JP5448112B2 - Suspension board - Google Patents

Description

  The present invention relates to a suspension substrate on which a magnetic head slider can be stably mounted.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate has a plurality of wiring layers and a plurality of connection terminals provided in the vicinity of the mounting area on which the magnetic head slider is mounted, and each connection terminal is connected to the wiring layer. These connection terminals are respectively connected to slider pads of the magnetic head slider, so that data is transferred to the magnetic head slider.

  In order to support the magnetic head slider in a stable posture, a suspension substrate having three pedestals formed by electrolytic plating has been proposed (for example, see Patent Document 1). The magnetic head slider is supported in a stable posture by three-point support by three pedestals.

  However, in such a conventional suspension substrate, the metal pedestal is in direct contact with the magnetic head slider, so that the magnetic head slider is damaged or generates dust. Further, since the surface of the pedestal is exposed, there is a risk of corrosion.

JP 2009-104712 A

  An object of the present invention is to provide a suspension substrate that can stably mount a magnetic head slider and prevent damage to the magnetic head slider.

  A suspension substrate according to an aspect of the present invention is a suspension substrate including a magnetic head slider mounting region on which a magnetic head slider is mounted, and a wiring pattern that connects the magnetic head slider mounting region and an electrode pad. The magnetic head slider mounting region includes a support part that supports one side of the magnetic head slider, a connection part that is located on the other side of the magnetic head slider and is separated from the support part, The connection portion includes a first wiring layer provided on the metal substrate via a first insulating layer, and the support portion is formed on the metal substrate so as to be in contact with the metal substrate. A first metal layer provided on the first metal layer; and a support insulating layer provided on the first metal layer and supporting the magnetic head slider.

  In the suspension substrate according to one aspect of the present invention, the surface of the first metal layer is preferably covered with the supporting insulating layer.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the supporting insulating layer is in direct contact with the magnetic head slider.

  In the suspension substrate according to the aspect of the present invention, it is preferable that the support portion further includes a third insulating layer provided at a lower periphery of the first metal layer.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the support portion further includes a fourth insulating layer provided on the third insulating layer.

  In the suspension substrate according to the aspect of the present invention, the support portion further includes a second metal layer provided between the third insulating layer and the fourth insulating layer, and the second metal layer includes: It is preferable that the first metal layer be bonded.

  In the suspension substrate according to an aspect of the present invention, it is preferable that the support insulating layer has a recess in a central region where an adhesive member for bonding the magnetic head slider is provided.

  In the suspension substrate according to one aspect of the present invention, the connection portion may further include a second wiring layer provided on the first insulating layer and the first wiring layer via a second insulating layer. preferable.

  In the suspension substrate according to an aspect of the present invention, the metal substrate is provided with an opening in a region between the support portion and the connection portion, and is positioned below the other side of the magnetic head slider. Preferably, the front end portion of the first wiring layer has a connection terminal with an exposed back surface, and the connection terminal is electrically connected to an element mounted on the magnetic head slider.

  In the suspension substrate according to one aspect of the present invention, the element is preferably a laser diode (LD) element or a light emitting diode (LED) element.

  According to the present invention, it is possible to stably mount a magnetic head slider and prevent damage to the magnetic head slider.

It is a top view of the board | substrate for suspensions concerning embodiment of this invention. It is sectional drawing along the AA line of FIG. It is a top view of the mounting area | region where the magnetic head slider was mounted. It is sectional drawing along the BB line of FIG. It is a figure which shows the modification of an adhesive member. It is a top view of a suspension concerning an embodiment of the present invention. It is a top view of the suspension with a head concerning the embodiment of the present invention. 1 is a perspective view of a hard disk drive according to an embodiment of the present invention. It is process sectional drawing explaining the manufacturing method of the board | substrate for suspensions concerning embodiment of this invention. It is process sectional drawing explaining the manufacturing method of the board | substrate for suspensions concerning embodiment of this invention. It is a schematic block diagram of the support part by a modification. It is a schematic block diagram of the support part by a modification. It is a schematic block diagram of the support part by a modification. It is a schematic block diagram of the support part by a modification. It is sectional drawing of the mounting area | region where the magnetic head slider by a modification was mounted. It is sectional drawing of the mounting area | region where the magnetic head slider by a modification was mounted. It is sectional drawing of the mounting area | region where the magnetic head slider by a modification was mounted.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view of a suspension substrate 1 according to an embodiment of the present invention. As shown in FIG. 1, the suspension substrate 1 includes a mounting area 2 on which a magnetic head slider (not shown) is mounted, an electrode pad 3, and a plurality of wiring patterns that connect the mounting area 2 and the electrode pad 3. It has. The plurality of wiring patterns are composed of, for example, a first wiring layer 10 and a second wiring layer 12. FIG. 1 is a simplified plan view showing a suspension substrate 1. In FIG. 1, a plurality of wiring layers are indicated by a single line. Although two electrode pads 3 are shown in FIG. 1, the number of electrode pads 3 corresponding to the wiring layer is actually provided. The electrode pad 3 is used for connection between the suspension substrate 1 and an external circuit.

  FIG. 2 shows a cross section taken along line AA of FIG. That is, in the AA sectional view of FIG. 1 shown in FIG. 2, the suspension substrate 1 is provided on the metal substrate 20, the first insulating layer 22 provided on the metal substrate 20, and the first insulating layer 22. The first insulating layer 22, the second insulating layer 24 provided on the first insulating layer 22 and the first wiring layer 10, the second wiring layer 12 provided on the second insulating layer 24, 2 insulating layer 24 and protective layer 26 provided on second wiring layer 12.

  The first wiring layer 10 and the second wiring layer 12 can transmit write data to a disk 103 (see FIG. 9) described later and read data from the disk 103. In FIG. 2, the first wiring layer 10 and the second wiring layer 12 are shown one by one, but two or more may be provided.

  FIG. 3 is a plan view of the mounting area 2 on which the magnetic head slider 30 is mounted. In FIG. 3, the second insulating layer 24 and the protective layer 26 are omitted in order to clearly show the arrangement of the second wiring layer 12. FIG. 4A is a longitudinal sectional view taken along line BB in FIG. As shown in FIGS. 3 and 4A, the mounting region 2 includes a support portion 50 that supports one side of the magnetic head slider 30 and a connection portion 40 that is connected to the other side of the magnetic head slider 30. . A space 60 is formed between the connection portion 40 and the support portion 50. Four support portions 50 are provided at predetermined intervals.

  As shown in FIG. 4A, the support portion 50 includes an insulating layer 52 provided on the metal substrate 20, an insulating layer 54 provided on the insulating layer 52, and the insulating layer 52 and the insulating layer 54. A metal layer 70 provided in contact with the metal substrate 20 and a supporting insulating layer 56 provided on the metal layer 70 are provided. The metal layer 70 can be formed by plating copper, for example. The supporting insulating layer 56 is formed so as to cover the surface of the metal layer 70. Further, one side of the magnetic head slider 30 and the supporting insulating layer 56 are in direct contact.

  FIG. 4B is a plan view of the support portion 50. In FIG. 4B, the support insulating layer 56 is not shown. As shown in FIG. 4B, when seen in a plan view, the insulating layer 52 and the insulating layer 54 are ring-shaped. The metal layer 70 has a recess in the central region. The supporting insulating layer 56 also has a recess in the central region. As shown in FIGS. 4A and 4B, the insulating layer 52 and the insulating layer 54 are provided at the lower peripheral edge of the metal layer 70.

  As shown in FIG. 4A, the connection portion 40 includes a first insulating layer 22 provided on the metal substrate 20, a first wiring layer 10 provided on the first insulating layer 22, and a first insulation. The second insulating layer 24 provided on the layer 22 and the first wiring layer 10 and the second wiring layer 12 provided on the second insulating layer 24 are included.

  The second wiring layer 12 is covered with a protective layer 26 except for the tip. The leading end portion (connection terminal) of the second wiring layer 12 is exposed after Ni plating and Au plating are formed, and a slider pad (see FIG. 5) provided at the end portion of the magnetic head slider 30 by the solder 41. (Not shown).

  As shown in FIG. 3, the first wiring layer 10 is connected to the second wiring layer 16 provided on the second insulating layer 24 through the via 14. The via 14 can be formed, for example, by plating copper inside a hole penetrating the second insulating layer 24 in the thickness direction. The second wiring layer 16 is connected to the magnetic head slider 30. Accordingly, the first wiring layer 10 is electrically connected to the magnetic head slider 30 via the via 14 and the second wiring layer 16.

  The space 60 is provided with an adhesive member 61 that bonds the metal substrate 20 and the back surface of the magnetic head slider 30 to fix the magnetic head slider 30. An adhesive or the like can be used for the adhesive member 61.

  Further, as shown in FIG. 5, the adhesive member 61 may be provided in the concave portion of the supporting insulating layer 56. By providing the adhesive member 61 in the concave portion of the supporting insulating layer 56, the adhesive member 61 can be prevented from flowing out.

  Next, each component of the suspension substrate 1 will be described.

  The electrode pad 3 includes, for example, a nickel (Ni) plating layer formed on the wiring layers 10 and 12 and a gold (Au) plating layer formed on the Ni plating layer.

  The material of the metal substrate 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel.

  The material of the first wiring layer 10 and the second wiring layers 12 and 16 is not particularly limited as long as the material has desired conductivity, but it is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. The metal layer 70 can also be made of copper.

  The material of the first insulating layer 22, the second insulating layer 24, and the insulating layers 52 and 54 is not particularly limited as long as the material has a desired insulating property. For example, polyimide (PI) is used. Is preferred.

  As a material of the protective layer 26 and the supporting insulating layer 56, it is preferable to use a resin material, for example, polyimide (PI). The material of the protective layer 26 and the supporting insulating layer 56 can be a photosensitive material or a non-photosensitive material.

  Next, the suspension 81 in the present embodiment will be described with reference to FIG. A suspension 81 shown in FIG. 6 is provided on the surface (lower surface) opposite to the suspension substrate 1 and the mounting region 2 of the suspension substrate 1 described above, and the above-described magnetic head slider 30 is attached to a disk 103 (described later). And a load beam 82 for holding.

  Next, the suspension with head 91 in this embodiment will be described with reference to FIG. The suspension with head 91 shown in FIG. 7 includes the suspension 81 described above and the magnetic head slider 30 mounted on the mounting region 2 of the suspension substrate 1 and having a plurality of slider pads on the back surface.

  Next, the hard disk drive 101 in this embodiment will be described with reference to FIG. A hard disk drive 101 shown in FIG. 8 is attached to a case 102, a disk 103 that is rotatably attached to the case 102, stores data, a spindle motor 104 that rotates the disk 103, and a desired flying height on the disk 103. And a suspension 91 with a head including a magnetic head slider 30 for writing and reading data to and from the disk 103. Of these, the suspension with head 91 is movably attached to the case 102, and a voice coil motor 105 that moves the magnetic head slider 30 of the suspension with head 91 along the disk 103 is attached to the case 102. . An arm 106 is connected between the suspension with head 101 and the voice coil motor 105.

  Next, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described. First, as shown in FIG. 9A, a metal substrate 20 is prepared in which polyimide as the first insulating layer 22 (and the insulating layer 52) and copper as the first wiring layer 10 are laminated.

  Next, as shown in FIG. 9B, the first wiring layer 10 is etched to form a desired wiring pattern.

  Next, as shown in FIG. 9C, polyimide is laminated on the first insulating layer 22 and the first wiring layer 10, and processed into a desired pattern to form the second insulating layer 24 and the insulating layer 54. . In addition, a hole to be the via 14 penetrating the second insulating layer 24 is formed.

  Next, as shown in FIG. 10A, polyimide as the first insulating layer 22 is processed into a desired pattern, and the first insulating layer 22 and the insulating layer 52 are formed. At this time, a predetermined region of the metal substrate 20 is exposed.

  Next, a chromium (Cr) and copper (Cu) sputtering layer (not shown) is formed on the second insulating layer 24, the insulating layer 54, and the metal substrate 20, and is formed on the upper surface of the sputtering layer and the lower surface of the metal substrate 20. A resist (not shown) is formed. Then, the resist on the upper surface of the sputtering layer is patterned into a pattern corresponding to the second wiring layer 12 and the metal layer 70 using photolithography. And the metal film comprised with copper is formed in the opening part of a resist by the electrolytic copper plating method, and a resist is removed after that. Subsequently, the second wiring layer 12 and the metal layer 70 are formed as shown in FIG. 10B by removing the exposed portion of the sputtering layer.

  Next, as shown in FIG. 10C, polyimide is laminated and patterned so as to cover the second wiring layer 12 and the metal layer 70, thereby forming the protective layer 26 and the supporting insulating layer 56.

  Thereafter, Ni plating and Au plating are sequentially formed on the exposed portions of the wiring layers 10 and 12, connection terminals connected to the magnetic head slider 30 are formed, and the electrode pads 3 are formed.

  In the manufacturing method described above, as shown in FIG. 9A, first, a metal substrate 20 in which polyimide as the first insulating layer 22 and copper as the first wiring layer 10 are laminated is prepared. After the first wiring layer 10 is patterned and the second insulating layer 24 and the insulating layer 54 are formed, the first insulating layer 22 and the insulating layer 52 are patterned. However, the metal substrate 20 is prepared, and the first insulating layer is prepared. 22 and the insulating layer 52, the first wiring layer 10, and the second insulating layer 24 and the insulating layer 54 may be sequentially formed.

  A load beam 82 is attached to the lower surface of the suspension substrate 1 obtained in this way, and the suspension 81 shown in FIG. 6 is obtained. The magnetic head slider 30 is mounted on the mounting area 2 of the suspension 81 to obtain the head-mounted suspension 91 shown in FIG. At this time, as shown in FIG. 4A, one side of the magnetic head slider 30 is supported by the support part 50 and the other side is connected to the connection part 40. In addition, the adhesive member 61 is filled in the recesses of the space 60 or the support insulating layer 56, and the magnetic head slider 30 is fixed.

  Further, the suspension with head 91 is attached to the case 102 of the hard disk drive 101, and the hard disk drive 101 shown in FIG. 8 is obtained.

  Thus, according to the present embodiment, the magnetic head slider 30 is supported in a flat posture by the support portion 50. Further, since the metal layer 70 of the support portion 50 is covered with the support insulating layer 56, the magnetic head slider 30 and the metal layer 70 are not in direct contact with each other, and the magnetic head slider 30 is damaged or generates dust. Can be prevented. Further, since the metal layer 70 is not exposed by being covered with the supporting insulating layer 56, corrosion of the metal layer 70 can be prevented.

  The lower part of the metal layer 70 of the support part 50 is bonded to the metal substrate 20. Since the bonding strength between the metals is stronger than the bonding strength between the metal and the insulating layer (resin), the support 50 and the metal substrate 20 The adhesion reliability can be improved.

  In addition, since the supporting insulating layer 56 is provided between the metal layer 70 and the magnetic head slider 30, when static electricity is generated when the magnetic head slider 30 is mounted and a current is generated in the metal substrate 20, the magnetic layer The head slider 30 can be protected.

  (Modified Example of Support Unit 50) FIGS. 11 to 14 show modified examples of the support unit 50. FIG. In addition, in the modification shown in FIGS. 11-14, the same code | symbol is attached | subjected to the part same as embodiment shown in FIG. 3, 4, and description is abbreviate | omitted.

  In the above embodiment, the example in which the support portion 50 is configured by the insulating layers 52 and 54, the metal layer 70, and the supporting insulating layer 56 has been described. However, as illustrated in FIG. The additional metal layer 72 may be further provided. A part of the additional metal layer 72 is bonded to the metal layer 70. The additional metal layer 72 can be formed in the same process as the first wiring layer 10.

  With such a configuration, the additional metal layer 72 provided between the insulating layer 52 and the insulating layer 54 is bonded to the metal layer 70 bonded to the metal substrate 20. Therefore, compared to the above embodiment, the reliability of the adhesion of the insulating layers 52 and 54 to the metal substrate 20 is improved, and the magnetic head slider 30 can be mounted more stably.

  Further, as shown in FIG. 12, the insulating layer 54 may be omitted from the support portion 50. In this case, the metal layer 70 may be formed in the same process as the first wiring layer 10 or the second wiring layer 12. Alternatively, the metal layer 70 may be formed in a step different from that of the first wiring layer 10 and the second wiring layer 12. When the metal layer 70 is formed in a process different from that of the first wiring layer 10 and the second wiring layer 12, the metal layer 70 having a desired thickness can be obtained by electrolytic copper plating, and the magnetic head slider 30 can be mounted horizontally. it can.

  Further, as shown in FIG. 13, the support portion 50 may be constituted by the metal layer 70 and the support insulating layer 56. The metal layer 70 can be formed on the metal substrate 20 by electrolytic copper plating. The supporting insulating layer 56 is provided so as to cover the surface of the metal layer 70. A side portion of the supporting insulating layer 56 is in contact with the metal substrate 20. Even with such a configuration, it is possible to prevent damage to the magnetic head slider 30, dust generation, and corrosion of the metal layer 70 while improving the adhesion between the support portion 50 and the metal substrate 20.

  Moreover, in the said embodiment, as shown in FIG. 3, although the four planar support parts 50 were arrange | positioned so that it may be located in the vertex of a rectangle, as shown in FIG. Five 50 may be arranged.

  Further, the planar shape of the support portion 50 is not limited to a circle, and may be a linear shape (elongated rectangular shape). For example, as shown in FIGS. 14B to 14E, a plurality of support portions having a linear planar shape may be arranged. Moreover, as shown in FIG.14 (f), you may make it the planar shape of the support part 50 become U shape or U shape. Cross sections along the line CC in FIGS. 14B to 14F correspond to the cross section of the support portion 50 in FIG.

  As shown in FIG. 15, the other side of the magnetic head slider 30 may be in direct contact with the upper surface of the second insulating layer 24. Thereby, the other side of the magnetic head slider 30 is supported by the connecting portion 40. Note that the second insulating layer 24 and the first insulating layer 22 of the connecting portion 40 are located immediately below the other side of the magnetic head slider 30, and the first wiring layer 10 and the second wiring layer 12 are located. However, it can be considered that the connecting portion 40 as a whole supports one side of the magnetic head slider 30. When it is assumed that “support” on the other side of the magnetic head slider 30 is “supported from below”, a part of the connecting portion 40 (the first insulating layer 22 and the second insulating layer 24) covers the other side of the magnetic head slider 30. I will support it.

  (Modification of Suspension Substrate 1) Referring to FIG. 16, a suspension substrate 1 on which a magnetic head slider 30 mounted with a laser diode (LD) element or a light emitting diode (LED) element and corresponding to a thermally assisted recording system is mounted. Will be described. The heat-assisted recording method is a recording that enables recording with high coercive force, which is difficult at room temperature, by instantaneously heating the part to be magnetically recorded on a hard disk with high density by reducing magnetic particles. It is a method.

  As shown in FIG. 16, the support portion 50 that supports one side of the magnetic head slider 30 includes insulating layers 52 and 54 provided on the metal substrate 20 and a lower portion provided on the insulating layers 52 and 54. 20 and a support insulating layer 56 provided so as to cover the surface of the metal layer 70.

  One side of the magnetic head slider 30 is placed on the upper surface of the supporting insulating layer 56. Further, the back surface of the magnetic head slider 30 is bonded to the supporting insulating layer 56 by an adhesive member 61 provided in the concave portion of the supporting insulating layer 56.

  Further, as shown in FIG. 16, the connection portion 40 includes a first insulating layer 22 provided on the metal substrate 20, a first wiring layer 10 provided on the first insulating layer 22, and a first insulating layer. 22 and the second insulating layer 24 provided on the first wiring layer 10, and the second wiring layer 12 provided on the second insulating layer 24.

  The second wiring layer 12 is covered with a protective layer 26 except for the tip. The leading end portion (connection terminal) of the second wiring layer 12 is exposed and is electrically connected to a slider pad (not shown) provided on the other side of the magnetic head slider 30 by solder 41.

  The metal substrate 20 is provided with an opening 20 </ b> A in a region between the connection portion 40 and the support portion 50. The opening 20 </ b> A extends to a lower part of the connection portion 40. A laser diode (LD) element or a light emitting diode (LED) element 32 (hereinafter simply referred to as “element 32”) is mounted on the back surface of the magnetic head slider 30 so that the element 32 passes through the opening 20A. The magnetic head slider 30 is mounted.

  The first wiring layer 10 extends below the end portion of the magnetic head slider 30, and the tip end portion has a pad shape. Further, the lower end of the first insulating layer 22 is removed and the back surface is exposed at the tip of the first wiring layer 10. The back surface of the front end portion of the first wiring layer 10 is electrically connected to a pad (not shown) provided on the element 32 by a solder 42.

  The magnetic head slider 30 on which the element 32 is mounted is supported by the support unit 50 in a flat posture. Further, since the metal layer 70 of the support portion 50 is covered with the support insulating layer 56, the magnetic head slider 30 and the metal layer 70 are not in direct contact with each other, and the magnetic head slider 30 is damaged or generates dust. Can be prevented. Further, since the metal layer 70 is not exposed by being covered with the supporting insulating layer 56, corrosion of the metal layer 70 can be prevented. Moreover, since the lower part of the metal layer 70 of the support part 50 is joined to the metal substrate 20, the adhesion reliability between the support part 50 and the metal substrate 20 can be improved. In addition, since the supporting insulating layer 56 is provided between the metal layer 70 and the magnetic head slider 30, when static electricity is generated when the magnetic head slider 30 is mounted and a current is generated in the metal substrate 20, the magnetic layer The head slider 30 and the element 32 can be protected.

  The element 32 mounted on the magnetic head slider 30 is not limited to a laser diode (LD) element or a light emitting diode (LED) element, but may be a light source unit including a laser diode (LD) element or a light emitting diode (LED) element. Any other functional element may be used as long as it can heat the portion of the hard disk where magnetic recording is performed.

  (Modification of Magnetic Head Slider 30) As shown in FIG. 17, the magnetic head slider 30 may have a convex portion 31 that fits into the concave portion of the supporting insulating layer 56. When the magnetic head slider 30 is mounted, the magnetic head slider 30 can be easily aligned by fitting the convex portion 31 and the concave portion of the supporting insulating layer 56. The convex portion 31 can be formed by adhering a resin or the like to the back surface of the magnetic head slider 30.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Mounting area | region 3 Electrode pad 10 1st wiring layer 12 2nd wiring layer 14 Via 16 2nd wiring layer 20 Metal substrate 20A Opening part 22 1st insulating layer 24 2nd insulating layer 26 Protective layer 30 Magnetic head slider 32 Element 40 Connection part 41, 42 Solder 50 Support part 52, 54 Insulating layer 56 Insulating layer 60 for support Space 61 Adhesive member 70 Metal layer 81 Suspension 82 Load beam 91 Suspension with head 101 Hard disk drive 102 Case 103 Disk 104 Spindle motor 105 Voice coil motor 106 Arm

Claims (8)

A suspension substrate comprising a magnetic head slider mounting area on which a magnetic head slider is mounted, and a wiring pattern connecting the magnetic head slider mounting area and the electrode pad,
The magnetic head slider mounting area is
A support for supporting one side of the magnetic head slider;
A connection portion located on the other side of the magnetic head slider and formed at a position away from the support portion;
With
The connection portion has a first wiring layer provided on the metal substrate via a first insulating layer,
The support portion is formed on a metal substrate and is provided so as to be in contact with the metal substrate; a support insulating layer provided on the first metal layer and supporting the magnetic head slider; A suspension substrate comprising: a third insulating layer provided at a lower periphery of the first metal layer; and a fourth insulating layer provided on the third insulating layer . The support portion further includes a second metal layer provided between the third insulating layer and the fourth insulating layer, and the second metal layer is bonded to the first metal layer. The suspension substrate according to claim 1 . A suspension substrate comprising a magnetic head slider mounting area on which a magnetic head slider is mounted, and a wiring pattern connecting the magnetic head slider mounting area and the electrode pad,
The magnetic head slider mounting area is
A support for supporting one side of the magnetic head slider;
A connection portion located on the other side of the magnetic head slider and formed at a position away from the support portion;
With
The connection portion has a first wiring layer provided on the metal substrate via a first insulating layer,
The support portion is formed on a metal substrate and is provided so as to be in contact with the metal substrate; a support insulating layer provided on the first metal layer and supporting the magnetic head slider; Have
The supporting insulating layer has a concave portion provided with an adhesive member for bonding the magnetic head slider in a central region, and the concave portion is surrounded by the supporting insulating layer over the entire circumference. substrate. Suspension substrate according to any one of claims 1 to 3 surface of the first metal layer is characterized by being covered with the supporting insulating layer. It said supporting insulating layer, suspension substrate according to any one of claims 1 to 4, characterized in that direct contact with the magnetic head slider. Said connection unit, said first insulating layer and the first wiring layer, to any one of claims 1 to 5, further comprising a second wiring layer provided over the second insulating layer The suspension substrate described. The metal substrate is provided with an opening in a region between the support portion and the connection portion,
The tip portion of the first wiring layer located below the other side of the magnetic head slider has a connection terminal with a back surface exposed,
It said connection terminal, a suspension substrate according to any one of claims 1 to 6, characterized in that it is mounted on the electrically connected to the element to the magnetic head slider. The suspension substrate according to claim 7 , wherein the element is a laser diode (LD) element or a light emitting diode (LED) element.

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