JP5601564B2 - Suspension substrate, suspension, suspension with head, hard disk drive, and method for manufacturing suspension substrate - Google Patents

Description

  The present invention relates to a suspension board, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension board, and more particularly, a suspension board, a suspension, and a suspension board capable of easily adjusting a differential impedance of a wiring layer. The present invention relates to a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate.

  Generally, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk on which data is stored is mounted. The suspension substrate has a plurality of wiring layers and a plurality of wiring pads provided in the vicinity of a mounting region on which the slider is mounted, and each wiring pad is connected to the wiring layer. By connecting these wiring pads to the slider pads of the magnetic head slider, data is transferred to the magnetic head slider.

  As a method of connecting the slider pad of the magnetic head slider and each wiring pad, for example, a method of connecting via a solder ball is known (for example, see Patent Document 1). Here, slider pads are provided on the side surfaces of the magnetic head slider, and solder balls are formed and connected between the slider pads and the wiring pads of the wiring layer corresponding thereto.

  Incidentally, in the recent advanced information society, it is required to increase the amount of information written to or read from the HDD drive. Thus, in order to increase the information processing amount of the HDD drive, it is necessary to increase the density of the magnetic disk for recording information as compared with the conventional one. Therefore, the relative position between the magnetic disk and the magnetic head slider is further increased. It is necessary to control the accuracy. In order to control the position of the slider with high accuracy, it is necessary to add a position control function to the slider, and accordingly, the number of terminals of the slider increases. Therefore, it is necessary to increase the number of connection terminals between each wiring layer on the suspension substrate side and the slider.

  However, in such a method, since the space on the side surface of the magnetic head slider is limited, it is difficult to increase the number of connection terminals with the slider.

  Thus, a method is considered in which a plurality of slider pads are provided on the back surface of the magnetic head slider and connected to the wiring pads of each wiring layer of the suspension substrate (see, for example, Patent Document 2). In this case, since more slider pads can be formed on the magnetic head slider, the number of connection terminals with the slider can be increased.

JP 2004-152393 A US Patent Application Publication No. 2007/0274005

  However, in the suspension board, in order to reduce the size of the HDD, the space of the mounting area where the magnetic head slider is mounted is limited. Thus, when many wiring pads are provided in the mounting region, there is a problem that it is difficult to adjust the differential impedance of the wiring layer by adjusting the width of the wiring layer or the distance between the wiring layers.

  The present invention has been made in consideration of such points, and a suspension board, a suspension, a suspension with a head, a hard disk drive, and a suspension board capable of easily adjusting the differential impedance of a wiring layer. It aims at providing the manufacturing method of.

  The present invention provides a suspension substrate having a mounting region for mounting a slider having a slider pad on the back surface, and an external connection substrate connecting portion connected to the mounting region and positioned on the base side. A spring metal layer provided on one surface of the first insulating layer; a first wiring layer provided on the other surface of the first insulating layer; and a second insulated from the first wiring layer. A wiring layer, and the second wiring layer is disposed on the same plane as the first wiring layer in the mounting region, and extends from the mounting region to the external connection board connecting portion via the second insulating layer to the first wiring layer. The first wiring layer and the second wiring layer disposed on the same plane as the first wiring layer are provided with wiring pads that are electrically connected to the slider pad of the slider. This is a suspension substrate.

  In the present invention, a portion of the second wiring layer that is disposed on the same plane as the first wiring layer is connected to a portion of the second wiring layer that is stacked on the second insulating layer via a transition portion. The suspension substrate is characterized in that:

  The suspension substrate according to the present invention is characterized in that a through hole is formed in the second insulating layer, a conductive connection portion having conductivity is provided in the through hole, and the conductive connection portion forms a transition portion. It is.

  The present invention is the suspension substrate characterized in that the first wiring layer and the second wiring layer constitute a writing wiring.

  The present invention is a suspension having a suspension substrate.

  The present invention is a suspension with a head including a suspension and a slider mounted on the suspension.

  The present invention is a hard disk drive having a suspension with a head.

  The present invention provides a method for manufacturing a suspension board having a mounting area for mounting a slider having a slider pad on the back surface, and an external connection board connecting part connected to the mounting area and located on the base side. A step of preparing a laminate having an insulating layer, a spring material layer provided on one surface of the first insulating layer, and a wiring layer provided on the other surface of the first insulating layer; Forming a first wiring layer from the first wiring layer and forming a portion of the second wiring layer insulated from the first wiring layer on the same plane as the first wiring layer in the mounting region; A step of forming a second insulating layer, a step of forming another portion of the second wiring layer stacked on the first wiring layer via the second insulating layer from the base portion to the mounting region, 1 wiring layer and the same wiring layer as this first wiring layer And to the portion of the second wiring layer, a method for producing a suspension substrate, characterized in that it comprises the steps of forming a wiring pad to be electrically connected to the slider pads of the slider, the.

  In the present invention, after the second insulating layer is formed, a transition portion connected to the part of the second wiring layer is formed, and when the other part of the second wiring layer is formed, the part of the second wiring layer is formed. The other part is connected to the transition part, which is a method for manufacturing a suspension substrate.

  In the present invention, when forming the transition portion, a through hole is formed in a region of the second insulating layer corresponding to the portion of the second wiring layer, and a conductive connection portion having conductivity is formed in the through hole. A method for manufacturing a suspension substrate, wherein the conductive connection portion constitutes a transition portion.

  According to the present invention, the differential impedance of the wiring layer can be easily adjusted.

FIG. 1 is a plan view showing an example of a suspension substrate according to an embodiment of the present invention. FIG. 2 is a plan view showing an example of a mounting area of the suspension board in the embodiment of the present invention. FIG. 3 is a cross-sectional view showing an example of a cross-sectional configuration of a mounting region of the suspension substrate in the embodiment of the present invention. FIG. 4A is a diagram showing an example of a planar shape of the spring material layer in the suspension board mounting region in the embodiment of the present invention. FIG. 4B is a diagram illustrating an example of a planar shape of the first insulating layer. FIG. 4C illustrates an example of a planar shape of each wiring layer. FIG. 4D illustrates an example of a planar shape of the second insulating layer. FIG. 4E is a diagram illustrating an example of a planar shape of the second wiring layer. FIG. 4F shows an example of the planar shape of the protective layer. FIG. 5 is a plan view showing an example of a suspension in the embodiment of the present invention. FIG. 6 is a plan view showing an example of a suspension with a head in the embodiment of the present invention. FIG. 7 is a plan view showing an example of a hard disk drive according to the embodiment of the present invention. FIGS. 8A, 8B, 8C, and 8D are views showing a process of forming a wiring layer in the method for manufacturing a suspension substrate according to the embodiment of the present invention. FIGS. 9A, 9B, 9C, and 9D are views showing a process of forming a second insulating layer in the method for manufacturing a suspension substrate according to the embodiment of the present invention. FIGS. 10A, 10B, 10C, 10D, and 10E are views showing a process of forming a second wiring layer in the suspension board manufacturing method according to the embodiment of the present invention. 11A, 11B, 11C, and 11D are diagrams showing a process of forming a protective layer in the method for manufacturing a suspension substrate in the embodiment of the present invention. 12A, 12B, and 12C are views showing a process of etching the first insulating layer in the method for manufacturing the suspension substrate in the embodiment of the present invention. FIG. 13 is a diagram showing a process of forming a wiring pad in the method for manufacturing a suspension board in the embodiment of the present invention. FIGS. 14A, 14B, and 14C are views showing a step of etching the spring material layer in the method for manufacturing the suspension substrate in the embodiment of the present invention.

  Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 114 are diagrams showing a manufacturing method of a suspension substrate, a suspension, a suspension with a head, a hard disk, and a suspension substrate in an embodiment of the present invention.

  First, the overall configuration of the suspension substrate 1 will be described with reference to FIG. A suspension substrate 1 shown in FIG. 1 has a mounting area 2 for mounting a slider 52 (see FIG. 6) provided with a plurality of (for example, 12) slider pads (not shown) on the back surface, and the mounting area 2. Are connected to the external connection substrate connection portion 3 located on the base side, and 11 wiring layers (the first wiring layer 14, the second wiring layer 15, and the connection region 2 and the external connection substrate connection portion 3). Other wiring layer 16 is included). As shown in FIG. 2, the slider 52 mounted in the mounting region 2 has a vertical dimension of 970 μm and a horizontal dimension of 730 μm. Here, the mounting area 2 refers to an area corresponding to the mounted slider 52, as shown in FIG.

  Next, a cross-sectional configuration of the suspension substrate 1 will be described with reference to FIGS. The suspension substrate 1 is provided on the first insulating layer 10, one surface (lower surface) of the first insulating layer 10, the spring material layer 11 having conductivity, and the other surface of the first insulating layer 10. A first wiring layer 14 provided on the (upper surface), a second wiring layer 15 and another wiring layer 16 insulated from the first wiring layer 14 are provided.

  Among these, the second wiring layer 15 is arranged on the same plane as the first wiring layer 14 in the mounting region 2, and the first wiring layer 14 extends from the mounting region 2 to the external connection substrate connecting portion 3. Two insulating layers 12 are stacked. That is, the second wiring layer 15 extends from the mounting region 2 to the external connection board connecting portion 3 to the external connection board connecting portion 3 and is disposed on the same plane as the first wiring layer 14 in the mounting region 2. 14 and a base portion 15b laminated via the second insulating layer 12. Of these, the slider-side portion 15a of the second wiring layer 15 is connected to the base-side portion 15b via a transition portion 21 provided in the mounting region 2.

  Here, in FIG. 3, other wiring layers 16 (wiring layers other than the first wiring layer 14 and the second wiring layer 15) are omitted for the sake of clarity, but FIGS. 2 and 4 are omitted. As shown, the other wiring layer 16 is provided on the same plane as the first wiring layer 14. The first wiring layer 14 is shown separately on both sides of the slider side portion 15a of the second wiring layer 15, but is integrally formed as shown in FIG.

  As shown in FIGS. 2 and 4, the base portion 15 b of the second wiring layer 15 extends from the transition portion 21 and has a small width portion 15 c having substantially the same line width as the other wiring layers 16. A large portion 15d is connected to the portion 15c, extends from the mounting region 2 to the external connection board connecting portion 3, and has a larger line width than the small width portion 15c. A width converting portion 15e that continuously changes the line width is interposed between the small width portion 15c and the large portion 15d. Similarly, as shown in FIG. 4, the first wiring layer 14 corresponds to a small width portion 14 c having a line width corresponding to the small width portion 15 c of the second wiring layer 15 and a large portion 15 d of the second wiring layer 15. A large portion 14d having a line width and a width conversion portion 14e having a shape corresponding to the width conversion portion 15e of the second wiring layer 15. Thus, the first wiring layer 14 and the second wiring layer 15 have substantially the same planar shape in the portion where they are stacked.

  The first wiring layer 14 and the second wiring layer 15 as described above constitute a writing wiring (lighter wiring). 2 and 4, two sets of the first wiring layer 14 and the second wiring layer 15 are provided. However, the present invention is not limited to this, and the first wiring layer 14 and the second wiring layer 15 are not limited thereto. There may be only one set.

  Each wiring layer 14, 15, 16 is provided with a circular wiring pad 17 that is electrically connected to the slider pad of the slider 52. Among these, for the second wiring layer 15, the wiring pad 17 is provided on a portion arranged on the same plane as the first wiring layer 14, that is, on the slider side portion 15 a. In the present embodiment, twelve wiring pads 17 including the grounding terminal 17 a are formed corresponding to the twelve slider pads of the slider 52. Each wiring pad 17 has a diameter of 100 μm, and as shown in FIG. 2, each wiring pad 17 is arranged so that the vertical pitch is 125 μm and the horizontal pitch is 218 μm.

  As shown in FIG. 4, the first insulating layer 10 is provided with a grounding through hole 10a corresponding to the grounding terminal 17a, and through a conductive portion (not shown) provided in the grounding through hole 10a. Thus, the grounding terminal 17 a is connected to the spring metal layer 11.

  As shown in FIGS. 2 and 4, two cylindrical through holes (vias) 20 are formed in the second insulating layer 12. Each through hole 20 is disposed in a region corresponding to the slider side portion 15a of the second wiring layer 15 and has an opening diameter of 70 μm. The second insulating layer 12 is provided with a circular hole 12 a for forming the wiring pad 17.

  As shown in FIG. 3, each through hole 20 is provided with a conductive connection portion 21 a having conductivity, and this conductive connection portion 21 a constitutes a transition portion 21. The conductive connection portion 21a is connected to the slider side portion 15a of the second wiring layer 15 through a metal thin film layer 23 and a Cu sputtering layer 24 which will be described later. In this way, the slider side portion 15a and the base portion 15b of the second wiring layer 15 are connected via the conductive connection portion 21a.

  Moreover, as shown in FIG. 3, the spring material layer 11 in this Embodiment is divided into the three spring material parts 11b through the fracture | rupture groove | channel 11a.

  On the second insulating layer 12, a protective layer 22 that covers the base portion 15b of the second wiring layer 15 is provided to prevent the base portion 15b of the second wiring layer 15 from deteriorating. The protective layer 22 is provided with a circular hole 22 a for forming the wiring pad 17.

  Between the base side portion 15b of the second wiring layer 15 and the conductive connection portion 21a and the second insulating layer 12, a metal thin film layer 23 made of nickel (Ni), chromium (Cr), or an alloy thereof, and copper ( A Cu sputtering layer 24 made of Cu) is interposed. That is, a metal thin film layer 23 is formed on the second insulating layer 12 side, and a Cu sputtering layer 24 is formed on the metal thin film layer 23. In this way, the base portion 15b of the second wiring layer 15 and the conductive connection portion 21a are securely attached to the second insulating layer 12.

  Next, each component will be described in detail.

  The material of the first insulating layer 10 and the second insulating layer 12 is not particularly limited as long as it has a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of each of the insulating layers 10 and 12 can be a photosensitive material or a non-photosensitive material. Moreover, it is preferable that the thickness of each insulating layers 10 and 12 is 5 micrometers-30 micrometers, especially 10 micrometers-20 micrometers. As a result, it is possible to ensure the insulation performance between the spring material layer 11 and the wiring layers 14, 15, 16 and to prevent the elasticity of the suspension substrate 1 as a whole from being lost.

  The material of each of the wiring layers 14, 15, and 16 is not particularly limited as long as it has a desired conductivity, but it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, the thickness of each of the wiring layers 14, 15, 16 is, for example, preferably 1 μm to 18 μm, and particularly preferably 5 μm to 12 μm. As a result, it is possible to ensure the conductivity of each of the wiring layers 14, 15, 16 and to prevent the elasticity of the suspension substrate 1 as a whole from being lost.

  The wiring pad 17 includes a Ni plating layer 18 made of nickel (Ni) formed on each wiring layer 14, 15, 16 and an Au plating layer 19 made of gold (Au) formed on the Ni plating layer 18. It is made up of. In this way, the surface of the wiring pad 17 is prevented from being deteriorated, and the contact resistance between the slider 52 and the slider pad is reduced.

  The material of each conductive connection portion 21a is not particularly limited as long as it has a desired conductivity, but the same material as each wiring layer 14, 15, 16 is used, that is, copper (Cu). Is preferred. In addition to copper, any material having electrical characteristics similar to pure copper can be used.

  The material of the spring material layer 11 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is possible to use stainless steel, preferably stainless steel. Further, the thickness of the spring material layer 11 is preferably 10 μm to 30 μm, more preferably 15 μm to 25 μm. Thereby, the conductivity and elasticity of the spring material layer 11 can be ensured.

  As a material of the protective layer 22, it is preferable to use a resin material, for example, polyimide (PI). The material of the protective layer 22 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 22 is preferably 3 μm to 30 μm.

  Next, the suspension 41 in the present embodiment will be described with reference to FIG. The suspension 41 shown in FIG. 5 is provided on the surface (lower surface) opposite to the suspension substrate 1 and the mounting area 2 of the suspension substrate 1 described above, and a slider 52 (see FIG. And a load beam 42 for holding (see FIG. 7).

  Next, the suspension with head 51 in the present embodiment will be described with reference to FIG. A suspension 51 with a head shown in FIG. 6 includes the suspension 41 described above and a slider 52 mounted on the mounting region 2 of the suspension substrate 1 and having 12 slider pads on the back surface.

  Next, the hard disk drive 61 in the present embodiment will be described with reference to FIG. A hard disk drive 61 shown in FIG. 7 has a case 62, a disk 63 that is rotatably attached to the case 62 and stores data, a spindle motor 64 that rotates the disk 63, and a desired flying height on the disk 63. And a suspension 51 with a head including a slider 52 for writing and reading data to and from the disk 63. Among them, the suspension with head 51 is attached to the case 62 so as to be movable, and the voice coil motor 65 for moving the slider 52 of the suspension with head 51 along the disk 63 is attached to the case 62. An arm 66 is connected between the suspension 51 with head and the voice coil motor 65.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 will be described. Although the other wiring layer 16 is omitted in FIGS. 8 to 14, it can be formed in a desired shape in the same manner as the step of forming the first wiring layer 14 shown below.

  First, as shown in FIG. 8A, a first insulating layer 10, a spring material layer 11 having conductivity provided on the lower surface of the first insulating layer 10, and an upper surface of the first insulating layer 10. A laminated body 25 having the provided wiring material layer 26 is prepared. In the laminate 25, the spring material layer 11 and the wiring material layer 26 may be formed by plating, or the first insulating layer 10, the spring material layer 11 and the wiring material layer 26 are bonded to each other. May be.

  Next, as shown in FIG. 8B, resists 27 and 28 are formed on both surfaces of the laminate 25. That is, a patterned resist 27 for forming the wiring layers 14 and 15 is formed on the surface of the wiring material layer 26, and a resist 28 is formed on the entire surface of the spring material layer 11.

  Next, the wiring material layer 26 is etched from the opening of the patterned resist 27 with a corrosive liquid such as a ferric chloride aqueous solution to form the wiring layers 14 and 15 (see FIG. 8C). ). That is, together with the first wiring layer 14, the slider-side portion 15 a of the second wiring layer 15 that is located on the same plane as the first wiring layer 14 in the mounting region 2 and is insulated from the first wiring layer 14 is formed. Thereafter, these resists 27 and 28 are peeled off (see FIG. 8D).

  Next, as shown in FIG. 9, the second insulating layer 12 is formed in the first wiring layer 14 to form the through hole 20. In this case, first, as shown in FIG. 9A, the second insulating layer 12 is formed above the first insulating layer 10 so as to cover the wiring layers 14 and 15. Next, a patterned resist 29 for forming the through hole 20 and the hole 12a for the wiring pad 17 is formed on the surface of the second insulating layer 12, and a resist 30 is formed on the entire surface of the spring material layer 11. (See FIG. 9B).

  Next, the second insulating layer 12 is etched from the opening of the patterned resist 29 with an etching solution such as an organic alkaline solution to form the through holes 20 and the holes 12a (see FIG. 9C). In this case, a part of each wiring layer 14 and 15 is exposed in the through hole 20 and each hole 12a. Thereafter, these resists 29 and 30 are peeled off (see FIG. 9D).

  Next, as shown in FIG. 10, the conductive connection portion 21 a and the base portion 15 b of the second wiring layer 15 are formed. In this case, first, as shown in FIG. 10A, the metal thin film layer 23 and the Cu sputtering layer 24 are sequentially formed on the second insulating layer 12 and the exposed portions of the wiring layers 14 and 15. The A patterned resist 31 for forming the conductive connection portion 21a and the base portion 15b of the second wiring layer 15 is formed on the Cu sputtering layer 24, and a resist 32 is formed on the entire surface of the spring material layer 11. (See FIG. 10B).

  Next, the conductive connection portion 21a is formed in the through hole 20 of the second insulating layer 12 and the base portion 15b of the second wiring layer 15 is formed in the opening of the patterned resist 31 by electrolytic copper plating. (See FIG. 10C). In this case, the second wiring layer 15 is connected to the conductive connection portion 21a, and the conductive connection portion 21a is connected to the slider side portion 15a of the second wiring layer 15 through the metal thin film layer 23 and the Cu sputtering layer 24. Thereafter, the resists 31 and 32 are peeled off (see FIG. 10D), and the exposed portions of the metal thin film layer 23 and the Cu sputtering layer 24 are removed (see FIG. 10E).

  Next, as shown in FIG. 11, a patterned protective layer 22 is formed on the second wiring layer 15. In this case, first, the protective layer 22 is formed over the entire region above the first insulating layer 10 (see FIG. 11A). Next, a patterned resist 33 is formed on the protective layer 22, and a resist 34 is formed on the entire surface of the spring material layer 11 (see FIG. 11B). Next, the protective layer 22 is etched from the opening of the patterned resist 33 with an etchant (see FIG. 11C). In this case, a hole 22a for forming the wiring pad 17 is formed in the protective layer 22, and a part of each wiring layer 14, 15 is exposed in each hole 22a. Thereafter, these resists 33 and 34 are peeled off (see FIG. 11D).

  Next, as shown in FIG. 12, the first insulating layer 10 is etched. In this case, first, as shown in FIG. 12A, a patterned resist 35 is formed above the first insulating layer 10 and a resist 36 is formed on the entire surface of the spring material layer 11. Next, the exposed portion of the first insulating layer 10 is removed by etching the first insulating layer 10 with an etchant from the opening of the patterned resist 35 (see FIG. 12B). . Thereafter, these resists 35 and 36 are peeled off (see FIG. 12C).

  Next, as shown in FIG. 13, the Ni plating layer 18 and the Au plating layer 19 are formed on the exposed portion of the first wiring layer 14 and the exposed portion of the slider-side portion 15 a of the second wiring layer 15. Are sequentially formed. In this way, the wiring pads 17 are formed on the wiring layers 14 and 15.

  Next, as shown in FIG. 14, the spring material layer 11 is separated into three spring material portions 11b via the fracture grooves 11a. In this case, first, as shown in FIG. 14A, a resist 37 is formed over the entire region above the spring material layer 11, and a patterned resist 38 is formed on the lower surface of the spring material layer 11. Is formed. Next, the spring material layer 11 is etched from the opening of the patterned resist 38 with a corrosive liquid such as a ferric chloride aqueous solution. Thus, the fracture | rupture groove | channel 11a is formed and the springy material layer 11 is isolate | separated into the three springy material parts 11b (refer FIG.14 (b)). Thereafter, the resists 37 and 38 are peeled off to obtain a cross-sectional configuration of the suspension substrate 1 according to the present embodiment (see FIGS. 3 and 14C).

  The load beam 42 is attached to the lower surface of the suspension substrate 1 obtained in this way, and the suspension 41 shown in FIG. 5 is obtained. A suspension 52 with a head shown in FIG. 6 is obtained by mounting a slider 52 having 12 slider pads on the back surface in the mounting area 2 of the suspension 41. In this case, the slider pad of the slider 52 is connected to the wiring pad 17 of each wiring layer 14, 15, 16. Further, the suspension 51 with the head is attached to the case 62 of the hard disk drive 61 to obtain the hard disk drive 61 shown in FIG.

  When data is read and written in the hard disk drive 61 shown in FIG. 7, the slider 52 of the head suspension 51 is moved along the disk 63 by the voice coil motor 65, and the disk 63 is rotated by the spindle motor 64. Keep close to the desired flying height. As a result, data is transferred between the slider 52 and the disk 63 via the slider pad and the wiring pad 17. During this time, electrical signals are transmitted by the respective wiring layers 14, 15, 16 connected between the mounting region 2 of the suspension substrate 1 and the external connection substrate connecting portion 3.

  As described above, according to the present embodiment, the first wiring layer 14 and the second wiring layer 15 are stacked via the second insulating layer 12 from the mounting region 2 to the external connection substrate connecting portion 3. . This can increase the space for routing each wiring layer in the mounting region 2. For this reason, the differential impedance of the first wiring layer 14 and the second wiring layer 15 can be easily adjusted. In this case, for example, as shown in FIGS. 2 and 4, the line widths of the first wiring layer 14 and the second wiring layer 15 can be increased. As a result, the differential impedance of the first wiring layer 14 and the second wiring layer 15 can be reduced. Further, the differential impedance of the first wiring layer 14 and the second wiring layer 15 is increased by increasing the thickness of the second insulating layer 12 between the first wiring layer 14 and the second wiring layer 15 (base portion 15b). Can also be reduced. As a result, transmission loss between the first wiring layer 14 and the second wiring layer 15 can be reduced.

  Further, according to the present embodiment, the first wiring layer 14 and the second wiring layer 15 as described above constitute the writing wiring. As a result, the differential impedance of the write wiring decreases, so that the speed of writing data to the disk 63 can be improved and the power consumption can be suppressed. Further, the transmission loss of the first wiring layer 14 and the second wiring layer 15 is reduced, so that the stability of data writing to the disk 63 can be improved. Note that the first wiring layer 14 and the second wiring layer 15 may constitute a reading wiring instead of a writing wiring. Also in this case, since the above-mentioned effect can be obtained, the reliability of reading data from the disk 63 can be improved.

  Further, according to the present embodiment, as described above, the first wiring layer 14 and the second wiring layer are laminated via the second insulating layer 12. As a result, when a large number of wiring pads are provided in the mounting area 2 where the space is limited, the wiring layers 14, 15, 16 extending from the wiring pads 17 are routed while securing an insulating distance. Can do. For this reason, the number of wiring pads 17 formed on the suspension substrate 1 can be increased, and the slider 52 having a large number (for example, 12) of slider pads can be mounted. The relative position of the magnetic disk and the magnetic head slider can be controlled with high accuracy.

  Further, according to the present embodiment, the suspension 41, the suspension with head 51, and the hard disk drive 61 having the above-described effects can be obtained.

  In the present embodiment, the second insulating layer 12 is interposed between the slider-side portion 15a and the base-side portion 15b of the second wiring layer 15, and is provided in the through hole 20 of the second insulating layer 12. The example in which the conductive connecting portion 21a constitutes the transition portion 21 has been described. However, the present invention is not limited to this, and the slider-side portion 15a and the base-side portion 15b can be provided without interposing the second insulating layer 12 between the slider-side portion 15a and the base-side portion 15b of the second wiring layer 15. May be connected via a conductive portion (not shown) having an arbitrary shape. Furthermore, the slider side portion 15a and the base side portion 15b may be connected without interposing such a transition portion.

  Further, in the present embodiment, as shown in FIGS. 2 to 4, an example in which the wiring layers 14, 15, 16 are disposed above the insulating layer 10 and the spring material layer 11 is disposed below the insulating layer 10. As described above, the wiring layers 14, 15, 16 may be disposed below and the spring material layer 11 may be disposed above.

  As described above, the embodiment of the present invention has been described in detail. However, the suspension substrate and the method for manufacturing the suspension substrate according to the present invention are not limited to the above-described embodiment, and depart from the spirit of the present invention. Various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Mounting area | region 3 External connection board | substrate connection part 10 1st insulating layer 10a Grounding through-hole 11 Springy material layer 11a Breaking groove 11b Springy material part 12 2nd insulating layer 12a Hole 14 1st wiring layer 14c Small width Part 14d Large part 14e Width conversion part 15 Second wiring layer 15a Slider side part 15b Base part 15c Small part 15d Large part 15e Width conversion part 16 Other wiring layer 17 Wiring pad 17a Grounding terminal 18 Ni plating layer 19 Au plating Layer 20 Through hole 21 Transition portion 21a Conductive connection portion 22 Protective layer 22a Hole 23 Metal thin film layer 24 Cu sputtering layer 25 Laminate 26 Wiring material layers 27 to 38 Resist 41 Suspension 42 Load beam 51 Suspension with head 52 Slider 61 Hard disk drive 62 Case 63 Disc 6 The spindle motor 65 voice coil motor 66 arm

Claims (10)

In a suspension board having a mounting area for mounting a slider provided with a slider pad on the back surface, and an external connection board connecting part connected to the mounting area and located on the base side,
A first insulating layer;
A spring metal layer provided on one surface of the first insulating layer;
A first wiring layer provided on the other surface of the first insulating layer;
A second wiring layer insulated from the first wiring layer,
The second wiring layer is disposed on the same plane as the first wiring layer in the mounting region, and is stacked on the first wiring layer via the second insulating layer from the mounting region to the external connection substrate connecting portion,
In the first wiring layer and the portion of the second wiring layer disposed on the same plane as the first wiring layer, a wiring pad that is conducted to the slider pad of the slider is provided,
The first wiring layer has a narrow portion and a large portion having a larger line width than the narrow portion,
The second wiring layer includes a narrow portion, a large portion having a larger line width than the narrow portion, and a large portion having a line width corresponding to the large portion, which is stacked on the large portion of the first wiring layer. A suspension substrate characterized by comprising:   A portion of the second wiring layer disposed on the same plane as the first wiring layer is connected to a portion of the second wiring layer laminated on the second insulating layer via a transition portion. The suspension substrate according to claim 1.   The suspension according to claim 2, wherein a through hole is formed in the second insulating layer, and a conductive connection portion having conductivity is provided in the through hole, and the conductive connection portion forms a transition portion. Substrate.   4. The suspension substrate according to claim 1, wherein the first wiring layer and the second wiring layer constitute a writing wiring.   A suspension comprising the suspension substrate according to claim 1.   A suspension with a head, comprising the suspension according to claim 5 and a slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 6. In a method for manufacturing a suspension board having a mounting area for mounting a slider provided with a slider pad on the back surface, and an external connection board connecting part connected to the mounting area and located on the base side,
Preparing a laminate having a first insulating layer, a spring material layer provided on one surface of the first insulating layer, and a wiring layer provided on the other surface of the first insulating layer;
Forming a first wiring layer from the wiring layer and forming a portion of the second wiring layer insulated from the first wiring layer on the same plane as the first wiring layer in the mounting region;
Forming a second insulating layer on the first wiring layer;
Forming the other part of the second wiring layer laminated from the base part to the mounting region via the second insulating layer with respect to the first wiring layer;
Forming a wiring pad connected to the slider pad of the slider on the first wiring layer and a portion of the second wiring layer disposed on the same plane as the first wiring layer,
The first wiring layer has a narrow portion and a large portion having a larger line width than the narrow portion,
The second wiring layer includes a narrow portion, a large portion having a larger line width than the narrow portion, and a large portion having a line width corresponding to the large portion, which is stacked on the large portion of the first wiring layer. A method for manufacturing a suspension substrate, comprising: After forming the second insulating layer, a transition portion connected to the portion of the second wiring layer is formed,
9. The method for manufacturing a suspension substrate according to claim 8, wherein when the other portion of the second wiring layer is formed, the other portion of the second wiring layer is connected to the transition portion. When forming the transition portion, a through hole is formed in a region of the second insulating layer corresponding to the portion of the second wiring layer, and a conductive connection portion having conductivity is formed in the through hole.
The method for manufacturing a suspension substrate according to claim 9, wherein the conductive connection portion constitutes a transition portion.

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