JP5807804B2 - Suspension substrate, suspension, suspension with head, hard disk drive, and method for manufacturing suspension substrate - Google Patents

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate, and in particular, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension capable of improving high-frequency characteristics. The present invention relates to a method for manufacturing an industrial substrate.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate includes a metal support layer and a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. To write or read data.

  In recent years, it has been demanded to increase the amount of information processing and improve the processing speed by increasing the speed of signal transmission. For this purpose, it is necessary to improve electrical characteristics such as differential impedance.

  In order to cope with this, for example, a suspension substrate as shown in Patent Document 1 is known. Here, each of the first write wiring pattern and the second write wiring pattern has two divided lines, and the divided lines of the first write wiring pattern and the second line The divided lines of the write wiring pattern are alternately arranged. In this way, the differential impedance between the first write wiring pattern and the second write wiring pattern is reduced.

JP 2010-114366 A

  By the way, in order to achieve impedance matching between the magnetic head mounted on the suspension board and the preamplifier connected to the suspension board, the suspension board wiring is designed as a distributed constant circuit as the data speed increases. It is desired to improve the high frequency characteristics while reducing the differential impedance.

  However, in the suspension substrate shown in Patent Document 1, the first write wiring pattern and the second write wiring pattern are arranged on a base insulating layer laminated on a metal support layer made of stainless steel. Yes. For this reason, since each write wiring pattern is close to the metal support layer, the signal is attenuated by an unnecessary current flowing through the metal support layer through electromagnetic induction or the like, and the high frequency characteristics of each write wiring pattern are improved. Has become difficult.

  The present invention has been made in consideration of such points, and provides a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate that can improve high-frequency characteristics. Objective.

  According to the present invention, as a first solution, a head slider is mounted and extends from a head region including a head side terminal portion connected to the head slider to a tail region including a tail terminal portion to which an external connection board is connected. In the suspension substrate, a first insulating layer, a metal support layer provided on one surface of the first insulating layer, a first wiring layer provided on the other surface of the first insulating layer, and a first insulating layer A second insulating layer that covers the first wiring layer, and a second wiring layer that is provided in the second insulating layer and includes a plurality of wirings including the first wiring and the second wiring. The first wiring of the wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. The metal support layer includes a metal support layer body, a metal A metal support layer separator separated from the support layer body. The first insulating layer and the second insulating layer are provided with a plurality of conductive connection portions penetrating the first insulating layer and the second insulating layer, and each divided wiring portion of the first wiring has a corresponding conductive connection portion. There is provided a suspension substrate characterized in that the suspension substrate is connected to the metal support layer separator.

  In the suspension substrate according to the first solving means described above, the second wiring includes a head side wiring part extending from the head side terminal part, and a plurality of divided wiring parts divided from the head side wiring part, It is preferable that the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged.

  Further, in the suspension substrate according to the first solving means described above, the second wiring of the second wiring layer includes a tail side wiring portion extending from the tail terminal portion and connected to each divided wiring portion, and the metal support layer is And a second metal support layer separator provided on the tail region side from the metal support layer separator and separated from the metal support layer main body and the metal support layer separator, respectively. The first insulating layer and the second insulating layer In the layer, a plurality of second conductive connection portions penetrating the first insulating layer and the second insulating layer are provided, and each divided wiring portion of the second wiring is connected via the corresponding second conductive connection portion. It is preferably connected to the second metal support layer separator.

  Further, in the suspension substrate according to the first solving means described above, each of the conductive connection portions and each of the second conductive connection portions includes a through portion that penetrates the first insulating layer and the second insulating layer, and a second insulating layer. It is preferable to have a protruding portion that protrudes and has an outer edge located outward from the outer edge of the penetrating portion, and is connected to the penetrating portion.

  Further, in the suspension substrate according to the first solving means described above, each of the conductive connection portions and each of the second conductive connection portions includes a first insulating layer side conductive connection portion penetrating the first insulating layer and a first insulating layer. And a second insulating layer-side conductive connecting portion that is connected to the side conductive connecting portion and penetrates the second insulating layer, and the first insulating layer-side conductive connecting portion penetrates the first insulating layer. And a first protruding portion that protrudes from the first insulating layer and has an outer edge located outward from the outer edge of the first penetrating portion, and is connected to the first penetrating portion. The connecting portion has a second penetrating portion that penetrates the second insulating layer, an outer edge that protrudes from the second insulating layer and is located outward from the outer edge of the second penetrating portion, and is connected to the second penetrating portion. 2 projecting portions.

  Further, in the suspension substrate according to the first solution described above, the metal support layer separator of the metal support layer is disposed in the head region, and the second metal support layer separator is disposed in the tail region. It is preferable.

  In the suspension substrate according to the first solving means described above, it is preferable that the first wiring and the second wiring of the second wiring layer constitute a pair of writing wirings.

  In the suspension substrate according to the first solving means described above, it is preferable that the plurality of wirings of the second wiring layer have a pair of reading wirings.

  In the suspension substrate according to the first solving means described above, it is preferable that at least a part of the head side terminal portion is provided on the surface of the second insulating layer on the second wiring layer side.

  In the suspension substrate according to the first solving means described above, it is preferable that the first wiring layer has a power supply wiring for supplying power to the laser diode to be mounted.

  In the suspension substrate according to the first solution described above, the power supply wiring of the first wiring layer is arranged outside the wiring located on the outermost side among the plurality of wirings of the second wiring layer in plan view. It is preferable.

  In the suspension substrate according to the first solving means described above, the thickness of the first insulating layer is preferably equal to or less than the thickness of the second insulating layer.

  The present invention provides a suspension comprising a base plate and any one of the above-described suspension substrates attached to the base plate via a load beam.

  The present invention provides a suspension with a head comprising the above-described suspension and a head slider mounted on the suspension.

  The present invention provides a hard disk drive having the above-described suspension with a head.

  As a second solution of the present invention, a head slider is mounted and extends from a head region including a head side terminal portion connected to the head slider to a tail region including a tail terminal portion to which an external connection board is connected. In the method for manufacturing a suspension substrate, a step of preparing a laminated body having a first insulating layer and a metal support layer provided on one surface of the first insulating layer; Forming a plurality of first through holes penetrating the insulating layer, forming a first wiring layer on the other surface of the first insulating layer, and covering the first wiring layer with the first insulating layer Forming a plurality of second through holes penetrating the second insulating layer at positions corresponding to the first through holes, and forming a first wiring on the second insulating layer Forming a second wiring layer having a plurality of wirings including the second wiring; A step of forming a metal support layer main body and a metal support layer separated body separated from the metal support layer main body in the step of forming a second wiring layer. The first wiring of the wiring layer is formed so as to include a head side wiring portion extending from the head side terminal portion, and a plurality of divided wiring portions divided from the head side wiring portion. A conductive connection portion is formed in each second through hole, and each divided wiring portion of the first wiring is connected to the metal support layer separator through the corresponding conductive connection portion. A manufacturing method is provided.

  In the method of manufacturing the suspension substrate according to the second solution described above, in the step of forming the second wiring layer, the second wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion, and It is preferable that the plurality of divided wiring portions are divided from the head side wiring portion, and the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. .

  Further, in the method for manufacturing a suspension substrate according to the second solution described above, in the step of forming the metal support layer separator, the metal support layer body and the metal support layer separator are located closer to the tail region than the metal support layer separator. A plurality of second metal support layer separators separated from each other, and in the step of forming the first through holes, a plurality of holes penetrating the first insulating layer at positions corresponding to the second metal support layer separators. In the step of forming the third through hole and forming the second through hole, a plurality of fourth through holes penetrating the second insulating layer are formed at positions corresponding to the third through hole, and the second wiring layer is formed. In the forming step, the second wiring of the second wiring layer is formed so as to include a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion, and each third through hole and each second wiring layer. 4 Conductive contact with 4 through holes Parts are formed, each of the divided wiring portion of the second wiring through the second conductive connection portion corresponding, and is connected to a second metallic support layer separator, it is preferable.

  As a third solution, the present invention has a head slider mounted thereon and extends from a head region including a head side terminal portion connected to the head slider to a tail region including a tail terminal portion to which an external connection board is connected. In the method for manufacturing a suspension substrate, a step of preparing a laminated body having a first insulating layer and a metal support layer provided on one surface of the first insulating layer; Forming a plurality of first through holes penetrating the insulating layer; forming a first wiring layer on the other surface of the first insulating layer; and covering the first wiring layer with the first insulating layer Forming a second insulating layer and forming a plurality of second through holes penetrating the second insulating layer at a position corresponding to the first through hole; Forming a second wiring layer having a plurality of wirings including two wirings; And forming a metal support layer main body and a metal support layer separator separated from the metal support layer main body in the step of forming the first wiring layer. In the step of forming the first insulating layer side conductive connection portion in one through hole and forming the second wiring layer, the first wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion, a head side A plurality of divided wiring portions divided from the wiring portion, and a second insulating layer side conductive connection portion connected to the first insulating layer side conductive connection portion is formed in each second through hole. Each of the divided wiring portions of the first wiring is connected to the metal support layer separator via the corresponding first insulating layer side conductive connection portion and second insulating layer side conductive connection portion. Provided is a method for manufacturing an industrial substrate.

  In the suspension substrate manufacturing method according to the third solving means described above, in the step of forming the second wiring layer, the second wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion; It is preferable that the plurality of divided wiring portions are divided from the head side wiring portion, and the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. .

  In the method for manufacturing a suspension substrate according to the third solution described above, in the step of forming the metal support layer separator, the metal support layer body and the metal support layer separator are located closer to the tail region than the metal support layer separator. A plurality of second metal support layer separators separated from each other, and in the step of forming the first through holes, a plurality of holes penetrating the first insulating layer at positions corresponding to the second metal support layer separators. In the step of forming the third through hole and forming the second through hole, a plurality of fourth through holes penetrating the second insulating layer are formed at positions corresponding to the third through hole, and the first wiring layer is formed. In the forming step, the first insulating layer side conductive connection portion is formed in each third through hole, and in the step of forming the second wiring layer, the second wiring of the second wiring layer extends from the tail terminal portion, Tail connected to split wiring A second insulating layer-side conductive connecting portion connected to the first insulating layer-side conductive connecting portion formed in the third through hole is formed in each fourth through-hole while being formed to include the wiring portion, Each divided wiring portion of the second wiring is connected to the first insulating layer side conductive connecting portion formed in the corresponding third through hole and the second insulating layer side conductive connecting portion formed in the fourth through hole. It is preferable to be connected to the two metal support layer separators.

  According to the present invention, the first wiring of the second wiring layer has a plurality of divided wiring portions, and the second wiring layer supports the metal via the second insulating layer, the first wiring layer, and the first insulating layer. Laminated in layers. Thus, the second wiring layer having the first wiring can be separated from the metal support layer, and an electric signal transmitted in the first wiring is signaled by an unnecessary current flowing through the metal support layer through electromagnetic induction or the like. Attenuation can be suppressed. For this reason, the high frequency characteristic of each wiring of a 2nd wiring layer can be improved. Moreover, according to this invention, each division | segmentation wiring part of 1st wiring is connected by the metal support layer separated body isolate | separated from the metal support layer main body. As a result, a wiring space can be secured in the first wiring layer, and the degree of freedom in wiring design in the first wiring layer can be improved.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2A is a plan view showing a head-side jumper portion in the suspension substrate according to the first embodiment of the present invention, and FIG. 2B is a plan view showing a tail-side jumper portion. FIG. 3 is a diagram showing a cross-sectional structure including a head-side jumper portion in the suspension substrate according to the first embodiment of the present invention. FIG. 4 is a diagram showing details of the conductive connection portion in the suspension substrate according to the first embodiment of the present invention. FIG. 5 is a plan view showing an example of a suspension according to the first embodiment of the present invention. FIG. 6 is a plan view showing an example of a suspension with a head according to the first embodiment of the present invention. FIG. 7 is a perspective view showing an example of the hard disk drive according to the first embodiment of the present invention. FIGS. 8A to 8G are views showing a method for manufacturing a suspension substrate in the first embodiment of the present invention. FIG. 9 is a view showing a modification of FIG. FIG. 10A is a diagram showing a cross-sectional structure including a head-side jumper portion in the suspension substrate according to the second embodiment of the present invention. FIG.10 (b) is a figure which shows the cross-sectional structure containing a tail side jumper part. FIG. 11 is a diagram showing details of the conductive connection portion in the suspension substrate according to the second embodiment of the present invention. 12 (a) to 12 (g) are views showing a method for manufacturing a suspension substrate in the second embodiment of the present invention.

First Embodiment A manufacturing method of a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension substrate 1 is mounted with a head slider 112 (see FIG. 6), which will be described later, and from the head region 2 including the head-side terminal portion 4 connected to the head slider 112 to the external connection substrate 113. Is formed so as to extend to the tail region 3 including the tail terminal portion 5 connected thereto. Here, the head region 2 means a region around the mounted head slider 112 and close to the head side terminal portion 4 connected to the head slider 112, and the tail region 3 is an external connection board. This means a region close to the tail terminal portion 5 connected to 113. An example of the external connection board 113 is a flexible printed board.

  As shown in FIG. 1 and FIG. 3, the suspension substrate 1 is provided on the insulating layer 10, one surface of the insulating layer 10, the conductive metal support layer 20, and the other surface of the insulating layer 10. The first wiring layer 30 provided, the second insulating layer 40 provided on the first insulating layer 10 and covering the first wiring layer 30, and the second wiring provided on the second insulating layer 40 and having a plurality of wirings And a layer 50. The plurality of wirings of the second wiring layer 50 include a first wiring 51 and a second wiring 52 that constitute a pair of writing wirings, a third wiring 53 and a fourth wiring 54 that constitute a pair of reading wirings, Is included. That is, as shown in FIG. 3, each of the first wiring 51 and the second wiring 52 constituting the writing wiring and the third wiring 53 and the fourth wiring 54 constituting the reading wiring are both the second wiring. It is provided on the insulating layer 40.

  As shown in FIGS. 2 and 3, the first wiring layer 30 has power wiring 33 for supplying power to the laser diode 114 (see FIG. 6) to be mounted. The laser diode 114 is mounted on the back surface of the head slider 112 corresponding to the thermally assisted recording method. The thermally assisted recording method is a disk 123 (FIG. 7) in which magnetic particles are made smaller to increase the density. In the recording method, a portion having magnetic recording is instantaneously heated to enable recording with high coercive force, which is difficult at room temperature. The above-described power supply wiring 33 is located on a plurality of wirings of the second wiring layer 50, that is, on the outermost side (right side in FIGS. 2 and 3) in plan view (when viewed as in FIG. 1 or FIG. 2). The second wiring 52 is disposed outside the divided wiring portion. Thereby, the influence on signal transmission by external noise etc. can be reduced. In FIG. 1, the power supply wiring 33 is omitted for the sake of clarity.

  At least a part of the head-side terminal portion 4 provided in the head region 2 is provided on the surface of the second insulating layer 40 on the second wiring layer 50 side. That is, the head-side terminal portion 4 is provided on the first insulating layer 10, and is connected to the power supply wiring 33 of the first wiring layer 30, a laser diode terminal (power supply terminal, not shown), and the second insulating layer. And a plurality of head terminals 4 a connected to the respective wirings 51 to 54 of the second wiring layer 50. In this way, the head-side terminal portion 4 has a two-stage configuration and can be connected to corresponding pads of the high-performance head slider 112 having a large number of pads. The laser diode terminal is formed of the same material as the power supply wiring 33 of the first wiring layer 30 and is subjected to nickel (Ni) plating and gold (Au) plating. The head terminal 4a is formed of the same material as the wirings 51 to 54 of the second wiring layer 50, and is subjected to nickel plating and gold plating in the same manner as the laser diode terminal.

  As shown in FIGS. 1 to 3, the first wiring 51 includes a first head-side wiring part 51 a extending from the head terminal 4 a of the head-side terminal part 4, and a plurality of (divided from the first head-side wiring part 51 a ( For example, two first divided wiring portions 51b and 51c are included, and the first head side wiring portion 51a is connected to each first division via a head side jumper portion 71 provided in the head region 2. The wiring parts 51b and 51c are connected so as to be divided. The first wiring 51 further includes a first tail-side wiring part 51d extending from the tail terminal part 5, and each first divided wiring part 51b, 51c is on the tail side described later on the second insulating layer 40. In the vicinity of the jumper part 72, the first tail side wiring part 51d is connected so as to be divided.

  The second wiring 52 includes a second head-side wiring portion 52a extending from the head terminal 4a of the head-side terminal portion 4, and a plurality of (for example, two) second divided wirings divided from the second head-side wiring portion 52a. Parts 52b and 52c. Each of the second divided wiring portions 52b and 52c is connected on the second insulating layer 40 so as to be divided from the second head side wiring portion 52a in the vicinity of the head side jumper portion 71. The second wiring 52 further includes a second tail side wiring portion 52 d extending from the tail terminal portion 5, and each of the second divided wiring portions 52 b and 52 c is a tail side jumper portion 72 provided in the tail region 3. The second tail side wiring portion 52d is connected to be separated from the second tail side wiring portion 52d.

  The first divided wiring portions 51 b and 51 c of the first wiring 51 and the second divided wiring portions 52 b and 52 c of the second wiring 52 are alternately arranged. That is, one second divided wiring portion 52b is interposed between the two first divided wiring portions 51b and 51c, and the other first divided wiring portion is interposed between the two second divided wiring portions 52b and 52c. The part 51c is interposed. In this way, an interleaved wiring structure is formed by the first wiring 51 and the second wiring 52.

  The metal support layer 20 includes a metal support layer main body 21, a head side jumper wiring part (metal support layer separator) 22 separated from the metal support layer main body 21, and the tail region 3 side from the metal support layer separator 22. And a tail side jumper wiring portion (second metal support layer separator) 23 that is provided and separated from the metal support layer main body 21 and the metal support layer separator 22. Separation grooves 24 are provided between the metal support layer main body 21 and the head-side jumper wiring part 22 and between the metal support bar main body 21 and the tail-side jumper wiring part 23, and the metal support layer main body 21. The jumper wiring portions 22 and 23 are electrically insulated from each other. In the present embodiment, the metal support layer main body 21 is provided on both sides of each jumper wiring portion 22, 23, and each jumper wiring portion 22, 23 is surrounded by the metal support layer main body 21. Although the jumper wiring portions 22 and 23 are separated from the metal support layer main body 21, the shapes of the metal support layer main body 21 and the metal support layer separators 22 and 23 may be arbitrary. it can. 3 is preferably half-etched and positioned closer to the first insulating layer side 10 than the lower surface of the metal support layer body 21. In FIG. In this case, each jumper wiring part 22 and 23 can be prevented from coming into contact with a load beam 102 described later.

  As shown in FIG. 2A, the head side jumper portion 71 is provided with two first head side through holes (first through holes) 11a and 11b penetrating the first insulating layer 10, and each first Second head side through holes (second through holes) 41a and 41b penetrating the second insulating layer 40 are provided at positions corresponding to the head side through holes. Head-side conductive connection portions (conductive connection portions, vias) 73a and 73b are provided in the first head-side through holes 11a and 11b and the second head-side through holes 41a and 41b, respectively. The head-side jumper wiring part 22 of the metal support layer 20 is provided at a position corresponding to the head-side conductive connection parts 73a and 73b, and each first divided wiring part 51b and 51c of the first wiring 51 is a corresponding head. It is connected to the head-side jumper wiring part 22 of the metal support layer 20 through the side conductive connection parts 73a and 73b. That is, one first divided wiring portion 51b is connected to the head side jumper wiring portion 22 via one head side conductive connection portion 73a, and the other first divided wiring portion 51c is connected to the other head side conductive connection portion. It is connected to the head side jumper wiring part 22 through 73b. The first head-side wiring part 51a is connected to the first divided wiring part 51b through the head-side conductive connection part 73a.

  The tail side jumper portion 72 has the same structure as the head side jumper portion 71, and is provided on the tail region 3 side from the head side jumper portion 71 as shown in FIG. In the tail side jumper portion 72, as shown in FIG. 2B, two first tail side through holes (third through holes) 12a and 12b penetrating the first insulating layer 10 are provided. Second tail side through holes (fourth through holes) 42a and 42b penetrating the second insulating layer 40 are provided at positions corresponding to the first tail side through holes 12a and 12b. Tail side conductive connection portions (second conductive connection portions, vias) 74a, 74b are provided in the first tail side through holes 12a, 12b and the second tail side through holes 42a, 42b. The tail-side jumper wiring part 23 of the metal support layer 20 is provided at a position corresponding to the tail-side conductive connection parts 74a and 74b, and each second divided wiring part 52b and 52c of the second wiring 52 has a corresponding tail. It is connected to the tail side jumper wiring part 23 of the metal support layer 20 through the side conductive connection parts 74a and 74b. That is, one second divided wiring portion 52b is connected to the tail side jumper wiring portion 23 via one tail side conductive connection portion 74a, and the other second divided wiring portion 52c is connected to the other tail side conductive connection portion. It is connected to the tail side jumper wiring part 23 through 74b. The second tail side wiring portion 52d is connected to the second divided wiring portion 51c via the tail side conductive connection portion 74b.

  As shown in FIG. 4, each of the head-side conductive connection portions 73a and 73b and each of the tail-side conductive connection portions 74a and 74b includes a through portion 75 penetrating the first insulating layer 10 and the second insulating layer 40, and a second insulating layer. A protruding portion 76 that protrudes from the layer 40, has an outer edge 76 a that is located outward from the outer edge 75 a of the penetrating portion 75 (relative to the central axis of the penetrating portion 75), and is connected to the penetrating portion 75 ing. In the present embodiment, the penetrating portion 75 has a cylindrical shape, and the protruding portion 76 has a disc shape so as to have an outer diameter larger than that of the penetrating portion 75. It is integrally formed. By forming the protruding portion 76 in this way, the diameter of the opening of the resist (not shown) for forming the conductive connection portions 73a, 73b, 74a, 74b is made larger than the diameter of the corresponding through hole. In this case, the opening can be allowed to be displaced to some extent with respect to the corresponding through hole.

  As shown in FIG. 3, a protective layer 60 that covers the second wiring layer 50 is provided on the second insulating layer 40. In FIGS. 1 and 2, the protective layer 60 is omitted for the sake of clarity.

  Although not shown, between the first insulating layer 10 and the first wiring layer 30, and between the second insulating layer 40 and the second wiring layer 50 and the conductive connection portions 73a, 73b, 74a, 74b, A seed layer made of nickel (Ni), chromium (Cr), copper (Cu) and having a thickness of about 300 nm may be interposed. In this case, the adhesion between the insulating layers 10 and 40 and the corresponding wiring layers 30 and 50 or the conductive connection portions 73a, 73b, 74a, and 74b can be improved.

  Next, each component will be described in detail.

  The material of the first insulating layer 10 and the second insulating layer 40 is not particularly limited as long as it has a desired insulating property. For example, it is preferable to use polyimide (PI). The material of each of the insulating layers 10 and 40 can be a photosensitive material or a non-photosensitive material. The thickness of the first insulating layer 10 is preferably equal to or less than the thickness of the second insulating layer 40. Of these, the thickness of the first insulating layer 10 is preferably 3 μm to 15 μm, particularly preferably 5 μm, and the thickness of the second insulating layer 40 is preferably 3 μm to 10 μm, particularly preferably 5 μm. Thus, the insulation performance between the metal support layer 20 and the first wiring layer 30 and the insulation performance between the first wiring layer 30 and the second wiring layer 50 are ensured, and the rigidity of the suspension substrate 1 as a whole is increased. It can be prevented from being lost.

  Each wiring 51-54 of the 2nd wiring layer 50 and the power supply wiring 33 of the 1st wiring layer 30 are comprised as a conductor for transmitting an electric signal, and are formed with the same material. The material of each of the wirings 33 and 51 to 54 is not particularly limited as long as the material has desired conductivity, but it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, the thickness of each wiring 33, 51-54 is, for example, preferably 1 μm to 18 μm, and particularly preferably 5 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of the wires 33 and 51 to 54 and to prevent the flexibility of the suspension substrate 1 as a whole from being lost.

  The material of each of the conductive connection portions 73a, 73b, 74a, and 74b is not particularly limited as long as it is a material having desired conductivity, and examples thereof include copper or nickel. In the present embodiment, the conductive connection portions 73a, 73b, 74a, and 74b are formed of the same material as the wirings 51 to 54 of the second wiring layer 50.

  The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. In addition, the thickness of the metal support layer 20 can be 10 micrometers-30 micrometers as an example, and can be 15 micrometers-25 micrometers especially. As a result, it is possible to ensure the conductivity of each of the jumper wiring portions 22 and 23 of the metal support layer 20 and prevent the flexibility of the suspension substrate 1 as a whole from being lost.

  As a material of the protective layer 60, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 60 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 60 is preferably 3 μm to 10 μm, particularly 5 μm.

  Next, the suspension 101 in the present embodiment will be described with reference to FIG. The suspension 101 shown in FIG. 5 is provided on the surface opposite to the surface on which the above-described suspension substrate 1 and the head slider 112 (see FIG. 6) described later of the suspension substrate 1 are mounted. And a load beam 102 for holding the disk 123 (see FIG. 7).

  Next, the suspension with head 111 in the present embodiment will be described with reference to FIG. A suspension with head 111 shown in FIG. 6 includes the suspension 101 described above and a head slider 112 mounted on the head region 2 of the suspension substrate 1.

  Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. 7 includes a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to the voice coil motor 125 via an arm 126.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described. Here, as an example, a method for manufacturing the suspension substrate 1 by the subtractive method will be described with reference to FIG. 8 showing a cross-sectional structure of the head-side jumper portion 71. Since the tail side jumper portion 72 can be manufactured in the same manner as the head side jumper portion 71, detailed description thereof is omitted here.

  First, the laminated body 80 which has the 1st insulating layer 10 and the metal support layer 20 which has the electroconductivity provided in the one surface of the 1st insulating layer 10 is prepared (refer Fig.8 (a)). In this case, first, the metal support layer 20 is prepared, and the first insulating layer 10 is formed on the metal support layer 20 by a coating method using non-photosensitive polyimide.

  Subsequently, a plurality of first head side through holes 11a and 11b penetrating the first insulating layer 10 are formed in the first insulating layer 10 (see FIG. 8B). In this case, a patterned resist (not shown) is formed on the first insulating layer 10, and a portion of the first insulating layer 10 exposed from the resist is etched to be processed. As a result, first head side through holes 11a and 11b penetrating the first insulating layer 10 are obtained. For example, an organic alkaline solution can be used as the etching solution. After the etching is performed, the resist is removed.

  Next, the first wiring layer 30 is formed on the other surface of the first insulating layer 10 (see FIG. 8C). In this case, first, nickel, chromium, and copper are sequentially coated on the first insulating layer 10 by a sputtering method to form a seed layer (not shown). Subsequently, a patterned resist (not shown) is formed, and a first wiring layer 30 having a power supply wiring 33 is formed on the first insulating layer 10 by electrolytic copper plating in an opening of the resist. At this time, a laser diode terminal (not shown) is formed in the same manner. Thereafter, the resist is removed.

  Thereafter, a second insulating layer 40 is formed on the first insulating layer 10 so as to cover the first wiring layer 30, and at a position corresponding to the first head side through holes 11 a and 11 b, the second insulating layer 40 is formed. A plurality of second head side through holes 41a and 41b penetrating through are formed (see FIG. 8D). In this case, first, the second insulating layer 40 is formed on the first insulating layer 10 so as to cover the first wiring layer 30. Subsequently, a patterned resist (not shown) is formed on the formed second insulating layer 40, and a portion of the second insulating layer 40 exposed from the resist is etched to be processed. Thus, second head side through holes 41a and 41b penetrating the second insulating layer 40 are obtained. For example, an organic alkaline solution can be used as the etching solution. After the etching is performed, the resist is removed.

  Next, the second wiring layer 50 having the wirings 51 to 54 is formed on the second insulating layer 40 (see FIG. 8E). At this time, head-side conductive connection portions 73a and 73b are formed in the first head-side through holes 11a and 11b and the second head-side through holes 41a and 41b, respectively. In this case, a patterned resist (not shown) is formed on the second insulating layer 40, and the wirings 51 to 54 are formed on the second insulating layer 40 by electrolytic copper plating at the opening of the resist. In addition, head-side conductive connection portions 73a and 73b are formed in the first head-side through holes 11a and 11b and the second head-side through holes 41a and 41b. Here, the first divided wiring portions 51b and 51c of the first wiring 51 and the corresponding head side conductive connection portions 73a and 73b are integrally formed. At this time, the head terminal 4a is formed in the same manner. Thereafter, the resist is removed.

  After the second wiring layer 50 is formed, a protective layer 60 that covers the second wiring layer 50 is formed on the second insulating layer 40 (see FIG. 8F). In this case, first, the protective layer 60 is formed on the second insulating layer 40 so as to cover the second wiring layer 50. Subsequently, a patterned resist (not shown) is formed on the formed protective layer 60, and a portion of the protective layer 60 exposed from the resist is etched to be processed. For example, an organic alkaline solution can be used as the etching solution. After the etching is performed, the resist is removed.

  Next, although not shown, nickel plating and gold plating are sequentially applied to the head side terminal portion (laser diode terminal and head terminal 4a) 4 and tail terminal portion 5.

  Thereafter, in the metal support layer 20, a metal support layer main body 21, a head-side jumper wiring portion 22, and a tail-side jumper wiring portion 23 are formed, and the metal support layer 20 is trimmed (FIG. 8G). reference). In this case, a patterned resist (not shown) is formed on the metal support layer 20, and a portion of the metal support layer 20 exposed from the resist is etched. For example, a ferric chloride aqueous solution can be used as the etching solution. After the etching is performed, the resist is removed. Thus, the suspension substrate 1 in the present embodiment is obtained.

  A load beam 102 is attached to the lower surface of the obtained suspension substrate 1 to obtain the suspension 101 shown in FIG. A head slider 112 is mounted on the head region 2 of the suspension 101 to obtain a suspension with head 111 shown in FIG. In this case, the plurality of pads of the head slider 112 are connected to the corresponding head side terminal portions 4. Further, the suspension with head 111 is attached to the case 122 of the hard disk drive 121 to obtain the hard disk drive 121 shown in FIG.

  When writing and reading data in the hard disk drive 121 shown in FIG. 7, the head slider 112 of the suspension with head 111 is moved along the disk 123 by the voice coil motor 125 and is rotated by the spindle motor 124. Keep close to the desired flying height. As a result, data is exchanged between the head slider 112 and the disk 123. During this time, electrical signals are transmitted by the respective wirings 51 to 54 extending between the head side terminal portion 4 and the tail terminal portion 5 of the suspension substrate 1.

  Thus, according to the present embodiment, the first wiring 51 and the second wiring 52 of the second wiring layer 50 have an interleaved wiring structure as a pair of write wirings, and the second wiring layer 50 is The metal support layer 20 is laminated via the second insulating layer 40, the first wiring layer 30 and the first insulating layer 10. Thus, the first wiring 51 and the second wiring 52 can be separated from the metal support layer 20, and an electric signal transmitted through the first wiring 51 and the second wiring 52 is electromagnetically induced to the metal support layer 20. It is possible to suppress signal attenuation due to unnecessary current flowing through the. For this reason, the high frequency characteristics of the first wiring 51 and the second wiring 52 of the second wiring layer 50 can be improved.

  Further, according to the present embodiment, the divided wiring portions 51 b and 51 c of the first wiring 51 are connected by the head-side jumper wiring portion 22 separated from the metal support layer main body 21. Further, the divided wiring portions 52 b and 52 c of the second wiring 52 are connected by the tail side jumper wiring portion 23 separated from the metal support layer main body 21. As a result, a wiring space can be secured in the first wiring layer 30 and the degree of freedom in wiring design in the first wiring layer 30 can be improved.

  Further, according to the present embodiment, the conductive connection portions 73a, 73b, 74a, and 74b that penetrate the first insulating layer 10 and the second insulating layer 40 are formed together with the second wiring layer 50 by a single plating process. be able to. Thereby, the process of forming each conductive connection part 73a, 73b, 74a, 74b can be simplified.

  In addition, according to the present embodiment, similarly to the first wiring 51 and the second wiring 52, the third wiring 53 and the fourth wiring 54 constituting a pair of reading wirings are formed on the second insulating layer 40. Is provided. As a result, like the pair of write wirings, the electric signal transmitted through the third wiring 53 and the fourth wiring 54 is attenuated by an unnecessary current flowing through the metal support layer 20 through electromagnetic induction or the like. This can be suppressed, and the high-frequency characteristics of the third wiring 53 and the fourth wiring 54 can be improved.

  In addition, according to the present embodiment, as described above, the second wiring layer 50 having the wirings 51 to 54 is made of metal via the second insulating layer 40, the first wiring layer 30, and the first insulating layer 10. Since it is laminated on the support layer 20, the electric signal transmitted in each of the wirings 51 to 54 of the second wiring layer 50 is attenuated by an unnecessary current flowing through the metal support layer 20 through electromagnetic induction or the like. Can be suppressed. As a result, the thickness of the first insulating layer 10 can be reduced, and the overall thickness of the suspension substrate 1 can be reduced. Further, in this case, the flexibility of the suspension substrate 1 can be improved to prevent warping and the amount of insulating material used can be reduced, and the suspension substrate 1 can be reduced in weight and cost. it can.

  Further, according to the present embodiment, the first wiring 51 and the second wiring 52 of the second wiring layer 50 constituting the pair of write wirings have an interleaved wiring structure. Thereby, the differential impedance between the first wiring 51 and the second wiring 52 can be reduced, and the electrical characteristics can be improved. In particular, according to the present embodiment, the head side jumper wiring portion 22 of the first wiring layer 30 is disposed in the head region 2, and the tail side jumper wiring portion 22 is disposed in the tail region 3. Accordingly, the first divided wiring portions 51b and 51c and the second divided wiring portions 52b and 52c can be lengthened, and the differential impedance between the first wiring 51 and the second wiring 52 is further reduced. can do.

  Further, according to the present embodiment, the second wiring layer 50 includes the first wiring 51 and the second wiring 52 that constitute a pair of writing wirings, the third wiring 53 that constitutes a pair of reading wirings, and The first wiring layer 30 includes a power supply wiring 33. As described above, the power supply wiring 33 is arranged on the first insulating layer 10 and the wiring connecting the head slider 112 and the external connection substrate 113 is arranged on the second insulating layer 40, thereby reducing the degree of freedom in wiring design. Can be improved.

  Further, according to the present embodiment, the head-side terminal portion 4 is provided on the first insulating layer 10 and is connected to the laser diode terminal (not shown) connected to the power supply wiring 33 of the first wiring layer 30. And a head terminal 4 a provided on the second insulating layer 40 and connected to the wirings 51 to 54 of the second wiring layer 50. As a result, the head-side terminal portion 4 connected to the head slider 112 can have a two-stage configuration, and a high-performance head slider 112 having a large number of pads can be mounted.

  Further, according to the present embodiment, the power supply wiring 33 of the first wiring layer 30 is outside the wiring located on the outermost side of the first wiring 51 and the second wiring 52 of the second wiring layer 50 in plan view. Is arranged. Thereby, each wiring 51-54 of the 2nd wiring layer 50 can be protected from an external noise, and the electrical property of each wiring 51-54 of the 2nd wiring layer 50 can be improved.

  In the present embodiment, an example in which the second wiring layer 50 includes the third wiring 53 and the fourth wiring 54 that constitute a pair of reading wirings has been described. However, the present invention is not limited to this, and the first wiring layer 30 may have a pair of reading wirings. In other words, the reading wiring may be provided on the first insulating layer 10. Further, the example in which the first wiring layer 30 has the power supply wiring 33 has been described, but the second wiring layer 50 may have the power supply wiring 33.

  In the present embodiment, the power supply wiring 33 of the first wiring layer 30 is outside the wiring located on the outermost side of the first wiring 51 and the second wiring 52 of the second wiring layer 50 in plan view. The example of arrangement has been described. However, the present invention is not limited to this, and the power supply wiring 33 may be arranged at an arbitrary position on the first insulating layer 10.

  In the present embodiment, the head side jumper wiring portion 22 is disposed in the head region 2 and the tail side jumper wiring portion 23 is disposed in the tail region 3. However, the present invention is not limited to this, and the head-side jumper wiring portion 22 may be disposed closer to the tail region 3 than the head region 2, or the tail-side jumper wiring portion 23 may be disposed more than the tail region 3. May be arranged on the head region 2 side.

  In the present embodiment, the example in which the first wiring 51 of the second wiring layer 50 includes the two first divided wiring portions 51b and 51c has been described. However, the present invention is not limited to this. The first wiring 51 may have three or more first divided wiring portions and may be connected by the head-side jumper wiring portion 31. Similarly, the second wiring 52 of the second wiring layer 50 may have three or more second divided wiring portions and may be connected by the tail side jumper wiring portion 32.

  Furthermore, in the present embodiment, the example in which the protective layer 60 that covers the second wiring layer 50 is provided on the second insulating layer 40 has been described. However, the present invention is not limited to this, and it is not necessary to provide such a protective layer 60 as shown in FIG. In this case, it is preferable that the wirings 51 to 54 of the second wiring layer 50 and the conductive connection portions 73a, 73b, 74a, and 74b are plated for corrosion prevention.

Second Embodiment Next, a method for manufacturing a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to a second embodiment of the present invention will be described with reference to FIGS.

  In the second embodiment shown in FIGS. 10 to 12, each conductive connection portion is connected to a first insulating layer side conductive connection portion penetrating the first insulating layer and a first insulating layer side conductive connection portion. And the second insulating layer side conductive connecting portion penetrating the second insulating layer, and the other configuration is substantially the same as that of the first embodiment shown in FIGS. It is. 10 to 12, the same parts as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 10A and 10B, each of the head-side conductive connection portions and each of the tail-side conductive connection portions includes a first insulating layer-side conductive connection portion 91 that penetrates the first insulating layer 10, and a first And a second insulating layer side conductive connecting portion 92 that is connected to the insulating layer side conductive connecting portion 91 and penetrates through the second insulating layer 40.

  That is, in the head-side jumper portion 71, as shown in FIG. 10A, the first insulating layer 10 is provided with first head-side through holes 11a and 11b penetrating the first insulating layer 10 to provide the second insulating layer. Second head side through holes 41a and 41b penetrating the second insulating layer 40 are provided in the layer 40, and first insulating layer side conductive connection portions 91 are formed in the first head side through holes 11a and 11b. The second insulating layer side conductive connection portion 92 is formed in the two head side through holes 41a and 41b. Further, in the tail side jumper portion 72, as shown in FIG. 10 (b), the first insulating layer 10 is provided with first tail side through holes 12a and 12b penetrating the first insulating layer 10 to provide the second insulating layer. The layer 40 is provided with second tail side through holes 42a and 42b penetrating the second insulating layer 40, and the first insulating layer side conductive connection portion 91 is formed in the first tail side through holes 12a and 12b. A second insulating layer side conductive connection portion 92 is formed in the two tail side through holes 42a and 42b.

  As shown in FIG. 11, the first insulating layer side conductive connection portion 91 is provided in the corresponding through hole 11 a, 11 b, 12 a, 12 b, and the first through portion 93 penetrating the first insulating layer 10 and the first A first projecting portion 94 that protrudes from the insulating layer and has an outer edge 94 a located outside the outer edge 93 a of the first penetrating portion 93 and connected to the first penetrating portion 93. In the present embodiment, the first penetrating portion 93 has a cylindrical shape, and the first projecting portion 94 has a disc shape so as to have an outer diameter larger than that of the first penetrating portion 93, and the first penetrating portion 93 The portion 93 and the first protruding portion 94 are integrally formed. By forming the first protruding portion 94 in this way, the diameter of the opening of the resist (not shown) for forming the first insulating layer side conductive connection portion 91 is made larger than the diameter of the corresponding through hole. In this case, the opening can be allowed to be displaced to some extent with respect to the corresponding through hole.

  Similarly, the second insulating layer side conductive connection portion 92 is provided in the corresponding through hole 12 a, 12 b, 42 a, 42 b, and the second through portion 95 penetrating the second insulating layer 40 and the second insulating layer 40. A second protruding portion 96 that protrudes and has an outer edge 96 a located outward from the outer edge 95 a of the second penetrating portion 95, and is connected to the second penetrating portion 95. In the present embodiment, the second penetrating portion 95 has a cylindrical shape, and the second projecting portion 96 has a disc shape so as to have an outer diameter larger than that of the second penetrating portion 95. The portion 96 and the second protruding portion 95 are integrally formed. By forming the second protruding portion 96 in this way, the diameter of the opening of the resist (not shown) for forming the second insulating layer side conductive connection portion 92 is made larger than the diameter of the corresponding through hole. In this case, the opening can be allowed to be displaced to some extent with respect to the corresponding through hole.

  When manufacturing the suspension substrate 1 according to the present embodiment, first, a laminated body having the first insulating layer 10 and the conductive metal support layer 20 provided on one surface of the first insulating layer 10. 80 is prepared (see FIG. 12A). Since the tail side jumper portion 72 can be manufactured in the same manner as the head side jumper portion 71, detailed description thereof is omitted here.

  Subsequently, a plurality of first head side through holes 11a and 11b penetrating the first insulating layer 10 are formed in the first insulating layer 10 (see FIG. 12B).

  Next, the first wiring layer 30 is formed on the other surface of the first insulating layer 10 (see FIG. 12C). At this time, the first insulating layer-side conductive connection portion 91 is formed in each of the first head-side through holes 11a and 11b. In this case, first, the first wiring layer 30 having the power supply wiring 33 is formed on the first insulating layer 10 by electrolytic copper plating, and the first head side through holes 11a and 11b are provided with the first insulating layer side. A conductive connection 91 is formed.

  Thereafter, a second insulating layer 40 is formed on the first insulating layer 10 so as to cover the first wiring layer 30, and at a position corresponding to the first head side through holes 11 a and 11 b, the second insulating layer 40 is formed. A plurality of second head side through holes 41a and 41b penetrating through are formed (see FIG. 12D).

  Next, the second wiring layer 50 having the wirings 51 to 54 is formed on the second insulating layer 40 (see FIG. 12E). At this time, the second insulating layer-side conductive connection portion 92 is formed in each of the second head-side through holes 41a and 41b. In this case, the wirings 51 to 54 are formed on the second insulating layer 40 by the electrolytic copper plating method, and the second insulating layer side conductive connection portions 92 are formed in the second head side through holes 41a and 41b. The Here, the first divided wiring portions 51b and 51c of the first wiring 51 and the corresponding second insulating layer side conductive connection portions 92 are integrally formed. Further, the second insulating layer side conductive connecting portion 92 is connected to the first insulating layer side conductive connecting portion 91, and the head side conductive connecting portions 73a and 73b are obtained.

  After the second wiring layer 50 is formed, a protective layer 60 that covers the second wiring layer 50 is formed on the second insulating layer 40 (see FIG. 12F). Thereafter, in the metal support layer 20, a metal support layer body 21, a head-side jumper wiring portion 22, and a tail-side jumper wiring portion 23 are formed, and the metal support layer 20 is subjected to outer shape processing (FIG. 12G). reference). Thus, the suspension substrate 1 in the present embodiment is obtained.

  As described above, according to the present embodiment, after the first insulating layer side conductive connecting portion 91 penetrating the first insulating layer 10 is formed, the second insulating layer side conductive connecting portion penetrating the second insulating layer 40 is formed. 92 is formed, and the first insulating layer side conductive connecting portion 91 and the second insulating layer side conductive connecting portion 92 form head side conductive connecting portions 73a and 73b and tail side conductive connecting portions 74a and 74b. The Thus, by performing the process of forming each conductive connection portion 73a, 73b, 74a, 74b in two steps, it is possible to prevent the conductive connection portions 73a, 73b, 74a, 74b from being defective and to be conductive. Sex can be secured.

  Although the embodiments of the present invention have been described in detail, the suspension substrate, the suspension, the suspension with a head, the hard disk drive, and the suspension substrate manufacturing method according to the present invention are not limited to the above-described embodiments. Instead, various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 3 Tail area | region 4 Head side terminal part 4a Head terminal 5 Tail terminal part 10 1st insulating layer 11a, 11b 1st head side through-hole 12a, 12b 1st tail side through-hole 20 Metal support layer 21 Metal support layer body 22 Head side jumper wiring portion 23 Tail side jumper wiring portion 24 Groove 30 First wiring layer 33 Power supply wiring 40 Second insulating layers 41a and 41b Second head side through holes 42a and 42b Second tail side through holes 50 2nd wiring layer 51 1st wiring 51a 1st head side wiring part 51b, 51c 1st divided wiring part 51d 1st tail side wiring part 52 2nd wiring 52a 2nd head side wiring part 52b, 52c 2nd divided wiring part 52d 2nd tail side wiring part 53 3rd wiring 54 4th wiring 60 Protective layer 71 Head side jumper part 72 Tail side jumper part 73a 73b Head side conductive connection portions 74a, 74b Tail side conductive connection portion 75 Through portion 75a Outer edge 76 Protruding portion 76a Outer edge 80 Laminate 91 First insulating layer side conductive connection portion 92 Second insulating layer side conductive connection portion 93 First through portion 93a outer edge 94 first protruding portion 94a outer edge 95 second penetrating portion 95a outer edge 96 second protruding portion 96a outer edge 101 suspension 102 load beam 111 suspension with head 112 head slider 113 external connection substrate 114 laser diode 121 hard disk drive 122 case 123 disk 124 Spindle motor 125 Voice coil motor 126 Arm

Claims (23)

In the suspension substrate that is mounted on the head slider and extends from the head region including the head side terminal portion connected to the head slider to the tail region including the tail terminal portion to which the external connection substrate is connected,
A first insulating layer;
A metal support layer provided on one surface of the first insulating layer;
A first wiring layer provided on the other surface of the first insulating layer;
A second insulating layer provided on the first insulating layer and covering the first wiring layer;
A second wiring layer provided in the second insulating layer and having a plurality of wirings including the first wiring and the second wiring;
The first wiring of the second wiring layer includes a head side wiring part extending from the head side terminal part, and a plurality of divided wiring parts divided from the head side wiring part,
The metal support layer has a metal support layer main body, and a metal support layer separator separated from the metal support layer main body,
The first insulating layer and the second insulating layer are provided with a plurality of conductive connection portions penetrating the first insulating layer and the second insulating layer,
Each of the divided wiring portions of the first wiring is connected to the metal support layer separator through a corresponding conductive connection portion. The second wiring includes a head side wiring portion extending from the head side terminal portion, and a plurality of divided wiring portions divided from the head side wiring portion,
The suspension substrate according to claim 1, wherein the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. The second wiring of the second wiring layer includes a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion,
The metal support layer is further provided on the tail region side from the metal support layer separator, and further includes a second metal support layer separator separated from the metal support layer main body and the metal support layer separator, respectively.
In the first insulating layer and the second insulating layer, a plurality of second conductive connection portions penetrating the first insulating layer and the second insulating layer are provided,
3. The suspension substrate according to claim 2, wherein each divided wiring portion of the second wiring is connected to the second metal support layer separator via a corresponding second conductive connection portion. 4.   Each conductive connection portion and each second conductive connection portion have a penetrating portion that penetrates the first insulating layer and the second insulating layer, and an outer edge that protrudes from the second insulating layer and is located outward from the outer edge of the penetrating portion. The suspension substrate according to claim 3, further comprising a protruding portion connected to the penetrating portion. Each conductive connecting portion and each second conductive connecting portion are connected to the first insulating layer side conductive connecting portion penetrating the first insulating layer and the first insulating layer side conductive connecting portion, and pass through the second insulating layer. Each having a second insulating layer-side conductive connection,
The first insulating layer-side conductive connection portion has a first penetrating portion that penetrates the first insulating layer, an outer edge that protrudes from the first insulating layer, and is located outward from the outer edge of the first penetrating portion. A first projecting portion connected to the portion,
The second insulating layer-side conductive connection portion has a second penetrating portion that penetrates the second insulating layer, an outer edge that protrudes from the second insulating layer, and is located outward from the outer edge of the second penetrating portion. The suspension substrate according to claim 3, further comprising a second projecting portion connected to the portion.   The metal support layer separator of the metal support layer is disposed in the head region, and the second metal support layer separator is disposed in the tail region. Suspension substrate.   The suspension substrate according to claim 1, wherein the first wiring and the second wiring of the second wiring layer constitute a pair of writing wirings.   The suspension substrate according to claim 7, wherein the plurality of wirings of the second wiring layer have a pair of reading wirings.   9. The suspension substrate according to claim 1, wherein at least a part of the head side terminal portion is provided on a surface of the second insulating layer on the second wiring layer side.   The suspension substrate according to any one of claims 1 to 9, wherein the first wiring layer has power wiring for supplying power to a laser diode to be mounted.   11. The suspension board according to claim 10, wherein the power supply wiring of the first wiring layer is disposed outside a wiring located on the outermost side among the plurality of wirings of the second wiring layer in a plan view. .   The suspension substrate according to any one of claims 1 to 11, wherein the thickness of the first insulating layer is equal to or less than the thickness of the second insulating layer. The surface of the metal support layer separator opposite to the first insulating layer is located closer to the first insulating layer than the surface of the metal support layer main body opposite to the first insulating layer. Item 13. The suspension substrate according to any one of Items 1 to 12. A base plate;
A suspension board comprising: a suspension substrate according to any one of claims 1 to 13 attached to a base plate via a load beam. A suspension according to claim 14 ,
And a head slider mounted on the suspension. A hard disk drive comprising the suspension with a head according to claim 15 . In the manufacturing method of the suspension substrate, the head slider is mounted and extends from the head region including the head side terminal portion connected to the head slider to the tail region including the tail terminal portion to which the external connection substrate is connected.
Preparing a laminate having a first insulating layer and a metal support layer provided on one surface of the first insulating layer;
Forming a plurality of first through holes penetrating the first insulating layer in the first insulating layer;
Forming a first wiring layer on the other surface of the first insulating layer;
A second insulating layer is formed in the first insulating layer so as to cover the first wiring layer, and a plurality of second through holes penetrating the second insulating layer are formed at positions corresponding to the first through holes. Process,
Forming a second wiring layer having a plurality of wirings including a first wiring and a second wiring on the second insulating layer;
Forming a metal support layer main body and a metal support layer separator separated from the metal support layer main body in the metal support layer,
In the step of forming the second wiring layer, the first wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. And a conductive connection portion is formed in each first through hole and each second through hole,
A method for manufacturing a suspension substrate, wherein each divided wiring portion of the first wiring is connected to a metal support layer separator through a corresponding conductive connection portion. In the step of forming the second wiring layer, the second wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. Formed into
18. The method for manufacturing a suspension board according to claim 17 , wherein the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. In the step of forming the metal support layer separator, a second metal support layer separator separated from the metal support layer main body and the metal support layer separator is formed on the tail region side from the metal support layer separator,
In the step of forming the first through hole, a plurality of third through holes penetrating the first insulating layer are formed at positions corresponding to the second metal support layer separator,
In the step of forming the second through hole, a plurality of fourth through holes penetrating the second insulating layer are formed at positions corresponding to the third through holes,
In the step of forming the second wiring layer, the second wiring of the second wiring layer is formed so as to include a tail side wiring portion that extends from the tail terminal portion and is connected to each of the divided wiring portions. A second conductive connection is formed in the through hole and each fourth through hole;
19. The suspension substrate according to claim 18 , wherein each divided wiring portion of the second wiring is connected to the second metal support layer separator via a corresponding second conductive connection portion. Method. In the manufacturing method of the suspension substrate, the head slider is mounted and extends from the head region including the head side terminal portion connected to the head slider to the tail region including the tail terminal portion to which the external connection substrate is connected.
Preparing a laminate having a first insulating layer and a metal support layer provided on one surface of the first insulating layer;
Forming a plurality of first through holes penetrating the first insulating layer in the first insulating layer;
Forming a first wiring layer on the other surface of the first insulating layer;
A second insulating layer is formed in the first insulating layer so as to cover the first wiring layer, and a plurality of second through holes penetrating the second insulating layer are formed at positions corresponding to the first through holes. Process,
Forming a second wiring layer having a plurality of wirings including a first wiring and a second wiring on the second insulating layer;
Forming a metal support layer main body and a metal support layer separator separated from the metal support layer main body in the metal support layer,
In the step of forming the first wiring layer, a first insulating layer side conductive connection portion is formed in each first through hole,
In the step of forming the second wiring layer, the first wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. And a second insulating layer side conductive connection portion connected to the first insulating layer side conductive connection portion is formed in each second through hole,
Each of the divided wiring portions of the first wiring is connected to the metal support layer separator via the corresponding first insulating layer side conductive connecting portion and second insulating layer side conductive connecting portion. Manufacturing method. In the step of forming the second wiring layer, the second wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. Formed into
21. The method for manufacturing a suspension substrate according to claim 20 , wherein the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. In the step of forming the metal support layer separator, a second metal support layer separator separated from the metal support layer main body and the metal support layer separator is formed on the tail region side from the metal support layer separator,
In the step of forming the first through hole, a plurality of third through holes penetrating the first insulating layer are formed at positions corresponding to the second metal support layer separator,
In the step of forming the second through hole, a plurality of fourth through holes penetrating the second insulating layer are formed at positions corresponding to the third through holes,
In the step of forming the first wiring layer, a first insulating layer side conductive connection portion is formed in each third through hole,
In the step of forming the second wiring layer, the second wiring of the second wiring layer is formed so as to include a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion. A second insulating layer side conductive connection portion connected to the first insulating layer side conductive connection portion formed in the third through hole is formed in the through hole,
Each divided wiring portion of the second wiring is connected to the first insulating layer side conductive connecting portion formed in the corresponding third through hole and the second insulating layer side conductive connecting portion formed in the fourth through hole. The suspension substrate manufacturing method according to claim 21 , wherein the suspension substrate is connected to the two metal support layer separators. The method further comprises the step of forming the surface of the metal support layer separator opposite to the first insulation layer on the first insulation layer side of the surface of the metal support layer main body opposite to the first insulation layer. A method for manufacturing a suspension substrate according to any one of claims 17 to 22.

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