JPS62202590A - Multiwire wiring board - Google Patents
Multiwire wiring boardInfo
- Publication number
- JPS62202590A JPS62202590A JP4474786A JP4474786A JPS62202590A JP S62202590 A JPS62202590 A JP S62202590A JP 4474786 A JP4474786 A JP 4474786A JP 4474786 A JP4474786 A JP 4474786A JP S62202590 A JPS62202590 A JP S62202590A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wire
- layer
- wire wiring
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は必要な配線パターンに絶縁’ｉ［＃（ワイヤ）
を使用したマルチワイヤ配線板に関する。Detailed Description of the Invention (Industrial Application Field) The present invention provides insulation for necessary wiring patterns.
Regarding a multi-wire wiring board using.
（従来の技術）
従来の布Ω後のマルチワイヤ配線板は、第２図に示す様
に、基材１の上下にそｒＬぞｒｌＪ７地層２と電曽層３
が配設さｉＬ、その外仙」に絶縁層４゜４が形成さｒｔ
、さらにその外側に接着剤層５．５が形成さγＬ、その
上にワイヤが布線さｒしている構成になっている。(Prior art) As shown in FIG. 2, the conventional multi-wire wiring board after cloth Ω has a base material 1, top and bottom layers 2 and 3.
is arranged iL, and an insulating layer 4゜4 is formed on its outer side.
Further, an adhesive layer 5.5 is formed on the outer side thereof, and a wire is laid thereon.
（発明が解決しようとする問題点）
従来、この種のマルチワイヤ配線板の内部絶縁層は平面
状をしており配線笛度が高密度化傾向にある現在、数値
制御布線機で接着剤層に布線されたワイヤを保＾する目
的でオーバレイノーを積層形成する際にワイヤが接着剤
層にしか埋込まｒしていない為、微妙に移動し、入明作
菓時に穴とワイヤの間隙が小さくなりリークまたはショ
ートの原因となる。また穴径が小さくなるとワイヤが穴
に入らずオープンの原因となるという欠点があった。(Problems to be Solved by the Invention) Conventionally, the internal insulating layer of this type of multi-wire wiring board has been flat, and now that the wiring density is increasing, adhesives are used in numerically controlled wiring machines. When layering the overlay to protect the wires laid in the layers, the wires are embedded only in the adhesive layer, so they move slightly, and the holes and wires may not be connected when making confections. The gap becomes smaller, causing leaks or short circuits. Another drawback is that when the hole diameter becomes smaller, the wire cannot fit into the hole, causing an open circuit.
本発明は、マルチワイヤ配線板の内ｌ−絶縁層にワイヤ
を固定するための溝を設け、上記欠点を解決したマルチ
ワイヤ配線板を提供することにある。An object of the present invention is to provide a multi-wire wiring board which solves the above-mentioned drawbacks by providing grooves for fixing wires in the inner insulating layer of the multi-wire wiring board.
（問題点を解決するための手段） 本発明を図面を参照して説明する。(Means for solving problems) The present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示したもので。FIG. 1 shows an embodiment of the present invention.
層構成としては従来と同様であるが、絶縁／Ｍ ４の表
面にワイヤ布線格子と同様のピッチで１１１１６を設け
たマルチワイヤ配線板を示す。The layer structure is the same as the conventional one, but a multi-wire wiring board is shown in which 11116 are provided on the surface of the insulator/M4 at the same pitch as the wire wiring grid.
第３囚は１本発明の一実施例であるマルチワイヤ配線板
の斜視内である。The third figure is a perspective view of a multi-wire wiring board that is an embodiment of the present invention.
本発明は、第１図、第６図に示す様に、ワイヤが絶縁層
の溝の中に一部又はすべて埋っている之め、この後工程
のオーバレイ層を形成する際に樹脂流ｎ等によるワイヤ
のズレ量を小さくすることができ、ワイヤを精度良く固
定することができる。そのため穴とワイヤの間隙が十分
確保さ几、ま友人とワイヤの接続部でのワイヤズレがな
くなりこの０Ｉｔ６は役割を十分に果たしている。In the present invention, as shown in FIGS. 1 and 6, the wire is partially or completely buried in the groove of the insulating layer, so when forming the overlay layer in the subsequent process, resin flow, etc. It is possible to reduce the amount of displacement of the wire due to this, and it is possible to fix the wire with high precision. As a result, a sufficient gap between the hole and the wire is ensured, and there is no wire misalignment at the connection between the wire and the wire, and this 0It6 fulfills its role satisfactorily.
（発明の効果）
以上に説明した様に本発明によｎば、内部絶縁層に溝を
設けることにより、マルチワイヤ配線板の配線の精度を
向上することが可能となり、不良低減が出来るとともに
、高密度配線のマルチワイヤ配線板の製造が出来るとい
う効果がある。(Effects of the Invention) As described above, according to the present invention, by providing grooves in the internal insulating layer, it is possible to improve the wiring accuracy of the multi-wire wiring board, reduce defects, and This has the effect of making it possible to manufacture multi-wire wiring boards with high-density wiring.
【図面の簡単な説明】
第１図は本発明のマルチワイヤ配線板の断面へ
必：＼第２図は従来の布ａ後のマルチワイヤ配線板の構
造断面図、第３図は第１図に示したものの斜視内である
。
符号の説明
１ 基材 ２ 接地層
３ 電源層 ４ 絶縁層
５ 接着剤ノー ６ 溝
７ ワイヤ[Brief Description of the Drawings] Figure 1 is a cross-sectional view of the multi-wire wiring board of the present invention; Figure 2 is a cross-sectional view of the structure of the multi-wire wiring board after conventional cloth a; Figure 3 is the same as Figure 1. It is within the perspective of what is shown in . Explanation of symbols 1 Base material 2 Ground layer 3 Power layer 4 Insulating layer 5 Adhesive layer 6 Groove 7 Wire
Claims (1)
層との間に絶縁層を有すると共に接着剤層にワイヤを布
線したマルチワイヤ配線板において、この内部絶縁層に
ワイヤを固定するための溝を設けたことを特徴とするマ
ルチワイヤ配線板。1. In a multi-wire wiring board that has an insulating layer between the adhesive layer located on the surface layer of the board and the copper foil layer on the inner layer, and wires are wired in the adhesive layer, the wires are wired in this inner insulating layer. A multi-wire wiring board characterized by having grooves for fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4474786A JPS62202590A (en) | 1986-02-28 | 1986-02-28 | Multiwire wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4474786A JPS62202590A (en) | 1986-02-28 | 1986-02-28 | Multiwire wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62202590A true JPS62202590A (en) | 1987-09-07 |
Family
ID=12700037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4474786A Pending JPS62202590A (en) | 1986-02-28 | 1986-02-28 | Multiwire wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62202590A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017135172A (en) * | 2016-01-25 | 2017-08-03 | 京セラ株式会社 | Thick copper circuit board and manufacturing method of the same |
-
1986
- 1986-02-28 JP JP4474786A patent/JPS62202590A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017135172A (en) * | 2016-01-25 | 2017-08-03 | 京セラ株式会社 | Thick copper circuit board and manufacturing method of the same |
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