JP2011048887A - Substrate for suspension, suspension, suspension with head, and hard disk drive - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for suspension of which the whole thickness can be reduced, and which can be manufactured efficiently. <P>SOLUTION: A substrate 1 for suspension includes an insulation layer 2, a first conductor 3 provided at one side plane of this insulation layer 2, a second conductor 4 provided at the other side plane of the insulation layer 2, and a metal substrate 5 laminated on the second conductor 4. Grooves 6 are formed at the second conductor 4 and the metal substrate 5 out of the above, the second conductor 4 comprises a plurality of second conductor part 4a and 4b separated through the groove 6. Also, the metal substrate 5 comprises a plurality of metal substrate parts 5a corresponding to respective second conductor parts 4a, 4b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, and a hard disk drive used in a hard disk drive, and in particular, a suspension substrate and a suspension that can reduce the overall thickness and can be efficiently manufactured. , Suspension with head, and hard disk drive.

  In recent years, with the spread of the Internet and the like, an increase in the amount of information processing of personal computers and an increase in information processing speed have been demanded. As a result, a hard disk drive (HDD) incorporated in a personal computer is also required to have a large capacity and a high information transmission speed. For this reason, in this hard disk drive, the magnetic head suspension supporting the magnetic head has a signal line such as a copper wiring formed on a stainless steel spring from a conventional type in which a signal line such as a gold wire is connected. It has shifted to a wiring integrated type (flexure) called so-called wireless suspension. Further, as the information transmission speed is increased, it is necessary to design the magnetic head suspension as a distributed constant circuit.

  Such a magnetic head suspension includes an insulating layer, a pair of read side wiring and a pair of write side wiring formed on one surface of the insulating layer, and a metal substrate formed on the other surface of the insulating layer. A suspension substrate is provided (see, for example, Patent Document 1). In the pair of lead-side wirings and the pair of write-side wirings, for example, electrical signals are transmitted by differential transmission. In addition, a differential impedance that is a characteristic impedance of a differential transmission line as a distributed constant circuit exists between the pair of read side wires and the pair of write side wires. As the differential impedance of the magnetic head and the preamplifier is reduced, it is required to reduce the impedance in order to match the impedance with these.

  Therefore, in order to reduce the differential impedance, it is necessary to increase the line width of each wiring (for example, several hundred μm) or to reduce the thickness of the insulating layer (for example, 5 μm or less).

JP 2005-11387 A

  However, increasing the line width of each wiring is not preferable from the viewpoint of increasing the density of the suspension substrate. Further, reducing the thickness of the insulating layer has a problem that pinholes are generated in the insulating layer.

  On the other hand, there is an attempt to change the arrangement of each wiring. That is, instead of planarly arranging a plurality of wirings on one surface of the insulating layer as described above, there is an attempt to stack each wiring in a vertical direction through the insulating layer (see FIG. 9). The suspension substrate shown in FIG. 9 includes a first insulating layer 102a, a lower wiring 103a formed on one surface of the first insulating layer 102a, and a second insulating layer formed so as to cover the lower wiring 103a. 102b and an upper wiring 103b formed on the second insulating layer 102b. Among these, the metal substrate 101 is formed on the other surface of the first insulating layer 102a. In this way, when the wirings are stacked and arranged, there is an advantage that the differential impedance can be lowered by widening the line width of the wirings as compared with the case of the conventional planar arrangement.

  However, the suspension substrate in which the wirings are arranged in a layer has a problem that the overall thickness becomes larger than that in the case of the planar arrangement.

  When the suspension substrate shown in FIG. 9 is manufactured, the lower wiring 103a is formed on one surface of the insulating layer 102a, and then the second insulating layer 102b is formed. Thereafter, the upper wiring is formed on the second insulating layer 102b. 103b is formed. For this reason, there is also a problem that a relatively large amount of time is spent to manufacture the suspension substrate.

  The present invention has been made in consideration of such points, and includes a suspension substrate, a suspension, a suspension with a head, and a hard disk drive that can reduce the overall thickness and can be efficiently manufactured. The purpose is to provide.

  The present invention includes an insulating layer, a first conductor provided on one surface of the insulating layer, a second conductor provided on the other surface of the insulating layer, and a metal substrate laminated on the second conductor; The second conductor and the metal substrate are formed with grooves, and the second conductor is composed of a plurality of second conductor portions separated via the grooves, and the metal substrate corresponds to each of the second conductor portions. The suspension substrate is characterized by comprising a metal substrate portion.

  The present invention is the suspension substrate, wherein a cover layer covering at least the side of the second conductor portion is provided in the groove.

  The present invention is the suspension substrate, wherein the cover layer is formed by filling a groove with a resin.

  The present invention is the suspension substrate, wherein the cover layer includes a plating layer formed on the side surface of the second conductor portion.

  The present invention is a suspension having a suspension substrate.

  The present invention is a suspension with a head including a suspension and a magnetic head slider mounted on the suspension.

  The present invention is a hard disk drive having a suspension with a head.

  In the present invention, the insulating layer, the first conductor layer provided on one surface of the insulating layer, the second conductor layer provided on the other surface of the insulating layer, and the second conductor layer are laminated. A step of preparing a laminate having a metal substrate layer, a step of etching the first conductor layer to form a first conductor, and a groove formed by etching the second conductor layer and the metal substrate layer And forming a plurality of second conductor portions separated from the second conductor layer via the grooves, and forming a plurality of metal substrate portions corresponding to each second conductor portion from the metal substrate layer. This is a method for manufacturing a suspension substrate.

  The present invention is the method for manufacturing a suspension substrate, further comprising a step of providing a cover layer covering at least the side of the second conductor portion in the groove.

  The present invention is a method of manufacturing a suspension substrate, wherein in the step of providing a cover layer, the cover layer is formed by filling a groove with a resin.

  The present invention is a method for manufacturing a suspension substrate, wherein in the step of providing a cover layer, the side surface of the second conductor portion is plated to form the cover layer.

  According to the present invention, the overall thickness of the suspension substrate can be reduced, and the suspension substrate can be efficiently manufactured.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing the suspension substrate according to the first embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing another example of the suspension substrate in the first embodiment of the present invention. FIG. 4A is a partial cross-sectional view showing a laminate used in the method for manufacturing a suspension substrate in the first embodiment of the present invention. FIG. 4B is a partial cross-sectional view showing a state in which a resist is formed on the laminated body. FIG.4 (c) is a fragmentary sectional view which shows the state in which the 1st conductor, the 2nd conductor part, and the metal substrate part were formed. FIG.4 (d) is a fragmentary sectional view which shows the state in which the cover layer was provided. FIG. 5 is a plan view showing an example of a suspension according to the first embodiment of the present invention. FIG. 6 is a plan view showing an example of a suspension with a head according to the first embodiment of the present invention. FIG. 7 is a plan view showing an example of the hard disk drive according to the first embodiment of the present invention. FIG. 8 is a partial cross-sectional view showing a suspension substrate according to a second embodiment of the present invention. FIG. 9 is a partial cross-sectional view showing a conventional suspension substrate.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 7 are diagrams showing a suspension substrate, a suspension, a suspension with a head, a hard disk, and a manufacturing method of the suspension substrate in the first embodiment of the present invention.

  First, the overall configuration of the suspension substrate 1 will be described with reference to FIG. A suspension substrate 1 shown in FIG. 1 has an insulating layer 2 and a gimbal portion 21 on which an after-mentioned magnetic head slider 42 (see FIG. 5) provided on one end of the insulating layer 2 is mounted. It has a relay board connecting part 22 provided at the other end of the layer 2 and a pair of read wirings 23 a and a write wiring 23 b that connect the gimbal part 21 and the relay board connecting part 22.

  Next, a cross-sectional configuration of the lead wire side 23a portion of the suspension substrate 1 will be described with reference to FIG. Here, FIG. 2 is a diagram showing a partial cross section (XX cross section) on the lead wiring 23a side in FIG. As shown in FIG. 2, the suspension substrate 1 includes the insulating layer 2 described above, the first conductor 3 provided on one surface (upper surface) of the insulating layer 2, and the other surface (lower surface) of the insulating layer 2. And a metal substrate 5 laminated on the second conductor 4. That is, the metal substrate 5 is provided on the lower surface of the second conductor 4, and two grooves 6 are formed in the second conductor 4 and the metal substrate 5.

  The second conductor 4 is composed of three second conductor portions 4 a and 4 b that are separated through the grooves 6. That is, the second conductor 4 is composed of a second conductor portion 4a for wiring disposed corresponding to the first conductor 3, and a remaining second conductor portion 4b disposed on both sides of the second conductor portion 4a for wiring. It has become. Among these, the second conductor portion 4a for wiring and the first conductor 3 constitute a pair of lead wires 23a.

  The second conductor portions 4a and 4b are preferably made of the same material and have the same thickness. As a result, as will be described later, the second conductor portions 4a and 4b can be easily formed by etching one second conductor layer 14 (see FIG. 4A).

  The material of each second conductor portion 4a, 4b is made of the same material as that of the first conductor 3, and the thickness of each second conductor portion 4a, 4b is the same as the thickness of the first conductor 3, The first conductor 3 and the wiring second conductor portion 4a constituting the lead wiring 23a preferably have the same width. Thereby, the direct current resistance of the first conductor 3 and the second conductor portion 4a for wiring can be made equal, and the pair of lead wirings 23a can be efficiently used as lines. In addition, there is an effect that the wiring can be easily designed.

  The metal substrate 5 includes three metal substrate portions 5a corresponding to the second conductor portions 4a and 4b. Each metal substrate portion 5a is preferably made of the same material and has the same thickness. Thus, as will be described later, each metal substrate portion 5a can be easily formed by etching from one metal substrate layer 15 (see FIG. 4A).

  The first conductor 3 is provided with a protective layer 7 that covers the first conductor 3. By providing the protective layer 7 in this way, it is possible to prevent the first conductor 3 from deteriorating.

  In each groove 6, a cover layer 8 that covers at least the sides of the second conductor portions 4 a and 4 b is provided. That is, a cover layer 8 is formed by filling a resin in each groove 6, and each cover layer 8 is not only a side surface of the second conductor portions 4 a and 4 b but also a side surface of the adjacent metal substrate portion 5 a. Covers a part of This can prevent the second conductor from deteriorating.

  The width of each groove 6 may be any size as long as it does not affect the differential impedance of the lead wiring 23a through which electrical signals are transmitted by differential transmission, and is particularly 10 μm to 60 μm. Is preferred. When the width of the groove 6 is small, the metal substrate portion 5a affects the differential impedance of the lead wiring 23a, and when the width of the groove 6 is large, the suspension substrate 1 is provided with desired elasticity and strength. This is because it becomes difficult.

  Next, each component will be described in detail.

  The material of the insulating layer 2 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). The material of the insulating layer 2 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 2 is preferably 5 μm to 30 μm, particularly preferably 10 μm to 20 μm.

  The material of the first conductor 3 and each of the second conductor portions 4a and 4b is not particularly limited as long as the material has desired conductivity, but it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used.

  Here, the thickness of the first conductor 3 and each of the second conductor portions 4a and 4b is, for example, preferably 1 μm to 18 μm, and particularly preferably 5 μm to 12 μm. When the thickness of the first conductor 3 and the second conductor portions 4a and 4b is small, it is difficult to obtain desired conductivity. On the other hand, when the thickness is large, the suspension substrate 1 as a whole has high rigidity. This is because it becomes difficult to impart desired elasticity. In addition, although it is preferable that the thickness of the 1st conductor 3 and each 2nd conductor part 4a, 4b is the same, it can also be set as a different thickness.

  The width of the first conductor 3 and the wiring second conductor portion 4a constituting the pair of lead wires 23a is preferably 10 μm to 300 μm. This is because it is difficult to reduce the impedance when the width is small, and it is difficult to increase the density of the suspension substrate 1 when the width is large. In addition, although it is preferable that the width | variety of the 1st conductor 3 and the 2nd conductor part 4a for wiring is the same, it is good also as a different width | variety.

  A plating layer (not shown) made of nickel (Ni), gold (Au), or the like may be formed on the upper surface and side surfaces of the first conductor 3. In this case, it is possible to prevent the first conductor 3 from deteriorating.

  In addition, as shown in FIG. 2, the 1st conductor 3 and the 2nd conductor part 4a for wiring which comprise a pair of lead wiring 23a are arrange | positioned so that it may correspond in the width direction. However, as shown in FIG. 3, the first conductor 3 and the wiring second conductor portion 4a may be shifted in the width direction so as to overlap at least partially.

  The material of the metal substrate portion 5a is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, it is preferable to use stainless steel. The thickness of each metal substrate 5 portion 5a is preferably 10 μm to 30 μm, more preferably 15 μm to 25 μm.

  As a material of the protective layer 7 and the cover layer 8, it is preferable to use a resin material, for example, polyimide (PI). The material of the protective layer 7 and the cover layer 8 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 7 is preferably 3 μm to 30 μm. Further, as described above, the thickness of the cover layer 8 is a thickness that can cover the side surfaces of the second conductor portions 4a and 4b in the groove 6 and can cover part of the side surfaces of the metal substrate portion 5a. It is preferable.

  Next, the suspension 31 in the present embodiment will be described with reference to FIG. A suspension 31 shown in FIG. 5 is provided on the surface (lower surface) opposite to the above-described suspension substrate 1 and the gimbal portion 21 of the suspension substrate 1, and a magnetic head slider 42 (see FIG. 6) described later is provided. And a load beam 32 for holding the disk 52 (see FIG. 7).

  Next, the suspension with head 41 in the present embodiment will be described with reference to FIG. A suspension with head 41 shown in FIG. 6 includes the suspension 31 described above and a magnetic head slider 42 mounted on the gimbal portion 21 of the suspension 31.

  Next, the hard disk drive 51 in the present embodiment will be described with reference to FIG. The hard disk drive 51 shown in FIG. 7 has a case 52, a disk 53 that is rotatably attached to the case 52 and stores data, a spindle motor 54 that rotates the disk 53, and a desired flying height on the disk 53. And a suspension 41 with a head including a magnetic head slider 42 for writing and reading data to and from the disk 53. Of these, the suspension with head 41 is movably attached to the case 52, and a voice coil motor 55 that moves the magnetic head slider 42 of the suspension with head 41 along the disk 52 is attached to the case 52. . An arm 56 is connected between the suspension with head 41 and the voice coil motor 55.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 will be described.

  First, as shown in FIG. 4A, the insulating layer 2, the first conductor layer 13 provided on the upper surface of the insulating layer 2, the second conductor layer 14 provided on the lower surface of the insulating layer 2, A laminate 11 having a metal substrate layer 15 laminated on the second conductor layer 14 is prepared. In this laminate 11, the first conductor layer 13, the second conductor layer 14, and the metal substrate layer 15 may be formed by plating, or the layers may be bonded to each other with an adhesive.

  Next, as shown in FIG. 4B, patterned resists 16 and 17 are formed on both surfaces by a photofabrication technique. That is, a patterned resist 16 for forming the first conductor 3 is formed on the surface of the first conductor layer 13, and the second conductor portions 4 a and 4 b and the metal substrate portion 5 a are formed on the surface of the metal substrate layer 15. For this purpose, a patterned resist 17 is formed. In this case, the resists 16 and 17 are preferably dry film resists, but liquid resists such as casein may be used.

  Next, the first conductor layer 13, the second conductor layer 14, and the metal substrate layer 15 are etched from the openings of the patterned resists 16 and 17 with a corrosive liquid such as ferric chloride aqueous solution. The Thereafter, the resists 16 and 17 are stripped using an alkaline stripping solution. As a result, as shown in FIG. 4C, the first conductor 3 is formed from the first conductor layer 13, the groove 6 is formed in the second conductor layer 14 and the metal substrate layer 15, and the second conductor layer 14 Three second conductor portions (second wiring conductor portion 4a and residual second conductor portion 4b) arranged through the groove 6 are formed, and each second conductor portion 4a, 4b is formed from the metal substrate layer 15. Three metal substrate portions 5a corresponding to are formed. It should be noted that the second conductor layer 14 and the metal substrate layer 15 are not limited to being etched with one corrosive liquid, and the corrosive liquid for etching the metal substrate layer 15 and the corrosive liquid for etching the second conductor layer 14 are used. Etching may be performed using the liquid separately.

  Next, a material for forming the protective layer 7 (for example, a dry film type photosensitive resin) is laminated on the insulating layer 2 and the first conductor 3 and formed into a pattern in an exposure apparatus (not shown). Exposure through a mask. After the exposure, development is performed with an alkaline aqueous solution such as an aqueous sodium carbonate solution or an aqueous potassium carbonate solution, and the photosensitive resin is patterned to form the protective layer 7 as shown in FIG. Thereafter, the protective layer 7 is heat-cured, and desired protective film properties are imparted to the protective layer 7.

  Next, each groove 6 is filled with a material for forming the cover layer 8 (for example, a liquid photosensitive resin). In this case, the photosensitive resin is filled to such an extent that the side surfaces of the second conductor portions 4a and 4b and a part of the side surface of the metal substrate portion 5a can be covered. Thereafter, the filled photosensitive resin is dried and subjected to thermosetting treatment, and each cover layer 8 is formed (see FIG. 4D).

  The load beam 32 is attached to the lower surface of the suspension substrate 1 obtained in this way, and the suspension 31 shown in FIG. 5 is obtained. A magnetic head slider 42 is mounted on the gimbal portion 21 of the suspension 31 to obtain the head suspension 41 shown in FIG. Further, the suspension with head 41 is attached to the case 52 of the hard disk drive 51 to obtain the hard disk drive 51 shown in FIG.

  When data is read and written in the hard disk drive 51 shown in FIG. 7, the magnetic head slider 42 of the suspension 41 with head is moved along the disk 52 by the voice coil motor 55 and is rotated by the spindle motor 54. 53 is kept close to the desired flying height. As a result, data is exchanged between the magnetic head slider 42 and the disk 53. During this time, an electrical signal is transmitted by differential transmission to the pair of lead wirings 23a and write wirings 23b connected between the gimbal part 21 and the relay board connecting part 22 of the suspension board 1.

  Thus, according to the present embodiment, the first conductor 3 is provided on the upper surface of the insulating layer 2, and the second conductor portions 4a and 4b are provided on the lower surface. Here, as shown in FIG. 9, when the lower wiring 103a is provided on the upper surface of the insulating layer 102a and the upper wiring 103b is laminated on the lower wiring 103a, these are interposed between the lower wiring 103a and the upper wiring 103b. In order to insulate, the second insulating layer 102b is required. On the other hand, according to the present invention, since the insulating layer 2 is interposed between the first conductor 3 and the second conductor portions 4a and 4b, the first conductor 3 and the second conductor portions 4a and 4b It is not necessary to provide another insulating layer for insulating them. As a result, the overall thickness of the suspension substrate 1 can be reduced. Further, since it is not necessary to provide another insulating layer in this way, the amount of the resin material formed on the upper surface of the insulating layer 2 can be reduced, and the suspension substrate 1 can be prevented from warping.

  Further, according to the present embodiment, the insulating layer 2, the first conductor layer 13 provided on the upper surface of the insulating layer 2, the second conductor layer 14 provided on the lower surface of the insulating layer 2, Using the laminate 11 having the metal substrate layer 15 laminated on the two-conductor layer 14, the laminate 11 is etched so that the first conductor 3, the second conductor portions 4a and 4b, and the metal substrate portion 5a are etched. Is formed. This eliminates the need to form a resist and form the first conductor 3 and the second conductor portions 4a and 4b in a desired shape by plating, so that the suspension substrate 1 can be manufactured efficiently.

  In addition, according to the present embodiment, three second conductor portions 4a and 4b that are separated through the respective grooves 6 are provided on the lower surface of the insulating layer 2, and a metal substrate is provided on each of the second conductor portions 4a and 4b. The portions 5a are laminated. As a result, the metal substrate portion 5a is also laminated on the wiring second conductor portion 4a constituting one of the pair of lead wires 23a, so that elasticity and strength can be uniformly imparted over the entire suspension substrate 1. it can.

  In addition, according to the present embodiment, three second conductor portions 4a and 4b that are separated through the respective grooves 6 are provided on the lower surface of the insulating layer 2, and the second wiring portion disposed in the center of these is provided. The conductor portion 4a and the first conductor 3 constitute a pair of lead wires 23a. Thus, by separating the wiring second conductor portion 4a constituting the pair of lead wires 23a from the other remaining second conductor portions 4b, the width dimension of the wiring second conductor portion 4a can be set to a predetermined differential. It can be arbitrarily designed to obtain an impedance.

  Further, according to the present embodiment, as described above, three second bodies are formed by etching the stacked body 11 including the first conductor layer 13, the insulating layer 2, the second conductor layer 14, and the metal substrate layer 15. Conductor portions 4a and 4b are formed. Here, when forming the laminated body 11, the 2nd conductor layer 14 is formed in a comparatively wide area | region by plating or adhesion | attachment. For this reason, when forming the second conductor portions 4a and 4b from the above-described multilayer body 11 as in the present invention, the second conductor portions 4a and 4b are formed by plating a relatively narrow region surrounded by a resist or the like. The thickness of the second conductor layer 14 can be made uniform as compared with the case of doing so. As a result, the accuracy of the suspension substrate 1 can be improved.

  Furthermore, according to the present embodiment, the suspension 31, the suspension with head 41, and the hard disk drive 51 having the above-described effects can be obtained.

  In the present embodiment, the cross-sectional configuration on the lead wiring 23a side has been described as an example. However, the present invention is not limited to this, and the cross-sectional configuration in the present embodiment can be similarly applied to the write wiring 23b side. That is, the pair of write wirings 23b can be configured by the first conductor 3 and the second conductor portion 4a for wiring. Further, in the overall cross-sectional configuration of the suspension substrate 1, the remaining second conductor portion 4b positioned inside the wiring second conductor portion 4a for the lead wiring 23a and the wiring second conductor portion 4a for the write wiring 23b. The remaining second conductor portion 4b located inside is integrally formed, and the metal substrate portion 5a is configured correspondingly. Furthermore, the cross-sectional configuration in the present embodiment may be applied to only one of the read wiring 23a and the write wiring 23b.

  In the present embodiment, an example in which the second conductor 4 includes three second conductor portions 4a and 4b and the metal substrate 5 includes three metal substrate portions 5a by the two grooves 6 has been described. . However, the present invention is not limited to this, and the single conductor 6 may separate the second conductor 4 into two second conductor portions and the metal substrate 5 into two metal substrate portions 5a. Even in this case, desired elasticity and strength can be imparted to the suspension substrate 1, and the width dimension of the wiring second conductor portion 4a is arbitrarily designed so as to obtain a predetermined differential impedance. be able to.

  In the present embodiment, as shown in FIGS. 2 to 4, the example in which the first conductor 3 is disposed on the upper side and the metal substrate portion 5 a is disposed on the lower side is described. However, the first conductor 3 is disposed on the lower side. The metal substrate portion 5a may be disposed above.

  Furthermore, in the suspension substrate 1 in the present embodiment, a jig hole (not shown) can be formed in the region of the remaining second conductor portion 4b. In this case, in FIG. 4B, the resist 17 is patterned so as to remove the jig hole portion, the second conductor layer 14 and the metal substrate layer 15 are etched, and then the jig hole is formed in the insulating layer 2. A patterned resist (not shown) that excludes the portion is formed, and etching using an organic alkali solution or plasma etching is performed. As a result, a jig hole can be formed in the region of the remaining second conductor portion 4 b of the suspension substrate 1.

Second Embodiment Next, with reference to FIG. 8, a suspension substrate according to a second embodiment of the present invention will be described.

  In the suspension substrate in the second embodiment shown in FIG. 8, the cover layer is different only in that it is made of a plating layer formed on the side surface of the second conductor portion, and the other configurations are the same as those in FIGS. This is substantially the same as the first embodiment shown in FIG. In FIG. 8, the same parts as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 8, the cover layer 8 includes a plating layer 61 formed on each side surface of the second conductor portions 4 a and 4 b in each groove 6. The plating layer 61 extends not only to the side surfaces of the second conductor portions 4a and 4b but also to a part of the side surface of the adjacent metal substrate portion 5a. As a material of the plating layer 61, nickel, gold, or the like is preferably used.

  Thus, according to the present embodiment, since the plating layer 61 is formed on the side surfaces of the second conductor portions 4a and 4b together with the side surfaces of the metal substrate portion 5a in each groove 6, the second conductor portions 4a and 4b are formed. Can be prevented from deteriorating.

  As described above, the embodiment of the present invention has been described in detail. However, the suspension substrate and the method for manufacturing the suspension substrate according to the present invention are not limited to the above-described embodiment, and depart from the spirit of the present invention. Various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Insulating layer 3 1st conductor 4 2nd conductor 4a 2nd conductor part 4b for wiring Remaining 2nd conductor part 5 Metal substrate 5a Metal substrate part 6 Groove 7 Protective layer 8 Cover layer 11 Laminated body 13 1st conductor Layer 14 Second conductor layer 15 Metal substrate layers 16 and 17 Resist 21 Gimbal portion 22 Relay substrate connection portion 23a Lead wiring 23b Write wiring 31 Suspension 32 Load beam 41 Suspension with head 42 Magnetic head slider 51 Hard disk drive 52 Case 53 Disk 54 Spindle Motor 55 Voice coil motor 56 Arm 61 Plating layer

Claims (11)

An insulating layer;
A first conductor provided on one surface of the insulating layer;
A second conductor provided on the other surface of the insulating layer;
A metal substrate laminated on the second conductor,
A groove is formed in the second conductor and the metal substrate;
The second conductor is composed of a plurality of second conductor portions separated by a groove,
The suspension substrate, wherein the metal substrate comprises a plurality of metal substrate portions corresponding to the second conductor portions.   The suspension substrate according to claim 1, wherein a cover layer covering at least a side of the second conductor portion is provided in the groove.   The suspension substrate according to claim 2, wherein the cover layer is formed by filling a resin in a groove.   The suspension substrate according to claim 2, wherein the cover layer is made of a plating layer formed on a side surface of the second conductor portion.   A suspension comprising the suspension substrate according to claim 1.   A suspension with a head, comprising the suspension according to claim 5 and a magnetic head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 6. An insulating layer; a first conductor layer provided on one surface of the insulating layer; a second conductor layer provided on the other surface of the insulating layer; and a metal substrate layer laminated on the second conductor layer; Preparing a laminate having
Etching the first conductor layer to form a first conductor;
Etching is performed on the second conductor layer and the metal substrate layer to form grooves, and a plurality of second conductor portions separated from the second conductor layer via the grooves are formed, and each second conductor portion is formed from the metal substrate layer. And a step of forming a plurality of metal substrate portions corresponding to the manufacturing method of the suspension substrate.   9. The method for manufacturing a suspension substrate according to claim 8, further comprising a step of providing a cover layer covering at least the side of the second conductor portion in the groove.   10. The method for manufacturing a suspension substrate according to claim 9, wherein in the step of providing the cover layer, the cover layer is formed by filling a resin in the groove.   10. The method for manufacturing a suspension substrate according to claim 9, wherein, in the step of providing the cover layer, the side surface of the second conductor portion is plated to form the cover layer.

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