JP5604850B2 - Suspension board, suspension, suspension with head and hard disk drive - Google Patents

Description

  The present invention relates to a suspension board used for a magnetic head suspension for HDD, for example, and more particularly to a suspension board with reduced distortion.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. A magnetic head suspension used in the HDD usually has a suspension board on which the magnetic head is mounted. Furthermore, wiring (read wiring and write wiring) made of a conductive thin film is formed on the suspension board in order to connect the magnetic head and the read / write line of the magnetic disk device.

  In a conventional suspension board, a plurality of (for example, two) narrow wirings are generally formed on the same plane on the insulating portion. On the other hand, there is known a suspension board in which a plurality of wide wirings are stacked via an insulating portion rather than on the same plane. For example, Patent Document 1 discloses a magnetic head suspension having a gimbal suspension in which two or more wide wirings are stacked via an insulating portion. Similarly, Patent Document 2 discloses a head assembly in which wide wirings are stacked via an insulating portion. Further, in FIG. 1 of Patent Document 3, a magnetic head suspension in which wiring patterns including effective wirings 3 and dummy wiring patterns 2 are arranged substantially symmetrically with respect to the suspension center line 4 in the spring portion 1 c of the suspension body 1. Is disclosed.

Japanese Patent Laid-Open No. 10-3632 Japanese Patent Laid-Open No. 9-22570 JP-A-8-102162

  As described above, a suspension board having a structure in which wide wirings are stacked via an insulating portion (wide wiring stacked structure) has been known. For example, for the purpose of high-frequency transmission, it is effective to form a wide wiring laminated structure on the light wiring side where low impedance is required. On the other hand, since the impedance on the read wiring side is not so low as compared with the write wiring side, a plurality of (for example, two) widths are formed on the same plane on the insulating portion as in the conventional case. A structure having a narrow wiring (narrow wiring single layer structure) may be formed.

  In this case, for example, a suspension board in which a wide wiring laminated structure is formed on the write wiring side and a narrow wiring single layer structure is formed on the read wiring side is assumed. Specifically, as shown in FIG. 11A, on the write wiring 30x side, the wide wiring first insulating portion 2a, the first wide wiring 4a formed thereon, and the first wide wiring 4a. A wide wiring laminated structure A having the second insulating portion 5a formed on the upper portion and the second wide wiring 7a formed on the second insulating portion 5a is formed. A suspension board in which a narrow wiring single layer structure C having a first insulating portion 2b and a plurality of (two) first narrow wirings 4b formed thereon is assumed.

  However, as shown in FIG. 11B, such a suspension board has a write wiring 30x having a wide wiring laminated structure and a read wiring 30y having a narrow wiring single-layer structure. There is a problem that the balance between rigidity and weight is poor and distortion occurs.

  Further, as described above, the conventional suspension board employs a narrow wiring single layer structure on both the write wiring side and the read wiring side. In such a suspension board, materials having linear expansion coefficients close to each other have been used as materials for the conductive layer, the insulating layer, and the metal substrate in order to prevent warping occurring after manufacture. However, even when a material having a similar linear expansion coefficient is used, it is difficult to completely prevent warpage due to thermal contraction that occurs due to receiving a thermal history in manufacturing the suspension board. Further, when the wide wiring laminated structure and the narrow wiring single layer structure are arranged on the left and right with respect to the center line of the suspension board, the two narrow wiring single layer structures on the left and right with respect to the suspension board center line. Compared with the case where it is arranged, it is much more susceptible to thermal shrinkage, and the suspension as a whole tends to warp. This is because the wide wiring laminate structure has a rigid structural feature in which two wirings are stacked via an insulating layer and the two wirings are wide, and is greatly affected by thermal shrinkage. It is easy.

  In addition, when the wide wiring laminated structure and the narrow wiring single-layer structure are arranged on the left and right with respect to the center line of the suspension board, not only warping of the entire suspension board but also distortion in the plane of the suspension board occurs. There is a problem that it is easy. This is because the degree of thermal contraction in the wide wiring laminated structure is different from the degree of thermal contraction in the narrow wiring single-layer structure. Furthermore, as described above, the wide wiring laminated structure has a significant difference in weight from the narrow wiring single layer structure. This point is also a cause of distortion in the plane of the suspension board.

  The present invention has been made in view of the above circumstances, and a main object thereof is to provide a suspension board with reduced distortion.

  In order to solve the above problems, in the present invention, a metal substrate, a first insulating layer and a wiring have a basic structure laminated in this order, and the first insulating portion for wide wiring of the first insulating layer A first wide wiring formed on the first insulating portion for wide wiring, a second insulating portion formed on the first wide wiring, and a second wide wiring formed on the second insulating portion. A wide wiring laminate structure, a first insulating portion for narrow wiring of the first insulating layer, and a narrow wiring containing structure having a first narrow wiring formed on the first insulating portion for narrow wiring; The suspension board is characterized in that a strain suppressing portion that suppresses distortion caused by the relation with the wide wiring laminated structure is formed in the narrow wiring containing structure.

  According to the present invention, since the narrow wiring containing structure has the distortion suppressing portion, the suspension board as a whole has a good balance of rigidity and weight and can be a suspension board with reduced distortion. Thereby, for example, FH (FlyHeight) that defines a gap between the magnetic head and the disk can be stably maintained.

  In the above invention, the wiring having the wide wiring laminated structure is preferably a write wiring, and the wiring having the narrow wiring containing structure is preferably a reading wiring. This is because the impedance of the write wiring is required to be lowered.

  In the above invention, it is preferable that the distortion suppressing portion is a dummy wiring. This is because the suspension board can be easily manufactured and reduced in distortion.

  In the above invention, it is preferable that the dummy wiring is a dummy wide wiring, and the dummy wide wiring is formed on the first narrow wiring via a second insulating portion. This is because by providing the dummy wide wiring at a predetermined place, the suspension board can be easily reduced in distortion.

  In the above invention, the dummy wiring is a dummy wide wiring and a dummy narrow wiring, the dummy wide wiring is formed on the first narrow wiring via a second insulating portion, and the dummy narrow wiring is It is preferable that the first narrow wiring is formed on the same plane. This is because by providing both the dummy wide wiring and the dummy narrow wiring at predetermined positions, a suspension board with further reduced distortion can be obtained.

  In the above invention, it is preferable that the dummy wiring is a dummy narrow wiring, and the dummy narrow wiring is formed on the same plane as the first narrow wiring. This is because by providing the dummy narrow wiring at a predetermined place, a suspension board with reduced distortion can be easily obtained.

  In the said invention, it is preferable that the said distortion suppression part is a 2nd insulating part formed on the said 1st narrow wiring, and the thickness or the width | variety was adjusted. This is because the suspension board can be easily reduced in distortion by adjusting the shape of the second insulating portion (for narrow wiring).

  In the said invention, it is preferable that the narrow wiring containing structure which has the said distortion suppression part is formed in the area | region which goes to the head part side at least from the jig hole for load beam joining. This is because the region is easily affected by distortion.

  The present invention also provides a suspension including the above-described suspension board.

  According to the present invention, a suspension with reduced distortion can be obtained by using the above-described suspension board.

  According to the present invention, there is provided a suspension with a head including the above-described suspension and a magnetic head slider mounted on the suspension.

  According to the present invention, a suspension with a head with reduced distortion can be obtained by using the above-described suspension.

  The present invention also provides a hard disk drive including the suspension with a head described above.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the suspension with a head described above.

  The present invention produces an effect that a suspension board with reduced distortion can be obtained.

It is a schematic plan view which shows an example of the suspension board of this invention. It is XX sectional drawing of FIG. It is a schematic sectional drawing explaining the distortion suppression part in this invention. It is a schematic sectional drawing explaining the distortion suppression part in this invention. It is a schematic plan view which shows an example of the suspension board obtained by this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the suspension board of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the suspension board of this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with a head of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is explanatory drawing explaining the suspension board which has a wide wiring laminated structure and a narrow wiring single layer structure.

  Hereinafter, the suspension board, suspension, suspension with head, and hard disk drive of the present invention will be described in detail.

A. Suspension board First, the suspension board of the present invention will be described. The suspension board of the present invention has a basic structure in which a metal substrate, a first insulating layer, and a wiring are laminated in this order, and the first insulating portion for wide wiring of the first insulating layer, the first wiring for wide wiring, A wide wiring laminated structure having a first wide wiring formed on one insulating portion, a second insulating portion formed on the first wide wiring, and a second wide wiring formed on the second insulating portion; And a narrow wiring containing structure having a first narrow wiring formed on the first insulating section for narrow wiring and a first narrow wiring formed on the first insulating section for narrow wiring. And the distortion suppression part which suppresses the distortion which arises in relation to the said wide wiring laminated structure in the said narrow wiring containing structure is formed.

  According to the present invention, since the narrow wiring containing structure has the distortion suppressing portion, the suspension board as a whole has a good balance of rigidity and weight and can be a suspension board with reduced distortion. Thereby, for example, FH (FlyHeight) that defines a gap between the magnetic head and the disk can be stably maintained. Further, as in the present invention, when the wide wiring laminated structure and the narrow wiring single layer structure are arranged on the left and right with respect to the center line of the suspension board, as described above, the thermal history of the suspension board manufacturing process The effect of heat shrinkage is large. Further, in such a case, not only warpage of the entire suspension board but also distortion in the plane of the suspension board is likely to occur. On the other hand, since the suspension board of the present invention has the distortion suppressing portion, the balance of rigidity and weight is improved as a whole suspension board, and the distortion in the plane of the suspension board can be reduced. In addition, when the strain suppressing portion described later is a dummy wiring, a suspension board with reduced strain can be easily obtained by performing a suspension manufacturing method described later.

  FIG. 1 is a schematic plan view showing an example of the suspension board of the present invention. A suspension board 100 shown in FIG. 1 includes a gimbal portion 21 on which a magnetic head is mounted, a connection terminal 22 of a relay board, and a wiring 30 that connects the magnetic head (not shown) and the connection terminal 22. . For convenience, description of a cover layer covering the wiring 30 is omitted. Further, the wiring 30 has a write wiring 30x and a read wiring 30y, a wide wiring laminated structure is formed on the write wiring 30x side, and a narrow wiring containing structure is formed on the read wiring 30y side. Is formed. Next, the “wide wiring laminated structure” and the “narrow wiring containing structure” will be described with reference to FIG.

  FIG. 2 is a sectional view taken along line XX in FIG. As shown in FIG. 2, the suspension board 100 has a basic structure in which a metal substrate 10, a first insulating layer 20, and a wiring 30 are laminated in this order. On the write wiring 30x side, the wide wiring first insulating portion 2a, the first wide wiring 4a formed thereon, the second insulating portion 5a formed on the first wide wiring 4a, and the second insulation A wide wiring laminated structure A having the second wide wiring 7a formed on the portion 5a is formed. On the other hand, on the lead wiring 30y side, the narrow wiring first insulating portion 2b, a plurality of (two) first narrow wirings 4b formed on the same plane of the surface, and the first narrow wiring 4b. A narrow wiring containing structure B having a second insulating portion 5b formed on the upper surface and a dummy wide wiring (distortion suppressing portion) 7b formed on the second insulating portion 5b is formed.

Here, the dummy wide wiring 7b is one of the dummy wirings in the present invention. The dummy wiring in the present invention refers to wiring that does not have a read / write function. Examples of wiring that does not have a read / write function include wiring that does not function as actual wiring. “Does not function as actual wiring” means that the magnetic head and the connection terminal of the relay substrate are not connected. In the present invention, by using a dummy wiring that does not function as an actual wiring, there is an advantage that the degree of freedom in design is improved as compared with a wiring that functions as an actual wiring. In the present invention, the power supply wiring described later is a wiring that does not have a read / write function, and can be used as a dummy wiring.
Hereinafter, the suspension board of the present invention will be described in detail for each configuration.

1. Wide Wiring Laminated Structure First, the wide laminated structure in the present invention will be described. The wide laminated structure according to the present invention is formed on the first insulating portion for wide wiring of the first insulating layer, the first wide wiring formed on the first insulating portion for wide wiring, and the first wide wiring. A second insulating part and a second wide wiring formed on the second insulating part. In the present invention, the wiring having the wide wiring laminated structure may be a writing wiring or a reading wiring, and among them, a writing wiring is preferable. This is because there is a demand for lower impedance on the light wiring side. In this case, a wiring having a narrow wiring containing structure, which will be described later, is a lead wiring.

(1) First insulating portion for wide wiring The first insulating portion for wide wiring in the present invention is a region of the first insulating layer constituting the wide wiring laminated structure. Examples of the material for the first insulating layer include polyimide (PI). The thickness of the first insulating layer is, for example, preferably in the range of 5 μm to 15 μm, and more preferably in the range of 5 μm to 10 μm.

(2) 1st wide wiring The 1st wide wiring in this invention is formed on the surface of said 1st insulation part for wide wiring. Examples of the material for the first wide wiring include copper (Cu). The thickness of the first wide wiring is preferably, for example, in the range of 3 μm to 12 μm, and more preferably in the range of 4 μm to 9 μm. The width of the first wide wiring is preferably in the range of 50 μm to 300 μm, for example. In particular, when designing the impedance within the range of 10Ω to 20Ω, the width of the first wide wiring is preferably within the range of 100 μm to 250 μm.

(3) Second insulating portion The second insulating portion (for wide wiring) in the present invention is formed on the surface of the first wide wiring. The material of the second insulating part is not particularly limited as long as it has a predetermined insulating property, and examples thereof include polyimide (PI). The material of the second insulating part may be a photosensitive material or a non-photosensitive material. Further, the photosensitive material may be a positive type or a negative type. The thickness of the second insulating portion formed on the first wide wiring is, for example, preferably in the range of 5 μm to 20 μm, and more preferably in the range of 7 μm to 15 μm. Further, the second insulating portion may be formed at least between the first wide wiring and the second wide wiring, but as shown in FIG. 2 described above, the second insulating portion covers the first wide wiring 4a. It is preferable that the insulating part 5a is formed.

(4) Second wide wiring The second wide wiring in the present invention is formed on the surface of the second insulating portion. Examples of the material for the second wide wiring include copper (Cu). The width of the second wide wiring is the same as the width of the first wide wiring described above. In the present invention, the widths of the first wide wiring and the second wide wiring may be the same or different from each other. The thickness of the second wide wiring is preferably in the range of 3 μm to 12 μm, and more preferably in the range of 4 μm to 9 μm.

(5) Other members In the wide wiring laminated structure, the wide wiring first insulating portion may be formed on a metal substrate. As shown in FIG. 2, the wide wiring first insulating portion 2a The metal substrate 10 immediately below may be removed. Normally, the design is appropriately performed in consideration of the rigidity of the suspension board. Examples of the material for the metal substrate include SUS. The thickness of the metal substrate is preferably in the range of 10 μm to 30 μm, for example.

  Moreover, it is preferable that a wide wiring laminated structure has a cover layer which protects wiring. Examples of the material for the cover layer include polyimide (PI). The material of the cover layer may be a photosensitive material or a non-photosensitive material. Further, the photosensitive material may be a positive type or a negative type. Further, the thickness of the cover layer is not particularly limited as long as the thickness can protect the wiring.

2. Narrow wiring containing structure Next, the narrow wiring containing structure in the present invention will be described. The narrow wiring containing structure in the present invention has at least a first insulating portion for narrow wiring of the first insulating layer and a first narrow wiring formed on the first insulating portion for narrow wiring. Is. Further, the narrow wiring containing structure is formed with a strain suppressing portion that suppresses the distortion caused by the relation with the wide wiring laminated structure described above.

(1) First insulating portion for narrow wiring The first insulating portion for narrow wiring in the present invention is a region of the first insulating layer constituting the narrow wiring containing structure. About the material and thickness of a 1st insulating layer, it is the same as that of the content described in "1. Wide wiring laminated structure (1) 1st insulating part for wide wiring" mentioned above. The first insulating portion for narrow wiring and the first insulating portion for wide wiring are usually made of the same material and have the same thickness.

(2) 1st narrow wiring The 1st narrow wiring in this invention is formed on the surface of said 1st insulation part for narrow wiring. Usually, a plurality (for example, 2 to 4) of first narrow wirings are formed on the same plane of the surface of the first insulating portion for narrow wiring. The width of the first narrow wiring is preferably, for example, in the range of 15 μm to 80 μm, and more preferably in the range of 20 μm to 40 μm. The material, thickness, and the like of the first narrow wiring are the same as those described in “1. Wide wiring laminated structure (2) First wide wiring”. In the present invention, it is preferable that the first narrow wiring and the first wide wiring are made of the same material. Similarly, it is preferable that both thickness is the same.

(3) Strain suppression part The distortion suppression part in this invention suppresses the distortion which arises in relation to the wide wiring laminated structure mentioned above. The strain suppressing portion in the present invention is not particularly limited as long as the strain of the suspension board can be reduced. Hereinafter, as specific examples of the strain suppression unit, (i) a case where the strain suppression unit is a dummy wiring and (ii) a case where the strain suppression unit is a second insulating portion whose thickness or width is adjusted are divided. I will explain.

(I) When a distortion suppression part is a dummy wiring In this case, a distortion suppression part can be divided roughly into three embodiments. Therefore, the distortion suppression unit will be described separately for the first to third embodiments.

(First embodiment of the strain suppression unit)
The first embodiment of the strain suppression unit is a mode in which the dummy wiring is a dummy wide wiring, and the dummy wide wiring is formed on the first narrow wiring (for the narrow wiring) via the second insulating portion. . Specifically, as shown in FIG. 3A, on the lead wiring 30y side, the narrow wiring first insulating portion 2b, the first narrow wiring 4b formed thereon, and the first width This is a mode in which a narrow wiring containing structure having a second insulating portion 5b formed on the narrow wiring 4b and a dummy wide wiring 7b formed on the second insulating portion 5b is formed.

  According to the first embodiment, by providing the dummy wide wiring at a predetermined place, the balance of rigidity and weight as the whole suspension board is improved, and a suspension board with reduced distortion can be obtained.

  The material, thickness, and the like of the second insulating portion for narrow wiring are the same as those described in “1. Wide wiring laminated structure (3) Second insulating portion”. In the present invention, it is preferable that the second insulating portion for narrow wiring and the second insulating portion for wide wiring are made of the same material. Similarly, it is preferable that both thickness is the same. Further, it is preferable that the width of the second insulating portion for narrow wiring is appropriately designed in consideration of the balance of rigidity and weight. For example, in the suspension board as shown in FIG. 3A, it is preferable that the width of the second insulating portion 5b for narrow wiring and the width of the second insulating portion 5a for wide wiring are the same.

  The material and thickness of the dummy wide wiring are the same as those described in “1. Wide wiring laminated structure (4) Second wide wiring”. Further, the dummy wiring can be easily formed by designing a wiring pattern in which a part is broken. In the present invention, it is preferable that the dummy wide wiring and the second wide wiring are made of the same material. Similarly, it is preferable that both thickness is the same. Further, it is preferable that the width of the dummy wide wiring is appropriately designed in consideration of a balance between rigidity and weight. For example, in the cross-sectional view as shown in FIG. 3A, the width of the dummy wide wiring 7b and the width of the second wide wiring 7a are preferably the same.

(Second embodiment of the strain suppression unit)
In the second embodiment of the distortion suppressing portion, the dummy wiring is a dummy wide wiring and a dummy narrow wiring, and the dummy wide wiring is formed on the first narrow wiring (for narrow wiring) via the second insulating portion. In this embodiment, the dummy narrow wiring is formed on the same plane as the first narrow wiring. Specifically, as shown in FIG. 3B, on the lead wiring 30y side, the narrow wiring first insulating portion 2b and the first narrow wiring 4b and the dummy narrow wiring formed thereon are formed. 4c, a narrow wiring containing structure having a second insulating part 5b formed on the first narrow wiring 4b and the dummy narrow wiring 4c, and a dummy wide wiring 7b formed on the second insulating part 5b Is an aspect in which is formed.

  According to the second embodiment, by providing both the dummy wide wiring and the dummy narrow wiring at predetermined positions, the balance of rigidity and weight as a whole suspension board is further improved, and the suspension board with reduced distortion is provided. can do.

  The material, thickness and width of the dummy narrow wiring are the same as the contents of the first narrow wiring described in “2. Narrow wiring containing structure (2) First narrow wiring”. In the present invention, it is preferable that the dummy narrow wiring and the first narrow wiring are made of the same material. Similarly, it is preferable that both thickness is the same. Moreover, it is preferable that the width of the dummy narrow wiring is appropriately designed in consideration of the balance between rigidity and weight. The dummy narrow wiring has an advantage that the degree of freedom in design of dimensions (particularly width) is high. Further, the number of dummy narrow wirings is preferably one or two, for example.

  In addition, since it is the same as that of the content described in the 1st embodiment mentioned above about the 2nd insulation part for narrow wiring and dummy wide wiring in a 2nd embodiment, description here is abbreviate | omitted.

(Third embodiment of the strain suppression unit)
The third embodiment of the distortion suppressing portion is an aspect in which the dummy wiring is a dummy narrow wiring, and the dummy narrow wiring is formed on the same plane as the first narrow wiring. Specifically, as shown in FIG. 3C, the first width formed on the narrow wiring first insulating portion 2b and the narrow wiring first insulating portion 2b on the lead wiring 30y side. In this embodiment, a narrow wiring containing structure having the narrow wiring 4b and the dummy narrow wiring 4c is formed.

  According to the third embodiment, by providing the dummy narrow wiring at a predetermined location, the suspension and the balance of rigidity and weight as the whole suspension board are improved, and the suspension board with reduced distortion can be obtained. In particular, in the third embodiment, as shown in FIG. 3C, it is preferable to provide the second insulating portion 5b for narrow wiring on the first narrow wiring 4b and the dummy narrow wiring 4c. This is because a suspension board with further reduced distortion can be obtained. Note that the dummy narrow wiring in the third embodiment is the same as the contents described in the second embodiment described above, and a description thereof will be omitted here.

(Ii) In the case where the strain suppressing portion is the second insulating portion whose thickness or width is adjusted In this case, the suspension board is adjusted by adjusting the shape of the second insulating portion (for narrow wiring) which is the strain suppressing portion. The balance of rigidity and weight as a whole is improved, and a suspension board with reduced distortion can be obtained. Specifically, as shown in FIG. 4A, a method of adjusting the width of the second insulating portion 5b for narrow wiring, and a second insulating portion 5b for narrow wiring as shown in FIG. 4B. The method of adjusting the height of the can etc. can be mentioned. Usually, the second insulating portion for narrow wiring is formed so as to cover the first narrow wiring.

  In the present invention, the distortion may be reduced by using both the dummy wiring and the second insulating portion whose thickness or width is adjusted.

(4) Other members In the narrow wiring containing structure, the first insulating portion for narrow wiring may be formed on a metal substrate, and as shown in FIG. The metal substrate 10 directly under the portion 2b may be removed. Normally, the design is appropriately performed in consideration of the rigidity of the suspension board. The material, thickness, and the like of the metal substrate are the same as those described in “1. Wide wiring laminated structure” described above. Further, the narrow wiring containing structure preferably has a cover layer for protecting the wiring. The cover layer material and the like are also the same as the contents described in the above-mentioned “1. Wide wiring laminated structure”, and thus the description thereof is omitted here.

3. As described above, the suspension board of the present invention has a basic structure in which the metal substrate, the first insulating layer, and the wiring are laminated in this order, and has a wide wiring laminated structure and a narrow wiring containing structure. Is.

In particular, in the present invention, it is preferable that a narrow wiring containing structure having a warp suppressing portion is formed at least in a region from the load beam bonding jig hole toward the head portion side. This is because the region is easily affected by distortion. Specifically, as shown in FIG. 5, it is preferable that a narrow wiring containing structure B having a distortion suppressing portion is formed in a region from the load beam bonding jig hole 23 toward the head portion 24 side. . Further, as shown in FIG. 5, the distance from the tip of the wire of the head portion 24 to the end of the wiring of the tail portion 25 and L _1, the distance width having a buckling restraint portion narrow wiring-containing structure B is formed and L _2. In this _case, L 2 / _{L 1} is preferably 1/4 or more, more preferably 1/2 or more, and more preferably 3/4 or more. Further, L ₂ / L ₁ may be 1. That is, the narrow wiring containing structure B having the distortion suppressing portion may be formed in all of the lead wirings 30y. In this case, the suspension board can be further reduced in distortion.

4). Next, a method for manufacturing a suspension board according to the present invention will be described. The manufacturing method of the suspension board of the present invention is not particularly limited as long as it is a method capable of obtaining the above-described suspension board. Hereinafter, an example of a method for manufacturing a suspension board according to the present invention will be described with reference to FIGS. 6 and 7 conceptually show part of the cross section of the suspension board of the present invention, and may differ from actual dimensions.

  First, a laminated substrate 11 is prepared in which a metal substrate 1 made of SUS, a first insulating layer 2 made of polyimide, and a first seed layer 3 and a first conductive layer 4 made of Cu are laminated in this order (FIG. 6 ( a)). For the laminated substrate 11, for example, a commercially available three-layer material can be used. Next, wet etching (for example, wet etching using a ferric chloride aqueous solution or a copper chloride aqueous solution) is performed on the first conductive layer 4 and the first seed layer 3 through a predetermined resist pattern, so that a wide wiring laminated structure is obtained. The first wide wiring 4a and the first seed portion 3a are formed in the region to be formed, and the first narrow wiring 4b and the first seed portion 3b are formed in the region in which the narrow wiring containing structure is formed (FIG. 6 ( b)). At the same time, the power supply wiring 32 can be formed. At the same time, wet etching may be performed on the metal substrate 1 to form the metal substrate and form a jig hole (FIG. 6C).

  Next, a second insulating layer 5 is formed by a die coater or the like so as to cover the first wide wiring 4a and the first narrow wiring 4b (FIG. 6D), and wet etching (for example, alkali) of the second insulating layer 5 is performed. Wet etching using a solution is performed to form the second wide wiring insulating portion 5a on the surface of the first wide wiring 4a, and the second narrow wiring wiring insulating portion on the surface of the first narrow wiring 4b. 5b is formed (FIG. 6E). Next, a second seed layer 6 made of Cu is formed on the surface of the obtained substrate by sputtering or the like (FIG. 6F). Next, the second wide wiring 7a is formed on the surface of the second seed layer 6 on which the wide wiring laminated structure is formed by electrolytic plating or the like, and the second seed layer 6 on which the narrow wiring containing structure is formed. A dummy wide wiring 7b is formed on the surface (FIG. 6G). At this time, it is preferable to form the second wide wiring 7a and the dummy wide wiring 7b by panel plating and etching. This is because a suspension board with a small variation in thickness can be obtained.

  Subsequently, the second seed layer 6 where the second wide wiring 7a and the dummy wide wiring 7b are not formed is removed by flash etching or the like to form second seed portions 6a and 6b (FIG. 7A). ). Next, cover layers 8a and 8b are formed so as to cover a desired wiring portion (FIG. 7B). Next, the first insulating layer 2 is etched by wet etching using an alkaline solution (FIG. 7C). Next, a wiring plating portion 9a made of Ni / Au plating is formed on the exposed wiring portion (FIG. 7D), and the ground terminal 12 is formed by Ni plating (FIG. 7E). Finally, the metal substrate 1 is etched to obtain the suspension board 100 having the wide wiring laminated structure A and the narrow wiring containing structure B (FIG. 7F). The obtained suspension board 100 includes the write wiring 30x of the wide wiring laminated structure A, the read wiring 30y of the narrow wiring containing structure B, the ground terminal portion 31, and the power supply wiring 32.

B. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the suspension board.

  FIG. 8 is a schematic plan view showing an example of the suspension of the present invention. A suspension 110 shown in FIG. 8 includes the suspension board 100 described above and a load beam 40 provided on the surface of the suspension board 100 opposite to the surface on which the magnetic head slider is mounted.

  According to the present invention, a suspension with reduced distortion can be obtained by using the above-described suspension board.

  The suspension of the present invention has at least a suspension board, and usually further has a load beam. The suspension board is the same as that described in the above “A. Suspension board”, and the description is omitted here. The load beam can be the same as the load beam used for a general suspension.

C. Next, the suspension with a head according to the present invention will be described. The suspension with a head of the present invention includes the above-described suspension and a magnetic head slider mounted on the suspension.

  FIG. 9 is a schematic plan view showing an example of the suspension with a head of the present invention. A suspension with head 120 shown in FIG. 9 has the above-described suspension 110 and the magnetic head slider 26 mounted on the suspension 100.

  According to the present invention, a suspension with a head with reduced distortion can be obtained by using the above-described suspension.

  The suspension with a head of the present invention has at least a suspension and a magnetic head slider. The suspension is the same as that described in “B. Suspension” above, and is not described here. Further, the magnetic head slider can be the same as the magnetic head slider used in a general suspension with a head.

  The suspension and the magnetic head slider can be bonded using, for example, an adhesive. The adhesive used in the present invention may be a conductive adhesive or a non-conductive adhesive. Further, the adhesive used in the present invention may be a thermosetting adhesive.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above suspension with a head.

  FIG. 10 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 130 shown in FIG. 10 is connected to the above-described suspension with head 120, the disk 51 on which the head suspension 120 writes and reads data, the spindle motor 52 that rotates the disk 51, and the suspension with head 120. The arm 53, the arm 53 and the voice coil motor 54 for moving the magnetic head slider of the suspension 120 with head, and the case 55 for sealing the above members are provided.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the suspension with a head described above.

  The hard disk drive of the present invention has at least a suspension with a head, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. The suspension with a head is the same as the contents described in the above “C. Suspension with a head”, and therefore description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example]
In this example, a suspension board having a wide wiring laminated structure and a narrow wiring containing structure as shown in FIG. First, a laminated substrate composed of a metal substrate / first insulating layer / seed layer / first conductive layer was prepared. Here, a laminated substrate made of stainless steel as the metal substrate, polyimide as the first insulating layer, seed layer, and Cu as the first conductive layer was prepared. Next, a resist for metal etching was made on the laminated substrate. Specifically, a resist layer for metal etching was provided on both surfaces of the multilayer substrate, and a resist pattern was formed by a photolithography method. Here, a resist pattern corresponding to the wiring portion was formed on the surface of the first conductive layer, and a resist pattern corresponding to the jig hole and the flying lead portion was formed on the surface of the metal substrate. Next, using a ferric chloride aqueous solution as an etchant, the metal substrate and the first conductive layer were etched through the resist pattern, and the resist pattern was peeled off. Thus, the first wide wiring and the first narrow wiring were formed from the first conductive layer, and jig holes and the like were formed in the metal substrate.

  Next, the second insulating part was formed using liquid polyimide. Specifically, a non-photosensitive polyimide-based liquid cover material is coated with a die coater, dried and resist-engraved, and after exposure and development, the liquid cover material is etched at the same time as development, and then cured to obtain the second insulation. Parts (second insulating part for wide wiring and second insulating part for narrow wiring) were formed. Next, a seed layer is formed on the surface of the obtained substrate by a sputtering method, subsequently, a resist for pattern plating is made, a predetermined resist pattern is formed, and an electrolytic plating method is applied to the exposed seed layer. The second wide wiring and the dummy wide wiring were formed. Next, the resist pattern was peeled off, and a cover layer covering each of the second wide wiring and the dummy wide wiring was formed. Specifically, a non-photosensitive polyimide-based liquid cover material is coated with a die coater, dried to form a resist plate, and after exposure, the liquid cover material is etched simultaneously with development, and then cured to form a cover layer. Formed. Next, a resist for etching the insulating layer was made. Specifically, a resist layer for polyimide etching was provided on both surfaces of the obtained multilayer substrate, and a resist pattern was formed by a photolithography method. Next, an organic alkaline solution was used as an etching solution, the insulating layer was etched through the resist pattern, and the resist pattern was peeled off. Thereby, the wiring part is integrally formed on the metal substrate via the insulating layer. Further, the metal substrate is in a state where a jig hole is formed and the outer shape is not processed.

  As described above, a predetermined post-processing was performed after performing an etching process excluding the outer shape processing of the metal substrate on the laminated substrate. Specifically, first, Au plating was performed so as to cover the exposed wiring portion to form a wiring plating portion. Next, in order to perform the outer shape processing of the metal substrate, a metal etching resist was made on the post-processed laminated substrate. Specifically, resist layers for metal etching were provided on both surfaces of the post-processed laminated substrate, and a resist pattern corresponding to the outer shape was formed only on the surface of the metal substrate by photolithography. Next, using a ferric chloride aqueous solution as an etchant, the metal substrate was etched through the resist pattern, and the resist pattern was peeled off. Thereby, the suspension board of the present invention was obtained.

DESCRIPTION OF SYMBOLS 1 ... Metal substrate 2 ... 1st insulating layer 2a ... 1st insulating part for wide wiring 2b ... 1st insulating part for narrow wiring 3 ... 1st seed layer 3a, 3b ... 1st seed part 4 ... 1st conductive layer 4a ... 1st wide wiring 4b ... 1st narrow wiring 4c ... Dummy narrow wiring 5 ... 2nd insulating layer 5a ... 2nd insulating part for wide wiring 5b ... 2nd insulating part for narrow wiring 6 ... 2nd seed layer 6a 6b ... second seed part 7a ... second wide wiring 7b ... dummy wide wiring 8a, 8b ... cover layer 9a ... wiring plating part 10 ... metal substrate 11 ... laminated substrate 12 ... ground terminal 20 ... first insulating layer 21 ... gimbal Portion 22… Relay board connection terminal 23… Jig hole 24… Head portion 25… Tail portion 30… Wiring 30x… Write wiring 30y… Lead wiring 31… Ground terminal portion 32… Power supply wiring 10 0 ... Suspension board

Claims (11)

A basic structure in which a metal substrate, a first insulating layer and wiring are laminated in this order; and
A first insulating portion for wide wiring of the first insulating layer; a first wide wiring formed on the first insulating portion for wide wiring; a second insulating portion formed on the first wide wiring; A wide wiring laminated structure having a second wide wiring formed on the two insulating parts;
A suspension board comprising: a first insulating portion for narrow wiring of the first insulating layer; and a narrow wiring containing structure having a first narrow wiring formed on the first insulating portion for narrow wiring. And
The suspension board according to claim 1, wherein a distortion suppressing portion that suppresses distortion caused by the relation with the wide wiring laminated structure is formed in the narrow wiring containing structure.   The suspension board according to claim 1, wherein the wiring having the wide wiring laminated structure is a write wiring, and the wiring having the narrow wiring containing structure is a reading wiring.   The suspension board according to claim 1, wherein the strain suppression unit is a dummy wiring.   The suspension board according to claim 3, wherein the dummy wiring is a dummy wide wiring, and the dummy wide wiring is formed on the first narrow wiring via a second insulating portion.   The dummy wiring is a dummy wide wiring and a dummy narrow wiring, the dummy wide wiring is formed on the first narrow wiring via a second insulating portion, and the dummy narrow wiring is the first narrow wiring. The suspension board according to claim 3, wherein the suspension board is formed on the same plane as the wiring.   The suspension board according to claim 3, wherein the dummy wiring is a dummy narrow wiring, and the dummy narrow wiring is formed on the same plane as the first narrow wiring.   3. The suspension board according to claim 1, wherein the strain suppressing portion is a second insulating portion formed on the first narrow wiring and having a thickness or width adjusted. 4.   8. The narrow wiring-containing structure having the distortion suppressing portion is formed at least in a region from the load beam joining jig hole toward the head portion side. 8. The suspension board according to claim 1.   A suspension comprising the suspension board according to any one of claims 1 to 8.   A suspension with a head, comprising the suspension according to claim 9 and a magnetic head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 10.

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