JP3580893B2 - Suspension wiring board for magnetic head - Google Patents

Suspension wiring board for magnetic head Download PDF

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Publication number
JP3580893B2
JP3580893B2 JP09171895A JP9171895A JP3580893B2 JP 3580893 B2 JP3580893 B2 JP 3580893B2 JP 09171895 A JP09171895 A JP 09171895A JP 9171895 A JP9171895 A JP 9171895A JP 3580893 B2 JP3580893 B2 JP 3580893B2
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Prior art keywords
conductor
signal transmission
wiring board
magnetic head
insulating layer
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JPH08264911A (en
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満 本上
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Nitto Denko Corp
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Nitto Denko Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

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  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【０００１】
【産業上の利用分野】
本発明はハ−ドディスクドライブの磁気ヘッド用サスペンション配線板に関するものである。
【０００２】
【従来の技術】
高速ディジタル信号の伝送に使用される配線板においては、信号伝送用導体から外部に電磁波が放射するのを防止したり、外部からの電磁波が信号伝送用導体に侵入するのを防止すること（すなわち、電磁波シ−ルド）、信号伝送用導体間でのクロスト−クを防止することが要求される。
磁気ヘツドを先端に取付け、その磁気ヘツドとハ−ドディスクドライブ部とを接続する磁気ヘッド用サスペンション配線板において、クロスト−クや電磁波ノイズが発生すれば、磁気ディスクからのデ−タの読み込み及び書き込みにエラ−が生じ、また、高速ディジタル信号から発生する高調波成分が電磁波ノイズとして放射されれば、誘導障害によるハ−ドディスクドライブ自体の誤動作の原因になるから、高性能な電磁波シ−ルドやクロスト−ク抑制が必要である。
【０００３】
近来、上記の磁気ヘッド用サスペンション配線板においては、ワイヤ方式からプリント回路方式に移行されつつあり、信号伝送用導体と地導体用導体とから成る対導体を同一絶縁層面上（従って、同一平面上）に印刷形成している。この導体路構造によれば、信号伝送用導体から発生する電磁界を当該信号伝送用導体とこの信号伝送用導体と対を成す地導体用導体との間の空間に比較的よく閉じ込め得、その電磁界の放射範囲を狭く抑えることができるので、クロスト−クや外部への電磁波障害をかなり抑制できる。
【０００４】
【発明が解決しようとする課題】
しかしながら、この対導体構成では、外部電磁波の信号伝送用導体への侵入防止は、さして期待できない。
上記ハ−ドディスクドライブの磁気ヘッド用サスペンション配線板においては、磁気ディスクの回転に伴う空気流で発生する浮上力とサスペンションの曲げ反力とを所定の浮上量で釣り合わせて磁気ヘツドを磁気ディスクに近接させるように、配線板裏面に高剛性金属板を積層して所定の曲げ剛性を付与している。
【０００５】
本発明の目的は、ハ−ドディスクドライブの磁気ヘッド用サスペンション配線板において、その高剛性金属板との協働で良好に外部電磁波の侵入を防止し得、しかもクロスト−クの抑制及び障害電磁波の放射防止も良好に行い得るプリント配線板を提供することにある。
【０００６】
【課題を解決するための手段】
本発明に係る磁気ヘッド用サスペンション配線板は、信号伝送用導体と地導体用導体と の対から成る対導体を複数有し、裏面の高剛性金属板上に絶縁層を介して前記複数の対導体のうちの信号伝送用導体を配設し、これらの信号伝送用導体群上に前記絶縁層とは別の絶縁層を介して同上複数の対導体のうちの地導体用導体を、該地導体用導体と前記高剛性金属板とで同一対の信号伝送用導体を挾むように配設したことを特徴とし、地導体用導体の巾は信号伝送用導体の巾よりも広くすることが望ましい。
【０００７】
以下、本発明の構成を図面を参照しつつ説明する。
図１は本発明に係る磁気ヘッド用サスペンション配線板を示す断面説明図である。
図１において、１は高剛性金属板である。２は信号伝送用導体２１と地導体用導体２２とから成る対導体であり、信号伝送用導体２１は絶縁層３及び４を介して上下から地導体用導体２２と高剛性金属板１との間に挾まれ、高剛性金属板１と絶縁層３との間、絶縁層３と信号伝送用導体２１との間、絶縁層３と絶縁層４との間並びに絶縁層４と地導体用導体２２との間は接着一体化されている。
上記地導体用導体２２の巾は信号伝送用導体２１の巾に対し少なくとも同等とされ、好ましくは、信号伝送用導体２１の巾よりも広くされる。
【０００８】
この配線板の先端に磁気ヘッドが取り付けられ、磁気ディスクの回転に伴う空気流で発生する浮上力で撓まされて磁気ヘツドが磁気ディスクに近接される。
上記高剛性金属板１は、上記作動に必要な曲げ剛性をプリント配線板に付与するために設けられており、この高剛性金属板には、厚み５〜１００μｍ、好ましくは１０〜５０のステンレス板を使用することができ、鉄、ニッケル、クロム等の成分比は特に限定されない。
【０００９】
上記信号伝送用導体２１及び地導体用導体２２の材質には、銅、クロム、ニッケル、チタン、アルミニウム、金、銀等の金属、またはこれらの金属の合金系を使用できる。また、これら金属の二種以上を用いて多層構造とすることもできる。信号伝送用導体２１及び地導体用導体２２のそれぞれの厚みは、０．１〜１００μｍ、好ましくは１〜５０μｍとされ、導体巾は、通常、厚みの５〜２０倍の範囲である。
上記絶縁層３及び４の材質は特に限定されるものではなく、例えば、ポリイミド樹脂系、ポリエステル樹脂系、フッ素樹脂系等の合成樹脂を使用でき、露光・現像によりこれらの絶縁層を所定のパタ−ンに形成するために、樹脂に感光剤等の添加・配合により感光性を付与することもできる。これらの絶縁層３及び４のそれぞれの厚みは、０．５〜１００μｍ、好ましくは１〜５０μｍとされる。
【００１０】
上記磁気ヘッド用サスペンション配線板は、例えば次のようにして製造することができる。
すなわち、図１において、まず、高剛性金属板１の片面に絶縁層３を形成する。この絶縁層３の形成には、高剛性金属板１の片面に樹脂を塗工し、必要に応じて加熱処理する方法、高剛性金属板１の片面に接着剤により樹脂フィルムを貼着する方法等を使用できる。
次いで、絶縁層３上に真空蒸着法等により導体層を形成し、フォトリソグラフィにより所定パタ−ンの信号伝送用導体２１，２１…をエッチング形成する。
次いで、信号伝送用導体２１，２１…の上面及び側面を覆うように絶縁層４を形成する。この絶縁層４の形成には、樹脂を塗工し、必要に応じて加熱処理する方法を使用することができる。この絶縁層４から上記の絶縁層３にわたり必要に応じ貫通孔を設けることもできる。
次いで、絶縁層４上に真空蒸着法等により導体層を形成し、フォトリソグラフィにより上記信号伝送用導体２１，２１，…を覆う所定パタ−ンで地導体用導体２２，２２，…をエッチング形成し、これにてプリント配線板の製作を終了する。
【００１１】
この磁気ヘッド用サスペンション配線板の製造方法に対し、上記信号伝送用導体の形成後、金属箔を接着剤を介して信号伝送用導体形成面上に積層し、この金属箔をフォトリソグラフィにより信号伝送用導体を覆う所定パタ−ンの地導体用導体にエッチング形成することもできる。
なお、地導体用導体とハ−ドディスク内の電気回路等との電気的接触が問題となる場合は、地導体用導体上に絶縁カバ−コ−トが設けられる。
【００１２】
【作用】
高剛性金属板１においては、地導体用導体２２に較べて低導電率であるが、断面積が大であるために、地導体用導体２２に匹敵するコンダクタンスを有する。而して、信号伝送用導体２１が地導体用導体２２と高剛性金属板１との間に挾まれ、かつ、信号伝送用導体２１が地導体用導体２２及び高剛性金属板１のそれぞれに充分に近接されているから、外来電磁波の信号伝送用導体２１への侵入をよく防止できる。
また、一対の信号伝送用導体２１と地導体用導体２２とが巾方向にずれなく、かつ対面接近して配置されているから、信号伝送用導体２１から発生する電磁界の対導体２１−２２間からのはみ出しが僅少にとどめられ、この発生電磁界の隣の信号伝送用導体への交鎖や他の電気回路部位への交鎖をよく抑制できる。
従って、電磁波シ−ルドやクロスト−ク抑制を良好に行わせることができ、 の効果については、次の実施例と比較例との対比からも、確認できる。
【００１３】
【実施例】
〔実施例１〕
厚み３０μｍのステンレス板（ＳＵＳ３０４）の片面に、ポリイミド前駆体（３，３’，４，４’−ビフェニルテトラカルボン酸二無水物をテトラカルボン酸成分とし、ｐ−フェニレンジアミンをジアミン成分とするものを使用した）をスピンコ−トにより塗工し、この塗工層を窒素ガス雰囲気下で３８０℃，１時間の条件で加熱して厚み１０μｍの絶縁層を形成した。次いで、この絶縁層上に厚み５μｍの銅層を真空蒸着法により積層し、この銅層を塩化第二鉄溶液を用いてエッチング加工し、巾５０μｍの信号伝送用導体を間隔５０μｍにて２本形成した。この信号伝送用導体形成面上に前記と同様に、ポリイミド前駆体をスピンコ−トにより塗工し、この塗工層を窒素ガス雰囲気下で３８０℃，１時間の条件で加熱して厚み１０μｍの絶縁層を形成し、この絶縁層上に厚み５μｍの銅層を真空蒸着法により積層した。次いで、銅層を塩化第二鉄溶液を用いてエッチング加工し、巾５０μｍの地導体用導体を上記信号伝送用導体の直上に位置させて２本形成した（従って、間隔は５０μｍ）。
【００１４】
〔実施例２〕
実施例１に対し、地導体用導体の巾を７０μｍ、地導体用導体の間隔を３０μｍとした以外、実施例１に同じとした。
【００１５】
〔比較例〕
厚み３０μｍのステンレス板（ＳＵＳ３０４）の片面に、ポリイミド前駆体をスピンコ−トにより塗工し、この塗工層を窒素ガス雰囲気下で３８０℃，１時間の条件で加熱して厚み１０μｍの絶縁層を形成した。次いで、この絶縁層上に厚み５μｍの銅層を真空蒸着法により積層し、この銅層を塩化第二鉄溶液を用いてエッチング加工し、巾５０μｍの導体を間隔５０μｍにて４本形成し、同一面上に地導体用導体−信号伝送用導体−信号伝送用導体−地導体用導体の配列にて２対の対導体を形成した。
【００１６】
これらの実施例品並びに比較例品について、クロスト−ク係数をパルス発生器とデジタルオシロスコ−プを用いて測定したところ、実施例品１では、０．００２、実施例２品では０．００１、比較例品では０．０１であり、実施例品は、比較例品に較べ一段と優れていた。
この測定結果から、本発明によれば、信号伝送用導体から発生する電磁界を地導体用導体と高剛性金属板との間に閉じ込めて外部への放射を充分に防止し得、優れたクロスト−ク抑制性能及び電磁波シ−ルド性能を保証できることが確認できる。
【００１７】
【発明の効果】
本発明に係る磁気ヘッド用サスペンション配線板によれば、信号伝送用導体から発生する電磁界を地導体用導体と高剛性金属板との間に閉じ込めて外部への放射をよく防止し得、また、信号伝送用導体が地導体用導体と高剛性金属板との間にコンパクトに閉じ込められていて外来電磁界の信号伝送用導体への侵入をよく防止できるから、優れた電磁波シ−ルド性能及びクロスト−ク抑制性能を保証できる。
【００１８】
また、対導体を成す信号伝送用導体と地導体用導体とを上下に配置しているから、同一平面上に配置している従来例に較べ、配線スペ−スを小さくでき、更に、信号伝送用導体の裏面側に絶縁層を介して金属板を設けているから、ストリップライン構造の伝送線路となり、インピ−ダンス整合を容易に行い得る等の利点もある。
【図面の簡単な説明】
【図１】本発明に係る磁気ヘッド用サスペンション配線板を断面で示す説明図である。
【符号の説明】
１ 高剛性金属板
２ 対導体
２１ 信号伝送用導体
２２ 地導体用導体
３ 絶縁層
４ 絶縁層[0001]
[Industrial applications]
The present invention ha - relates de suspension wiring board for a magnetic head of the disk drive.
[0002]
[Prior art]
In a wiring board used for transmitting high-speed digital signals, it is necessary to prevent electromagnetic waves from radiating from the signal transmission conductor to the outside, or to prevent external electromagnetic waves from entering the signal transmission conductor (ie, It is required to prevent crosstalk between signal transmission conductors.
If a magnetic head is attached to the tip and a crosstalk or electromagnetic wave noise occurs in the magnetic head suspension wiring board that connects the magnetic head to the hard disk drive, data is read from the magnetic disk. If an error occurs in writing and a harmonic component generated from a high-speed digital signal is radiated as electromagnetic noise, it causes a malfunction of the hard disk drive itself due to an induction failure. In this case, it is necessary to suppress the pressure and crosstalk.
[0003]
Recently, in the above-described suspension wiring board for a magnetic head, there has been a shift from a wire system to a printed circuit system, and a pair of conductors composed of a signal transmission conductor and a ground conductor has been placed on the same insulating layer surface (and therefore on the same plane). ). According to this conductor path structure, the electromagnetic field generated from the signal transmission conductor can be relatively well confined in the space between the signal transmission conductor and the ground conductor forming a pair with the signal transmission conductor. Since the emission range of the electromagnetic field can be suppressed to a small value, crosstalk and electromagnetic interference to the outside can be considerably suppressed.
[0004]
[Problems to be solved by the invention]
However, with this paired conductor configuration, it cannot be expected to prevent external electromagnetic waves from entering the signal transmission conductor.
In the above-mentioned suspension wiring board for a magnetic head of a hard disk drive, a levitation force generated by an airflow caused by rotation of the magnetic disk and a bending reaction force of the suspension are balanced by a predetermined levitation amount, thereby making the magnetic head a magnetic disk. A high-rigidity metal plate is laminated on the back surface of the wiring board so as to bring the predetermined bending rigidity close to the wiring board.
[0005]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a suspension wiring board for a magnetic head of a hard disk drive which can effectively prevent the invasion of an external electromagnetic wave by cooperating with the high-rigidity metal plate, suppress crosstalk and prevent an electromagnetic interference. It is an object of the present invention to provide a printed wiring board which can effectively prevent radiation of the printed wiring board.
[0006]
[Means for Solving the Problems]
The magnetic head suspension wiring board according to the present invention has a plurality of paired conductors formed of pairs of a signal transmission conductor and a ground conductor, and the plurality of pairs of conductors are provided on a high-rigidity metal plate on the back surface with an insulating layer interposed therebetween. A signal transmission conductor among the conductors is disposed, and a ground conductor among the plurality of paired conductors is placed on the signal transmission conductor group via an insulation layer different from the insulation layer on the signal transmission conductor group. The same pair of signal transmission conductors are disposed so as to sandwich the same pair of signal transmission conductors between the conductor conductor and the high-rigidity metal plate, and it is desirable that the width of the ground conductor be wider than the width of the signal transmission conductor.
[0007]
Hereinafter, the configuration of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory sectional view showing a suspension board for a magnetic head according to the present invention.
In FIG. 1, reference numeral 1 denotes a high-rigidity metal plate. Numeral 2 denotes a pair conductor composed of a signal transmission conductor 21 and a ground conductor 22. The signal transmission conductor 21 is formed between the ground conductor 22 and the high-rigidity metal plate 1 from above and below via insulating layers 3 and 4. Sandwiched between the high-rigidity metal plate 1 and the insulating layer 3, between the insulating layer 3 and the signal transmission conductor 21, between the insulating layer 3 and the insulating layer 4, and between the insulating layer 4 and the ground conductor. 22 is bonded and integrated.
The width of the ground conductor 22 is at least equal to the width of the signal transmission conductor 21, and is preferably wider than the width of the signal transmission conductor 21.
[0008]
A magnetic head is attached to the tip of the wiring board, and is bent by a levitation force generated by an air flow accompanying the rotation of the magnetic disk to bring the magnetic head close to the magnetic disk.
The high-rigidity metal plate 1 is provided to impart bending rigidity required for the operation to the printed wiring board. The high-rigidity metal plate has a thickness of 5 to 100 μm, preferably a thickness of 10 to 50 stainless steel. Can be used, and the component ratio of iron, nickel, chromium and the like is not particularly limited.
[0009]
As a material of the signal transmission conductor 21 and the ground conductor 22, metals such as copper, chromium, nickel, titanium, aluminum, gold, and silver, or alloys of these metals can be used. Further, a multilayer structure can be formed by using two or more of these metals. The thickness of each of the signal transmission conductor 21 and the ground conductor 22 is 0.1 to 100 μm, preferably 1 to 50 μm, and the width of the conductor is usually 5 to 20 times the thickness.
The material of the insulating layers 3 and 4 is not particularly limited, and for example, a synthetic resin such as a polyimide resin, a polyester resin, and a fluororesin can be used. In order to form a negative electrode, the resin may be provided with photosensitivity by adding or blending a photosensitive agent or the like. The thickness of each of these insulating layers 3 and 4 is 0.5 to 100 μm, preferably 1 to 50 μm.
[0010]
The magnetic head suspension wiring board can be manufactured, for example, as follows.
That is, in FIG. 1, first, the insulating layer 3 is formed on one surface of the high-rigidity metal plate 1. The insulating layer 3 is formed by applying a resin to one surface of the high-rigidity metal plate 1 and performing a heat treatment as necessary, or by attaching a resin film to one surface of the high-rigidity metal plate 1 with an adhesive. Etc. can be used.
Next, a conductor layer is formed on the insulating layer 3 by a vacuum deposition method or the like, and the signal transmission conductors 21, 21,... Of a predetermined pattern are formed by photolithography.
Next, the insulating layer 4 is formed so as to cover the upper and side surfaces of the signal transmission conductors 21, 21,. For forming the insulating layer 4, a method of applying a resin and performing a heat treatment as necessary can be used. If necessary, a through hole can be provided from the insulating layer 4 to the insulating layer 3.
Next, a conductor layer is formed on the insulating layer 4 by a vacuum evaporation method or the like, and the ground conductors 22, 22,... Are formed by photolithography with a predetermined pattern covering the signal transmission conductors 21, 21,. Then, the production of the printed wiring board is completed.
[0011]
According to this method of manufacturing a suspension wiring board for a magnetic head, after forming the signal transmission conductor, a metal foil is laminated on a signal transmission conductor formation surface via an adhesive, and the metal foil is used for signal transmission by photolithography. It can also be formed by etching a predetermined pattern of the ground conductor for covering the conductor.
If electrical contact between the ground conductor and an electric circuit in the hard disk becomes a problem, an insulating cover coat is provided on the ground conductor.
[0012]
[Action]
The high-rigidity metal plate 1 has a lower conductivity than the conductor 22 for the ground conductor, but has a conductance comparable to that of the conductor 22 for the ground conductor because of its large cross-sectional area. Thus, the signal transmission conductor 21 is sandwiched between the ground conductor 22 and the high-rigidity metal plate 1, and the signal transmission conductor 21 is disposed on each of the ground conductor 22 and the high-rigidity metal plate 1. Since they are sufficiently close, it is possible to prevent foreign electromagnetic waves from entering the signal transmission conductor 21 well.
In addition, since the pair of signal transmission conductors 21 and the ground conductor 22 are arranged close to each other without shifting in the width direction, the pair of conductors 21-22 for the electromagnetic field generated from the signal transmission conductor 21 are disposed. The protrusion from the space is suppressed to a small extent, and the crossing of the generated electromagnetic field to the adjacent signal transmission conductor and the crossing to other electric circuit parts can be suppressed well.
Accordingly, it is possible to favorably suppress electromagnetic wave shielding and crosstalk, and the effect of (1) can be confirmed also by comparing the following example with a comparative example.
[0013]
【Example】
[Example 1]
A polyimide precursor (3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride as a tetracarboxylic acid component and a p-phenylenediamine as a diamine component) on one side of a stainless steel plate (SUS304) having a thickness of 30 μm. Was applied by spin coating, and this coating layer was heated at 380 ° C. for 1 hour under a nitrogen gas atmosphere to form an insulating layer having a thickness of 10 μm. Next, a copper layer having a thickness of 5 μm is laminated on the insulating layer by a vacuum deposition method, and the copper layer is etched using a ferric chloride solution, and two signal transmission conductors having a width of 50 μm are arranged at intervals of 50 μm. Formed. A polyimide precursor is applied on the signal transmission conductor forming surface by spin coating in the same manner as described above, and the applied layer is heated at 380 ° C. for 1 hour in a nitrogen gas atmosphere to have a thickness of 10 μm. An insulating layer was formed, and a 5 μm thick copper layer was laminated on the insulating layer by a vacuum evaporation method. Then, the copper layer was etched using a ferric chloride solution to form two ground conductors having a width of 50 μm, which were positioned immediately above the signal transmission conductors (accordingly, the interval was 50 μm).
[0014]
[Example 2]
Example 1 was the same as Example 1 except that the width of the ground conductor was set to 70 μm and the interval between the ground conductors was set to 30 μm.
[0015]
(Comparative example)
A polyimide precursor is applied on one side of a stainless steel plate (SUS304) having a thickness of 30 μm by spin coating, and this coating layer is heated at 380 ° C. for 1 hour under a nitrogen gas atmosphere to form an insulation layer having a thickness of 10 μm. Was formed. Next, a copper layer having a thickness of 5 μm was laminated on the insulating layer by a vacuum evaporation method, and the copper layer was etched using a ferric chloride solution to form four conductors having a width of 50 μm at intervals of 50 μm. Two pairs of conductors were formed on the same surface in an arrangement of a conductor for ground conductor, a conductor for signal transmission, a conductor for signal transmission, and a conductor for ground conductor.
[0016]
The crosstalk coefficient of these examples and comparative examples was measured using a pulse generator and a digital oscilloscope. As a result, 0.002 was obtained for Example 1 and 0.001 for Example 2. It was 0.01 in the comparative example product, and the example product was much better than the comparative example product.
From the measurement results, according to the present invention, the electromagnetic field generated from the signal transmission conductor can be confined between the ground conductor and the high-rigidity metal plate to sufficiently prevent radiation to the outside. It can be confirmed that the arc suppression performance and the electromagnetic wave shielding performance can be guaranteed.
[0017]
【The invention's effect】
According to the suspension wiring board for a magnetic head according to the present invention, the electromagnetic field generated from the signal transmission conductor can be confined between the ground conductor and the high-rigidity metal plate to prevent radiation to the outside, and Since the signal transmission conductor is compactly confined between the ground conductor and the high-rigidity metal plate, it is possible to prevent the invasion of the external electromagnetic field into the signal transmission conductor, so that the excellent electromagnetic shielding performance and Crosstalk suppression performance can be guaranteed.
[0018]
Further, since the signal transmission conductor and the ground conductor, which form a pair conductor, are arranged vertically, the wiring space can be reduced as compared with the conventional example in which the conductors are arranged on the same plane. Since the metal plate is provided on the back surface side of the conductor for use with an insulating layer interposed therebetween, the transmission line has a stripline structure, and there is an advantage that impedance matching can be easily performed.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a suspension wiring board for a magnetic head according to the present invention in cross section.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 High rigid metal plate 2 Pair conductor 21 Signal transmission conductor 22 Ground conductor 3 Insulation layer 4 Insulation layer

Claims (2)

信号伝送用導体と地導体用導体との対から成る対導体を複数有し、裏面の高剛性金属板上に絶縁層を介して前記複数の対導体のうちの信号伝送用導体を配設し、これらの信号伝送用導体群上に前記絶縁層とは別の絶縁層を介して同上複数の対導体のうちの地導体用導体を、該地導体用導体と前記高剛性金属板とで同一対の信号伝送用導体を挾むように配設したことを特徴とする磁気ヘッド用サスペンション配線板。 A plurality of paired conductors each comprising a pair of a signal transmission conductor and a ground conductor are provided, and the signal transmission conductor among the plurality of paired conductors is disposed on a high-rigidity metal plate on the back surface via an insulating layer. On these signal transmission conductor groups, the ground conductor of the plurality of paired conductors is the same as the ground conductor and the high-rigidity metal plate via the insulating layer different from the insulating layer. A suspension wiring board for a magnetic head, comprising a pair of signal transmission conductors sandwiched therebetween . 地導体用導体の巾が信号伝送用導体の巾よりも広くされている請求項１記載の磁気ヘッド用サスペンション配線板。The suspension wiring board for a magnetic head according to claim 1, wherein the width of the ground conductor is wider than the width of the signal transmission conductor.
JP09171895A 1995-03-24 1995-03-24 Suspension wiring board for magnetic head Expired - Lifetime JP3580893B2 (en)

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JP09171895A JP3580893B2 (en) 1995-03-24 1995-03-24 Suspension wiring board for magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09171895A JP3580893B2 (en) 1995-03-24 1995-03-24 Suspension wiring board for magnetic head

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JP3580893B2 true JP3580893B2 (en) 2004-10-27

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JP2005011387A (en) 2003-06-16 2005-01-13 Hitachi Global Storage Technologies Inc Magnetic disk unit
JP4620495B2 (en) * 2005-03-01 2011-01-26 大日本印刷株式会社 Flexures and methods of manufacturing flexures
JP4916235B2 (en) * 2006-06-29 2012-04-11 日東電工株式会社 Printed circuit board
US8173909B2 (en) * 2006-10-25 2012-05-08 Nitto Denko Corporation Method for mating flexure to flex-print circuit and flexure therefor
JP5000451B2 (en) 2007-10-15 2012-08-15 日東電工株式会社 Printed circuit board
JP2009188379A (en) 2008-01-07 2009-08-20 Nitto Denko Corp Wired circuit board
JP5139102B2 (en) * 2008-02-05 2013-02-06 日東電工株式会社 Wiring circuit board and manufacturing method thereof
JP5304175B2 (en) * 2008-10-29 2013-10-02 大日本印刷株式会社 Suspension board manufacturing method
JP4952827B2 (en) * 2010-07-13 2012-06-13 大日本印刷株式会社 Flexures and methods of manufacturing flexures
CN104885578B (en) * 2013-02-26 2018-05-04 大自达电线股份有限公司 Flexible printed circuit board reinforcement part, flexible printed circuit board and shielding printed wiring board

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JPS60109106A (en) * 1983-11-16 1985-06-14 日本電気株式会社 Flexible cable for magnetic head
JPS6240860U (en) * 1985-08-30 1987-03-11
JPH0793481B2 (en) * 1988-03-23 1995-10-09 松下電器産業株式会社 Metal base printed wiring board
JPH0693552B2 (en) * 1990-11-29 1994-11-16 日本メクトロン株式会社 Shield type flexible circuit board and manufacturing method thereof
JPH05304345A (en) * 1992-04-27 1993-11-16 Sanken Electric Co Ltd Metallic wiring board and its production
JPH0653621A (en) * 1992-06-05 1994-02-25 Mitsui Toatsu Chem Inc Three-dimentional printed circuit board, electronic circuit package using it, and manufacture of printed circuit board
JPH06176335A (en) * 1992-12-04 1994-06-24 Fujitsu Ltd Magnetic head assembly and magnetic disk device

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