrate with wiring of the present invention will be described with reference to the drawings. FIG. 19 is a schematic process diagram showing an example of a method for manufacturing a flexure substrate with wiring according to the present invention. 20 is a cross-sectional view taken along the line II of FIG. As illustrated in FIGS. 19 and 20, a metal substrate 1 is prepared, a first insulating layer 2a is formed on the surface of the metal substrate 1, and a seed layer (not shown) is formed on the first insulating layer 2a by sputtering. After that, the first conductor layer forming layer 3aX is formed on the seed layer by electrolytic plating to form a laminate.
Thereafter, as shown in FIGS. 19A and 20A, a resist 17 is formed using a dry film resist (DFR), and then, as illustrated in FIGS. 19B and 20B. The first conductor layer 3a, the pillow part 4 and the first terminal part metal layer 3aa are simultaneously formed from the first conductor layer forming layer 3aX, and then the resist is peeled off.
Next, as illustrated in FIGS. 19C and 20C, the second insulating layer is formed so as to cover the first conductor layer 3a, the pillow portion 4, and the first terminal portion metal layer 3aa. The layer 2bX is formed, and then a resist is formed using DFR, and the second insulating layer forming layer 2bX exposed from the resist is wet-etched so as to cover a part of the first conductor layer 3a and the pillow portion 4 The second insulating layer 2b formed in (1) is formed.
Next, as illustrated in FIG. 19D and FIG. 20D, it is continuously formed on the second insulating layer 2b, the pillow portion 4 and the first insulating layer 2a, and has a stepped shape. A second terminal portion 3b ′ comprising the second conductor layer 3b, the pillow portion conductor layer 3b ″ and the second terminal portion metal layer 3bb; the first terminal portion metal layer 3aa and the first terminal portion metal layer 3aa; The first terminal portion 3a ′ including the third conductor layer 16 formed thereon is simultaneously formed by plating, and then the cover layer 5 having an opening is formed in the terminal forming portion 11, thereby providing wiring. A flexure substrate 10 is obtained.
In addition, FIG.19 (b) and FIG.20 (b) are the said pillow part formation process, FIG.19 (d) and FIG.20 (d) are the 2nd conductor layer formation process. 19 and 20 indicate the same members as those shown in FIGS. 2 to 4, and a description thereof will be omitted here.

  According to this invention, the pillow part in the said terminal formation part can be easily formed by having the said pillow part formation process. That is, it is possible to easily form a flexure substrate with wiring having no disconnection failure and excellent pattern accuracy of the conductor layer.

The manufacturing method of the flexure substrate with wiring of this invention has the said pillow part formation process at least. Moreover, it usually has a second conductor layer forming step of simultaneously forming the second conductor layer, the pillow portion conductor layer, and the second terminal portion metal layer included in the second terminal portion.
Hereinafter, each process of the manufacturing method of the flexure board | substrate with wiring of this invention is demonstrated.
Note that the flexure substrate with wiring obtained by the present invention is the same as the contents described in the above-mentioned “A. Flexure substrate with wiring”, and therefore description thereof is omitted here.

1. Pillow part formation process The pillow part formation process in the manufacturing method of the flexure substrate with wiring of this invention is a process of forming the said pillow part, the said 1st conductor layer, and the said 1st terminal part metal layer simultaneously.

In this step, the method for simultaneously forming the pillow portion, the first conductor layer, and the first terminal portion metal layer is not particularly limited as long as they can be stably formed. 19 and FIG. 20, which have already been described, using the laminate (three-layer material) as a starting material, the pillow portion, the first conductor layer, and the first terminal portion of the first conductor layer forming layer. A method using a subtracting method of etching after forming a resist on a region where a metal layer is to be formed, or a region where the pillow portion, the first conductor layer, and the first terminal portion metal layer are formed on the first insulating layer. Examples thereof include a method in which a resist having an opening is formed and then formed using an additive method such as a plating method.
In this step, among these, a method using a subtract method using an etching step is preferable. This is because by performing etching after plating on the entire surface, in-plane plating thickness variation can be reduced as compared with the additive method, and the process of removing the seed layer can be shortened.

In this step, when the first terminal part metal layer has a through part as a groove part, it is preferable to form the groove part simultaneously with the formation of the pillow part. It is because the pillow part which has the said groove part can be formed easily.
In addition, as a method of forming a through portion as the groove portion, specifically, in the method of simultaneously forming the above-described pillow portion or the like, a method of using a resist having an opening in the region where the groove portion is formed in the subtract method. In addition, a method of forming a resist in a region where the groove is formed in the additive method can be used.

  The formation method of the laminated body in this step is not particularly limited as long as each member can be stably laminated. For example, the metal substrate, the first insulating layer, the first A method of forming the conductor layer forming layer in this order can be mentioned. Moreover, in this process, after forming a seed layer on the said 1st insulating layer formation layer, the method of forming the said 1st conductor layer formation layer may be sufficient.

  In this step, as a method for forming the first insulating layer included in the laminate, a first insulating layer forming coating solution containing a material constituting the first insulating layer is applied and cured on the metal substrate. A method can be mentioned.

  Further, as a method for forming the first conductor layer forming layer in the laminate, the first conductor layer is formed on the first insulating layer by a plating method such as an electrolytic plating method and an electroless plating method, and a sputtering method. The method of forming the layer which consists of the material to comprise can be mentioned.

  The resist used in this step is not particularly limited as long as the above pattern can be stably formed. For example, a dry film resist or the like can be used.

  The etching method is not particularly limited as long as it can be etched into a desired pattern. For example, wet etching using an etchant can be used.

  The etching solution used for wet etching in this step is not particularly limited as long as it can accurately etch the first conductor layer forming layer, and is appropriately selected in consideration of the characteristics of each material. It is preferable. For example, when copper is used for the pillow part, the first conductor layer, and the first terminal part metal layer, for example, an iron chloride based etchant can be used as the etchant.

  The pillow part, the first conductor layer, and the first terminal part metal layer formed in this step are the same as the contents described in the above-mentioned section “A. Flexure substrate with wiring”, so the explanation here is as follows. Omitted.

2. 2nd conductor layer formation process The 2nd conductor layer formation process in the manufacturing method of the flexure board | substrate with wiring of this invention is a process of forming the said 2nd conductor layer, the said pillow part conductor layer, and the said 2nd terminal part metal layer simultaneously. is there.

The method for forming the second conductor layer, the pillow portion conductor layer, and the second terminal portion metal layer is not particularly limited as long as the second conductor layer and the like can be stably formed. For example, after forming the resist which has an opening in the area | region which forms the said 2nd conductor layer etc., the method of forming the said 2nd conductor layer etc. by additive methods, such as a plating method, can be mentioned.
In this step, when the third conductor layer made of the same material as the second terminal portion metal layer is formed on the first terminal portion metal layer, the third terminal portion is formed simultaneously with the formation of the second terminal portion metal layer. A method of forming a conductor layer is preferred. This is because the third conductor layer can be easily formed.
The method for simultaneously forming the second terminal portion metal layer and the third conductor layer is not particularly limited as long as both methods can be stably formed. For example, as the resist, The method of using the resist which has an opening in the area | region which forms a conductor layer, the said pillow part conductor layer, the said 2nd terminal part metal layer, and the said 3rd conductor layer can be mentioned.

In this step, in particular, when the second terminal metal layer and / or the third conductor layer to be formed have a through portion as a groove, the second conductor layer, the pillow portion conductor layer, and the above It is preferable that the groove is formed simultaneously with the formation of the second terminal portion metal layer. This is because the second conductor layer having the groove can be easily formed.
In addition, as a method for forming the through portion as the groove portion, specifically, in the method for forming the second conductor layer and the like, a method for forming a resist in a region where the groove portion is to be formed can be exemplified.

  About the resist etc. which are used in this process, it can be made the same as the content as described in said "1.

  The second conductor layer and the like formed in this step are the same as the contents described in the above-mentioned section “A. Flexure substrate with wiring”, and thus the description thereof is omitted here.

3. Manufacturing method of flexure substrate with wiring The manufacturing method of a flexure substrate with wiring of the present invention has at least the pillow part forming step and usually has the second conductor layer forming step. It may have a process.
Examples of such other processes include an insulating layer forming process for forming the first insulating layer and the second insulating layer, and a cover layer forming process for forming the cover layer. As a method of forming the insulating layer and the cover layer, when the constituent material is a photosensitive material, a method of exposing and developing a coating film containing each material can be used. Moreover, when the said constituent material is a non-photosensitive material, the method of forming a resist on the said coating film and etching can be used. As the exposure / development method and the etching method, methods generally used for forming a flexure substrate with wiring can be used.
Moreover, in this invention, it can have a wiring plating layer formation process which forms a wiring plating layer in the surface of each said conductor layer exposed in the said terminal formation part. In addition, as a method of forming a wiring plating layer in the wiring plating layer forming step, for example, an electrolytic plating method can be exemplified.

C. Next, the flexure with wiring of the present invention will be described. The flexure with wiring of the present invention includes the above-described flexure substrate with wiring.

  According to the present invention, by using the above-described flexure substrate with wiring, a flexure with wiring excellent in connection stability can be obtained.

  FIG. 21 is a schematic plan view showing an example of a flexure with wiring according to the present invention. A wiring flexure 30 shown in FIG. 21 includes the above-described wiring flexure substrate 10 and a load beam 31 provided on the surface of the wiring flexure substrate 10 opposite to the surface on which the element mounting region 20 is formed. It is what has.

  The flexure with wiring of the present invention has at least a flexure substrate with wiring, and usually further has a load beam. Since the flexure substrate with wiring is the same as that described in “A. Flexure substrate with wiring”, description thereof is omitted here. Further, the load beam can be the same as the load beam used for a general wiring flexure.

D. Next, the flexure with wiring with elements of the present invention will be described. The flexure with wiring of the present invention has the above-mentioned flexure with wiring and the element mounted in the element mounting region of the above-mentioned flexure with wiring.

  According to the present invention, by using the above-described flexure with wiring, a flexure with wiring with an element excellent in connection stability can be obtained.

  FIG. 22 is a schematic plan view showing an example of the flexure with an element wiring according to the present invention. A wiring-equipped flexure 40 with elements shown in FIG. 22 includes the above-described flexure 30 with wiring and elements 41 mounted in the element mounting region 20 of the flexure 30 with wiring.

  The wiring-equipped flexure with elements of the present invention has at least a wiring-equipped flexure and elements. The flexure with wiring is the same as the contents described in the above “C. Flexure with wiring”, and therefore description thereof is omitted.

E. Next, the hard disk drive of the present invention will be described. The hard disk drive according to the present invention includes the above-described flexure with wiring with elements.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described flexure with wiring with elements.

  FIG. 23 is a schematic plan view showing an example of the hard disk drive of the present invention. The hard disk drive 50 shown in FIG. 23 includes the above-described wiring-equipped flexure 40 with elements, the disk 51 on which the wiring-equipped flexure 40 with elements writes and reads data, the spindle motor 52 that rotates the disk 51, and the elements. It has an arm 53 and a voice coil motor 54 for moving the elements of the flexure 40 with wiring, and a case 55 for sealing the above members.

  The hard disk drive of the present invention has at least a flexure with wiring with elements, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. About the flexure with a wiring with an element, since it is the same as the content described in the above-mentioned "C. flexure with a wiring with an element", description here is abbreviate | omitted. As other members, the same members as those used in a general hard disk drive can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example 1]
First, a laminated material having a metal substrate 1, a first insulating layer, and a first conductor layer was prepared. Here, the metal substrate 1 was SUS304 having a thickness of 20 μm, the first insulating layer 2a was polyimide having a thickness of 10 μm, and the first conductor layer 3a was electrolytic Cu having a thickness of 5 μm.
Next, as shown in FIG. 19B, the laminated material was etched to form the pillow portion 4 and the first conductor layer 3a at the same time.
Next, as shown in FIG. 19C, a second insulating layer 2b (polyimide, thickness 10 μm) was formed. The thickness of the second insulating layer 2b refers to the thickness from the top of the first conductor layer 3a (or the pillow portion 4) to the top of the second insulating layer 2b.

Next, a diffusion suppression layer (Cr thin film layer, thickness 0.06 μm) and a seed layer (Cu thin film layer, thickness 0.3 μm) were formed over the entire surface by sputtering.
Thereafter, a predetermined resist pattern was produced on the surface of the seed layer, and a second conductor layer (thickness 5 μm) was formed by electrolytic copper plating. Next, the resist pattern is peeled off, the unnecessary seed layer 6 and the diffusion suppressing layer 7 are removed by wet etching, and a cover layer 5 (polyimide, thickness 5 μm) is formed as shown in FIG. As shown in FIG. 20D, the second conductor layer 3b at the position where the terminal forming portion 11 is formed was removed by wet etching.
Finally, as shown in FIG. 20 (d), Ni plating (thickness 0.2 μm) and Au plating (thickness 2.5 μm) are performed on the surface of the second conductor layer 3 b exposed in the terminal forming portion 11. Thereby, the wiring plating layer 8 was formed, and a printed circuit board as shown in FIG. 3 was obtained.

[Example 2]
As in Example 1, a laminated material having a metal substrate 1, a first insulating layer, and a first conductor layer was prepared. Next, as shown in FIG. 15A, when the laminated material is etched to form the pillow part 4 and the first conductor layer 3a, the pillow part 4 and the first conductor layer 3a are half-etched. The uneven part was formed at the same time. A printed circuit board was obtained in the same manner as in Example 1 except that the uneven portion was formed by this etching step.

[Example 3]
As shown in FIG. 16A, a printed circuit board was obtained in the same manner as in Example 1 except that a through hole was formed in the pillow portion 4 and the first conductor layer 3a by etching the laminated material.

[Example 4]
As shown in FIG. 17A, a printed circuit board was obtained in the same manner as in Example 1 except that the protrusions were formed on the pillow portion 4 and the first conductor layer 3a by etching the laminated material.

[Example 5]
A laminated material having a metal substrate 1, a first insulating layer, and a first conductor layer was prepared, and etching was performed as shown in FIG. Next, as shown in FIG. 3, the diffusion suppression layer 7 and the seed layer 6 were formed on the entire surface by sputtering.
Thereafter, a predetermined resist pattern was formed on the surface of the seed layer 6, and the second conductor layer 3b was formed in a through hole shape as shown in FIG. 13 by electrolytic copper plating to obtain a printed circuit board.

[Example 6]
A printed circuit board was obtained in the same manner as in Example 5 except that the second conductor layer 3b was formed in a convex shape as shown in FIG.

[Example 7]
As shown in FIG. 3, the second conductor layer 3b is half-etched with respect to the base material on which the second conductor layer 3b is formed, and the shape shown in FIG. Similarly, a printed circuit board was obtained.

[Example 8]
As shown in FIG. 10, in the portions where the terminal portions are formed on the front and back surfaces, the pillow portion and the first conductor layer are formed by wet etching in the same manner as in Example 1. Then, as shown in FIG. The metal support substrate 1 in the region where the portion 3b ′ is formed is removed by wet etching.
Thereafter, up to the cover layer 5 is formed in the same manner as in Example 1, and then the same as in Example 1 except that the first insulating layer 2a in the region where the second terminal portion 3b 'is formed is removed by wet etching. A printed circuit board was obtained.

  When the presence or absence of disconnection of the obtained printed circuit board was confirmed, it was confirmed that the second conductor layer to the second terminal portion could be formed without disconnection.

DESCRIPTION OF SYMBOLS 1 ... Metal substrate 2a ... 1st insulating layer 2b ... 2nd insulating layer 3 ... Wiring 3X ... Write wiring 3Y ... Lead wiring 3a ... 1st conductor layer 3aa ... 1st terminal part metal layer 3a '... 1st terminal part 3b ... 2nd conductor layer 3bb ... 2nd terminal part metal layer 3b '... 2nd terminal part 3b "... Pillow part conductor layer 4 ... Pillow part 5 ... Cover layer 6 ... Seed layer 7 ... Diffusion prevention layer 8 ... Wiring plating layer 10 ... flexure substrate with wiring 11 ... terminal forming part 12 ... connection region 13 ... intermediate part 14 ... wiring forming part 16 ... third conductor layer 17 ... resist 20 ... element mounting region (gimbal part)
DESCRIPTION OF SYMBOLS 21 ... External terminal formation part 24 ... Groove part 30 ... Flexure with wiring 31 ... Load beam 40 ... Flexure with wiring with element 41 ... Element 50 ... Hard disk drive 51 ... Disk 52 ... Spindle motor 53 ... Arm 54 ... Voice coil motor 55 ... Case

Claims (8)

A first insulating layer; a first conductor layer formed on the first insulating layer; a second insulating layer formed on the first conductor layer; and the first conductor layer on the second insulating layer. And a second wiring layer formed so as to overlap in the thickness direction, and a laminated wiring forming portion formed at an end of the wiring forming portion, disposed on the first insulating layer, A flexure substrate with wiring having a first terminal portion connected to a first conductor layer, and a terminal forming portion disposed on the first insulating layer and having a second terminal portion connected to the second conductor layer,
In the connection region connecting the second conductor layer and the second terminal portion, a pillow portion that is formed of the same material as the first conductor layer and is insulated from the first conductor layer is formed.
The flexure substrate with wiring, wherein the second conductor layer and the second terminal portion are connected via a pillow portion conductor layer formed on the pillow portion. The pillow part is also formed in the terminal forming part, and has a groove part in the terminal forming part,
The flexure substrate with wiring according to claim 1, wherein the second terminal portion is disposed in the groove portion. The first terminal portion has a first terminal portion metal layer and a third conductor layer formed on the first terminal portion metal layer,
3. The wiring according to claim 1, wherein the third conductor layer is made of the same material as the second terminal portion and is insulated from the second terminal portion. With flexure substrate.   4. The flexure substrate with wiring according to claim 3, wherein a groove is formed in the first terminal portion metal layer.   A flexure with wiring, comprising the flexure substrate with wiring according to any one of claims 1 to 4.   A flexure with wiring, comprising: a flexure with wiring according to claim 5; and an element mounted in an element mounting region of the flexure with wiring.   A hard disk drive comprising the flexure with wiring according to claim 6. A first insulating layer; a first conductor layer formed on the first insulating layer; a second insulating layer formed on the first conductor layer; and the first conductor layer on the second insulating layer. And a second wiring layer formed so as to overlap in the thickness direction, and a laminated wiring forming portion formed at an end of the wiring forming portion, disposed on the first insulating layer, A first terminal part connected to the first conductor layer, and a terminal forming part arranged on the first insulating layer and having a second terminal part connected to the second conductor layer;
Have
In the connection region connecting the second conductor layer and the second terminal portion, a pillow portion that is formed of the same material as the first conductor layer and is insulated from the first conductor layer is formed.
The second conductor layer and the second terminal portion are a manufacturing method of a flexure substrate with wiring connected via a pillow portion conductor layer formed on the pillow portion,
The manufacturing method of the flexure board | substrate with wiring characterized by having the pillow part formation process which forms the 1st terminal part metal layer contained in the said pillow part, a said 1st conductor layer, and a 1st terminal part simultaneously.

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