JPH0653621A - Three-dimentional printed circuit board, electronic circuit package using it, and manufacture of printed circuit board - Google Patents

Abstract

PURPOSE:To obtain a three-dimensional printed circuit board excellent in heat dissipation and electromagnetic shielding, and on which high density mounting is possible by providing a metallic plate on the back side as a multiple-layer structure. CONSTITUTION:A metallic plate 101, wiring conductors (copper foil) 103, are laminated through an insulating layers 102, 104 by using thermoplastic polyimide as insulating layers 102, 104, and a metal-base substrate of multiple layer structure is formed. Bending work and deep-drawing are made for the metal-base substrate, and the substrate is shaped into a case having an opening 180. Ridges 107, where lead terminals to be used for connection with other wiring substrate are formed, are provided on the periphery of the opening 180. The edge of the ridge 107A and the end of the lead terminal 110A are formed far separated between the two.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional printed board used for mounting electronic parts and a method for manufacturing the same, and more particularly to a three-dimensional printed board using a metal base board and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the trend toward lighter, thinner, shorter, and smaller electronic devices in which electronic circuits are mounted and their operating speeds have increased, high-density mounting and high-speed operation of electronic circuits themselves have been progressing. When high-density mounting is performed, the distance between the electronic components that make up the electronic circuit becomes smaller.Therefore, especially when the operating frequency of the circuit is high, malfunction of the electronic circuit due to unnecessary radiation generated from each electronic component, etc. is a problem. Become. In order to protect the electronic circuit from unwanted radiation or reduce the amount of unwanted radiation, it is required to provide an electromagnetic wave shield. In addition, when high-speed operation is performed, power consumption generally increases and the amount of heat generated by electronic components increases. Therefore, it is required to mount these electronic components with good heat dissipation.

The inventors of the present invention have disclosed, in Japanese Patent Laid-Open No. 4-6893, an electronic circuit package that enables high-density mounting, has a shielding property against electromagnetic waves, and enables a good heat dissipation property. This electronic circuit package is a soup dish shape obtained by bending or drawing a metal base substrate, and electronic parts are mounted on the bottom of the soup dish when viewed from the opening side. By arranging it on another wiring board with the metal base board side as the top side and the opening side as the bottom side, and joining this wiring board at this opening side, unnecessary radiation leaking from the inside of this electronic circuit package is reduced. In addition, the heat is also radiated well.

A typical package for mounting electronic parts is QFP (Quad Flat Packag).
e), DIP (Dual Inline Package), etc. have been conventionally known. Lead frames are used as chip carriers for these packages. In the lead frame, a plurality of carrier portions are continuously arranged on the same frame in order to improve the efficiency of the mounting work of electronic components. recent years,
With the increasing number of electronic component pins, it is necessary to narrow the pitch of inner leads and outer leads in a lead frame on which a large number of electronic components are mounted. By the way, in the case of the outer leads, since the outer leads are individually projected to the outside of the package, the pitch cannot be narrowed to a certain extent or more in order to maintain the positional accuracy during mounting. Also with regard to the inner leads, when the pitch is narrowed, it is difficult to stably form the portion adjacent to the electronic component. Therefore, it is difficult to make the package itself smaller.

To solve these problems when using a lead frame, Japanese Patent Laid-Open No. 1-132147 discloses a resin layer made of an epoxy resin having a thickness of several tens of μm as an insulating layer using aluminum or copper as a base metal. After that, a package is disclosed in which a copper foil is laminated, and after patterning, a bent portion is formed by pressing. In this package, electronic parts are mounted in the central part and the peripheral parts are used as outer leads. By configuring the package in this way, it is possible to miniaturize the lead portion while maintaining stability, and it is also possible to improve heat dissipation.

Further, Japanese Patent Publication No. 1-43473 discloses a wiring board for mounting electronic parts, which uses a metal plate as a support substrate, in which a metal thin film is formed by an ion engineering deposition method. In this wiring board, the metal thin film is bent together with the support substrate and the organic insulating layer and processed into a desired shape.

[0007]

The electronic circuit package disclosed in Japanese Patent Laid-Open No. 4-6893 includes a single-layer wiring conductor formed on a metal plate with an insulating layer interposed therebetween. It is not possible to sufficiently cope with cases where high density wiring is required after mounting. Since it is a metal base substrate,
The through-hole plating technique cannot be simply used to form a multilayer substrate. Further, since the diaphragm has a shallow shape, the outer size of the electronic circuit package is likely to be larger than the effective inner dimension thereof. Therefore, when this electronic circuit package is mounted on another substrate, an extra space is required and it becomes difficult to perform high-density mounting.

In the package of Japanese Patent Laid-Open No. 1-132147,
Since epoxy resin is used as the insulating layer, heat resistance is insufficient. In addition, since the epoxy resin has a low elongation rate, when deep drawing is performed by pressing or bending is performed so that the radius of curvature is small, cracks occur in the insulating layer and peel off from the metal of the substrate. Such things happened, and the reliability was not sufficient. After all,
Deep drawing is fundamentally impossible in this package, and the outer size is larger than the effective inner size of the package. For this reason, an extra space is required when it is mounted on another substrate, and it is not possible to sufficiently cope with high-density mounting.

In the case of the wiring board disclosed in Japanese Patent Publication No. 1-43473,
Since the conductor layer is formed by an ion engineering method, there is a problem that it requires a special apparatus such as sputtering or vapor deposition and cannot be easily implemented.

Further, the packages and wiring boards described in each of the above publications are handled as individual ones, and work efficiency is high when these packages and wiring boards are mounted on other boards or the like. However, there is a problem that compatibility with existing mounting machines cannot be obtained.

The present invention has been made in view of the above problems. An object of the present invention is a three-dimensional printed circuit board for mounting electronic components, which has heat dissipation properties, electromagnetic shielding properties, and is capable of high-density wiring, and is capable of mounting multiple electronic components. The present invention is to provide a small-sized and highly reliable three-dimensional printed circuit board, which is used for a package or the like, has no wasted space, and can have a narrow lead pitch, and a manufacturing method thereof. Another object of the present invention is to provide a three-dimensional printed circuit board with improved mounting work efficiency.

[0012]

In order to solve the above-mentioned problems, the present inventors used a general copper foil as a conductor layer and bonded it through an insulating layer made of a thermoplastic polyimide having a high elongation rate. Laminating copper foil and metal plate without using an agent,
Furthermore, by stacking multiple layers of copper foil layers via thermoplastic polyimide, performing circuit processing and then bending or drawing, it has excellent heat resistance, electromagnetic shielding and heat dissipation, and a mounting area. We have completed a highly efficient three-dimensional printed circuit board for mounting electronic components. Furthermore, the present inventors can use an existing mounting machine by arranging a plurality of the above-described three-dimensional printed boards continuously on the same frame, and the three-dimensional printed board with good mounting work efficiency. Was completed.

That is, the three-dimensional printed board according to claim 1 (hereinafter referred to as the three-dimensional printed board of the first invention) has a copper foil layer and a metal plate laminated via a first insulating layer and has a circuit processed. In the three-dimensional printed board having a brim portion by performing a bending process or a drawing process on the metal base substrate, the metal base substrate is a plurality of copper foil layers. A second insulating layer that insulates each of the plurality of copper foil layers, and a multilayer structure including the plurality of copper foil layers and the second insulating layer is shown.
At least two layers of the plurality of copper foil layers are electrically connected to each other, and a contact interface of the first insulating layer to the copper foil layer and a contact of the first insulating layer to the metal plate. The interface is made of at least thermoplastic polyimide, the second insulating layer is made of at least thermoplastic polyimide, and the area of the opening formed by the bending or drawing is almost equal to the area of the bottom, and the copper foil is formed. The lead portion, which is a part of the layer and serves as a connection portion with another circuit board, is formed on the collar portion such that the tip of the lead portion is separated from the tip of the collar. In the three-dimensional printed board of the first invention, a plurality of copper foil layers are provided to form a so-called multilayer board structure.

A three-dimensional printed circuit board according to claim 10 (hereinafter,
The three-dimensional printed board of the second invention is a three-dimensional printed board using a metal base substrate in which a copper foil layer and a metal plate are laminated via an insulating layer, and a plurality of them are continuously provided on the same frame. And a plurality of independent circuit pattern groups are formed in the copper foil layer of the metal base substrate corresponding to the frame, and then the metal base substrate is bent or drawn to form a brim portion. And a contact interface of the insulating layer to the copper foil layer and a contact interface of the insulating layer to the metal plate are made of at least thermoplastic polyimide, and an opening formed by the bending process or the drawing process. The area of the bottom portion and the area of the bottom portion are substantially equal to each other, and the lead portion, which is a part of the copper foil layer and serves as the connection portion with another circuit board, has the tip of the lead portion which is the tip of the brim. Wherein the also formed on the flange portion to be separated. In the three-dimensional printed circuit board of the second invention, a plurality of three-dimensional printed circuit boards are continuously provided on the same frame, and at the time of mounting (when mounting electronic components on the three-dimensional printed circuit board, When the electronic circuit package including the three-dimensional printed circuit board is mounted on another circuit board, each three-dimensional printed circuit board is separated from the frame. The three-dimensional printed circuit board of the second invention can have a so-called multi-layered substrate structure having a plurality of copper foil layers, like the three-dimensional printed circuit board of the first invention.

The method of manufacturing a three-dimensional printed circuit board according to the present invention is a first method.
In the method for manufacturing a three-dimensional printed board according to the invention, the step of electrically connecting at least two layers of the plurality of copper foil layers penetrates the insulating layer by laser light from an excimer laser or by etching with an alkaline solution. It comprises a step of forming a hole and then a step of electrically connecting the copper foil layers on both sides of the insulating layer to each other through the through hole.

The present invention will be described in detail below.

In the three-dimensional printed board of the present invention, a metal plate having a thickness of about 0.05 to 2.0 mm is used, preferably aluminum having a thickness of 0.1 to 1.5 mm, nickel silver. And copper alloy such as Shinchu, copper, copper clad invar, stainless steel, iron, iron-nickel alloy, silicon steel, electrolytically oxidized aluminum and the like can be used. If the thickness of the metal plate is less than 0.05 mm, the flatness of the surface will be reduced after the final machining, and the workability of wire bonding will be reduced when mounting electronic components. Further, if the metal plate is thicker than 2.0 mm, there is no problem in simple bending work, but machining becomes difficult when performing deep drawing.

Examples of the thermoplastic polyimide used in the present invention include LARC-TPI, New TPI manufactured by Mitsui Toatsu Chemical, Upimol manufactured by Ube Industries, and Hoechst Made by PIS, Zicef-33 (Sixef-33), GE made Ultem, Amoco made Torlon (Torlo)
There are products such as n). Further, a thermoplastic polyimide obtained by the following reaction between diamine and tetracarboxylic dianhydride can also be used. As a diamine,
For example, 3,3'-diaminobenzophenone, 1,3-bis (3-
Aminophenoxy) benzene, 4,4'-bis (3-aminophenoxy) biphenyl, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) ) Phenyl] -1,1,1,3,3,3-hexafluoropropane, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl]
Examples include meta-position diamines such as ketones and bis [4- (3-aminophenoxy) phenyl] sulfone, which may be used alone or in admixture of two or more. The tetracarboxylic dianhydride, for example, ethylene tetracarboxylic dianhydride, cyclopentane tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic acid Dianhydride, 2,2 ', 3,3'-benzophenone tetracarboxylic dianhydride, 3,3'4,4'-biphenyltetracarboxylic dianhydride, 2,2'3,3'-biphenyltetra Carboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, bis (3,4- Dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-di Carboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 2,3, 6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3, 4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride,
2,3,6,7-anthracene tetracarboxylic acid dianhydride, 1,2,
7,8-phenanthrenetetracarboxylic dianhydride and the like can be mentioned, and these can be used alone or in admixture of two or more. Polyamic acid varnish is obtained by mixing these diamines and tetracarboxylic acid dianhydride in a solution and performing a primary reaction. By further subjecting this to a dehydration condensation reaction, a thermoplastic polyimide is obtained.

The thermoplastic polyimide having an imide structure in the main chain thus obtained has a glass transition temperature (T _g ) of 160 ° C. or higher and 350 ° C. or lower.
The one having an elongation at break of 30% or more as measured by the method defined in (Japanese Industrial Standard) -C2318 is optimally used in the present invention. When the glass transition temperature is 160 ° C. or lower, the reliability against heat at the time of component mounting including the gold (Au) wire bonding step is deteriorated, which is not preferable. On the other hand, the glass transition temperature is 3
When the temperature is 50 ° C. or higher, the adhesive strength between the metal plate and the copper foil decreases, which is not preferable. Further, when the elongation percentage of the thermoplastic polyimide is lower than 30%, peeling between the metal and the polyimide and cracks in the insulating layer are generated when mechanical processing such as bending and drawing is performed, which is not preferable.

In the present invention, a thermoplastic polyimide resin is used as an insulating layer in combination with a thermosetting resin such as epoxyphenol and bismaleimide, and a thermoplastic resin such as polyamideimide, polysulfone, polyparabanic acid and polyphenylene sulfide. Things can also be used. Further, a heat-resistant film, for example, a sheet-shaped product obtained by applying a polyamic acid varnish on both surfaces of polyimide, polyamideimide, aramid, polyetherketone, etc. and heating and imidizing it can also be used as the insulating layer. Further, a film-like product obtained by casting or coating and drying a thermoplastic polyimide varnish similar to the film forming method can also be used as the insulating layer. Furthermore, the insulating layer may be formed by applying the above-mentioned polyimide acid varnish or thermoplastic polyimide on the back surface of the metal plate and / or copper foil to be used, heating and drying and laminating.

For the purpose of further improving heat dissipation, an inorganic filler may be added to the insulating layer within a range that does not impair the machinability such as bending and drawing. As an inorganic filler,
Examples thereof include alumina, silica, silicon carbide, aluminum nitride, boron nitride and the like.

As the copper foil, commercially available electrolytic copper foil, rolled copper foil and the like, which are relatively inexpensive and easily available, are used.

As a method for joining the metal plate, the insulating layer and the copper foil layer to each other, there are a hot roll method, a hot press method and the like. In particular, in the three-dimensional printed board of the first invention, the copper foil layer and the insulating layer have a multi-layered structure. As a method for forming such a multi-layered structure, there is, for example, a build-up method or a laminating method. The build-up method is a method of sequentially laminating an insulating layer and a copper foil layer on a metal plate. On the other hand, the laminating method is a structure in which a sheet in which only an insulating layer and a copper foil layer are laminated is formed, and the copper foil layer is exposed on both sides of the sheet, and the sheet is a metal plate through an insulating layer different from the sheet. It is a method of joining to. With these methods, a multilayer structure is realized.

Further, in the three-dimensional printed board of the second invention, when a long frame is used, a continuous heat roll method can be used for connecting the metal plate, the insulating layer and the copper foil layer to each other. . When the frame is short, a batch hot pressing method or the like can be used.

As a circuit processing method, a general method for forming a circuit pattern on a printed wiring board can be used as it is. After circuit processing, if necessary,
Ni-Au plating is performed for protection of the copper foil layer surface or wire bonding used when mounting electronic components,
You may plate soldering etc. to the lead part used as a connection part with other boards. In the case where a long frame is used in the three-dimensional printed board of the second invention, etching resist ink is continuously applied or a dry film is attached and pattern exposure is sequentially performed, followed by development, etching,
Patterning can be performed through peeling.

In the method for manufacturing a three-dimensional printed board of the present invention, the through holes for interlayer connection are formed by laser light from an excimer laser or etching with an alkaline solution. In the case of an excimer laser, by adjusting the laser power, it is possible to accurately form a through hole having a sharp shape without eroding the portion of the copper foil layer which is not desired to be removed. Even when an alkaline solution is used, a sharp through hole can be obtained without eroding the copper foil layer.

As an example of the excimer laser, for example, Kr
Some are / F type. Examples of the alkaline solution include alcoholic solutions of potassium hydroxide, sodium hydroxide and the like, and a hydrazine compound may be added to the alcoholic solution, if necessary.

As a method for electrically connecting the copper foil layers through the through holes, plating, solder, conductive paste, etc., which are generally used in the conventional method for manufacturing a printed wiring board, can be used. It is also possible to connect by wire bonding.

The drawing and bending machining in the present invention can be carried out by press working using a normal die. In order to protect the conductor portion of the three-dimensional printed board during drawing, a resin coating may be applied to the surface of the mold, or a concave shape may be provided in the mold according to the shape of the pattern. In the present invention, since the insulating layer having an elongation of 30% or more is provided, even in deep drawing and bending with a small radius of curvature, processing is performed by applying heat, or the insulating layer is swollen with a solvent or the like. It does not require processing such as.

The machining of the three-dimensional printed board according to the second aspect of the invention can be carried out by progressive type press working using a die. After forming the lance at a place other than the pattern formation part of the frame, then drawing the pattern surface (the part that will be the bottom surface of the three-dimensional printed circuit board) and bending the collar part (lead part), then performing the mounting work. Holes for transport and reference are formed. These are performed in a continuous process so that each three-dimensional printed circuit board is connected to the frame at the ends of four corners.

What is important for machining in the present invention is that
The shape after processing is that the leading end of the lead portion is formed so as to be separated from the end portion of the collar by 50 μm or more in the collar portion formed on the peripheral edge of the opening surface of the three-dimensional printing substrate. Here, the lead part is a part of the copper foil layer and extends to the brim part for the purpose of connection with another circuit board. When the tip of the lead part and the end part of the brim are within 50 μm, when the three-dimensional printed board is mounted on another board, a short circuit occurs between the lead part and the metal plate on the back surface due to the wraparound of the solder. It becomes easy and not preferable.

The shape of the collar portion can be selected as appropriate, but is preferably U-shaped for ease of processing. When the shape of the brim is U-shaped, the inner radius of curvature is 0.1 to 5.0 mm in order to improve connection reliability and prevent damage to the insulating layer and wiring conductor (copper foil). It is desirable to process as follows. In the examples described later, this radius of curvature was set to 1.0 mm. For the same reason,
Regarding the corner portion forming the bottom portion of the three-dimensional printed board, it is desirable that the inside radius of curvature be 0.1 to 10 mm. In the examples described later, this radius of curvature was set to 1.0 mm.

In the three-dimensional printed circuit board of the present invention, the heating element mounting area where the copper foil layer or the metal plate is exposed is formed on the circuit pattern surface obtained by processing the circuit of the metal base board. You can in this case,
The metal base substrate does not have to have a so-called multilayer substrate structure, and may have a structure in which only one copper foil layer is provided. In the heating element mounting area, the metal surface where heat transfer is performed better than the insulating layer is exposed, so by directly bonding an electronic component (power element) with a large amount of heat generation such as a power transistor to this The heat dissipation operation from the power element can be efficiently performed.

In the three-dimensional printed board of the present invention, the copper foil layer and the insulating layer may extend outside the opening while maintaining the laminated state. In this case, the metal base substrate does not need to have a so-called multi-layer substrate structure, and the copper foil layer is
A structure in which only layers are provided may be used. The portion extending outside the opening is in the shape of a flat cable and can be used for connection with another printed board or circuit board. You may attach a connector to the front-end | tip part of the extended part. According to this structure, since the flat cable is directly pulled out from the three-dimensional printed board, work such as connection with another circuit board is facilitated and the number of required connectors is reduced.

The electronic circuit package of the present invention is one in which electronic components are mounted on the above-described three-dimensional printed board of the present invention. In this electronic circuit package, if necessary,
The electronic component mounting surface can be resin-sealed. As the organic resin for sealing, silicon resin, epoxy resin, bismaleimide resin or the like can be used alone or in combination. In order to adjust the linear expansion coefficient by heat, an inorganic filler may be mixed with the sealing resin and used. Also,
As a sealing method, injection, potting, transfer molding, press molding or the like can be appropriately used.

[0036]

The three-dimensional printed circuit board of the first invention has a multi-layer structure and the metal plate is arranged on the back side, so that high-density component mounting is possible, and the heat dissipation and electromagnetic shielding properties are high. is doing. Since this three-dimensional printed board has a deep drawing structure, the area required when it is mounted on another board can be reduced. In addition, since the inner lead portion (wiring conductor) formed in the bottom surface of the three-dimensional printed board can be arranged near the electronic component to be mounted, the bonding wire can be shortened when mounting the electronic component. As a result, it is possible to reduce the size and speed of the package as compared with a lead frame or the like used in a conventional chip carrier.
Further, since the lead portion used for connection with another substrate is formed on the metal plate via the insulating layer,
Even if the pitch of the outer leads is narrowed, there is no problem in strength.

Since the three-dimensional printed circuit board of the second invention has a structure in which a plurality of three-dimensional printed circuit boards are continuously provided on the same frame, it is possible to carry out the mounting using the existing mounting machine and to carry out the mounting work. Efficiency improves.

[0038]

Embodiments of the present invention will now be described with reference to the drawings.

A stereoscopic printed circuit board according to an embodiment of the present invention is shown in FIG.
It is shown in (a) and (b). This three-dimensional printed circuit board 100 is
It has two layers of circuit-processed copper foil layers (wiring conductors). After forming a circuit pattern of a multilayer structure on the metal plate 101 by the first insulating layer 102, the first wiring conductor 103, the second insulating layer 104, and the second wiring conductor 105, bending or drawing is performed. Opening surface 18 by processing
The three-dimensional printed circuit board 100 is processed into a box shape having 0. A brim portion 107 used for a connection portion with another wiring board is formed on the periphery of the opening surface 180. In the collar portion 107, the first insulating layer 102 and the first wiring conductor 1
Only 03 is laminated on the metal plate 101. Collar 1
In 07, the first wiring conductor 103 has a plurality of parallel wiring patterns 110, the wiring patterns 110 extend in the direction from the center of the three-dimensional printed board 100 toward the peripheral edge, and the tip 110A thereof is the tip of the brim. 107A to 5
It is formed up to a distance of 0 μm or more. First insulating layer 1
02 is provided on the entire surface of the metal plate 101 on the opening surface 180 side.

First wiring conductor 103 and second wiring conductor 1
05 are electrically connected to each other by the plated portion 108. That is, in the connection portion between the first wiring conductor 103 and the second wiring conductor 105, the second insulating layer 104 is removed and the plated portion 108 is formed in that portion. A method of forming a circuit having a multi-layered structure including the insulating layers 102 and 104 and the conductor layers 103 and 105 will be described later. Here, a copper plate having a thickness of 0.2 mm was used as the metal plate 101. Each of the insulating layers 102 and 104 has a LARK- made by Mitsui Toatsu Chemicals, Inc.
Of TPI, elongation is 30%, glass transition temperature is 18
A thermoplastic polyimide having a temperature of 0 ° C. was used. Insulating layer 10
The thickness of 2,104 was 15 μm each. Wiring conductor 103,
As 105, a rolled copper foil having a thickness of 18 μm was used. Here, the elongation is JIS (Japanese Industrial Standard) -C23.
It is represented by the elongation at break measured by the method specified in 18.

Next, mounting an electronic component on the three-dimensional printed board 100 to form an electronic circuit package will be described.

The electronic circuit package 13 shown in FIG.
0 is the one in which the chip component 120 and the bare chip 121 are mounted on the above-described three-dimensional printed board 100. The chip component 120 is of a surface mounting type, and a lead terminal 122 extends substantially horizontally from the bottom.
2 is soldered to the surface of the second wiring conductor 105. On the other hand, the bare chip 121 has the bonding wire 1
It is connected to the second wiring board 105 by 23.
Recently, there are some resistors, capacitors, diodes, transistors, etc., in which the outer peripheral portion of the package is directly used as a terminal portion without providing a lead terminal. When mounting such an electronic component, the electronic component is arranged at a desired position on the three-dimensional printed board 100, and the terminal portion on the outer periphery of the package and the wiring conductor of the three-dimensional printed board 100 are directly soldered. do it. In this electronic circuit package 130, since the mounting board, which is the three-dimensional printed board 100, has a multi-layered structure, the wiring density can be increased, and high-density mounting is possible.

Next, a method of mounting the electronic circuit package 130 on the wiring board 140 will be described. The wiring board 140 here is a board on which the electronic circuit package 130 of this embodiment, a hybrid IC, an LSI, and other electronic components are mounted. A wiring conductor 141, which is a circuit pattern, is previously formed on the surface of the wiring board 140.

As shown in FIGS. 2B and 2C, in the electronic circuit package 130, the wiring conductor 14 on the wiring board 140 is arranged so that its opening surface faces the wiring board 140.
1 and the wiring pattern 1 formed on the brim 107.
10 is soldered to the wiring board 140.
Will be implemented in. That is, the wiring pattern 110 and the wiring conductor 141 are joined via the solder portion 181.
Wiring conductor 141 and wiring pattern 110 on flange 107
For connection with the wiring conductor 141, solder cream is applied to the surface of the wiring conductor 141, and then the wiring pattern 110 is formed on the wiring conductor 141.
The electronic circuit package 130 may be placed on the wiring board 140 so as to face No. 1 and heated by using a normal reflow furnace. In order to enhance the electromagnetic shield effect, it is desirable that no gap be created between the flange 107 and the wiring board 140.

Next, the manufacturing process of the three-dimensional printed board 100 will be described. The three-dimensional printed board 100 is provided with first and second insulating layers 102 and 104 and first and second wiring conductors 103 and 105, and then these insulating layers 10 and 10 are provided.
2, 104, wiring conductors 103, 105 and metal plate 10
It is manufactured by bending or drawing 1 to obtain a desired shape. Circuit formation has already been completed before bending or drawing. First, each insulating layer 102, 104 and each wiring conductor 103, 105
A method of forming a circuit pattern having a multi-layered structure will be described. First, the build-up method will be described with reference to FIG.

The build-up method is a method in which an insulating layer and a wiring conductor made of a copper foil are laminated one by one, the number of which is equal to the number of layers of the wiring conductor, and the layers are sequentially laminated and joined on a metal plate. In this case, the first insulating layer 10 is formed on the metal plate 101.
Prepared is one in which 2 and the first wiring conductor 103 are joined. The first wiring conductor 103 is formed into a circuit by a known method and has a circuit pattern. Then, as shown in (a), the one prepared by joining the second insulating layer 104 and the second wiring conductor 105 is prepared, or as shown in (b) or (c), The thing which the copper foil layer 151 was joined is prepared. Here, the copper foil layer 151 is in a state before the circuit processing of the second wiring conductor 105 is performed.
Is provided on the entire upper surface of the insulating layer 104. The second wiring conductor 105 shown in (a) has already been subjected to circuit processing. The difference between (b) and (c) is that a hole 152 penetrating the second insulating layer 104 and the copper foil layer 151 is formed at a position where the first and second wiring conductors 103 and 105 should be connected to each other. Is provided [in the case of (c)] or not provided [in the case of (b)]. Also in the case of (a), a hole 152 is provided at the position of interconnection between the wiring conductors 103 and 105.

From the state shown in FIG. 3A, the metal plate 101 side is joined to the second insulating layer 104 side by hot pressing to obtain the state shown in FIG. 3G, that is, the first and second states. Although the wiring conductors 103, 105 are laminated, but no interlayer connection is obtained. The hot pressing is performed under an inert gas atmosphere or under vacuum at a temperature of 200 ° C. A hole 152 has already been opened at the position of the interlayer connection,
Since the first wiring conductor 103 is exposed at the bottom of the hole 152, an interlayer connection is made by filling the hole 152 with the conductive paste 153 and drying and solidifying.
(h). This operation may be repeated in the case of a multilayer structure. Alternatively, the holes 152 may be filled with solder paste and reflow heated to form a solder layer.

From the state shown in FIG. 3B, the metal plate 101 is heated under an inert gas atmosphere or in a vacuum at a temperature of 200 ° C.
By bonding the second insulating layer 104 side to the side of the second insulating layer 104 by hot pressing, the state shown in (d), that is, the second insulating layer 104 and the copper foil layer 151 are provided on the first wiring conductor 103. A laminated product is obtained. Here, the copper foil layer 15
The second wiring conductor 105 is formed by processing the circuit of the first wiring conductor 105.
(F). In this state, the hole for interlayer connection is not opened in the second insulating layer 104. Therefore, a hole 152 is formed in the second insulating layer 104 at the position of interlayer connection. As a result, the above-mentioned (g) is obtained, and thereafter the interlayer connection may be completed in the same manner.

From the state of FIG. 3C, the metal plate 101 side is joined to the second insulating layer 104 side by hot pressing in an inert gas atmosphere or vacuum at a temperature of 200 ° C. By doing so, the state shown in FIG. 2E, that is, the first wiring conductor 103 on which the second insulating layer 104 and the copper foil layer 151 are sequentially laminated is obtained. At this time, the hole 152 is already opened at the position of the interlayer connection. Then, by processing the circuit on the copper foil layer 151,
It becomes (g), and thereafter, the interlayer connection may be completed in the same manner.

When plating is performed from the state (e), the hole 1
52 is also plated, and the hole 152 has a plated layer 1
It is filled with 54 (i). Thereby, the first conductor wiring 1
03 and the copper foil layer 151 are electrically connected. After that, the circuit processing of the copper foil layer 151 is performed and the second wiring conductor 1 is formed.
No. 05 is formed, the first and second wiring conductors 103, 1
Reference numeral 05 indicates a state in which the plating portion 108 connects the layers.
(j). The above state (e) can also be reached from the state (d) by making a hole 152 in the copper foil layer 151 and the second insulating layer 103 at the position of interlayer connection, and the multilayer structure can be obtained by this route. It is also possible to do so.

Next, the bonding method will be described with reference to FIG. First, on both surfaces of the second insulating layer 104, the first
Then, the second copper foil layers 161 and 162 are formed (a). Subsequently, a hole 163 is formed at a position where interlayer connection is to be made so as to penetrate each of the copper foil layers 161, 162 and the second insulating layer 104 (b). Then, the hole 163 is subjected to through-hole plating, and a plating layer 164 is formed on the side wall surface of the hole 163 so as to short-circuit both the copper foil layers 161 and 162 (c). Circuit processing is performed on each of the copper foil layers 161, 162 to form the first and second wiring conductors 103, 105 (d). Then, hot pressing is performed in an inert gas atmosphere or vacuum under the condition of 200 ° C. to bond the metal plate 101 and the second insulating layer 104 side with the first insulating layer 102 interposed therebetween. This completes the multilayer structure (e). The interlayer connection in this case is formed by through-hole plating.

The method of forming a circuit having a multilayer structure has been described above. In each of the forming methods described here, it is essential to make a hole in the insulating layer or the copper foil layer. As a method for making holes, there is a conventional method of machining using a drill, but when drilling is performed after stacking, the drill will damage the lower layer wiring conductor. For example, in the example shown in FIG. 3, when a hole is drilled from the state (f) to the state (g) with a drill, the first wiring conductor 1 in the lower portion of the hole 152 is
03 is also unavoidably shaved, and as a result, good interlayer insulation may not be achieved.

Therefore, as a method for making holes, there are a method of using laser light from an excimer laser and a method of etching an insulating layer with an alkaline solution. As an excimer laser, for example, a Kr / F system (oscillation wavelength 248 nm, 486 n
m) etc. When the excimer laser is used, the polyimide used as the insulating layer can be punched in a good shape. Further, when holes are punched in a sandwich structure of a copper foil layer, an insulating layer, and a copper foil layer by controlling the laser power, a good hole is formed in one of the copper foil layer and the insulating layer. It is also possible to adjust so that no holes or recesses are formed in the other copper foil layer.

In the present invention, since a polyimide material is used as the insulating layer, it is possible to carry out etching with an alkaline solution. When drilling by etching,
It is efficient because it is possible to drill multiple holes at the same time. A resist layer or the like may be provided on the surface of the insulating layer that is exposed and does not require etching, prior to etching. In this alkaline etching, the wiring conductor formed of the copper foil layer or the copper foil is not etched, so
It is possible to perforate only the insulating layer. An etching solution having a known composition, that is, an alcohol solution such as potassium hydroxide or sodium hydroxide can be used. If necessary, a hydrazine compound may be added to this for use.

After constructing the multilayer substrate on which the circuit processing has been performed in this manner, mechanical processing such as bending and drawing is performed to obtain a desired shape, and the three-dimensional printed board 100 is completed.
Next, machining will be described.

In this embodiment, machining is performed by press working using a normal die. At this time, it is not necessary to apply heat or swell the insulating layers 102 and 104 with a solvent. Three-dimensional printed circuit board 1 by deep drawing
The area of the bottom surface of 00 is almost equal to the area of the opening. The radius of curvature inside the corner portion, which corresponds to the peripheral portion of the bottom of the three-dimensional printed circuit board 100, is 1.0 m.
m. Also, the shape of the brim 107 is U-shaped,
The inner radius of curvature of the U-shaped portion was set to 1.0 mm.

Further, in this machining, the surface accuracy of the opening surface, that is, each of the collar portions 1 on the four sides of the three-dimensional printed board 100.
The height difference of 07 is set to 0.5 mm or less so that the connection with the wiring board 140 is surely made. Further, the circuit pattern surface formed on the bottom has a surface accuracy, that is, a difference in height of unevenness of 0.5 mm or less, so that high-density mounting of electronic components can be realized. It is easy for those skilled in the art to perform bending or drawing with the surface accuracy of the degree described here.

Next, another embodiment of the three-dimensional printed board of the present invention will be described.

In the three-dimensional printed board 100A shown in FIG. 5, interlayer connection is performed by a wire bonding method instead of plating. A through hole 152 is formed in the second insulating layer 104, and the first wiring conductor 10 is formed at the bottom of the hole 153.
3 is exposed. The second wiring conductor 105 has the hole 1
The first and second wiring conductors 103 and 105 are patterned so as to surround the periphery of 52.
They are connected to each other by bonding wires 170 passing through the holes 152. When using a bonding wire, the wire bonding work should be performed after the machining.

In the above-mentioned ones shown in FIGS. 1 (a), 1 (b) to 5, the wiring conductor extending to the collar portion 107 is the first conductor.
Wiring conductor 103, that is, the one closest to the metal plate 101. However, the wiring conductor extending to the brim 107 is not limited to this. 3D printed circuit board 101 shown in FIG.
In B, the second wiring conductor 105, that is, the wiring conductor on the upper layer side extends to the collar portion 107. When a multilayer structure is formed by the above-mentioned laminating method, the first and second wiring conductors 103 and 105 are formed on both sides of the second insulating layer 104 by circuit processing, as shown in FIG. In order to expose the first wiring conductor 103 in the collar portion 107, the step of removing the second insulating layer 104 is essential. On the other hand, since the uppermost wiring conductor (here, the second wiring conductor 105) is exposed,
When this wiring conductor is extended to the brim 107, the step of removing the insulating layer is unnecessary.

In the three-dimensional printed board 100C shown in FIG. 7A, the insulating layers 102 and 104 and the wiring conductors 103 and 10 are formed in a part of the bottom (exposed portion 109) of the three-dimensional printed board.
5 is removed, and the metal plate 101 is exposed. Metal plate 1
In order to expose 01, the insulating layers 102, 104 are laminated on the metal plate 101 and then removed by etching, or the insulating layers 102, 104 in which the portions corresponding to the exposed portions 109 are initially openings are formed. There is a method of joining to the metal plate 101. The three-dimensional printed circuit board 100C is suitable when a power element that generates a relatively large amount of heat is mounted and good heat dissipation characteristics are required. As shown in FIG. 7B, the power element 121A is directly mounted on the metal plate 101 in the exposed portion 109 using solder, silver paste, or the like.

FIG. 7 (c) shows a three-dimensional printed circuit board having only one wiring conductor (copper foil layer), in which the metal plate is exposed at a part of its bottom. ing.
A copper foil and a metal plate 301 are joined together via an insulating layer, and a circuit pattern is formed by processing the circuit by the insulating layer 302 and a wiring conductor (copper foil layer) 303, and then bending is performed together with the metal plate 301. Alternatively, it is processed into a box-like shape having an opening surface (upper side in the drawing) by drawing processing to form a three-dimensional printed board. As the insulating layer 302, thermoplastic polyimide is used. A brim portion 305, which is a connection portion with another printed board, is formed on the periphery of the opening surface.
The circuit pattern is formed by the wiring conductor 303 by selectively removing the copper foil by an ordinary etching method. In the case shown here, the wiring conductor 303 is formed.
The insulating layer 302 in the substantially central portion where the metal is not formed is also removed by etching to form an insulating layer removal region (heating element mounting region) 304 where the metal plate 301 is exposed on the circuit pattern surface. In the insulating layer removal region 304, a power element is mounted as in the case shown in FIG. 7B.

In the three-dimensional printed board 100D shown in FIG. 8A, the first and second insulating layers 102 and 105 and the first wiring conductor 104 are arranged on the main body of the three-dimensional printed board, that is, from the periphery of the metal plate 101. The structure extends to the outside. The portion extending from the peripheral edge of the metal plate 101 constitutes the flat cable 190. As shown in FIG. 8B, the connector 19 is attached to the tip of the flat cable 190.
By mounting No. 1, it is possible to electrically connect the three-dimensional printed circuit board 100C to another printed circuit board via the connector 191. Note that in FIG. 8A, the bare chip 121B is arranged at a portion where the second insulating layer 104 is removed to expose the first wiring conductor 103, and is directly mounted on the first wiring conductor 103. There is. By mounting the bare chip 121B in this way, compared with the one shown in FIG. 1B, the heat dissipation characteristics from the bare chip 121B are improved due to the absence of the second insulating layer 104.

FIG. 8 (c) shows a three-dimensional printed board provided with only one wiring conductor (copper foil layer), in which a copper foil layer 303 and an insulating layer 302 processed into a circuit pattern are opened. A configuration is shown extending outwardly from the periphery of the section. A brim portion 305, which is a connection portion with another printed board, is provided on the periphery of the opening portion. Further, the extending portion is used as a flat cable 306 for connection with other circuits.

In FIG. 9, a plurality of three-dimensional printed circuit boards 200 are continuously provided on the same frame 201. The structure of each three-dimensional printed circuit board 200 is the same as that of the three-dimensional printed circuit board 100 in the above-mentioned embodiment. Each three-dimensional printed circuit board 200 is formed with respect to the frame 201 so as to be connected to the frame 201 at four corner portions 202 on the side of the flange portion 207. Frame 2
Reference numeral 01 is equivalent to the metal base substrate having the multilayer structure in each of the above-mentioned embodiments, and has a circuit pattern formed therein. Further, pin insertion holes 210 are formed at both ends of the frame 201 in the width direction so as to correspond to the three-dimensional printed circuit boards 200. The pin insertion hole 210 is formed on the three-dimensional printed board 200.
It is used for positioning when mounting electronic components on.

A three-dimensional printed circuit board 200 is sequentially formed by sequentially performing lance formation, drawing, and bending on the flat plate-shaped frame 201 using a progressive feed type die. By configuring the three-dimensional printed board 200 in this way, compared to the case of a single three-dimensional printed board, it is possible to mount electronic components on the three-dimensional printed board more efficiently, and a normal mounting machine is used. Can be implemented.

Next, with respect to the electronic circuit package using the three-dimensional printed board of the present embodiment, an example in which the mounted electronic parts are resin-sealed will be described. Here, Fig. 1 (a), (b)
The three-dimensional printed circuit board 100 shown in FIG.

In FIG. 10A, the bonding wire 12 is most likely to suffer a failure such as deterioration of conductivity due to oxidation.
Only the portion 3 is sealed with the sealing resin 171 by the potting method.

In the structure shown in FIG. 10B, the entire electronic circuit housed in the electronic circuit package is resin-encapsulated with the encapsulating organic resin 172 by an injection method or a transfer molding method. Therefore, the wiring conductors 103 and 105 except the collar portion 107 are also covered with the organic sealing resin 172.

In the structure shown in FIG. 10 (c), the portion of the bonding wire 123 that is weak in strength is resin-sealed by the potting method using the first sealing resin 171 which has a small shrinkage upon curing. , Then, for other parts, by injection method or transfer molding method,
The second sealing organic resin 174 having excellent weather resistance is used for resin sealing. As a result, the entire electronic circuit housed in the electronic circuit package is resin-sealed. By using a resin having a small curing shrinkage amount for the bonding wire 123, it is possible to prevent disconnection of the bonding wire 123 due to shrinkage at the time of sealing.

By encapsulating these resins, it is possible to prevent the deterioration of the conductivity at the portion where the electrical connection is made, and it is possible to prevent the deterioration of the conductivity for a long period of time when used under severe conditions such as high temperature and high humidity. The reliability can be secured.

Although the embodiments of the present invention have been described above focusing on the case where the number of wiring conductor layers (copper foil layers) is two, the present invention is not limited to this. It is also possible to have a structure in which three layers or more of copper foil are laminated. Further, the shape of the three-dimensional printed board is not limited to the shape of a substantially hexahedron, and may be, for example, a cylindrical shape.

[0073]

As described above, according to the present invention, the three-dimensional printed circuit board is formed in a multi-layer structure, and the metal plate is arranged on the back side, so that high-density component mounting is possible. In addition, there is an effect that the heat radiation property and the electromagnetic shielding property become excellent. Since the thermoplastic polyimide having a large elongation rate is used as the insulating layer, it becomes possible to stably perform the bending process and the drawing process having a small radius of curvature, and the three-dimensional printing of the present invention on another substrate. The area for mounting the substrate can be reduced. In addition, since the inner leads formed in the electronic component mounting surface can be placed up to the position closest to the electronic component, the bonding wire can be shortened, and compared with the lead frame or the like conventionally used as a chip carrier, the package form Miniaturization and high speed operation can also be achieved. Further, since the lead portion used for connection with another substrate is provided on the metal plate via the insulating layer, there is an effect that strength can sufficiently be coped with even if the pitch is narrowed.

By arranging a plurality of three-dimensional printed boards in series on the same frame, it is possible to mount using an existing mounting machine, and there is an effect that the mounting work efficiency is improved.

[Brief description of drawings]

1A and 1B are a cross-sectional view and a perspective view, respectively, showing the configuration of a stereoscopic printed circuit board according to an embodiment of the present invention.

FIG. 2A is a schematic cross-sectional view showing the configuration of an electronic circuit package obtained by mounting electronic components on the three-dimensional printed circuit board of FIGS. 1A and 1B, and FIGS. FIG. 3 is a perspective view and a sectional view showing a state in which the electronic circuit package of FIG. 2 (a) is mounted on a wiring board.

FIG. 3 is a diagram illustrating a manufacturing process of a stereoscopic printed circuit board by a build-up method.

FIG. 4 is a diagram illustrating a manufacturing process of a three-dimensional printed circuit board by a bonding method.

FIG. 5 is a schematic cross-sectional view showing an example in which layers are connected by wire bonding.

FIG. 6 is a schematic cross-sectional view showing another example in which interlayer connection is performed by plating.

7A is a schematic cross-sectional view showing an example in which an insulating layer at a place where electronic parts are mounted is removed, and FIG. 7B is a schematic cross-sectional view.
(a) A schematic cross-sectional view showing an example in which an electronic component is mounted on a three-dimensional printed circuit board, (c) is a schematic cross-sectional view showing another example in which the insulating layer at the place where the electronic component is mounted is removed. Is.

FIG. 8A is a schematic cross-sectional view showing an example in which a flat cable is extended to connect to another substrate, and FIG. 8B shows a state in which a connector is attached to the tip of the flat cable portion. FIG. 3 is a perspective view, and FIG. 6C is a schematic cross-sectional view showing another example in which a flat cable is extended for connection with another substrate.

FIG. 9 is a plan view showing an example in which a plurality of three-dimensional printed circuit boards are continuously arranged on the same frame.

10A to 10C are schematic cross-sectional views showing the configuration of an electronic circuit package sealed with an organic resin.

[Explanation of symbols]

100, 100A to 100D, 200 Three-dimensional printing substrate 101 Metal plate 102 First insulating layer 103 First wiring conductor 104 Second insulating layer 105 Second wiring conductor 107, 207 Flange portion 108 Plated portion 120 Chip component 121 Bare chip 130 Electronic Circuit Package 140 Wiring Board 201 Frame

 ─────────────────────────────────────────────────── ─── Continuation of the front page (31) Priority claim number Japanese Patent Application No. 4-145620 (32) Priority date Hei 4 (1992) June 5 (33) Country of priority claim Japan (JP) (72) Inventor Kyoichi Ishigaki 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Hoshino ▲ Tatsumi 1190, Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Takashi Kayama 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Takayuki Ishikawa 1190, Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Yoshikazu Oishi Sakae, Yokohama-shi, Kanagawa Mitsui Toatsu Chemical Co., Ltd. 1190 Kasama-cho, Mitsui (72) Inventor Seiichi Takahashi 1190 Kasama-cho Sakae-ku, Yokohama, Kanagawa Mitsui Toatsu Chemical Co., Ltd.

Claims (24)

[Claims] 1. A metal base substrate, in which a copper foil layer and a metal plate are laminated via a first insulating layer and on which a circuit process is performed, is used, and the metal base substrate is bent or drawn. The metal base substrate has a plurality of copper foil layers and a second insulating layer that insulates each of the plurality of copper foil layers. The multilayer structure which consists of a copper foil layer and the said 2nd insulating layer is shown, At least 2 layer of these copper foil layers are mutually electrically connected, The said copper foil layer of the said 1st insulating layer And a contact interface between the first insulating layer and the metal plate are made of at least thermoplastic polyimide, the second insulating layer is made of at least thermoplastic polyimide, and are formed by the bending process or the drawing process. The area of the opening and the area of the bottom surface are substantially equal, and the lead portion that is a part of the copper foil layer and serves as a connection portion with another circuit board is separated from the tip of the lead by the tip of the lead portion. A three-dimensional printed circuit board, characterized in that it is formed on the brim. 2. The three-dimensional printed board according to claim 1, wherein the leading end of the lead portion is formed at a distance of 50 μm or more from the end portion of the collar. 3. The first and second insulating layers are composed of a thermoplastic polyimide having an elongation of 30% or more and a glass transition temperature of 160 ° C. or more and 350 ° C. or less. The three-dimensional printed circuit board according to. 4. The collar portion having the lead portion is substantially U-shaped, and an inner radius of curvature thereof is 0.1 mm or more and 5.0 mm or less. 3D printed circuit board. 5. The three-dimensional printed board according to claim 1, wherein a radius of curvature inside a corner forming a bottom portion of the three-dimensional printed board is 0.1 mm or more and 10.0 mm or less. 6. A metal base substrate provided with a circuit pattern composed of an insulating layer and a copper foil layer is formed into a shape having a brim portion to be a connection portion with another circuit substrate at the periphery of an opening by bending or drawing. And a heating element mounting region in which the copper foil layer or the metal plate is exposed is formed on a circuit pattern surface obtained by processing a circuit of the metal base substrate. 3D printed circuit board. 7. The heating element mounting area in which the copper foil layer or the metal plate is exposed is formed on the circuit pattern surface obtained by processing the circuit of the metal base substrate. The three-dimensional printed circuit board according to. 8. A metal base substrate provided with a circuit pattern consisting of an insulating layer and a copper foil layer is formed into a shape having a brim portion to be a connection portion with another circuit substrate at the periphery of an opening by bending or drawing. A three-dimensional printed board, wherein the copper foil layer and the insulating layer forming the circuit pattern extend outside the opening. 9. The method according to claim 1, wherein at least one of the first and second insulating layers and the circuit-processed copper foil layer extend outside the opening while maintaining a laminated state. The three-dimensional printed circuit board according to item. 10. A three-dimensional printed circuit board using a metal base substrate, in which a copper foil layer and a metal plate are laminated with an insulating layer interposed therebetween, a plurality of which are consecutively provided on the same frame, and which are connected to the frame. A plurality of independent circuit pattern groups are formed in the copper foil layer for the corresponding metal base substrate, and then the metal base substrate is formed into a shape having a brim portion by bending or drawing. The contact interface of the insulating layer to the copper foil layer and the contact interface of the insulating layer to the metal plate are made of at least thermoplastic polyimide, and the area of the opening and the area of the bottom surface formed by the bending or drawing. Are substantially equal to each other, and the lead portion which is a part of the copper foil layer and serves as a connection site with another circuit board is separated from the tip of the brim. 3D print substrate, characterized in that it is formed on the serial flange portion. 11. A three-dimensional printed circuit board using a metal base substrate in which a copper foil layer and a metal plate are laminated via a first insulating layer, wherein a plurality of three-dimensional printed circuit boards are continuously arranged on the same frame, and Forming a plurality of independent circuit pattern groups on the copper base layer corresponding to the metal base substrate corresponding to the frame, and then performing a bending process or a drawing process on the metal base substrate to provide a shape with a collar portion. The metal base substrate has a plurality of copper foil layers and a second insulating layer that insulates each of the plurality of copper foil layers, and includes the plurality of copper foil layers and the second insulating layer. A multilayer structure, wherein at least two layers of the plurality of copper foil layers are electrically connected to each other, a contact interface of the first insulating layer to the copper foil layer, and the first insulating layer of the first insulating layer. At least the contact interface with the metal plate Made of a thermoplastic polyimide, the second insulating layer is made of at least a thermoplastic polyimide, and the area of the opening and the area of the bottom formed by the bending or drawing are substantially equal to each other, and a part of the copper foil layer The three-dimensional printed circuit board is characterized in that a lead portion serving as a connection portion with another circuit board is formed on the collar portion such that a tip of the lead portion is separated from a tip of the collar. 12. The three-dimensional printed board according to claim 10, wherein the leading end of the lead portion is formed at a distance of 50 μm or more from the end portion of the collar. 13. The three-dimensional printed board according to claim 10, wherein the insulating layer is made of a thermoplastic polyimide having an elongation of 30% or more and a glass transition temperature of 160 ° C. or higher and 350 ° C. or lower. . 14. The three-dimensional printed board according to claim 10, wherein a plurality of pin insertion holes are provided at both ends in the width direction of the frame. 15. The three-dimensional printed circuit board according to claim 10, wherein the metal plate is made of copper or a copper alloy. 16. The three-dimensional printed board according to claim 10, wherein the metal plate is made of an iron-nickel alloy. 17. The method according to any one of claims 1 to 5, 7, and 9.
The method for manufacturing a three-dimensional printed board according to the item, wherein the step of electrically connecting at least two layers of the plurality of copper foil layers includes the step of forming a through hole in the insulating layer with laser light from an excimer laser. And then electrically connecting the copper foil layers on both sides of the insulating layer to each other through the through holes. 18. A method according to any one of claims 1 to 5, 7, and 9.
The method for manufacturing a three-dimensional printed board according to item 1, wherein the step of electrically connecting at least two layers of the plurality of copper foil layers includes the step of forming a through hole in the insulating layer by etching with an alkaline solution, And a step of electrically connecting copper foil layers on both sides of the insulating layer to each other through the through holes. 19. An electronic circuit package in which an electronic component is mounted on the three-dimensional printed board according to claim 1. 20. An electronic circuit package configured by using the stereoscopic printed board according to claim 6 or 7, wherein an electronic component is directly bonded to a heating element mounting region. 21. The three-dimensional printed board according to claim 1, and an electronic component mounted on the three-dimensional printed board, wherein the electronic component is resin-sealed with a sealing organic resin. Electronic circuit package. 22. The electronic component is at least a bare chip, the bare chip is electrically connected to a three-dimensional printed circuit board by a bonding wire, and only the bare chip and the bonding wire portion are made of an organic resin for sealing by a potting method. 22. It is sealed
The electronic circuit package described in. 23. The inside of the three-dimensional printed board including electronic components mounted on the three-dimensional printed board is resin-sealed with an organic resin for sealing by an injection method or a transfer molding method. Electronic circuit package. 24. The electronic component is at least a bare chip, the bare chip is electrically connected to a three-dimensional printing substrate by a bonding wire, and the bare chip and the bonding wire portion are formed by a potting method to form a first sealing organic resin. Then, the inside of the three-dimensional printed circuit board including the electronic components mounted in the three-dimensional printed circuit board is resin-sealed by a second sealing organic resin by an injection method or a transfer molding method. 22. The electronic circuit package according to claim 21, wherein: