M345451 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種鑽微孔用之導電緩衝層導莫板 是指一種將導電樹脂緩衝層以淋膜、塗佈、壓貼合及棋烤二 成粘著方式結合於鋁箔層之鑽微孔用之導電緩衝居 ㈢導板。 【先前技術】M345451 VIII. New Description: 【New Technical Fields】 This is a kind of conductive buffer layer for drilling micropores. It refers to a kind of conductive resin buffer layer coated, coated, pressed and baked. The 20% adhesive method is combined with the conductive buffer (3) guide plate for drilling the micro holes of the aluminum foil layer. [Prior Art]
隨著電子技術的演進，許多高科技電子違口姓# %丁座如持績不斷 相繼問世，使得人性化、功能更佳的電子產品不斷地推 新，並不斷地朝向「輕、薄、短、小」的設計方向邁、出 而’各種琳瑯滿目之電子產品均須具備有一印刷電路板p :、、' (Printed Circuit Board)，提供電子元件搭載及使各元件 到電性連接之功效。 然而，在進行電路板鑽微孔作業時，對於孔徑愈小的孔 洞，相對地須採用較小的鑽針與較高的轉速加以進7亍势迕， 避免表面靜電、加速散熱、降低斷針率與提高鑽孔 究之重要課題。 μ ·了業的專業人士持續不斷研 為使職孔能順利進行，一般均會在電路板上放置一絕 緣树脂塗層純，供鑽針受料覆而於進人電路板時得以提 供：滑效果」惟’該絕緣樹脂塗層鋁板，其表面電阻值高達 〇 Ω „亥问电阻值之材料往往會在塗佈與裁切過程中或是 於鑽針高轉速切削貫穿時，產生大量靜電集中於樹脂層表 面’更甚至是附著㈣針表面；如此，不但㈣作業人員的 4 M345451 不ί:產生灰塵粉屬吸附於鑽針表面，造成斷針與 二:二二種種問題。此外，該絕緣樹脂塗層銘板主要 疋強_由包覆鑽針的方式，據以將賴物 刀具潤滑用，㈣，當孔徑愈小、縱橫比愈 ^來 .賴作之主要目的在於改善高轉速I細微之鑽孔作業 _斤產生及熱里問題，並加以提升鑽微孔_針之穩定声 與壽命，進而防止斷針、孔偏及孔口不良之現象產生:又 衝声述#之目的，本1彳作係提供—_微孔用之導電緩 =旨緩衝層係以淋膜、塗佈及壓貼合方式附著於1電 再經由供烤熟成枯著成導電緩衝層導蓋板。 曰 當鑽微孔時，可將本創作放置於電路板上，使鑽 二：緩:?層緩衝貫穿力道，並將熱量、靜電吸收傳； ”_、、工由鋁泊層加以定位而進入電路板。其中該導電 表面電阻值為106Ω以下，如此即可有效降低。 帶離，產生靜電亦可藉由導電樹脂緩衝層之傳導而 Q而可有效地避免靜電吸附粉屑所造成之斷針 產生孔層之定位效果，將可使鑽針進人電路板時不合 題生孔偏之現象’並可加以改善孔内樹脂殘留與污染之； 佈、==入緩T蓋板結構簡單’係採以淋膜、塗 貼户方式結合’再以洪烤熟絲著方式製造，因此可 5 M345451 有效提高生產效率及增加成品良率，並可獲得較低之生產製 造成本。 為能更進一步暸解本創作所採取之技術及功效，茲舉一 較佳可行之實施例並配合圖式詳細說明如下。 【實施方式】 請參閱圖一所示，其係為本創作導電緩衝層導蓋板之剖 面示意圖。該鑽微孔用之導電緩衝層導蓋板10係為一複合 材料，其總厚度可依需求調整為30μιη至150μιη，主要係由 一導電樹脂缓衝層30及一鋁箔層20所組成；該導電樹脂緩 衝層30之厚度可達5 // m至75 // m，該導電樹脂緩衝層内容 物之定義如下所述，其中導電性的形成方式包含以下兩種： (1)在以下（A)、（B)樹脂材料中添加具導電性之物質，包括有 導電碳黑（carbon black)或共輕導電而分子’該共耗導電南分 子更可包含聚乙炔、雜環聚合物、芳香族聚合物、不飽和碳 氫及芳香族並存的聚合物等以上任一種或兩種以上混合 物，（2)在以下（A)、（B)樹脂材料表面施以金屬化鍍膜等方 式，使該樹脂緩衝層具有導電性避免靜電累積；被用於施加 上述方式後使其增加導電性之樹脂材料可為：（A)聚酯樹脂、 PU系樹脂、壓克力系樹脂或環氧樹脂、聚丙烯、聚乙烯(PE)、 及聚苯乙烯（PS)等之混成非水溶性抗靜電塗料與塑料及表面 金屬化薄膜，（B)水性乳化樹脂混成物：係將聚多醇類、聚醇 酯類、聚醋酸酯類、聚醚酯類及酸鹼類與脂肪類之皂化產物 M345451 再與魏樹較應狀高分子，«具水可溶性或 環氧樹脂聚合物或以上-種及-種以上之樹脂 此成物等。 心欠:二時:首先，箱層2。可為壓延銘 使用之π而步：" 依而要而加以表面之界面處理，其所 •級錢劑係可切氧峨siiane)類、環氧基類、四 任:;:！機，、醋酸鹽類、脂肪酸鹽、氨基酸類等 面叙，=或/、“物均可。當供乾完成表面處理之單面或雙 ==20時，前揭形成導物旨緩衝層％之材質以 土佈、淋膜或壓貼合方式附著於鋁箔層2〇而 ^ ^ 樹脂緩衝層30與㈣層2〇之結合藉由烘烤^成方式枯= i電=裁切成所需之尺寸大小即可;另外，本創作之 ;緩衝層¥盍板1G亦可依❹厚度將其疊置成二層以上 鑽倣孔用之導電緩衝層導蓋板10，如圖二所示。曰 請參閱圖三、圖四所示’係為本創作使用丁於鑽孔裝置之 鑽孔狀㈣意®及鑽孔狀態4圖。如針對電路板 放業時，首先，將鑽微孔用之導電緩衝層導蓋板二 即-鑽：?上方’當鑽孔裝置40達到預定鑽孔位置， ::鑽針41下降鑽孔’將使該鑽針41先藉 ，衝貫穿力道’並排除鑽孔過程中所產生之靜； =^此，可避免鑽針41表面受靜電吸附使灰塵粉屬 ΓΠ 此外更可減少靜電與高溫對印刷電路 板50材質產生影響，並可加以延長鑽針41之使用妄人盘口 質。再者，當鑽針41持續鑽孔而下降至㈣層2〇;:二 7 M345451 鋁箔層20之定位效果，將可使鑽針41進入電路板50時， 不至於產生孔偏之現象，並可加以改善孔内樹脂殘留與污 染、以及孔口不良之問題。 為便於了解本創作可有效提升鑽孔品質，因此舉實例並 與現行使用之絕緣樹脂塗層銘板作一比較： 習知絕緣樹脂塗層鋁 板（ΙΟΟμιη) 導電緩衝層導蓋板 (90μιη) 斷針率％ 0.5 0.2 鑽孔孔徑：0.075mm，精準度：25 μιη ; 硬板ΒΤ/2片一鑽/每片厚度0.06T/Tmm 習知絕緣樹脂塗層鋁 板(100 μπι) 導電緩衝層導蓋板 (90μπι) 斷針率％ 0.4 0.15 鑽孔孔徑：0.075mm，精準度：25 μπι ; 軟板？1/4片一鑽/每片厚度0.02511/11111111 因此，由上可知，本創作實具有以下之優點： 1.本創作鑽微孔用之導電缓衝層導蓋板，由於設有導電樹脂 緩衝層可使其表面電阻值達1〇6Ω以下，並使鑽孔所產生的 靜電及熱量可有效地經由傳導而帶離，因而避免靜電吸附鑽 針而使粉屑累積所造成之斷針現象產生；其次，可使該鑽針 M345451 :得以定位及緩衝貫穿力道，進而防止鑽孔時孔偏、孔口不良 - 及孔内樹脂殘留與污染之問題。 2·本創作鑽微孔用之導電緩衝層導蓋板結構簡單，由於係採 淋膜、塗佈及壓貼合製程等方式製造，因此製程單純，故可 有效增加生產效率及良率，並可獲得較低之製造成本。 3·本創作鑽微孔用之導電緩衝層導蓋板可減少習知不導電性 •潤滑樹脂型產品之靜電累積、孔㈣留污染，以及儲存條件 鲁限制等問題，使用極為方便。 ,以上所述内谷僅為本案一較佳實施例之說明，而非用以 對本創作作任何限制者。任何熟諳此技#可能湘上揭技術 2容以變更或修飾為其他實施例而不脫離本創作之精神與 範疇，本創作範圍僅由以下申請專利。 【圖式簡單說明】 圖係為本創作導電緩衝層導蓋板之剖面示意圖； %圖二係為本創作二層導電緩衝層導蓋板之剖面示意圖； 圖三係為本創作使用於鑽孔裝置之未鑽孔狀態示意圖；及 圖四係為本創作使用於鑽孔裝置之鑽孔狀態示意圖。 【主要元件符號說明】 20鋁箔層 40鑽孔裝置 50電路板 導電緩衝層導蓋板 30導電樹脂緩衝層 41鑽針With the evolution of electronic technology, many high-tech electronic violations surname #% Dingzuo has been successively released, making humanized and better-functioning electronic products constantly push new and constantly moving toward "light, thin and short." "Small and small" design direction, "all kinds of electronic products must have a printed circuit board p:,, ' (Printed Circuit Board), provide electronic components and make the components to electrical connection. However, in the micro-hole drilling operation of the circuit board, for the hole with smaller aperture, relatively small burs and higher speeds are required to enter the 亍 迕, to avoid surface static electricity, accelerate heat dissipation, and reduce broken needles. Rate and improve the important issues of drilling. μ · Professionals in the industry continue to research and develop the hole. Generally, an insulating resin coating is placed on the circuit board for the drill pin to be covered and supplied to the circuit board: slippery The effect is "only" the insulating resin-coated aluminum plate has a surface resistance value of up to 〇 Ω. The material of the resistance value tends to generate a large amount of static concentration during the coating and cutting process or when the drill bit is cut at a high speed. On the surface of the resin layer, 'even even the surface of the needle (4); therefore, not only (4) the operator's 4 M345451 does not: the dust powder is adsorbed on the surface of the drill needle, causing broken needles and two: two kinds of problems. In addition, the insulation Resin-coated nameplate is mainly reluctant _ by the way of wrapping the drill needle, according to the lubrication of the tool, (4), when the aperture is smaller, the aspect ratio is more and more. The main purpose of the work is to improve the high speed I Drilling operation _ kg generation and heat problems, and to improve the stability of the drilling micro-hole _ needle and life, and thus prevent the phenomenon of broken needle, hole deviation and poor aperture: the purpose of the rushing voice #, this 1彳作系提供—_微The conductive buffer layer is attached to the 1st electricity by lamination, coating and pressure bonding, and then formed into a conductive buffer layer through the bake. The enamel can be used to drill the micropores. Placed on the circuit board, so that the drill two: slow: layer buffer through the force, and heat, static absorption; "_,, the work is positioned by the aluminum layer to enter the board. The conductive surface resistance value is 106 Ω or less, so that it can be effectively reduced. With the separation, the generation of static electricity can also be prevented by the conduction of the conductive resin buffer layer Q, which can effectively avoid the positioning effect of the broken hole caused by the electrostatic adsorption powder, which will make the drill pin into the circuit board. Phenomenon of the hole hole can be used to improve the resin residue and pollution in the hole; cloth, == into the slow T-cover structure is simple 'seed by laminating, coating households combined with 're-baked and cooked Manufacturing, so 5 M345451 can effectively improve production efficiency and increase the yield of finished products, and can obtain lower manufacturing costs. In order to better understand the technology and efficacy of this creation, a preferred embodiment is described in detail below with reference to the drawings. [Embodiment] Please refer to FIG. 1 , which is a schematic cross-sectional view of the conductive buffer layer guide cover. The conductive buffer layer guide cover 10 for the microvia is a composite material, and the total thickness thereof can be adjusted to 30 μm to 150 μm according to requirements, and is mainly composed of a conductive resin buffer layer 30 and an aluminum foil layer 20; The thickness of the conductive resin buffer layer 30 can be up to 5 // m to 75 // m, and the content of the conductive resin buffer layer is defined as follows, wherein the conductivity is formed in the following two ways: (1) In the following (A (B) a conductive material is added to the resin material, including carbon black or lightly conductive, and the molecule 'co-conducting conductive south molecule may further comprise polyacetylene, heterocyclic polymer, aromatic Any one or a mixture of two or more of a polymer, an unsaturated hydrocarbon, and an aromatic polymer, and (2) applying a metallization coating to the surface of the resin material (A) or (B) below The buffer layer is electrically conductive to avoid static electricity accumulation; the resin material used to apply the above-described manner to increase conductivity may be: (A) polyester resin, PU resin, acrylic resin or epoxy resin, polypropylene , polyethylene (PE), and polystyrene A mixture of non-water-soluble antistatic coatings such as ethylene (PS) and plastics and surface metallized films, and (B) a mixture of aqueous emulsion resins: polyalcohols, polyalcohols, polyacetates, polyetheresters The saponified product of the class and the acid and base and the fat, M345451, and the polymer of the eucalyptus, the water-soluble or epoxy resin polymer or the above-mentioned type and above-mentioned resin. I owe: 2 o'clock: First, the box layer 2. It can be used for calendering π step: " According to the surface of the surface treatment, the level of money can be cut oxime siiane), epoxy, four:::! Machine, acetate, fatty acid salt, amino acid, etc., = or /, "all things can be. When the surface is dry for surface treatment or double ==20, the first release of the guide layer buffer layer% The material is attached to the aluminum foil layer by soil cloth, lamination or pressure bonding, and the combination of the resin buffer layer 30 and the (four) layer 2〇 is baked by the method of baking = i electricity = cutting into required The size and size of the buffer layer can also be stacked into two or more layers of the conductive buffer layer guide cover 10 for drilling holes according to the thickness, as shown in FIG.曰Please refer to Figure 3 and Figure 4 for the purpose of creating a drilled hole (4) Italian® and drilling state 4 for the drilling device. For the board, for the first time, drill the micro hole The conductive buffer layer guide cover two is - drill: ? above 'When the drilling device 40 reaches the predetermined drilling position, :: the drill needle 41 descends the drilling hole 'will cause the drilling needle 41 to borrow first, rush through the force track' and exclude The static generated during the drilling process; =^This can avoid the electrostatic adsorption of the surface of the drill needle 41 to make the dust powder belong to ΓΠ and also reduce the static electricity and high temperature for printing The material of the road plate 50 has an influence, and the use of the drill pin 41 can be extended. The burr 41 continues to drill and descends to the (four) layer 2 〇;: 2 7 M345451 aluminum foil layer 20 positioning effect, When the boring needle 41 enters the circuit board 50, the phenomenon of hole deviation is not caused, and the problem of resin residue and contamination in the hole and the hole defect can be improved. To facilitate understanding of the creation, the drilling quality can be effectively improved. Therefore, an example is compared with the currently used insulating resin coated nameplate: Conventional Insulating Resin Coated Aluminum Sheet (ΙΟΟμιη) Conductive Buffer Layer Guide Plate (90μιη) Break Rate % 0.5 0.2 Drilling Aperture: 0.075mm, Accurate Degree: 25 μιη; Hard plate ΒΤ 2 pieces/one drill / thickness 0.06T/Tmm per piece Conventional insulating resin coated aluminum plate (100 μπι) Conductive buffer layer guide plate (90μπι) Break rate % 0.4 0.15 Drill hole diameter :0.075mm, precision: 25 μπι; soft board? 1/4 piece one drill / each piece thickness 0.02511/11111111 Therefore, as can be seen from the above, this creation has the following advantages: 1. The conductive hole used in this creation drill Buffer layer guide cover due to The electric resin buffer layer can make the surface resistance value less than 1〇6Ω, and the static electricity and heat generated by the drilling can be effectively carried away by conduction, thereby avoiding the electrostatic adsorption of the drill needle and the accumulation of dust particles. The needle phenomenon is generated; secondly, the drill needle M345451 can be positioned and buffered through the force path, thereby preventing the hole deviation and the hole defect during the drilling - and the problem of resin residue and contamination in the hole. The conductive buffer layer guide cover has a simple structure and is manufactured by a method such as coating, coating and press-bonding process, so that the process is simple, so that the production efficiency and the yield can be effectively increased, and a lower manufacturing cost can be obtained. 3. The conductive buffer layer guide cover for the micro hole can reduce the conventional non-conductivity. • The static accumulation of the lubricating resin type product, the hole (4) pollution, and the storage condition are limited, which is extremely convenient to use. The above description is only for the description of a preferred embodiment of the present invention, and is not intended to limit the creation of the present invention. Any skill in the art may be changed or modified into other embodiments without departing from the spirit and scope of the present invention. [Simple diagram of the diagram] The diagram is a schematic cross-sectional view of the conductive buffer layer guide cover; % Figure 2 is a schematic cross-sectional view of the two-layer conductive buffer layer guide cover; Figure 3 is the original use for drilling Schematic diagram of the un-drilled state of the device; and Figure 4 is a schematic view of the drilling state used in the drilling device. [Main component symbol description] 20 aluminum foil layer 40 drilling device 50 circuit board Conductive buffer layer guide cover 30 conductive resin buffer layer 41 drill needle