JPH0456393A - Manufacture of high density wiring board - Google Patents

Abstract

PURPOSE:To improve insufficient burying of the end of a wire by cutting an insulated wire, then setting the output of an ultrasonic oscillator to the same as that at the time of wiring the wire, and burying the end of the wire in an adhesive layer. CONSTITUTION:When a time for once stopping a stylus for cutting a wire is approached, the moving speed of the stylus is started to be decelerated, and the output of an ultrasonic output unit is started to be reduced. A wiring machine stops moving of the stylus, stops its magnetostrictive vibration and cuts the wire. In this case, since the controller of the machine receives a wire cut signal, it set the output of the oscillator to the same as that at the time of wiring at a high speed constant speed during a period after a predetermined time is elapsed. Thus, even if the moving speed of the stylus is slow in a wiring region at the end of the wire after the wire is cut, since the output of the oscillator is large, the adhesive layer is sufficiently dissolved, the end of the wire is buried in the layer so that the end is not floated.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a high-density wiring board (hereinafter referred to as a multi-wire wiring board) using insulated wires.

(Prior art) In general, multi-wire wiring boards are made by coating an adhesive layer on an insulating substrate, wiring insulated wires on the adhesive layer, and connecting the insulated wires (hereinafter referred to as wires) to the adhesive layer. By embedding it, wires were laid and a wiring pattern was formed. The multi-wire wiring board is constructed by forming through holes that cross the wires and metallizing the insides of the through holes.

Wiring on such multi-wire wiring boards involves generating magnetostrictive vibrations in the wiring tension (hereinafter referred to as stylus) of the wiring machine using a current supplied from an ultrasonic oscillator, and the vibrations cause the adhesive layer to tighten. This was done by embedding the wire in an adhesive layer while dissolving it.

At this time, as shown in FIG. 3, the output of the ultrasonic oscillator (indicated by a thick line in the figure) is controlled in conjunction with the wiring speed, that is, the moving speed of the stylus (indicated by a thin line in the figure). When the stylus accelerates at time to-tl, the output increases in the same way, maintains a high output state during high speed from time t1 to t2, and similarly decreases during deceleration from time t2 to t3.

(The problem to be solved by the present invention>) However, in the conventional wiring method, the wiring machine runs just before the end point indicated by time t3 (according to experiments, about 1.3 mm from the end point) as shown in FIG. Stop at -1 in front) and start at time t3~
The wire was cut at time 4, and then moved again from time t4 to t6 to wire the remaining wire end.

For this reason, the moving speed of the stylus is slow at the end of the wire at the wiring end point, and the output of the ultrasonic oscillator is small accordingly, so the adhesive layer is not sufficiently melted and the adhesive layer at the end of the wire is The end of the wire becomes shallower and the end of the wire rises up, causing the wire to shift from the specified position during the pressing process to fix the wire in the next process, or oven failures occur where the through hole and wire are not connected. There was a problem that there was a risk.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method of manufacturing a wiring board that can improve the problem of insufficient embedding of the wire end portion at the wiring end point.

(Means for Solving the Problems) In order to solve the above problems, the present invention forms an adhesive layer on an insulating substrate, wires insulated wires on this adhesive layer, and uses the output of an ultrasonic oscillator to bond the adhesive layer. In a method of manufacturing a wiring board in which an insulated wire is embedded in an adhesive layer by dissolving the adhesive layer, after cutting the insulated wire, the output of the ultrasonic oscillator is made the same as when the insulated wire is laid, and the insulated wire is It is characterized in that the terminal end is embedded in the adhesive layer.

(Function) According to the above configuration, after cutting the insulated wire, the output of the ultrasonic oscillator is set to the same output as when wiring the insulated wire, and the terminal end of the insulated wire is wired. The adhesive layer is sufficiently dissolved at the terminal end of the electric wire, and the terminal end is buried in the adhesive layer. Therefore, it is possible to prevent the insulated wire from lifting up, thereby preventing so-called open failures and the like occurring in the next step, the pressing step.

(Example) Hereinafter, an example of a method for manufacturing a high-density wiring board using an insulated wire according to the present invention will be described based on the drawings.

First, in order to realize the method for manufacturing a high-density wiring board of this embodiment, the control circuit of the wiring machine is constructed as follows: As shown in FIG.
a, a second-stage one-shot circuit 7b which receives the output from this one-shot circuit 7a, and the output of the second-stage one-shot circuit 7b and the output of the ultrasonic oscillator at a high-speed constant speed. It is composed of an OR circuit 8 which receives an instruction as an input signal. In this embodiment, this control circuit is set to make the output of the ultrasonic oscillator the same as when the stylus is wired at a high-speed constant speed for a certain period of time after a time of 0 to 200 m5ec has passed after receiving the wire cutting signal. . Setting of these times is performed by a potentiometer 5 and a capacitor 6 connected to each one-shot circuit 7a, 7b.

According to the control circuit of the wiring machine as described above, as shown in Fig. 2, at time ti~2, the insulated wire is wired at a high constant speed with the output from the ultrasonic oscillator corresponding to the speed. When the time t3 at which the stylus is temporarily stopped for cutting the wire approaches, the moving speed of the stylus begins to decrease at time t2, and the output of the ultrasonic output device begins to decrease.

Then, when time t3 is reached, the wiring machine stops the movement of the stylus and also stops its magnetostrictive vibration to cut the wire.

At this time, since the control circuit of the wiring machine receives the wire cutting signal at time t3, the output of the ultrasonic oscillator is changed from time t5 to time t6 after a certain period of time has elapsed from time t3. The output is made to be the same as the output during high-speed constant speed wiring from time t1 to t2.

Therefore, even if the stylus movement speed is slow in the wiring area at the end of the wire after cutting the wire, the output of the ultrasonic oscillator is large, so the adhesive layer is sufficiently dissolved and the end of the wire is placed inside the adhesive layer. This prevents the terminal end from floating up.

As a result, in the next press step, there is no possibility that the wire will shift from a predetermined position or that an open defect in which the through hole and the wire are not connected will occur.

In addition, the control circuit of the above-mentioned wiring machine was actually constructed using Motorola's M
C14538BCP, TC40718P manufactured by Toshiba Corporation, two potentiometers (lookΩ) manufactured by Japan Laboratories, and capacitors luP and 2uF manufactured by Kochusha were made in combination, and an experiment was conducted. What used to be 0.55% has now been reduced to 0%, that is, completely eliminated.

(Effects of the Invention) As explained above, in the present invention, in the wiring of a multi-wire wiring board, after cutting the insulated wires, the output of the ultrasonic oscillator is set to be the same as that during the wiring of the insulated wires for a certain period of time, Since the terminal end of the insulated wire is embedded in the adhesive layer, the adhesive layer is sufficiently dissolved at the terminal end of the insulated wire so that the terminal end is embedded in the adhesive layer, and the terminal end of the insulated wire is buried in the adhesive layer. parts will no longer float up. As a result, it is possible to prevent open defects caused by misalignment of the wire in the next press step.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing a control circuit of a wiring machine for realizing the method of manufacturing a high-density wiring board according to the present embodiment, and FIG. Time Chart Showing Time Characteristics FIG. 3 is a time chart showing time characteristics of a conventional high-density wiring board manufacturing method. 5...Potentiometer 6...Capacitor 7...One-shot circuit 8...OR circuit

Claims (1)

[Claims] A method for producing a wiring board, in which an adhesive layer is formed on an insulating substrate, insulated wires are wired on the adhesive layer, and the adhesive layer is dissolved by the output of an ultrasonic oscillator to embed the insulated wires in the adhesive layer. A high-density wiring board characterized in that after cutting the insulated wire, the output of the ultrasonic oscillator is made the same as when the insulated wire was laid, and the terminal end of the insulated wire is embedded in the adhesive layer. Production method.