JP6070881B2 - Suspension substrate, suspension, suspension with element, hard disk drive, and manufacturing method of suspension substrate - Google Patents

Description

  The present invention relates to a suspension board having a terminal portion with high connection reliability.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required.

  A suspension substrate (flexure) used in an HDD is usually formed at one end portion, formed at a recording / reproducing element mounting area for mounting a recording / reproducing element such as a magnetic head slider, and at the other end portion. It has an external circuit board connection area for connecting to the external circuit board, and a wiring layer for connecting the recording / reproducing element mounting area and the external circuit board connection area.

  The suspension substrate usually has a basic structure in which a metal support substrate (for example, stainless steel), an insulating layer (for example, polyimide resin), and a wiring layer (for example, copper) are laminated in this order. For example, as shown in Patent Document 1, a pair of wiring layers in the suspension substrate are formed on the same surface of the insulating layer (planar arrangement wiring layers). On the other hand, as shown in Patent Documents 2 and 3, a wiring layer in which wiring layers are stacked via an insulating layer (a wiring layer in a stacked arrangement) is known.

JP 2005-11387 A Japanese Patent Laid-Open No. 9-022570 JP-A-10-003632

  As the functionality of HDDs increases, the number of wiring layers required for a suspension board is increasing. The wiring layer in the stacked arrangement has an advantage in that it can easily cope with the increase in the number of wiring layers in comparison with the wiring layer in the planar arrangement. That is, the wiring layer in the stacked arrangement can be arranged on the upper and lower sides of the intervening insulating layer, and therefore has an advantage that the wiring layer can be arranged twice by simple calculation as compared with the wiring layer in the planar arrangement.

  On the other hand, the wiring layer in the stacked arrangement has a problem that the wiring layers are three-dimensionally arranged, and thus the heights of the terminal portions of the wiring layer are difficult to align. For this reason, when two or more terminal portions having uneven heights and, for example, the terminal portions of the recording / reproducing element are connected by solder or the like, a case where a good connection cannot be assumed is assumed.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a suspension substrate having a terminal portion with high connection reliability.

  In order to solve the above problems, in the present invention, a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the above A suspension substrate having a second insulating layer formed on the first wiring layer and a second wiring layer formed on the second insulating layer, wherein the second wiring layer has a second wiring layer in plan view. A terminal portion of the third wiring layer is formed in the vicinity of the terminal portion, and the terminal portion of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side. And the terminal portion of the third wiring layer is formed on the second insulating layer without the first wiring layer on the surface of the metal support substrate or on the first insulating layer, The terminal portion of the wiring layer and the terminal portion of the third wiring layer are each made of the same material. The top of the plating portion formed on the terminal portion of the second wiring layer and the top of the plating portion formed on the terminal portion of the third wiring layer are coincident with each other. A suspension substrate is provided.

  According to the present invention, since the top part of the plating part formed in the terminal part of the second wiring layer and the top part of the plating part formed in the terminal part of the third wiring layer match, the connection reliability A suspension substrate having a high terminal portion can be obtained.

  In the above invention, the second wiring layer and the third wiring layer are preferably wiring layers connected to the recording / reproducing element.

  In the above invention, it is preferable that the first wiring layer overlapping with the terminal portion of the second wiring layer in plan view is a heat assist wiring layer.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  According to the present invention, a suspension having a terminal portion with high connection reliability can be obtained by using the suspension substrate described above.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and a recording / reproducing element disposed on the suspension.

  According to the present invention, by using the above-described suspension, for example, a suspension with an element having high connection reliability with a recording / reproducing element can be obtained.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  In the present invention, the metal support substrate, the first insulating layer formed on the metal support substrate, the first wiring layer formed on the first insulating layer, and the first wiring layer A second wiring layer formed on the second insulating layer; and a terminal of the third wiring layer in the vicinity of the terminal portion of the second wiring layer in plan view. Part is formed, the terminal part of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side, the terminal part of the third wiring layer is A method of manufacturing a suspension substrate formed on the second insulating layer or on the first insulating layer that does not have the first wiring layer on the surface of the metal support substrate, the second wiring layer A plating part forming step of simultaneously forming a plating part on the terminal part of the second wiring layer and the terminal part of the third wiring layer, In the plating portion forming step, power is supplied from the first power supply terminal to the terminal portion of the second wiring layer, power is supplied from the second power supply terminal to the terminal portion of the third wiring layer, and power is supplied from the second power supply terminal. The plating area to be formed is smaller than the plating area fed by the first power supply terminal, so that the top part of the plating part formed on the terminal part of the second wiring layer, and the terminal part of the third wiring layer A method of manufacturing a suspension substrate, characterized in that the tops of the plating parts formed in the above are made to coincide with each other.

  According to the present invention, power is supplied to the terminal portion of the second wiring layer and the terminal portion of the third wiring layer using the power supply terminals having different plating areas, thereby forming the terminal portion of the second wiring layer. A suspension substrate can be obtained in which the top of the plating portion and the top of the plating portion formed on the terminal portion of the third wiring layer coincide.

  The suspension substrate of the present invention has an effect of having a terminal portion with high connection reliability.

It is a schematic diagram which shows an example of the board | substrate for suspension which has the wiring layer of a lamination | stacking arrangement | sequence. It is a schematic plan view which shows an example of the element mounting area for recording / reproducing in this invention. It is AA sectional drawing of FIG. It is a schematic sectional drawing explaining the plating part in this invention. It is a schematic sectional drawing explaining a plating part. It is a schematic plan view which shows the other example of the element mounting area | region for recording / reproducing in this invention. It is sectional drawing of FIG. It is a schematic sectional drawing explaining the plating part in this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic diagram which shows the electric power feeding method in this invention. It is a schematic sectional drawing which shows the board | substrate for suspension in the middle of manufacture. It is a schematic sectional drawing which shows the other example of the manufacturing method of the board | substrate for suspensions of this invention.

  Hereinafter, the suspension substrate, suspension, suspension with element, hard disk drive, and manufacturing method of the suspension substrate of the present invention will be described in detail.

A. Suspension Substrate The suspension substrate of the present invention includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A suspension substrate having a second insulating layer formed on a wiring layer and a second wiring layer formed on the second insulating layer, wherein the terminal portion of the second wiring layer in plan view A terminal portion of the third wiring layer is formed in the vicinity of the second wiring layer, and the terminal portion of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side, The terminal portion of the third wiring layer is formed on the second insulating layer without the first wiring layer on the surface on the metal support substrate side or on the first insulating layer, and the second wiring layer. The terminal portion of the third wiring layer and the terminal portion of the third wiring layer are each made of the same material. The top of the plating part formed on the terminal part of the second wiring layer and the top of the plating part formed on the terminal part of the third wiring layer coincide with each other. It is characterized by this.

  FIG. 1A is a schematic plan view showing an example of a suspension substrate having a wiring layer in a stacked arrangement, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 1A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A wiring layer 103 that electrically connects the element mounting region 101 and the external circuit board connection region 102 is provided. In addition, one of the wiring layers 103 in FIG. 1A is a writing wiring layer, and the other is a reading wiring layer.

  Further, as shown in FIG. 1B, the suspension substrate 100 is formed on the metal supporting substrate 1, the first insulating layer 2x formed on the metal supporting substrate 1, and the first insulating layer 2x. The first wiring layer 3x, the second insulating layer 2y formed on the first wiring layer 3x, the second wiring layer 3y formed on the second insulating layer 2y, and the second wiring layer 3y are covered. The cover layer 4 is formed. In FIG. 1B, the first wiring layer 3x and the second wiring layer 3y are stacked so as to overlap in plan view via the second insulating layer 2y. Arbitrary patterns can be employed for the layer and the second wiring layer, respectively, and do not need to overlap in plan view.

  FIG. 2 is a schematic plan view showing an example of a recording / reproducing element mounting region in the present invention, and FIG. 3 is a cross-sectional view taken along line AA of FIG. In FIG. 2, the description of the insulating layer and the cover layer is omitted for convenience. As shown in FIG. 2, the terminal portion 3za of the third wiring layer 3z is formed in the vicinity of the terminal portion 3ya of the second wiring layer 3y in plan view. The “vicinity” refers to a region within 100 μm, preferably a region within 50 μm. Also, as shown in FIG. 3, the terminal portion 3ya of the second wiring layer is formed on the second insulating layer 2y having the first wiring layer 3x on the surface on the metal support substrate 1 side, and the terminal of the third wiring layer. The portion 3za is formed on the second insulating layer 2y that does not have the first wiring layer 3x on the surface on the metal support substrate 1 side. Although the terminal portion 3ya and the terminal portion 3za are both formed in the second insulating layer 2y, the positions in the thickness direction are mutually different depending on whether or not the first wiring layer 3x exists under the second insulating layer 2y. Different.

Moreover, as shown in FIG. 3, the plating part 5 which consists of the same material is formed in the terminal part 3ya of a 2nd wiring layer, and the terminal part 3za of a 3rd wiring layer, respectively. This plating part 5 is comprised from the 1st plating part 5a and the 2nd plating part 5b. Suspension substrate of the present invention, the top T ₁ of the plated portion 5 formed in the terminal portion 3ya of the second wiring _layer, and a top portion T ₂ of the plated portion 5 formed in the terminal portion 3za of the third wiring layer The main feature is that they match.

Here, the “top portion of the plating portion” refers to the thickest portion in the plating portion formed on the surface of the terminal portion on the side opposite to the metal support substrate side. Further, “the top part T ₁ and the top part T ₂ are coincident” means that the difference D ₁ in the thickness direction between the top part T ₁ and the top part T ₂ is as shown in FIGS. 4 (a) and 4 (b). It means that it is 5 μm or less. Incidentally, FIG. 4 (a) shows a slightly higher than the top T ₁ is top T _2, FIG. 4 (b) top T ₂ indicates a slightly higher than the top T _1. The value of D ₁ is preferably smaller, it is preferable in particular is 3μm or less.

  According to the present invention, since the top part of the plating part formed in the terminal part of the second wiring layer and the top part of the plating part formed in the terminal part of the third wiring layer match, the connection reliability A suspension substrate having a high terminal portion can be obtained. As shown in FIG. 2, although the terminal portion 3ya and the terminal portion 3za are both formed in the second insulating layer 2y, depending on whether or not the first wiring layer 3x exists under the second insulating layer 2y. The positions in the thickness direction are different from each other. As described above, the wiring layer in the stacked arrangement has a problem that the height of the terminal portions of the wiring layer is difficult to align because the wiring layers are three-dimensionally arranged. On the other hand, since the suspension substrate of the present invention can adjust the thickness of the plated portion by adjusting the thickness of the plated portion, it can be brought into contact with solder, ACF (anisotropic conductive film) or the like. There is an advantage that defects can be suppressed.

On the other hand, in order to align the heights of the terminal portions of the wiring layer, for example, as shown in FIG. 5, it is conceivable to provide a dummy wiring layer 3α under the terminal portion 3za. By providing the dummy wiring layer 3α, the heights of the terminal portions of the wiring layer can be made uniform. However, the provision of the dummy wiring layer 3α causes the following problems. As a first problem, there arises a problem of positional accuracy between the dummy wiring layer 3α and the terminal portion 3za. This problem of positional accuracy can also occur between the first wiring layer 3x and the terminal portion 3ya, but the defect occurrence rate increases as the number of objects that need to be aligned increases. In addition, when a positional shift occurs between the dummy wiring layer 3α and the terminal portion 3za, usually a shape in which a part or all of the terminal portion 3za falls to the metal support substrate side along the shape of the second insulating layer 2y. It becomes. Further, if the width of the dummy wiring layer 3α is increased in order to avoid positional deviation, it is difficult to increase the density of the wiring layer. As a second problem, there arises a problem of adhesion between the dummy wiring layer 3α, the second insulating layer 2y, and the terminal portion 3za. This adhesion problem may also occur between the first wiring layer 3x, the second insulating layer 2y, and the terminal portion 3ya, but the defect occurrence rate increases as the contact area of different phases increases. On the other hand, the suspension substrate of the present invention has the advantage that these problems do not occur because the height of the terminal portion of the wiring layer is made uniform by adjusting the thickness of the plating portion.
Hereinafter, the suspension substrate of the present invention will be described separately for the suspension substrate member and the suspension substrate configuration.

1. First, members of the suspension substrate of the present invention will be described. The suspension substrate of the present invention has at least a metal support substrate, a first insulating layer, a first wiring layer, a second insulating layer, a second wiring layer, and a third wiring layer. The third wiring layer will be described later in “2. Configuration of suspension substrate”.

  The metal support substrate in the present invention functions as a support for the suspension substrate. The material of the metal support substrate is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The first insulating layer in the present invention is formed on a metal support substrate. The material of the first insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. The material of the first insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the first insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The first wiring layer in the present invention is formed on the first insulating layer. The material of the first wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be used, and among these, copper (Cu) is preferable. The material of the first wiring layer may be rolled copper or electrolytic copper. The thickness of the first wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 5 μm to 12 μm.

  The second insulating layer in the present invention is formed on the first wiring layer. The material of the second insulating layer is not particularly limited as long as it has an insulating property, but for example, the material described as the material of the first insulating layer can be used. Especially, it is preferable that the material of a 2nd insulating layer is a polyimide resin. The material of the second insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the second insulating layer (inter-wiring thickness) between the first wiring layer and the second wiring layer is not particularly limited, but is preferably in the range of 5 μm to 30 μm, for example, 5 μm. It is more preferably in the range of ˜18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The second wiring layer in the present invention is formed on the second insulating layer. The material of the second wiring layer is not particularly limited as long as it has conductivity. For example, the material described as the material of the first wiring layer can be used. Especially, it is preferable that the material of a 2nd wiring layer is copper (Cu). Moreover, since the preferable range of the dimension of a 2nd wiring layer is the same as the preferable range of the dimension of the 1st wiring layer mentioned above, description here is abbreviate | omitted.

  The cover layer in the present invention is formed so as to cover the second wiring layer. By providing the cover layer, deterioration (corrosion or the like) of the second wiring layer can be prevented. Examples of the material of the cover layer include those described as the material of the first insulating layer described above, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material. The thickness of the cover layer is preferably in the range of 2 μm to 30 μm, for example, and more preferably in the range of 2 μm to 10 μm.

2. Next, the configuration of the suspension substrate of the present invention will be described. The suspension substrate of the present invention has a third wiring layer, and its terminal portion is formed in the vicinity of the terminal portion of the second wiring layer in plan view. In the present invention, the terminal portion of the third wiring layer and the terminal portion of the second wiring layer are preferably connected to the same target (for example, a recording / reproducing element). The material of the third wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be used, and among these, copper (Cu) is preferable. The material of the third wiring layer may be rolled copper or electrolytic copper. The thickness of the third wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 9 μm to 12 μm.

  The third wiring layer in the present invention may be the same material as the second wiring layer, the same material as the first wiring layer, or a material different from the second wiring layer and the first wiring layer. Also good. The third wiring layer is preferably the same layer as the second wiring layer or the first wiring layer. Here, the “same layer” means a layer formed simultaneously in the manufacturing process. If the third wiring layer is the same layer as the second wiring layer or the first wiring layer, the manufacturing process can be simplified. In FIG. 2 described above, the third wiring layer 3z is the same layer as the second wiring layer 3y, and in FIG. 6 described later, the third wiring layer 3z is the same layer as the first wiring layer 3x.

  The terminal portion of the third wiring layer is formed on (i) the second insulating layer that does not have the first wiring layer on the surface on the metal support substrate side, or (ii) on the first insulating layer. As a specific example of (i), as shown in FIG. 3 described above, the terminal portion 3za of the third wiring layer is on the second insulating layer 2y that does not have the first wiring layer 3x on the surface on the metal support substrate 1 side. The aspect currently formed in can be mentioned. On the other hand, a specific example of (ii) will be described with reference to FIGS. FIG. 6 is a schematic plan view showing another example of the recording / reproducing element mounting region in the present invention, FIG. 7A is a cross-sectional view taken along the line AA in FIG. 6, and FIG. It is BB sectional drawing of. In FIG. 6, the description of the insulating layer and the cover layer is omitted for convenience. As shown to Fig.7 (a), the terminal part 3za of a 3rd wiring layer can mention the aspect currently formed on the 1st insulating layer 2x.

  On the other hand, the terminal portion of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side. Specifically, as shown in FIG. 3 described above, the terminal portion 3ya of the second wiring layer is formed on the second insulating layer 2y having the first wiring layer 3x on the surface on the metal support substrate 1 side. Embodiments can be mentioned. The first wiring layer 3x existing under the terminal portion 3ya may be a terminal portion or a wiring portion (a routing portion).

  Moreover, the plating part comprised from the same material is formed in the terminal part of a 2nd wiring layer, and the terminal part of a 3rd wiring layer, respectively. By providing the plating part, it is possible to prevent deterioration (corrosion or the like) of the terminal part. Although the kind of plating part is not limited, Au plating, Ni plating, Ag plating etc. can be mentioned, for example. The thickness of the plating part is preferably 0.1 μm or more, for example. Further, the plated portion may have a single layer structure or a multilayer structure. Especially, in this invention, as shown in FIG. 3 mentioned above, the plating part 5 is the 1st plating part 5a formed on the terminal part, and the 2nd plating part 5b formed on the 1st plating part 5a. It is preferable that it is comprised from these. For example, it is because it can be set as a plating part with favorable adhesiveness. In particular, in the present invention, the first plating part is preferably Ni plating, and the second plating part is preferably an Au plating part. It is because it can be set as a plating part with high adhesiveness and chemical stability.

Here, as shown in FIG. 8, the second plating the thickness of the first plated portion 5a formed on the second wiring layer of the terminal portion 3ya and T _y1, formed on the first plated portion 5a The thickness of the part 5b is _Ty2 . The value of T _y1 is not particularly limited, but is preferably in the range of 0.1 μm to 1.5 μm, for example, and more preferably in the range of 0.3 μm to 1.2 μm. If the value of T _y1 is too small, the deterioration of the terminal part may not be sufficiently protected, and if the value of T _y1 is too large, the size of the terminal part becomes large and the density of the terminal part may not be increased. Because there is sex. The value of T _y2 is not particularly limited, but is preferably in the range of 0.1 μm to 3.0 μm, for example, and more preferably in the range of 0.5 μm to 2.5 μm. This is because if the value of T _y2 is too small, for example, chemical stability may not be sufficiently maintained, and if the value of T _y2 is too large, for example, the cost may increase. Further, the value of T _y2 / T _y1 is preferably in the range of 1.0 to 2.0, for example, and more preferably in the range of 1.6 to 2.0.

Further, as shown in FIG. 8, the second plating section the thickness of the first plated portion 5a formed on the third wiring layer of the terminal portion 3za and T _z1, formed on the first plated portion 5a The thickness of 5b is _Tz2 . The value of T _z1 is not particularly limited, for example, is preferably in the range of 0.1Myuemu～2.0Myuemu, and more preferably in a range of 0.3Myuemu～1.5Myuemu. The value of T _z2 is not particularly limited, for example, is preferably in the range of 0.1Myuemu～5.0Myuemu, and more preferably in a range of 0.5Myuemu～4.0Myuemu. Further, the value of T _z2 / T _z1 is, for example, preferably in the range of 1.0 to 2.7, and more preferably in the range of 1.7 to 2.5. In the present invention, it is preferable that the value of T _y2 / T _{y1 and} the value of T _z2 / T _z1 match. Note that “match” means that both are within a range of ± 10% of the average of both.

  In the present invention, a wiring layer having an arbitrary function can be used as the first wiring layer, the second wiring layer, and the third wiring layer. Specific examples of these wiring layers include write wiring layers, read wiring layers, thermal assist wiring layers, actuator wiring layers, ground wiring layers, power supply wiring layers, flight height control wiring layers, and sensors. A wiring layer etc. can be mentioned.

  Among these, in the present invention, the second wiring layer and the third wiring layer are preferably wiring layers connected to the recording / reproducing element. Specifically, the second wiring layer and the third wiring layer are preferably any of a write wiring layer, a read wiring layer, and a ground wiring layer. Here, the second wiring layer 3y and the third wiring layer 3z in FIG. 2 described above are a write wiring layer or a read wiring layer, and constitute a pair of differential wirings. The second wiring layer 3y and the third wiring layer 3z in FIG. 6 and FIG. 7B described above are also a write wiring layer or a read wiring layer, and constitute a pair of differential wirings. Further, the recording / reproducing element in the present invention is not particularly limited, but an element having a magnetism generating element is preferable. Specifically, a magnetic head slider can be mentioned.

  On the other hand, the first wiring layer overlapping the terminal portion of the second wiring layer in plan view is not particularly limited, but is preferably a heat assist wiring layer or an actuator wiring layer. This is because the thermal assist element and the actuator element may be mounted on the metal support substrate side of the suspension substrate. Further, the first wiring layer may be used as a ground wiring layer for a thermal assist element or an actuator element.

  The heat assisting element is not particularly limited as long as it can assist recording by the recording / reproducing element with heat. Among them, the heat assist element in the present invention is preferably an element using light. This is because heat-assisted recording by an optical dominant recording method can be performed. Examples of the heat assist element using light include a semiconductor laser diode element. The semiconductor laser diode element may be a pn-type element, or a pnp-type or npn-type element.

  The actuator element usually corresponds to a microactuator or a millimeter actuator. Examples of the actuator element include a piezo element. As the piezo element, for example, one made of PZT can be cited. By using the expansion / contraction response of the piezo element, positioning can be performed in submicron units. In addition, the piezoelectric element has advantages such as high energy efficiency, large load resistance, fast response, no wear deterioration, and no magnetic field. In the present invention, a single bipolar piezo element may be used. Two unipolar piezoelectric elements may be used.

B. Suspension Next, the suspension of the present invention will be described. The suspension according to the present invention includes the suspension substrate described above and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  FIG. 9 is a schematic plan view showing an example of the suspension of the present invention. A suspension 300 shown in FIG. 9 includes the suspension substrate 100 described above and a load beam 200 provided on the surface of the suspension substrate 100 on the metal support substrate side.

  According to the present invention, a suspension having a terminal portion with high connection reliability can be obtained by using the suspension substrate described above.

  The suspension of the present invention has at least a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and a recording / reproducing element disposed on the suspension.

  FIG. 10 is a schematic plan view showing an example of the suspension with an element of the present invention. 10 includes the above-described suspension 300 and the recording / reproducing element 301 mounted on the suspension 300 (recording / reproducing element mounting region 101 of the suspension substrate 100).

  According to the present invention, by using the above-described suspension, for example, a suspension with an element having high connection reliability with a recording / reproducing element can be obtained.

  The suspension with an element of the present invention includes at least a suspension and a recording / reproducing element. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here. The recording / reproducing element of the present invention is the same as the contents described in the above “A. Suspension substrate”, and therefore the description thereof is omitted here. Moreover, the suspension with an element of the present invention may have at least one of the above-described element for thermal assist and an actuator element.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 11 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 500 shown in FIG. 11 includes the above-described suspension 400 with an element, a disk 401 on which data is written and read by the suspension 400 with an element, a spindle motor 402 that rotates the disk 401, and the elements of the suspension 400 with an element. Arm 403 and voice coil motor 404, and a case 405 for sealing the above members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

E. Next, a method for manufacturing a suspension substrate according to the present invention will be described. The manufacturing method of the suspension substrate of the present invention includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A second insulating layer formed on the wiring layer; and a second wiring layer formed on the second insulating layer; in plan view, in the vicinity of the terminal portion of the second wiring layer; A terminal portion of the wiring layer is formed, and the terminal portion of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side, and The terminal portion is a method for manufacturing a suspension substrate formed on the second insulating layer or on the first insulating layer that does not have the first wiring layer on the surface on the metal support substrate side, Plating part form that forms plating part simultaneously on terminal part of second wiring layer and terminal part of third wiring layer In the plating part forming step, the terminal part of the second wiring layer is fed from the first feeding terminal, the terminal part of the third wiring layer is fed from the second feeding terminal, By making the plating area fed by the two feeding terminals smaller than the plating area fed by the first feeding terminal, the top of the plating part formed on the terminal part of the second wiring layer, and the third The top of the plating part formed on the terminal part of the wiring layer is made to coincide.

  FIG. 12 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to the present invention. In FIG. 12, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 12A). Next, the conductive member 3A is patterned by wet etching to form the first wiring layer 3x (FIG. 12B). Next, the second insulating layer 2y is formed on the first wiring layer 3x and the insulating member 2A (FIG. 12C).

  Thereafter, a seed layer (not shown) is formed on the surface of the second insulating layer 2y by sputtering, and a resist pattern composed of a dry film resist is formed on the seed layer and exposed from the resist pattern. A second wiring layer having a terminal portion 3ya and a third wiring layer having a terminal portion 3za are formed on the surface of the seed layer (FIG. 12D). Next, although not shown, a cover layer is formed so as to cover the second wiring layer and the third wiring layer, and wet etching is performed on the insulating member 2A to form the first insulating layer 2x.

  Then, the plating part 5 is simultaneously formed in the terminal part 3ya of the second wiring layer and the terminal part 3za of the third wiring layer (FIG. 12E). At this time, the terminal area 3ya of the second wiring layer is fed from the first feeding terminal, the terminal area 3za of the third wiring layer is fed from the second feeding terminal, and the plating area fed by the second feeding terminal is The plating area to be fed by the first feeding terminal is made smaller. Thereby, the thickness of the plating part 5 on the terminal part 3za can be made thicker than the thickness of the plating part 5 on the terminal part 3ya. Next, although not shown, wet etching is performed on the metal support member 1 </ b> A to form the metal support substrate 1. Thereby, a suspension substrate is obtained.

According to the present invention, power is supplied to the terminal portion of the second wiring layer and the terminal portion of the third wiring layer using the power supply terminals having different plating areas, thereby forming the terminal portion of the second wiring layer. A suspension substrate can be obtained in which the top of the plating portion and the top of the plating portion formed on the terminal portion of the third wiring layer coincide. For example, as shown in FIG. 13, power is supplied from the first power supply terminal 11 to the terminal portion and other parts of the second wiring layer, and power is supplied from the second power supply terminal 12 to the terminal portion of the third wiring layer. At this time, the plating area S ₂ for feeding the second feeding terminal 12, when smaller than the plating area S ₁ for feeding by the first feeding terminal 11, the current density in the power supply from the second feeding terminal 12, a first power supply It becomes larger than the current density in the power supply from the terminal 11. As a result, the plating portion formed on the terminal portion of the third wiring layer is formed thicker than the plating portion formed on the terminal portion of the second wiring layer.

  FIG. 14 is a schematic cross-sectional view showing a suspension substrate during manufacture. The plurality of suspension substrates 100 in the process of manufacture are integrated with the support frame 110 to form a sheet. For example, by forming the first power supply terminal 11 on the conductor member of the support frame 110 and forming the second power supply terminal 12 on the metal support member of the support frame 110, two systems of power supply are possible. In addition, when using a metal supporting member (for example, stainless steel) as a power feeding terminal, it is preferable to feed power to the wiring layer through a via penetrating the insulating member. The method for manufacturing a suspension substrate according to the present invention can be broadly divided into a manufacturing method by a subtractive method and a manufacturing method by an additive method.

1. Subtractive Method First, a manufacturing method using the subtractive method will be described. As an example of the manufacturing method by the subtractive method, a laminated member preparing step of preparing a laminated member in which a metal supporting member, an insulating member, and a conductor member are laminated in this order, and etching the conductor member to form a first wiring layer Forming a first wiring layer; forming a second insulating layer on the first wiring layer; forming a second wiring layer on the second insulating layer; A cover layer forming step for forming a cover layer so as to cover the second wiring layer; a first insulating layer forming step for etching the insulating member to form a first insulating layer; and the second wiring layer. And a metal support substrate forming step of forming a metal support substrate by etching the metal support member and simultaneously forming a plating portion on the terminal portion of the first wiring layer and the terminal portion of the third wiring layer. Give way Door can be.

In addition, FIG. 12 mentioned above is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions by a subtractive method.
Hereinafter, a method for manufacturing a suspension substrate by the subtractive method will be described step by step.

(1) Laminated member preparation step The laminated member preparation step is a step of preparing a laminated member having a metal supporting member, an insulating member formed on the metal supporting member, and a conductor member formed on the insulating member. It is.

  In the subtractive method, the metal support substrate is obtained by etching the metal support member of the laminated member, the first insulating layer is obtained by etching the insulating member of the laminated member, and the conductor member of the laminated body is etched. Thus, the first wiring layer is obtained. The laminated member may be a commercially available three-layer material, or may be obtained by sequentially forming an insulating member and a conductor member on a metal support member.

(2) First wiring layer forming step The first wiring layer forming step is a step of forming the first wiring layer by etching the conductor member.

  As a method for forming the first wiring layer, for example, a method is used in which a resist pattern is formed on a conductive member of a laminated member using a dry film resist (DFR) or the like, and the conductive member exposed from the resist pattern is wet-etched. Can be mentioned. The type of etching solution used for wet etching is preferably selected as appropriate according to the type of conductor member. For example, when the material of the conductor member is Cu, an iron chloride-based etching solution or the like can be used.

  In the subtractive method, the metal support member may be etched simultaneously with the etching of the conductor member. Examples of the etching of the metal support member include etching for forming an opening and a jig hole. Further, if necessary, at least a part of the processing performed in the metal support substrate forming step described later may be performed simultaneously with the etching of the conductor member.

(3) Second insulating layer forming step The second insulating layer forming step is a step of forming a second insulating layer on the first wiring layer.

  The method for forming the second insulating layer is not particularly limited, and it is preferable to select appropriately according to the material of the second insulating layer. For example, when the material of the second insulating layer is a photosensitive material, a patterned second insulating layer can be obtained by exposing and developing the second insulating layer formed on the entire surface. In addition, when the material of the second insulating layer is a non-photosensitive material, a predetermined resist pattern is formed on the surface of the second insulating layer formed on the entire surface, and a portion exposed from the resist pattern is removed by wet etching. Thus, a patterned second insulating layer can be obtained.

(4) Second wiring layer forming step The second wiring layer forming step is a step of forming a second wiring layer on the second insulating layer.

  Examples of the method for forming the second wiring layer include an electrolytic plating method. When using the electrolytic plating method, it is preferable to form a seed layer on the surface of the second insulating layer by sputtering or the like before forming the second wiring layer.

(5) Cover layer forming step The cover layer forming step is a step of forming a cover layer so as to cover the second wiring layer.

  The method for forming the cover layer is not particularly limited, and is preferably selected as appropriate according to the material of the cover layer. For example, when the material of the cover layer is a photosensitive material, a patterned cover layer can be obtained by exposing and developing the cover layer formed on the entire surface. In addition, when the cover layer material is a non-photosensitive material, a predetermined resist pattern is formed on the entire surface of the cover layer, and a portion exposed from the resist pattern is removed by wet etching. The cover layer can be obtained.

(6) First insulating layer forming step The first insulating layer forming step is a step of forming the first insulating layer by etching the insulating member.

  Examples of the method for forming the first insulating layer include a method in which a resist pattern is formed on an insulating member using a dry film resist (DFR) or the like, and the insulating member exposed from the resist pattern is wet-etched. Can do. The type of etchant used for wet etching is preferably selected as appropriate according to the type of insulating member. For example, when the material of the insulating member is a polyimide resin, an alkaline etchant or the like can be used.

(7) Plating part formation process A plating part formation process is a process of forming a plating part on the terminal part of the second wiring layer and the terminal part of the third wiring layer at the same time. Furthermore, in the present invention, the terminal portion of the second wiring layer is fed from the first feeding terminal, the terminal portion of the third wiring layer is fed from the second feeding terminal, and is fed by the second feeding terminal. The plating area to be formed is smaller than the plating area fed by the first power supply terminal, so that the top part of the plating part formed on the terminal part of the second wiring layer, and the terminal part of the third wiring layer The feature is that the tops of the plated parts formed in the above are matched.

As shown in FIG. 13 described above, the plating area for feeding by the first feeding terminal 11 and S _1, when the plating area for feeding the second feeding terminal 12 and the S _2, the value of S 1 _/ S ₂ is Although it will not specifically limit if it is a value which can form a desired plating part, For example, it is preferable to exist in the range of 50-300, it is more preferable to exist in the range of 50-200, and 100-150 More preferably, it is within the range.

(8) Metal support board | substrate formation process A metal support board | substrate formation process is a process of etching the said metal support member and forming a metal support board | substrate. In this step, the outer shape of the metal support substrate is usually processed.

  Although the method for etching the metal support member is not particularly limited, specific examples include wet etching. The type of etchant used for wet etching is preferably selected as appropriate according to the type of metal support member. For example, when the material of the metal support member is stainless steel, an iron chloride-based etchant or the like can be used. .

2. Additive Method Next, a manufacturing method using the additive method will be described. As an example of the manufacturing method by the additive method, a metal supporting member preparing step for preparing a metal supporting member, a first insulating layer forming step for forming a first insulating layer on the metal supporting member, and the first insulating layer A first wiring layer forming step for forming a first wiring layer, a second insulating layer forming step for forming a second insulating layer on the first wiring layer, and a second wiring layer on the second insulating layer. A second wiring layer forming step to be formed; a cover layer forming step of forming a cover layer so as to cover the second wiring layer; and a terminal portion of the second wiring layer and a terminal portion of the third wiring layer simultaneously. The manufacturing method which has the plating part formation process which forms a plating part, and the metal support substrate formation process which etches the said metal support member and forms a metal support substrate can be mentioned.

FIG. 15 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate by the additive method. In FIG. 15, first, a metal support member 1A is prepared (FIG. 15 (a)). Next, a patterned first insulating layer 2x is formed on the surface of the metal support member 1A (FIG. 15B). Next, a seed layer (not shown) is formed on the surface of the first insulating layer 2x by sputtering, a resist pattern composed of a dry film resist is formed on the seed layer, and exposed from the resist pattern. On the surface of the seed layer to be formed, the first wiring layer 3x is formed (FIG. 15C). Since the subsequent steps, FIGS. 15D to 15F, are the same as the contents described in FIGS. 12C to 12E described above, description thereof is omitted here.
Hereinafter, a method for manufacturing a suspension substrate by the subtractive method will be described step by step.

(1) Metal support member preparation process A metal support member preparation process is a process of preparing a metal support member. For example, a commercially available metal support member can be used as the metal support member.

(2) First insulating layer forming step The first insulating layer forming step is a step of forming the first insulating layer on the metal support member.

  The formation method of a 1st insulating layer is not specifically limited, It is preferable to select suitably according to the material of a 1st insulating layer. For example, when the material of the first insulating layer is a photosensitive material, a patterned first insulating layer can be obtained by exposing and developing the first insulating layer formed on the entire surface. Further, when the material of the first insulating layer is a non-photosensitive material, a predetermined resist pattern is formed on the surface of the first insulating layer formed on the entire surface, and a portion exposed from the resist pattern is removed by wet etching. Thus, a patterned first insulating layer can be obtained.

(3) First wiring layer forming step The first wiring layer forming step is a step of forming a first wiring layer on the first insulating layer.

  Examples of the method for forming the first wiring layer include an electrolytic plating method. When using the electroplating method, it is preferable to form a seed layer on the surface of the first insulating layer by sputtering or the like before forming the first wiring layer.

(4) Other Steps The other steps are the same as those described in the manufacturing method using the subtractive method described above, and thus the description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 12A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thus, the first wiring layer was formed from the conductor member (FIG. 12B), and a jig hole was formed in the metal support member.

  Thereafter, a polyimide precursor solution was coated on the patterned first wiring layer with a die coater, and a second insulating layer was formed by a predetermined patterning (FIG. 12C). Next, a seed layer made of Cr was formed on the surface on the second insulating layer side by a sputtering method. Next, a predetermined resist pattern was formed on the seed layer, and a second wiring layer and a third wiring layer were formed on the portion exposed from the resist pattern by electrolytic copper plating (FIG. 12D).

  After removing the seed layer, a polyimide precursor solution was coated on the patterned second wiring layer and third wiring layer with a die coater, and a cover layer was formed by predetermined patterning. Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching to form a first insulating layer.

Then, the plating part was formed in the terminal part of the 2nd wiring layer, and the terminal part of the 3rd wiring layer by electrolytic Au plating (FIG.12 (e)). The terminal portion of the second wiring layer and the power feeding from the first power supply terminal, the terminal portion of the third wiring layer and the power feeding from the second feeding terminal, plating area S ₁ and the second power supply terminal for supplying power by the first power supply terminal the ratio of the plating area _{S 2} for feeding _{a, S 1: S 2 = 150} : set to 1. The plating conditions were current 0.8 A, voltage 1.8 V, temperature 65 ° C., and time 180 seconds. Finally, the outer shape of the metal support substrate was processed. As a result, a suspension substrate was obtained.

The thickness of the plated portion was measured on the obtained suspension substrate. As a result, _{D 1} shown in FIG. 4 (a) was 2.8 .mu.m. Moreover, the thickness of the plating part 5 formed on the terminal part 3ya of the second wiring layer is 2.8 μm, and the thickness of the plating part 5 formed on the terminal part 3za of the third wiring layer is 3. It was 9 μm.

[Example 2]
First, SUS304 (metal support member) having a thickness of 18 μm was prepared (FIG. 15A). Next, a photosensitive polyimide precursor solution was coated on a metal support member with a die coater, and a first insulating layer was formed by predetermined patterning (FIG. 15B). Next, a seed layer made of Cr was formed on the surface on the first insulating layer side by a sputtering method. Next, a predetermined resist pattern was formed on the seed layer, and a first wiring layer was formed on the portion exposed from the resist pattern by electrolytic copper plating (FIG. 15C).

  After removing the seed layer, a photosensitive polyimide precursor solution was coated on the patterned first wiring layer with a die coater, and a second insulating layer was formed by a predetermined patterning (FIG. 15D). Next, a seed layer made of Cr was formed on the surface on the second insulating layer side by a sputtering method. Next, a predetermined resist pattern was formed on the seed layer, and a third wiring layer was formed on the portion exposed from the resist pattern by an electrolytic copper plating method (FIG. 15E).

  After removing the seed layer, a polyimide precursor solution was coated on the patterned second wiring layer and third wiring layer with a die coater, and a cover layer was formed by predetermined patterning. Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching to form a first insulating layer.

Thereafter, plated portions were formed by electrolytic Au plating on the terminal portions of the second wiring layer and the third wiring layer (FIG. 12 (f)). The terminal portion of the second wiring layer and the power feeding from the first power supply terminal, the terminal portion of the third wiring layer and the power feeding from the second feeding terminal, plating area S ₁ and the second power supply terminal for supplying power by the first power supply terminal the ratio of the plating area _{S 2} for feeding _{a, S 1: S 2 = 150} : set to 1. The plating conditions were current 0.8 A, voltage 1.8 V, temperature 65 ° C., and time 180 seconds. Finally, the outer shape of the metal support substrate was processed. As a result, a suspension substrate was obtained.

  DESCRIPTION OF SYMBOLS 1 ... Metal support substrate, 2x ... 1st insulating layer, 2y ... 2nd insulating layer, 3x ... 1st wiring layer, 3y ... 2nd wiring layer, 3z ... 3rd wiring layer, 3ya ... Terminal part of 2nd wiring layer 3za ... terminal portion of third wiring layer, 4 ... cover layer, 5 ... plating portion, 5a ... first plating portion, 5b ... second plating portion, 11 ... first feeding portion, 12 ... second feeding portion, 100 ... Suspension substrate 101 ... Recording / reproducing element mounting area 102 ... External circuit board connection area 103 ... Wiring layer

Claims (5)

A metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and a second insulating layer formed on the first wiring layer A suspension substrate having a second wiring layer formed on the second insulating layer,
In plan view, a terminal portion of the third wiring layer is formed in the vicinity of the terminal portion of the second wiring layer,
The terminal part of the second wiring layer is formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side,
The terminal portion of the third wiring layer is formed on the second insulating layer not having the first wiring layer on the surface on the metal support substrate side, or on the first insulating layer,
Each of the terminal portion of the second wiring layer and the terminal portion of the third wiring layer is formed with a plating portion made of the same material,
The top part of the plating part formed on the terminal part of the second wiring layer and the top part of the plating part formed on the terminal part of the third wiring layer are matched,
The second wiring layer and the third wiring layer are wiring layers connected to a recording / reproducing element,
The suspension substrate, wherein the first wiring layer overlapping the terminal portion of the second wiring layer in plan view is a heat assist wiring layer.   A suspension board comprising: the suspension board according to claim 1; and a load beam provided on a surface of the suspension board on the metal support board side.   A suspension with an element, comprising: the suspension according to claim 2; and a recording / reproducing element disposed on the suspension.   A hard disk drive comprising the suspension with an element according to claim 3. A metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and a second insulating layer formed on the first wiring layer And a second wiring layer formed on the second insulating layer, and in plan view, a terminal portion of the third wiring layer is formed in the vicinity of the terminal portion of the second wiring layer. The terminal portions of the two wiring layers are formed on the second insulating layer having the first wiring layer on the surface on the metal support substrate side, and the terminal portions of the third wiring layer are on the surface on the metal support substrate side. Wiring formed on the second insulating layer without the first wiring layer or on the first insulating layer, the second wiring layer and the third wiring layer being connected to the recording / reproducing element Suspension wherein the first wiring layer that is a layer and overlaps the terminal portion of the second wiring layer in plan view is a wiring layer for heat assist A tio down a substrate for the production method of,
A plating part forming step of simultaneously forming a plating part on the terminal part of the second wiring layer and the terminal part of the third wiring layer;
In the plating portion forming step, power is supplied from the first power supply terminal to the terminal portion of the second wiring layer, power is supplied from the second power supply terminal to the terminal portion of the third wiring layer, and power is supplied from the second power supply terminal. The plating area to be made is smaller than the plating area fed by the first power supply terminal, so that the top of the plating part formed on the terminal part of the second wiring layer and the terminal part of the third wiring layer A method for manufacturing a suspension substrate, wherein the top portions of the plating portions formed on the substrate are made to coincide with each other.

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