JPH02119294A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To increase mounting density by laminating a linear or rod material of an electronic part in parallel, by integrating it into one body through fusion or adhesive, by cutting it at an approximately right angle to a plate shape, and by electrically connecting exposed conductors, resistors, etc. CONSTITUTION:An appropriate number of linear insulators 1, linear conductors 2 which are coated with an insulator, linear conductors 3 which are provided with a part hole coated with an insulator, and linear resistors 4 coated with an insulator are laminated. They are put in a die to acquire integration state 5 through heating and pressurizing. A board 7 is acquired by cutting it with a diamond saw along a cutting line 6. For example, a conductor 2, a resistor 4, and a conductor 3 equipped with a part fitting hole of the board 7 are connected by plated copper 8 to form a printed wiring board 9 which is made electrically conductive. Conductor paste or a jumper line can be used instead of plated copper. A shape of a linear conductor, etc., can be changed readily, thereby improving bonding with an insulator.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a printed wiring board in which conductors and other materials covered with a sintered body are stacked, integrated, and cut.

[Conventional technology]

In general, printed wiring @ consists of a conductor that forms a circuit and an insulator that holds it. Its production involves melting or melting thermosetting resins such as epoxy resins, phenolic resins, and unsaturated polyester resins, and heat a] plastic resins with relatively high melting points such as polycarbonate resins and fluorine resins on paper or glass fiber paper cloth. This is made into a liquid, and then subjected to an impregnating, heating and drying process to produce a prepreg. A copper-clad wood board (hereinafter referred to as a board) is obtained by placing one or more sheets of copper foil on both sides or one side and applying heat and pressure.

A conductor circuit is formed on the surface layer of this board by a method such as an etched foil method. In the case of a double-sided board, holes are drilled in the cover at the predetermined positions of the board, and conductors on both sides are coated with chemical or electrochemical plating.
*Through-hole connection printed layout with tX air connection
shall be. This hole serves as a mounting and electrical connection point for electronic components such as resistors, capacitors, transistors, LSIs, etc. after the printed wiring board is installed.

Other methods include forming conductor circuits only in the necessary areas by chemical plating without using the steel foil used for the previous plate, and forming conductive circuits directly on the insulator. How to wire it to the required part, how to form a predetermined circuit on another part and transfer it to an insulator, and into a predetermined mold! After molding a mixture of 8 resin and optical filler, the surface layer or holes are chemically plated, and a towara method is used.

The above-mentioned manufacturing methods have been devised and implemented from the viewpoint of usage, characteristics of various materials, productivity, economic efficiency, etc.

[Problem to be solved by the invention]

In manufacturing these printed wiring boards, conductors are fixed to the inner walls of holes drilled in the wafer by plating or the like to electrically connect the upper and lower layers. This plating method can be uniformly applied to the entire area including the large circle. However, when plating a very small diameter hole intended for only 4 conductors or when it is necessary to change the thickness of the conductor in the hole in the same plate, excellent technology and many steps are required.6b.

Furthermore, since the resin used for the insulator is inactive like fluororesin, it may be difficult to form a plating layer.

Furthermore, in the case of plating, its properties and characteristics cannot be changed by each individual.

Furthermore, it would be impossible to place electronic components such as resistors and capacitors into the holes in advance due to the manufacturing process. The purpose is to provide a manufacturing method that can add special functions that are not possible.

[Means to solve the problem]

As a result of extensive research, the inventors of the present invention discovered that, fundamentally different from conventional manufacturing methods, the inventors insulated the conductor parts of holes in printed wiring boards or the materials that would become electronic components such as resistors and capacitors. It has been found that a method of co-forming with the body is effective in solving the above-mentioned problems. Based on this knowledge, the following invention was obtained.

The present invention consists of linear conductors, resistors, capacitors, etc., each coated with a +/- insulator, a wire conductor, a resistor, a capacitor, etc., by arranging and stacking a workpiece-like body and an insulator in parallel, and integrating them by fusing or bonding. Further, this integrated product is cut at a right angle to the longitudinal direction of the conductor, resistor, etc. If necessary, cutting at an angle in the range of about 45 to 135° rather than at a right angle widens the usage conditions.

An electric circuit is completed by connecting the necessary parts of the cross section obtained by the above method with repaired conductors, resistors, etc., using gold plating or conductor wires.

FIG. 1 shows an embodiment of the invention. Although the cross section of each constituent unit in which the conductor 2, resistor 4, etc. are covered with an insulator is square in the figure, the cross section may also be circular. In terms of cross-sectional size, various types can be used, from extremely small to large, in other words, from thin wire to thick rod. Also? Instead of the linear insulator 1 consisting of only the edge, it is also possible to use an insulating material.

It is desirable that the conductor and insulator have strong adhesion from the viewpoint of later required properties. To do this, the conductor surface must be covered with an insulator.
A method of roughening physically or chemically before P! There are ways to chemically enhance the bond with the limbus. ? There are no particular restrictions on the body, and there are many types of bodies. Edge materials can be used. Thermoplastics, thermosets and ceramics can be used. If it is a thermoplastic resin, it is melted by heat melting, and if it is a thermosetting resin, it is brought to the B stage state in advance and then heated and pressurized to integrate it. If it is a ceramic, it is glued between each unit. Use the desired resin. - During incorporation, it is necessary to reduce air bubbles and gaps from the viewpoint of later gas and mechanical properties.

Furthermore, in order to mount electronic components such as I(, LSI, etc.), it is desirable to integrate them into L5 that does not cause deformation or displacement.

The molding method varies depending on the material, but the mold is placed in a certain mold.
It is desirable to do this while maintaining the shape.

As shown in Figure 2, it is OK to cut the integrated material into a plate, and cut it with a diamond saw while cooling it with water to avoid deformation, peeling, or heat generation. The cutting direction is usually perpendicular to the longitudinal direction, but the angle can be changed if necessary. After cutting, polishing to improve the cross-sectional condition is also a method of producing a good printed wiring board.

〔Example〕

Next, embodiments of the present invention will be described in detail.

FIG. 1 shows a linear insulator 1, a linear conductor 2 covered with an insulator, a linear conductor 3 having a component hole covered with an insulator,
An example of a state in which a suitable number of linear resistors 4 each covered with an insulator are stretched is shown.

This was put into a mold and heated and pressed to obtain an integrated state 5t shown in FIG. Furthermore, it was cut with a diamond saw along the cutting line 6 shown in FIG. 3 to obtain the base 8i7 shown in FIG.

FIG. 5 shows a printed layout m@9 in which the conductor 2, resistor 4, and conductor 3 with a hole on the board 7 shown in FIG. 4 are connected by plating copper 8 for electrical continuity. be. Conductor paste or jumpers instead of plated steel?
fM can also be used.

〔Effect of the invention〕

The present invention makes it possible to add the following functions that cannot be obtained using conventional printed wiring board manufacturing methods.

(It was possible to easily change the shape of a single-wire conductor, etc., and thereby improve the contact with the insulator.

(2) Printing and wiring electronic components such as continuous resistors
It was possible to incorporate it into the @, greatly increasing the packaging density.

(3) It has become possible to efficiently manufacture multiple boards that serve as the base for the same printed wiring◎

[Brief explanation of drawings]

Figure 1 is an assembled diagram of a linear iPs body and a wire material containing a conductor, etc., Figure 2 is a diagram of each material integrated, Figure 3 is a cutaway diagram of the integrated deadly material, and Figure 4 is the basic plan obtained by cutting, Figure 5
The figure shows the obtained printed wiring board (8). 1... Linear P! Edge body, 2... Linear conductor of the insulator removing machine, ...... Linear monument having a component hole of the insulator removing machine, ・
・・・・・・Insulator-coated wire resistor. ...Integrated state, 6... Cutting line. ......Substrate, 8...Plated steel.・・・・・・Printed W4 board. Figure 1 Figure 2

Claims (1)

[Claims] Multiple insulators, insulator-coated conductors, insulator-coated resistors, capacitors, and other electronic component wire or bar materials are stacked in parallel and integrated using fusion or adhesive, and then A method for manufacturing a printed wiring board, which comprises cutting the printed wiring board at right angles to form a plate, and electrically connecting exposed conductors, resistors, etc.