JP2011096822A - Method for manufacturing multi-wire wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-wire wiring board which is excellent in wiring density, and does not separate an insulating coating electric wire from an insulating board with a bonding agent even if a wiring rate is doubled and the insulating board with the bonding agent is thinned. <P>SOLUTION: In the method for manufacturing the multi-wire wiring board, an adhesive layer is melted by ultrasonic vibration and a wire is set to the insulating board with the bonding agent having the adhesive layer as an outermost layer. While the insulating board with the bonding agent is joined to a table, wiring is performed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multi-wire wiring board using an insulated wire as a necessary wiring pattern.

  In recent years, with the functionalization of electronic devices, printed wiring boards have been strongly required to improve wiring density. On one of the wiring boards that satisfy this requirement, an adhesive layer is formed on the prepreg on the insulating board or inner circuit board, and the adhesive layer is applied to the insulated wire while applying ultrasonic vibration. Activated, fixed insulated wires in the required shape (hereinafter referred to as wiring), drilled holes to cut the insulated wires at the places where connection is required, and metalized the holes by plating etc. There is a wiring board. Since insulated wires are used, cross wiring on the same plane is possible, and further multilayering is possible, so that it is easy to improve wiring density.

  As shown in FIG. 1, in such a multi-wire wiring board, a head portion 10 and a slip ring 12 are attached to respective end portions of a cylindrical sheath portion 11, and a cylindrical portion of the sheath portion 11 is divided into 2 parts. The head mounting portion 13 is rotatably supported by two bearings (upper bearing 131 and lower bearing 132). A motor 133 that rotates the head portion 10 in the circumferential direction of the sheath portion 11 is attached to the head attachment portion 13, and the head attachment portion 13 is attached to the Y-axis moving gantry 15 so that it can be moved up and down by the vertical movement means 151. The Y-axis moving gantry 15 is provided so as to be movable in the Y direction perpendicular to the ground. In addition, an X-axis moving table 14 that is movable in the X direction parallel to the ground and orthogonal to the Y direction and that fixes the insulating substrate with adhesive 3 is provided.

  In the cylinder of the sheath portion 11, a stylus 101 that reaches the tip of the head portion 10 and an oscillation coil 111 for ultrasonic vibration are provided around the stylus 101, and the oscillation coil 111 is provided with a slip ring 12 interposed therebetween. The ultrasonic oscillator 121 is connected, and the insulation-coated electric wire 1 is passed through the cylinder of the sheath portion 11 (see Patent Document 1). The insulated wire 1 is supplied to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head unit 10, and a cutter 104 is provided near the stylus tip 105 to cut the insulated wire 1 to a required length. Furthermore, a torque motor 102 that generates torque in a direction in which the stylus chip 105 is pressed against the insulating substrate 3 with an adhesive is attached near the stylus chip 105.

  Further, the Y-axis moving gantry 15 is determined based on the position, length, the position of the corner of the wiring pattern of the wiring pattern, the angle, and the position at which the insulation-coated electric wire 1 is fixed. Of the X-axis movement table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, etc. A wiring pattern is formed by using a wiring device in which a sequence for forming a necessary wiring pattern is accommodated and fixed on the insulating substrate 3.

  The state of wiring using this wiring device will be described. With the device shown in FIG. 1, the insulated coated electric wire 1 is drawn to the tip of the stylus 101, and a wire guide groove ( (Not shown) and held. Next, when the numerical control device that executes the sequence is started, the numerical control device starts the first wiring data, that is, the position, length, and wiring pattern corner portion of the wiring pattern at which one set of the insulated wire 1 starts to be fixed. From the data of the position, the angle, and the position where the insulation-coated electric wire 1 is fixed, the amount of movement of the Y-axis moving base 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, The output of the torque motor 102, the operation of the cutter 104, etc. are calculated, the head unit 10 is driven in the Y direction by driving the Y axis moving base 15, and the X axis moving table 14 to which the insulating substrate 3 with adhesive is fixed is driven. In the X direction, the insulation covered electric wire 1 is moved to a position where it is first fixed and stopped.

  Further, the vertical movement means 151 lowers the head unit 10 to a predetermined position so that the stylus 101 is in contact with the insulating substrate 3 with adhesive, and the direct current power applied to the ultrasonic oscillator 121 and the pressing force applied by the torque motor 102 are used. The insulation-coated electric wire 1 is fixed to the starting point of the wiring. At the same time, an AC signal is applied to the ultrasonic oscillator 121 to start transmitting ultrasonic vibrations to the stylus 101, and the Y-axis moving base 15 and the X-axis moving table 14 are driven according to the wiring data to insulate the wiring pattern shape. While covering the covered electric wire 1, the ultrasonic wave of the stylus 101 activates the adhesive on the insulating substrate 3 with adhesive and the adhesive applied to the surface of the insulating covered electric wire 1 to bond and fix. Further, when forming the corner portion of the wiring pattern, the driving of the Y-axis moving base 15 and the X-axis moving table 14 is stopped while adjusting the ultrasonic output and the stylus pressure, and only the head portion 10 is rotated by the motor 133. And rotate to a necessary angle calculated from the wiring data (see Patent Document 2).

  Further, the Y-axis moving gantry 15 and the X-axis moving table 14 are driven to continue the bonding and fixing, and the cutter 104 is moved by the distance between the ending point of the wiring 104 and the stylus 101 from the length calculated from the wiring data. To drive the Y-axis moving base 15 and the X-axis moving table 14 to the cut position, and bond and fix to the end point of the wiring. Further, the vertical movement means 151 is driven to raise the head unit 10 to the original position, the next wiring data is read, this is repeated, and when all the wiring is completed, the vertical movement means 151 is driven to return to the original position. Raise the head unit 10 to the position. Next, the Y-axis moving base 15 and the X-axis moving table 14 are driven to move the head unit 10 to the reference position of the wiring device, and the numerical controller stops the sequence. In this way, for the first time, the insulating substrate 3 with adhesive can be removed, and similarly, the circuit can be formed on both sides by turning the insulating substrate 3 with adhesive and performing the same process. You can move on to the process.

  Thus, since the insulated wire 1 is fixed to the insulating substrate 3 with adhesive, it can be fixed so that the insulated wire 1 intersects (see Patent Documents 3 and 4). Therefore, like a normal wiring board, a circuit is formed by etching away unnecessary portions of copper foil, or a dense wiring circuit is formed compared to a method of forming a circuit by plating only at a necessary portion. it can.

JP-A-11-150353 JP 2000-174419 A JP 2000-269629 A JP 2000-269630 A

  However, in recent years, there has been a demand for improvement in productivity with a thinner and denser wiring than such high-density wiring, and in order to secure lead time, the wiring speed has been doubled, for example, 21 so far. It is required to increase the speed from 2 mm / s to 42.4 mm / s. Moreover, the thickness of the insulating substrate with adhesive 3 is also reduced, and for example, a countermeasure is required when the thickness is changed from 0.2 mm to 0.06 to 0.1 mm.

  When the wiring speed is doubled, the contact time between the stylus and the insulating substrate with adhesive 3 is shortened, so that the adhesive on the insulating substrate with adhesive 3 and the adhesive applied to the surface of the insulated coated electric wire 1 When the insulation-coated electric wire 1 is fixed so that the insulation-coated electric wire 1 is not fixed and peeled without being fixed, or the fixing is weak even if it is not peeled, so that it can be further moved over. There is a problem that the fixed position is shifted by being pulled by the.

  Furthermore, when the insulated coated electric wire 1 is wired on both surfaces of the insulating substrate 3 with adhesive, when forming the wired circuit on the other side after forming the wired circuit on one side, the unevenness due to the insulated coated electric wire 1 formed on one side is caused. When a gap is generated between the insulating substrate 3 with adhesive and the X-axis moving table 14 around the unevenness, and the stylus tries to perform wiring at that location, the insulating substrate 3 with adhesive and the X-axis moving table 14 Decrease in the repulsive force of the insulating substrate with adhesive 3 due to the gap between the two, the ultrasonic vibration is attenuated, and the adhesive applied to the insulating substrate 3 with adhesive and the surface of the insulated coated electric wire 1 is applied. There is a problem that the activation of the agent is lowered, and the insulation-coated electric wire 1 is peeled without being fixed.

  The present invention solves the above-mentioned problems, has excellent wiring density, doubles the wiring speed, and even if the insulating substrate with adhesive is made thinner, the insulation-coated electric wire is less likely to be peeled off than the insulating substrate with adhesive. It aims at providing the manufacturing method of a wire wiring board.

In view of the above problems, as a result of intensive studies, the present inventors have found that the above problems can be solved by performing the wiring while keeping the adhesive-attached insulating substrate in close contact with the table, and have reached the present invention.
The present invention relates to the following.
(1) In the method of manufacturing a multi-wire wiring board in which a wire is wired while melting the adhesive layer by ultrasonic vibration on an insulating substrate with an adhesive having an adhesive layer as an outermost layer, the insulating substrate with adhesive is A method of manufacturing a multi-wire wiring board, wherein wire wiring is performed while being in close contact with a table.
(2) The multi-wire according to (1), wherein the table is a suction table having suction holes, and wire wiring is performed while the insulating substrate with adhesive is brought into close contact with the suction table by suction fixation. A method for manufacturing a wiring board.
(3) The method for producing a multi-wire wiring board according to (1) or (2), wherein an underlay sheet is disposed between the table and the insulating substrate with adhesive.
(4) The manufacturing method of the multi-wire wiring board according to (3), wherein the underlying sheet has a slit or a hole.
(5) The above (3) or (3), wherein the underlay sheet comprises at least a foam base material and a surface film, and the underlay sheet is disposed so that the surface film is on the insulating substrate side with an adhesive. The manufacturing method of the multi-wire wiring board as described in 4).
(6) The manufacturing method of the multi-wire wiring board as described in said (5) whose thickness of a surface film is 10-100 micrometers.
(7) The manufacturing method of the multi-wire wiring board as described in said (5) or (6) whose surface film is a porous film.
(8) The manufacturing method of the multi-wire wiring board in any one of said (4)-(7) in which an underlay sheet | seat has a some hole.
(9) The method for manufacturing a multi-wire wiring board according to any one of (4) to (8), wherein the position of the hole in the underlay sheet is at the same position as the suction hole of the suction table.
(10) The method for producing a multi-wire wiring board according to (8) or (9), wherein the diameter of the plurality of holes in the underlay sheet is 2 to 4 mm.
(11) The method for manufacturing a multi-wire wiring board according to (9), wherein the diameter of the plurality of holes of the underlay sheet is 100 to 150% with respect to the diameter of the suction holes of the suction table.
(12) The manufacturing method of the multi-wire wiring board in any one of said (5)-(11) whose surface film is a polyethylene film or a polyolefin film.

  According to the present invention, attenuation of ultrasonic vibration due to doubled wiring speed and thinning of the insulating substrate with adhesive can be reduced, and the insulation-coated electric wire has a high density without peeling or shifting from the insulating substrate with adhesive. It has become possible to provide a method for manufacturing a multi-wire wiring board capable of wiring.

It is a side view which shows the wiring apparatus of a prior art example. It is a side view which shows the wiring apparatus at the time of using the base sheet in this invention. It is a top view which shows the underlay sheet | seat shape used for the Example of this invention. It is a top view which shows the underlay sheet | seat shape used for the Example of this invention. It is a schematic diagram which shows the wiring process of multi-wire wiring board manufacture.

The method of manufacturing a multi-wire wiring board according to the present invention is a multi-wire in which a wire (insulating coated electric wire) is laid on an insulating substrate with an adhesive having an adhesive layer as an outermost layer while melting the adhesive layer by ultrasonic vibration. In the method for manufacturing a wiring board, wiring is performed while the insulating substrate with adhesive is brought into close contact with a table.
Hereinafter, the manufacturing method of the multi-wire wiring board of this invention is demonstrated in detail using drawing.
For example, in the method for manufacturing a multi-wire wiring board according to the present invention, ultrasonic vibrations are efficiently transmitted between the insulating substrate 3 with adhesive and the X-axis moving table 14 as shown in FIG. An underlay sheet for the purpose of activating the adhesive on the insulating substrate 3 and the adhesive applied to the surface of the insulating coated electric wire 1 so that the insulating coated electric wire 1 can be fixed on the insulating substrate 3 with adhesive without peeling off 16 is preferably disposed. Moreover, it is preferable that the underlay sheet used in the present invention has a repulsive force between the stylus and the insulating substrate 3 with adhesive so as not to lower the activation of the adhesive due to ultrasonic vibration.

  Furthermore, when forming a wiring circuit on both surfaces of the insulating substrate 3 with adhesive, the underlay is made so as not to generate a gap between the insulating substrate 3 with adhesive and the underlay sheet 16 in the peripheral portion of the unevenness by the insulating coated wire 1 on the surface. It is preferable that the sheet surface follows the unevenness.

Moreover, it is preferable that it is the form which the space | gap between the insulating board | substrate 3 with an adhesive agent and an underlay sheet | seat does not generate | occur | produce by contact | adhering insufficiently by making the insulating board | substrate 3 with an adhesive contact | adhere uniformly. There are methods such as suction fixation, pressure bonding, and adhesion via a medium as a method of close contact, but in terms of work efficiency, suction fixation that allows the insulating substrate 3 with adhesive to be easily peeled off if suction is stopped. Is preferred. The suction fixation is preferably performed using a suction table having a suction hole in the table.
The underlay sheet used in the present invention is preferably composed of at least a foam base material and a surface film, and the underlay sheet is preferably disposed so that the surface film is on the insulating substrate with adhesive 3 side. 3 and 4, the underlying sheet preferably has a slit or a hole at the same position as the suction hole provided in the table 202.

In general, the foam substrate is preferably a hard material having a repulsive force so as not to attenuate the ultrasonic vibration. For example, an acrylic resin, a polystyrene resin, a urethane resin, or the like is preferable. The thickness of the foam substrate is preferably 0.5 to 1.0 mm. Examples of commercially available products include VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name, acrylic resin).
Further, if necessary, in order to absorb the unevenness of the insulated coated electric wire 1 fixed on the insulating substrate 3 with adhesive, a gel-like or liquid foam base material, for example, a face washing made of a liquid such as water, for example, is used. A foam base material such as foam or hair-styling foam may be used.

The surface film preferably has an appropriate thickness in order to absorb the unevenness of the insulated coated electric wire 1 fixed to the insulating substrate with adhesive 3 by the foam base material, specifically, 10 to 80 μm is preferable. 20-60 micrometers is more preferable and 25-40 micrometers is especially preferable. The material is preferably a polyolefin film such as a polyethylene film or a polyvinyl fluoride film. Commercially available products include Porum PH40 (manufactured by Tokuyama Corporation, product name), Tedra film (manufactured by DuPont Co., Ltd., product name), TPX film (manufactured by Mitsui Chemicals, Inc., product name), Sunmap (Nitto Denko Corporation) Product name).
The surface film is preferably a porous film, and is preferably a polyethylene-based porous film such as Porum PH40 (manufactured by Tokuyama Corporation, product name), Sunmap (manufactured by Nitto Denko Corporation, product name) and the like. . When a porous film is used as the surface film, effects equivalent to those of other films can be obtained even if the thickness is about 20 μm. Accordingly, the preferred thickness of the porous film is preferably 10 to 100 μm, more preferably 20 to 80 μm, and particularly preferably 25 to 60 μm.

The slit or hole in the underlay sheet absorbs the insulating substrate 3 with adhesive evenly and fixes it to the underlay sheet so as to absorb the irregularities of the insulated coated electric wire 1 and not generate a gap. It is preferably provided at the same position as the suction hole on the shaft moving table 14. Moreover, it is preferable that there are a plurality of slits or holes in the underlying sheet.
Further, the slit or hole of the underlay sheet preferably has a diameter of 4 mm or less so as not to deform the insulating substrate with adhesive 3 to be sucked, and the diameter of the hole of the underlay sheet for efficient suction is as follows: 2 mm or more is preferable. Furthermore, as for the diameter of the hole of the said base sheet, 2-3 mm is more preferable.

  The diameter of the suction hole of the X-axis moving table which is a suction table is not particularly limited, but is usually equal to or smaller than the diameter of the hole in the underlay sheet. Accordingly, the diameter of the hole in the underlay sheet is preferably 100 to 150% with respect to the diameter of the suction hole in the suction table. For example, if the diameter of the suction hole in the suction table is 2 mm, The diameter is preferably 2 to 3 mm.

  By installing the underlay sheet on the X-axis moving table 14 in this way, the insulating coated electric wire 1 is bonded and fixed to both surfaces of the insulating insulating substrate 3 without peeling off to form a necessary wiring pattern. Thus, a multi-wire wiring board can be manufactured.

  In this case, the insulation-coated electric wire can be a metal wire with an insulation coating formed as in the case of a normal multi-wire wiring board. The metal wire can be a copper wire, an aluminum wire, an iron wire, or these. Those plated with nickel, gold, cobalt or the like can be used. As the metal wire, a copper wire having a diameter of 0.04 to 0.10 mm is preferable because it is highly flexible and can easily form a corner portion of a wiring pattern and is inexpensive.

  Considering that the insulating coating formed on the surface of the metal wire is used as a wiring board, it is preferable to use an epoxy resin or a polyimide resin because it is excellent in heat resistance and durability. Insulated coated electric wires can usually be obtained by applying a thin varnish such as polyimide varnish and curing at a high temperature about 5 to 30 times to obtain a required thickness.

  The manufacturing method of the multi-wire wiring board of the present invention uses an insulating substrate with an adhesive having an adhesive layer as the outermost layer. In order to increase the adhesive force between the adhesive of the insulating substrate with adhesive 3 and the insulated coated electric wire, it is preferable to apply an adhesive to the surface of the insulated coated electric wire. The adhesive resin may be epoxy resin, polyimide resin or It is preferable to use an epoxy resin modified with polyimide, and it is preferable to use a varnish that has been dried to the extent that it is not completely cured.

  The adhesive of the insulating substrate with adhesive can be made of ordinary epoxy resin, polyimide resin or epoxy resin modified with polyimide, but in order to form a wiring board, the insulating coated electric wire 1 as a wiring pattern is bonded.・ After fixing, it must satisfy the conflicting property that it does not move as much as possible from its fixed position and the conflicting property that it flows to fill the insulated wire as much as possible when it is wired. It is preferable to use an adhesive, and the thickness thereof can be selected as necessary from 0.05 to 0.10 mm.

  As the insulating substrate, an insulating substrate in which a glass cloth used for a normal wiring board is impregnated with an epoxy resin or a polyimide resin can be used, and an insulating substrate having an inner layer circuit board in which an inner layer circuit is formed is used as the inner layer. You can also.

The adhesive substrate with adhesive can be applied to the above-mentioned insulating substrate in a varnish state and heated and dried to make it semi-cured. Is laminated on an insulating substrate as an adhesive film formed on a support film such as a polyethylene terephthalate film in a semi-cured state.
Moreover, as an insulating substrate with an adhesive having an adhesive layer as the outermost layer, for example, a prepreg is laminated on the surface of the insulating substrate with a press or the like, and an adhesive layer is further formed on the surface of the prepreg. A substrate with a prepreg having an adhesive layer may be used. A commercially available product such as GIA-671N (manufactured by Hitachi Chemical Co., Ltd., product name) can be used as the prepreg. The outermost adhesive layer can be formed by, for example, AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.).

(Wiring device)
As shown in FIG. 2, a head portion 10 and a slip ring 12 are attached to respective end portions of a cylindrical sheath portion 11, and the cylindrical portion of the sheath portion 11 is divided into two bearings (an upper bearing 131, a lower bearing). 132), a motor 133 that rotates and supports the head mounting portion 13 in the circumferential direction of the sheath portion 11 is mounted on the head mounting portion 13, and the head mounting portion 13 is moved up and down by the vertical movement means 151. It is attached to a Y-axis moving gantry 15 so that it can be moved to the Y-axis, and the Y-axis moving gantry 15 is provided so that it can move in the Y direction perpendicular to the ground, and can move in the X direction that is parallel to the ground and perpendicular to the Y direction. An X-axis moving table 14 is provided for fixing the insulating substrate 3 with adhesive, and the stylus 101 reaching the tip of the head portion 10 and the stylus 10 are provided in the cylinder of the sheath portion 11. Is provided with an oscillation coil 111 for ultrasonic vibration, and an ultrasonic oscillator 121 is connected to the oscillation coil 111 via a slip ring 12. Is passed to the stylus tip 105 at the tip of the stylus 101 by the feeder 103 of the head unit 10, and a cutter 104 is provided near the stylus tip 105 to cut the insulation coated electric wire 1 to a required length. A torque motor 102 that generates torque in a direction in which the stylus chip 105 is pressed against the insulating substrate 3 with adhesive is attached near the stylus chip 105, and the position and length at which the insulation coated electric wire 1 prepared in advance starts to be fixed. , The position and angle of the corner of the wiring pattern of the wiring pattern, and the position where the insulation covered electric wire 1 is fixed From the data, the amount of movement of the Y-axis moving gantry 15, the amount of movement of the X-axis moving table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104, etc. An improvement was made to a conventional wiring device in which a sequence for forming a necessary wiring pattern by bonding and fixing the insulated coated wire 1 on an insulating substrate 3 with an adhesive was contained.

  Further, from this sequence, data prepared in advance for the position and length at which the insulation-coated electric wire 1 starts to be fixed, the position of the corner of the wiring pattern of the wiring pattern, the angle, and the position at which the insulation-coated electric wire 1 is completely fixed are obtained. The movement amount of the Y-axis moving gantry 15, the movement amount of the X-axis movement table 14, the rotation angle of the sheath 11, the output of the ultrasonic oscillator 121, the output of the torque motor 102, the operation of the cutter 104 are calculated. A numerical control device using a computer system is used, and the output includes a drive circuit for the Y-axis moving gantry 15, a drive circuit for the X-axis moving table 14, a rotation drive circuit for the sheath 11, an output control circuit for the ultrasonic oscillator 121, An output drive circuit of the torque motor 102 and an electromagnetic lever drive circuit for cutting by the cutter 104 are connected to drive each mechanism.

  The improved part is that a wiring sheet is provided on both sides of the insulating substrate 3 with adhesive by disposing an underlay sheet 16 composed of a foam base material and a surface film between the insulating substrate 3 with adhesive and the X-axis moving table. The surface of the underlay sheet follows the unevenness so as not to generate a gap between the insulating substrate 3 with adhesive and the underlay sheet in the peripheral portion of the unevenness caused by the insulation coated electric wire 1 on the surface, and insulation with adhesive The substrate 3 is uniformly sucked and fixed so that no gap is generated between the insulating substrate 3 with adhesive and the underlay sheet due to insufficient suction, and ultrasonic vibration by the stylus is efficiently applied to the insulated coated wire on the insulating substrate 3 with adhesive. 1 and activate the adhesive on the insulating substrate 3 with adhesive and the adhesive applied to the surface of the insulated wire 1 and fix it on both sides of the insulating substrate 3 without peeling off the insulated wire 1 Those who wear way.

Example 1
(Underlay sheet)
VHB-Y-4910J (product name, manufactured by Sumitomo 3M Co., Ltd.) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm is used as a foam base material, and a polyethylene film having a thickness of 40 μm is used as a surface film. A porous porous film made of Porum PH40 (product name, manufactured by Tokuyama Corporation) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(Wiring)
As shown in FIG. 5, using a wiring apparatus using the above-mentioned underlay sheet, MCL-I-671 (manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.170 mm, which is a double-sided copper-clad laminate having an insulating layer 1a. , Product name), GIA-671N (product name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 30 μm, which is an insulating resin layer 3a made of a modified polyimide prepreg, is stacked and integrated by heating and pressing, and the thickness is increased. AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) forming a 70 μm adhesive resin layer 2a is roll-laminated at a temperature of 120 ° C., and an insulating substrate with adhesive (substrate with prepreg) having an adhesive layer as the outermost layer HAW (manufactured by Hitachi Cable, Ltd., a product manufactured by Hitachi Cable Co., Ltd.), which is an insulated coated electric wire having a core coating diameter of 65 μm and a polyimide coating layer by ultrasonic vibration using the above wiring device ), And the test pattern 4a in which two wires are arranged between 0.80 mm is wired and fixed in the same plane at a wiring speed of 42.4 mm / s. Similarly, the test pattern 4a was wired at the same position as the pattern 4a at a wiring speed of 42.4 mm / s.

  The insulation-coated copper wire is coated with Pire-ML-RC5057 (manufactured by DuPont, product name), which is a polyimide resin, on a copper wire having a diameter of 65 μm, and dried at 350 ° C. for 8 minutes to obtain a thickness of 20 μm. The adhesive was coated with HAW-216D (product name, manufactured by Hitachi Chemical Co., Ltd.) and dried at 200 ° C. for 1 minute for a thickness of 13 μm.

  As a result, as shown in Table 1, it was confirmed that there was no peeling of the insulated coated electric wire 1 and displacement of the fixed position of the insulated coated electric wire 1 in the wiring on the front and back surfaces of the insulating substrate with adhesive 3. Was adhered and fixed to both surfaces of the insulating substrate 3 with adhesive, and a necessary wiring pattern could be formed.

(Example 2)
(Underlay sheet)
VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of the acrylic base material having a thickness of 1.0 mm is used as the foam base material. A vinyl fluoride film tedla film (product name, manufactured by DuPont Co., Ltd.) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

(Example 3)
(Underlay sheet)
A VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyolefin having a thickness of 50 μm as a surface film A film in which a TPX film (manufactured by Mitsui Chemicals, product name) was bonded was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

Example 4
(Underlay sheet)
VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyethylene having a thickness of 100 μm as a surface film A porous map with a sun map (product name, manufactured by Nitto Denko Corporation) was used.
Further, as shown in FIG. 4, a plurality of holes having a diameter of 2 mm, which is the same diameter as the suction holes, are provided at the same position as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate with adhesive 3 was fixed (adhered).

(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, there is no peeling or deviation of the insulated coated electric wire 1 from the insulating insulated substrate 3 on the surface of the insulating insulated substrate 3 with adhesive, and the insulated coated electric wire 1 with the adhesive on the back surface. Although peeling or deviation from the insulating substrate 3 occurred, it was slight.

(Example 5)
(Underlay sheet)
A VHB-Y-4910J (manufactured by Sumitomo 3M Co., Ltd., product name) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm as a foam base material, and a polyolefin having a thickness of 50 μm as a surface film A film in which a TPX film (manufactured by Mitsui Chemicals, product name) was bonded was used.
Further, a slit 300 is provided at the same position as the suction hole 203 on the table 202 as shown in FIG. 3, and suction is performed through the slit, and the insulating substrate 3 with adhesive is fixed (adhered) to the table. .

(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, the insulation-coated electric wire 1 was peeled or shifted on the surface of the insulating substrate 3 with adhesive. Separation or deviation from the surface occurred.

(Example 6)
(Underlay sheet)
VHB-Y-4910J (product name, manufactured by Sumitomo 3M Co., Ltd.) having an acrylic adhesive on both sides of an acrylic base material having a thickness of 1.0 mm is used as a foam base material, and a polyethylene film having a thickness of 40 μm is used as a surface film. A porous porous film made of Porum PH40 (product name, manufactured by Tokuyama Corporation) was used.
In addition, as shown in FIG. 4, a plurality of holes having a diameter of 3 mm, which is 1 mm larger than the suction holes, are provided at the same position (5 cm grid) as the suction holes 203 on the table 202, and suction is performed from the suction holes. The insulating substrate 3 with adhesive was fixed (adhered) to the table.

(Wiring)
The test pattern 4a was wired in the same manner as in Example 1 by using the wiring device using the above-mentioned underlay.
As a result, as shown in Table 1, peeling or displacement of the insulation-coated electric wire 1 from the insulating substrate with adhesive 3 occurred on the front surface and the back surface of the insulating substrate with adhesive 3 but was slight.

(Comparative Example 1)
In Example 1, the wiring of the test pattern 4a was performed in the same manner as in Example 1 using the wiring device without using the foam base material and the underlay sheet.
As a result, as shown in Table 2, on the surface of the insulating substrate 3 with adhesive, the insulation-coated electric wire 1 was good without peeling or shifting, but on the back surface, the insulation-coated electric wire 1 was detached from the stylus in the middle of wiring, The wiring device stopped due to an error, and subsequent wiring could not be performed.

(Comparative Examples 2-6)
In Examples 1-5, the wiring of the test pattern 4a was performed like Example 1 using the underlay sheet | seat and using the wiring apparatus, without attracting | sucking a table.
As a result, as shown in Table 2, on the surface of the insulating substrate 3 with adhesive, the insulation-coated electric wire 1 was not peeled off or shifted slightly, but on the back surface, the insulation-coated electric wire 1 was detached from the stylus in the middle of wiring, The wiring device stopped due to an error, and subsequent wiring could not be performed.

As shown in Example 1, a polyethylene-based porous film (Poram PH40; manufactured by Tokuyama Corporation, product name) having a thickness of 40 μm was used as the surface film, and the suction holes of the table were located at the same positions as the suction holes on the table. When a plurality of holes having a diameter of 2 mm, which is the same diameter as the above, are provided, the adhesion (fixing) of the insulating substrate with the adhesive to the table is sufficient, and the insulation-coated electric wire of the insulating coated electric wire is placed on the front and back wiring of the insulating substrate with the adhesive. It was found that there was no separation and displacement of the fixing position of the insulated coated electric wire, and the necessary wiring pattern could be formed by adhering and fixing the insulated coated electric wire to both surfaces of the insulating substrate with adhesive.
As described above, according to the present invention, attenuation of ultrasonic vibration due to double wiring speed and thinning of the insulating substrate with adhesive can be reduced, and the insulation-coated electric wire can be peeled off from the insulating substrate with adhesive, It has become possible to provide a method for manufacturing a multi-wire wiring board that can perform high-density wiring without shifting.

1a. Insulating layer (or inner layer circuit board), 2a. Adhesive resin layer, 3a. Insulating resin layer, 4a. 0.8mm / 2 test pattern,
1. 2. Insulated coated wire, 10. Insulated substrate with adhesive, Head part, 101. Stylus, 102. Torque motor, 103. Feeder, 104. Cutter, 105. Stylus tip, 11. Sheath, 111. Oscillating coil, 115. Hall element, 116. Magnet, 12. Slip ring, 121. Ultrasonic oscillator, 13. Head mounting portion, 131. Upper bearing, 132. Lower bearing, 133. Motor, 14. X-axis movement table, 15. Y-axis moving mount, 16. Underlay sheet, 151. Vertical movement means,
201. Underlay sheet, 202. Table, 203. Suction hole, 300. slit.

Claims (12)

  In a method of manufacturing a multi-wire wiring board in which a wire is wired while melting the adhesive layer by ultrasonic vibration on an insulating substrate with an adhesive having an adhesive layer as an outermost layer, the insulating substrate with adhesive is placed on a table A method of manufacturing a multi-wire wiring board, wherein wire wiring is performed while closely contacting.   2. The manufacturing method of a multi-wire wiring board according to claim 1, wherein the table is a suction table having suction holes, and wire wiring is performed while adhering an insulating substrate with adhesive on the suction table by suction fixation. Method.   The method for producing a multi-wire wiring board according to claim 1 or 2, wherein an underlay sheet is disposed between the table and the insulating substrate with adhesive.   The manufacturing method of the multi-wire wiring board of Claim 3 with which an underlay sheet has a slit or a hole.   The multi-layer sheet according to claim 3 or 4, wherein the underlay sheet comprises at least a foam base material and a surface film, and the underlay sheet is disposed so that the surface film is on the insulating substrate side with an adhesive. Manufacturing method of wire wiring board.   The method for producing a multi-wire wiring board according to claim 5, wherein the surface film has a thickness of 10 to 100 µm.   The method for producing a multi-wire wiring board according to claim 5 or 6, wherein the surface film is a porous film.   The manufacturing method of the multi-wire wiring board in any one of Claims 4-7 in which an underlay sheet | seat has a some hole.   The manufacturing method of the multi-wire wiring board in any one of Claims 4-8 in which the position of the hole of an underlay sheet exists in the same position as the suction hole of a suction table.   The manufacturing method of the multi-wire wiring board according to claim 8 or 9 whose diameter of a plurality of holes of an underlay sheet is 2-4 mm.   The manufacturing method of the multi-wire wiring board according to claim 9 whose diameter of a plurality of holes of an underlay sheet is 100 to 150% to a diameter of a suction hole of a suction table.   The method for producing a multi-wire wiring board according to any one of claims 5 to 11, wherein the surface film is a polyethylene film or a polyolefin film.

Images