JP5304175B2 - Suspension board manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a suspension board used in, for example, a magnetic head suspension for an HDD, and more particularly to a method of manufacturing a suspension board having a wide wiring and a small variation in the thickness of an insulating portion.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed. Increasing information transmission speed is required. A magnetic head suspension used in the HDD usually has a suspension board on which the magnetic head is mounted. Furthermore, wiring (read wiring and write wiring) made of a conductive thin film is formed on the suspension board in order to connect the magnetic head and the read / write line of the magnetic disk device.

  In a conventional suspension board, a plurality of (for example, two) narrow wirings are generally formed on the same plane on the insulating portion. On the other hand, there is known a suspension board in which a plurality of wide wirings are stacked via an insulating portion rather than on the same plane. For example, Patent Document 1 discloses a magnetic head suspension having a gimbal suspension in which two or more wide wirings are stacked via an insulating portion. Furthermore, as a method for forming the laminated wide wiring, a transfer method using a transfer master having an adhesive layer and a wide wiring is disclosed (see FIGS. 5 and 6 of Patent Document 1). Similarly, Patent Document 2 discloses a head assembly in which wide wirings are stacked via an insulating portion.

Japanese Patent Laid-Open No. 10-3632 Japanese Patent Laid-Open No. 9-22570

  As described above, a suspension board having a structure in which wide wirings are stacked via an insulating portion (wide wiring stacked structure) has been known. For example, for the purpose of high-frequency transmission, it is effective to form a wide wiring laminated structure on the light wiring side where low impedance is required. However, the suspension board having the wide wiring laminated structure has a problem that the thickness of the wide wiring and the insulating portion varies greatly. For example, as described in Patent Document 1 described above, when wide wiring is formed using a transfer method, the conductive substrate (substrate that holds the wide wiring and the adhesive layer) used for the transfer master is: From the viewpoint of plate separation, a material having a high electrical resistance value such as stainless steel or titanium is often used. For this reason, when a wide wiring is formed on a conductive substrate by an electroplating method or the like, there is a problem that a variation in the thickness of the wide wiring becomes large. Further, Patent Document 1 discloses a method of forming an insulating portion by an electrodeposition method, but in this case, there is a problem that the variation in the thickness of the insulating portion becomes large.

  The present invention has been made in view of the above circumstances, and it is a main object of the present invention to provide a method for manufacturing a suspension board in which variations in the thickness of the wide wiring and the insulating portion are small.

  In order to solve the above problems, in the present invention, a first insulating portion, a first wide wiring formed on the first insulating portion, and a second insulating portion formed on the first wide wiring, A method of manufacturing a suspension board having a wide wiring laminated structure having a second wide wiring formed on the second insulating part, the laminated board having a metal substrate, a first insulating layer, and a first conductive layer A laminated substrate preparing step for preparing the first conductive layer; a first wide wiring forming step for forming the first wide wiring by etching the first conductive layer; and the first wide wiring for forming the wide wiring laminated structure. A second insulating portion forming step for forming the second insulating portion on the surface of the wiring; and a second wide wiring forming step for forming the second wide wire on the surface of the second insulating portion. A suspension board manufacturing method characterized by Subjected to.

  According to the present invention, the thickness of the first insulating portion and the first wide wiring can be increased by using, as a starting material, a laminated substrate having a highly uniform film thickness of each of the metal substrate, the first insulating layer, and the first conductive layer. A suspension board with small variations can be obtained.

  In the said invention, it is preferable to etch the said 1st insulating layer and to perform the 1st insulating part formation process which forms the said 1st insulating part after the said 2nd insulating part formation process. This is because the variation in the thickness of the second insulating portion can be further reduced by such an order.

  In the above invention, in the second insulating part forming step, a second insulating layer forming process for forming a second insulating layer with a die coater on the surface of the first wide wiring and the first insulating layer, and It is preferable to perform a second insulating part forming process for forming the second insulating part from the second insulating layer. This is because the second insulating portion having a smaller thickness variation can be formed.

  In the said invention, it is preferable to form said 2nd wide wiring by pattern plating in the case of said 2nd wide wiring formation process. This is because it is possible to form the second wide wiring with a smaller variation in thickness compared to the case where the transfer method described above is used.

  In the said invention, it is preferable to form said 2nd wide wiring by panel plating and an etching in the case of said 2nd wide wiring formation process. This is because it is possible to form the second wide wiring with a smaller variation in thickness compared to the case where the pattern plating described above is used.

  In the said invention, when etching with respect to said 1st conductive layer at said 1st wide wiring formation process, it is preferable to perform the etching which forms the jig | tool hole of the said metal substrate simultaneously. This is because the process can be simplified and the suspension board can be manufactured with high accuracy.

  In the above invention, the suspension board includes a narrow wiring having the first insulating portion and a plurality of first narrow wirings formed on the first insulating portion in addition to the wide wiring laminated structure. Preferably, the first narrow wiring having the structure and the narrow wiring containing structure is formed simultaneously with the first wide wiring forming step. This is because the process can be simplified.

  In the above invention, the wiring having the wide wiring laminated structure is preferably a write wiring, and the wiring having the narrow wiring containing structure is preferably a reading wiring. This is because the impedance of the write wiring is required to be lowered.

  In the present invention, there is an effect that it is possible to obtain a suspension board with a small variation in the thickness of the wide wiring and the insulating portion.

  Hereinafter, the manufacturing method of the suspension board of the present invention will be described in detail.

  The suspension board manufacturing method of the present invention includes a first insulating portion, a first wide wiring formed on the first insulating portion, a second insulating portion formed on the first wide wiring, and the first insulating wire. A method for manufacturing a suspension board having a wide wiring laminated structure having a second wide wiring formed on two insulating portions, wherein a laminated board having a metal substrate, a first insulating layer, and a first conductive layer is prepared. A laminated substrate preparing step, a first wide wiring forming step for forming the first wide wiring by etching the first conductive layer, and a surface of the first wide wiring on which the wide wiring laminated structure is formed A second insulating portion forming step for forming the second insulating portion; and a second wide wiring forming step for forming the second wide wire on the surface of the second insulating portion. It is what.

  According to the present invention, the thickness of the first insulating portion and the first wide wiring can be increased by using, as a starting material, a laminated substrate having a highly uniform thickness of each of the metal substrate, the first insulating layer, and the first conductive layer. A suspension board with small variations can be obtained. Further, as will be described later, for example, a second insulating layer is formed using a die coater, and the second insulating portion is formed from the second insulating layer, whereby a suspension substrate having a small variation in thickness of the second insulating portion is obtained. Can be obtained. Further, as described later, by forming the second wide wiring by pattern plating, or by forming the second wide wiring by panel plating and etching, a suspension board with a small variation in the thickness of the second wide wiring is obtained. Can be obtained. Impedance control and the like are facilitated by reducing the variation in the thickness of each layer.

  FIG. 1 is a schematic plan view showing an example of a suspension board obtained by the present invention. A suspension board 100 shown in FIG. 1 includes a gimbal portion 21 on which a magnetic head is mounted, a connection terminal 22 of a relay board, and a wiring 30 that connects the magnetic head (not shown) and the connection terminal 22. . For convenience, description of a cover layer covering the wiring 30 is omitted. Further, the wiring 30 includes a write wiring 30x and a read wiring 30y, and a wide wiring laminated structure in which a plurality of wide wirings are stacked via an insulating portion is formed on the writing wiring 30x side. . Thereby, it can be set as a suspension board suitable for high frequency transmission. Next, the “wide wiring laminated structure” will be described with reference to FIG.

  FIG. 2 is a sectional view taken along line XX in FIG. As shown in FIG. 2, the suspension board 100 has a basic structure in which a metal substrate 10, a first insulating layer 20, and a wiring 30 are laminated in this order. On the write wiring 30x side, the first insulating portion 2a (for wide wiring), the first wide wiring 4a formed thereon, the second insulating portion 5a formed on the first wide wiring 4a, A wide wiring laminated structure A having a second wide wiring 7a formed on the two insulating portions 5a is formed. On the other hand, on the lead wiring 30y side, a narrow wiring containing structure B having a first insulating portion 2b (for narrow wiring) and a plurality of (two) first narrow wirings 4b is formed. Is formed. In the present invention, it is preferable that a wide wiring laminated structure is formed at least on the write wiring 30x side. This is because a suspension board suitable for high-frequency transmission can be obtained. Although not shown, a wide wiring laminated structure may be formed on both sides of the write wiring 30x side and the read wiring 30y side.

  3 and 4 are schematic cross-sectional views showing an example of a method for manufacturing a suspension board according to the present invention. 3 and 4 conceptually show part of the cross section of the suspension board of the present invention, and may differ from actual dimensions. First, a laminated substrate 11 is prepared in which a metal substrate 1 made of SUS, a first insulating layer 2 made of polyimide, and a first seed layer 3 and a first conductive layer 4 made of Cu are laminated in this order (FIG. 3 ( a)). Next, the first conductive layer 4 and the first seed layer 3 are wet-etched (for example, wet etching using a ferric chloride aqueous solution) through a predetermined resist pattern to form a wide wiring laminated structure. The first wide wiring 4a and the first seed portion 3a are formed, and the first narrow wiring 4b and the first seed portion 3b are formed in the region where the narrow wiring containing structure is formed (FIG. 3B). At the same time, the power supply wiring 32 can be formed. At the same time, it is preferable to perform wet etching of the metal substrate 1 to form the jig hole 12 of the metal substrate (FIG. 3C).

  Next, a second insulating layer 5 is formed by a die coater or the like so as to cover the first wide wiring 4a (FIG. 3D), and wet etching (for example, wet etching using an alkaline solution) is performed on the second insulating layer 5. The second insulating portion 5a (for wide wiring) is formed on the surface of the first wide wiring 4a (FIG. 3E). Next, a second seed layer 6 made of Cu is formed on the exposed surface of the obtained substrate by sputtering (FIG. 3F). Next, the second wide wiring 7a is formed on the surface of the second seed layer 6 on which the wide wiring laminated structure is formed by electrolytic plating or the like (FIG. 3G).

Subsequently, the second seed layer 6 where the second wide wiring 7a is not formed is removed by flash etching or the like to form the second seed portion 6a (FIG. 4A). Next, cover layers 8a and 8b are formed so as to cover a desired wiring portion (FIG. 4B). Next, the first insulating layer 2 is etched by wet etching using an alkaline solution (FIG. 4C). Next, a wiring plating portion 9a made of Ni / Au plating is formed on the exposed wiring portion (FIG. 4D), and the ground terminal 13 is formed by Ni plating (FIG. 4E). Finally, the metal substrate 1 is etched to obtain the suspension board 100 having the wide wiring laminated structure A and the narrow wiring containing structure B (FIG. 4F). The obtained suspension board 100 includes a write wiring 30x having a wide wiring laminated structure, a read wiring 30y having a narrow wiring containing structure, a ground terminal portion 31, and a power supply wiring 32.
Hereinafter, the method for manufacturing a suspension board of the present invention will be described step by step.

1. Laminated substrate preparation process The laminated substrate preparation process in this invention is demonstrated. The laminated substrate preparation step in the present invention is a step of preparing a laminated substrate having a metal substrate, a first insulating layer, and a first conductive layer (see FIG. 3A). Such a laminated substrate is generally called a three-layer material. In the multilayer substrate of the present invention, a first seed layer may be formed between the first insulating layer and the first conductive layer.

  The metal substrate used for the laminated substrate has a predetermined spring property and conductivity. Examples of the material for the metal substrate include SUS. The thickness of the metal substrate varies depending on the material of the metal substrate and the like, but is preferably in the range of 10 μm to 30 μm, for example.

  The first insulating layer used for the laminated substrate has a predetermined insulating property and is formed between the metal substrate and the first conductive layer. Examples of the material for the first insulating layer include polyimide (PI). The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 20 μm, and more preferably in the range of 7 μm to 15 μm.

  The first conductive layer used for the multilayer substrate is a layer having predetermined conductivity and forming a first wide wiring described later. Examples of the material of the first conductive layer include copper (Cu). The thickness of the first conductive layer is, for example, preferably in the range of 3 μm to 12 μm, and more preferably in the range of 4 μm to 9 μm. Moreover, when the material of the first conductive layer is copper, there may be a first seed layer made of a Cu thin film formed by sputtering or the like between the first conductive layer and the first insulating layer.

  In the laminated substrate of the present invention, the metal substrate, the first insulating layer, and the first conductive layer are preferably uniform in thickness, and the first insulating layer and the first conductive layer are particularly uniform in thickness. Is more preferable. This is because it is possible to obtain a suspension board with small variations in the first insulating portion and the first wide wiring described later. The thickness tolerance of the first conductive layer is preferably within a range of ± 1.5 μm, and more preferably within a range of ± 0.75 μm. The thickness tolerance of the first insulating layer is preferably within a range of ± 2.5 μm, and more preferably within a range of ± 1.5 μm. In addition, the tolerance of the thickness of each layer can be measured by a stylus step meter or a focal depth meter.

  The laminated substrate used in the present invention is not particularly limited as long as it has the above-described metal substrate, first insulating layer, first conductive layer, and the like, and a commercially available laminated substrate can be used as it is.

2. First Wide Wiring Formation Step Next, the first wide wiring formation step in the present invention will be described. The first wide wiring forming step in the present invention is a step of etching the first conductive layer to form the first wide wiring (see FIG. 3B).

  The method for forming the first wide wiring is not particularly limited as long as the desired first wide wiring can be formed. For example, a photosensitive resist layer is formed on the surface of the first conductive layer. Next, the resist layer is exposed and developed to form a desired resist pattern, then the first conductive layer exposed from the resist pattern is wet etched, and finally the resist pattern is removed. be able to. The etchant used for wet etching is preferably selected as appropriate according to the material of the first conductive layer used. When the material of the first conductive layer is copper, examples of the etchant include ferric chloride aqueous solution and copper chloride aqueous solution.

  The width of the first wide wiring in the wide wiring laminated structure is preferably in the range of 50 μm to 300 μm, for example. In particular, when designing the impedance within the range of 10Ω to 20Ω, the width of the first wide wiring is preferably within the range of 100 μm to 250 μm. On the other hand, in the present invention, when forming the first wide wiring, it is preferable to simultaneously form the first narrow wiring 4b as shown in FIG. Further, in this case, it is preferable that the wiring having the wide wiring laminated structure is a write wiring, and the wiring having the narrow wiring containing structure is a read wiring. Further, the width of the first narrow wiring is preferably, for example, in the range of 15 μm to 80 μm, and more preferably in the range of 20 μm to 40 μm. Note that the thicknesses of the first wide wiring and the first narrow wiring generally match the thickness of the first conductive layer in the laminated substrate.

  In the present invention, the metal substrate may be etched simultaneously with the first wide wiring forming step (see FIG. 3C). Thereby, the external shape processing of a metal substrate and the formation of a jig hole can be performed. Especially, in this invention, when etching with respect to a 1st conductive layer, it is preferable to perform simultaneously the etching which forms the jig | tool hole of a metal substrate. As a method for etching a metal substrate, for example, a photosensitive resist layer is formed on the surface of the metal substrate, and then the resist layer is exposed and developed to form a desired resist pattern. Examples include a method of wet etching the metal substrate exposed from the pattern and finally removing the resist pattern.

3. Second Insulating Part Forming Step Next, the second insulating part forming step in the present invention will be described. The second insulating portion forming step in the present invention is a step of forming the second insulating portion on the surface (the upper surface and the side surface of the wiring) of the first wide wiring where the wide wiring laminated structure is formed (FIG. 3 (d), see FIG. 3 (e)).

  The method for forming the second insulating portion is not particularly limited as long as the second insulating portion can be formed on the surface of the first wide wiring on which the wide wiring laminated structure is formed. Among these, in the present invention, the second insulating layer forming process for forming the second insulating layer on the surfaces of the first wide wiring and the first insulating layer, and the second insulating layer forming the second insulating portion from the second insulating layer. It is preferable to form the second insulating portion by performing the insulating portion forming treatment. This is because the second insulating portion having a smaller thickness variation can be formed.

  In the second insulating layer forming process, the method for forming the second insulating layer is not particularly limited, but among them, the method using a die coater is preferable. That is, it is preferable to form the second insulating layer by applying a material for forming the second insulating layer using a die coater and drying. This is because a second insulating layer having a smaller thickness variation can be formed.

  In the second insulating part forming process, it is preferable to appropriately select a method for forming the second insulating part by treating the second insulating layer according to the property of the material for forming the second insulating layer. In the case where the second insulating layer is formed using the photosensitive material, for example, the second insulating portion can be formed by directly performing pattern exposure on the second insulating layer and developing the pattern. On the other hand, when the second insulating layer is formed using a non-photosensitive material, for example, a photosensitive resist layer is formed on the surface of the second insulating layer, and then the resist layer is exposed and developed. The second insulating portion can be formed by forming a desired resist pattern, then etching the second insulating layer exposed from the resist pattern, and finally removing the resist pattern. Examples of the method for etching the second insulating layer include wet etching using an alkaline solution, dry etching such as plasma etching, and the like.

  The material of the second insulating part is not particularly limited as long as it has a predetermined insulating property, and examples thereof include polyimide (PI). In addition, as described above, the material of the second insulating portion may be a photosensitive material or a non-photosensitive material. Further, the photosensitive material may be a positive type or a negative type. The tolerance of the thickness of the second insulating portion formed on the first wide wiring is preferably within a range of ± 1.5 μm, and more preferably within a range of ± 1.0 μm. Further, since the thickness of the second insulating portion directly affects the impedance of the entire circuit, it is preferable that the thickness is as uniform as possible. In addition, if the thickness of the second insulating portion is too thin, it may be difficult to exhibit desired insulation between the first wide wiring and the second wide wiring. If the thickness of the suspension board is too thick, it may be difficult to reduce the weight of the suspension board or the suspension may be too rigid. Further, the second insulating portion only needs to be formed at least between the first wide wiring and the second wide wiring, but is formed so as to cover the first wide wiring as shown in FIG. It is preferable that

4). Second Wide Wiring Forming Step Next, the second wide wiring forming step in the present invention will be described. This is a step of forming the second wide wiring on the surface of the second insulating portion (see FIGS. 3F, 3G, and 4A).

  The method for forming the second wide wiring is not particularly limited as long as it is a method capable of forming a desired first wide wiring. For example, an electrolytic plating method can be used. When forming the second wide wiring by the electrolytic plating method, a seed layer (for example, the second seed layer 6 in FIG. 3F) is usually formed on the surface of the second insulating portion or the like. Examples of the method for forming the seed layer include a sputtering method and a CVD method.

  In the present invention, the second wide wiring may be formed by pattern plating, or the second wide wiring may be formed by panel plating and etching. As a method of forming the second wide wiring by pattern plating, for example, a resist pattern reverse to the wiring pattern of the target second wide wiring is formed by photolithography, and plating is performed on a portion exposed from the resist pattern. Examples thereof include a method of forming the second wide wiring by the method. On the other hand, as a method of forming the second wide wiring by panel plating and etching, for example, a predetermined region including the region where the second wide wiring is formed is plated on the entire surface, and then the target is obtained by a photolithography method. A method of forming a wiring pattern having the same resist pattern, etching a plated portion exposed from the resist pattern, and finally removing the resist pattern can be exemplified. Further, from the viewpoint that a second wide wiring having a small thickness variation can be obtained, it is preferable to form the second wide wiring by panel plating and etching.

  In the present invention, the second wide wiring may be formed using an electroless plating method or a sputtering method.

  Examples of the material for the second wide wiring include copper (Cu). The width of the second wide wiring is the same as the width of the first wide wiring described above. In the present invention, the widths of the first wide wiring and the second wide wiring may be the same or different from each other. The thickness tolerance of the second wide wiring is preferably in the range of ± 1.5 μm, for example, and more preferably in the range of ± 0.75 μm.

5. Cover Layer Forming Step In the present invention, a cover layer forming step of forming a cover layer that covers at least the second wide wiring may be performed (see FIG. 4B). At this time, as shown in FIG. 4B, a region other than the second wide wiring (for example, a region in which the ground terminal portion 31 in FIG. 4F is formed, a region in which the lead wiring 30y is formed, etc.). In addition, it is preferable to form the cover layer at the same time.

  The method for forming the cover layer is the same as the method for forming a general cover layer, and for example, a photolithography method can be used. Examples of the material for the cover layer include polyimide (PI). The material of the cover layer may be a photosensitive material or a non-photosensitive material. Further, the photosensitive material may be a positive type or a negative type. Further, the thickness of the cover layer is not particularly limited as long as the thickness can protect the wiring.

6). First Insulating Portion Forming Step In the present invention, a first insulating portion forming step for forming the first insulating portion is usually performed by etching the first insulating layer (see FIG. 4C). Especially, in this invention, it is preferable to perform a 1st insulating part formation process after a 2nd insulating part formation process. This is because the variation in the thickness of the second insulating portion can be further reduced by such an order. After the first insulating layer is etched, when the second insulating layer forming material is applied, the second insulating layer forming material flows into the uneven portions of the first insulating layer, and the second insulating layer having a uniform thickness is formed. It may not be formed. On the other hand, if the first insulating layer is etched after forming the second insulating portion on the flat first insulating layer, the flow of the material for forming the second insulating layer does not occur, and the thickness varies. A small second insulating portion can be formed. For the same reason, when the cover layer forming step described above is performed, it is preferable to perform the first insulating portion forming step after the cover layer forming step. In addition, about the method of forming a 1st insulation part, it is the same as that of the content described in "3. 2nd insulation part formation process" mentioned above. Further, the etching of the first insulating layer may be plasma etching.

7). Other Steps In the present invention, in addition to the above steps, a wiring plating portion forming step for forming a wiring plating portion such as Ni / Au plating or Au plating on the exposed wiring portion may be performed (FIG. 4 ( d)). Moreover, you may perform the ground terminal formation process which forms a ground terminal using Ni plating etc. (refer FIG.4 (e)). In addition, a metal substrate etching step for etching the metal substrate may be performed at a desired timing (see FIG. 4F). Note that the first insulating portion may be formed on a metal substrate, and the metal substrate immediately below the first insulating portion may be removed. In addition, these steps are the same as the steps in manufacturing a general suspension board, and thus description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example]
In this example, a suspension substrate having a wide wiring laminated structure and a narrow wiring containing structure as shown in FIG. First, a laminated substrate composed of a metal substrate / first insulating layer / seed layer / first conductive layer was prepared. Here, a laminated substrate made of stainless steel as the metal substrate, polyimide as the first insulating layer, seed layer, and Cu as the first conductive layer was prepared. Next, a resist for metal etching was made on the laminated substrate. Specifically, a resist layer for metal etching was provided on both surfaces of the multilayer substrate, and a resist pattern was formed by a photolithography method. Here, a resist pattern corresponding to the wiring portion was formed on the surface of the first conductive layer, and a resist pattern corresponding to the jig hole and the flying lead portion was formed on the surface of the metal substrate. Next, using a ferric chloride aqueous solution as an etchant, the metal substrate and the first conductive layer were etched through the resist pattern, and the resist pattern was peeled off. Thus, the first wide wiring and the first narrow wiring were formed from the first conductive layer, and jig holes and the like were formed in the metal substrate.

  Next, the second insulating part was formed using liquid polyimide. Specifically, a non-photosensitive polyimide-based liquid cover material is coated with a die coater, dried to form a resist plate, and after exposure and development, the liquid cover material is etched simultaneously with development, and then cured (wide wiring). The second insulating part was formed. Next, a seed layer is formed on the surface of the obtained substrate by a sputtering method, subsequently, a resist for pattern plating is made, a predetermined resist pattern is formed, and an electrolytic plating method is applied to the exposed seed layer. The second wide wiring was formed. Next, the resist pattern was peeled off, and a cover layer covering the second wide wiring was formed. Specifically, a non-photosensitive polyimide-based liquid cover material is coated with a die coater, dried to form a resist plate, and after exposure, the liquid cover material is etched simultaneously with development, and then cured to form a cover layer. Formed. Next, a resist for etching the insulating layer was made. Specifically, a resist layer for polyimide etching was provided on both surfaces of the obtained multilayer substrate, and a resist pattern was formed by a photolithography method. Next, an organic alkaline solution was used as an etching solution, the insulating layer was etched through the resist pattern, and the resist pattern was peeled off. Thereby, the wiring part is integrally formed on the metal substrate via the insulating layer. Further, the metal substrate is in a state where a jig hole is formed and the outer shape is not processed.

  As described above, a predetermined post-processing was performed after performing an etching process excluding the outer shape processing of the metal substrate on the laminated substrate. Specifically, first, Au plating was performed so as to cover the exposed wiring portion to form a wiring plating portion. Next, in order to perform the outer shape processing of the metal substrate, a metal etching resist was made on the post-processed laminated substrate. Specifically, resist layers for metal etching were provided on both surfaces of the post-processed laminated substrate, and a resist pattern corresponding to the outer shape was formed only on the surface of the metal substrate by photolithography. Next, using a ferric chloride aqueous solution as an etchant, the metal substrate was etched through the resist pattern, and the resist pattern was peeled off. Thereby, a suspension board was obtained.

It is a schematic plan view which shows an example of the suspension board obtained by this invention. It is XX sectional drawing of FIG. It is a schematic sectional drawing which shows an example of the manufacturing method of the suspension board of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the suspension board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal substrate 2 ... 1st insulating layer 2a ... (for wide wiring) 1st insulating part 2b ... (for narrow wiring) 1st insulating part 3 ... 1st seed layer 3a, 3b ... 1st seed part 4 ... 1st 1 conductive layer 4a ... first wide wiring 4b ... first narrow wiring 5 ... second insulating layer 5a ... (for wide wiring) second insulating part 5b ... (for narrow wiring) second insulating part 6 ... second seed Layer 6a, 6b ... 2nd seed part 7a ... 2nd wide wiring 8a, 8b ... Cover layer 9a ... Wiring plating part 10 ... Metal substrate 11 ... Multilayer substrate 12 ... Jig hole 13 ... Ground terminal 20 ... First insulating layer 21 ... Gimbal part 22 ... Relay board connection terminal 30 ... Wiring 30x ... Write wiring 30y ... Lead wiring 31 ... Ground terminal part 32 ... Power supply wiring 100 ... Suspension board

Claims (5)

A first insulating portion; a first wide wiring formed on the first insulating portion; a second insulating portion formed on the first wide wiring; and a second insulating portion formed on the second insulating portion. A method for manufacturing a suspension board having a wide wiring laminated structure having a wide wiring,
A laminated substrate preparing step of preparing a laminated substrate having a metal substrate, a first insulating layer and a first conductive layer;
Etching the first conductive layer to form the first wide wiring; a first wide wiring forming step;
A second insulating part forming step of forming the second insulating part on the surface of the first wide wiring on which the wide wiring laminated structure is formed;
A second wide wiring forming step of forming the second wide wiring on the surface of the second insulating portion;
Have
A method for manufacturing a suspension board, comprising: performing a first insulating portion forming step of etching the first insulating layer to form the first insulating portion after the second insulating portion forming step. During the second insulating part forming step,
A second insulating layer forming process for forming a second insulating layer by a die coater on the surface of the first wide wiring and the first insulating layer;
A second insulating part forming process for forming the second insulating part from the second insulating layer;
The method for manufacturing a suspension board according to claim 1 , wherein: The suspension board manufacturing method according to claim 1 or 2, wherein the second wide wiring is formed by pattern plating in the second wide wiring forming step. 3. The method for manufacturing a suspension board according to claim 1, wherein the second wide wiring is formed by panel plating and etching in the second wide wiring forming step. When performing etching on the first conductive layer at the first wide wiring formation process, of claims 1 to 4, characterized in that etching is performed to form a jig hole of the metal substrate simultaneously A method for manufacturing a suspension board according to any one of claims.

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