JPH0269993A - Lamination layer guide hole machining apparatus - Google Patents

Abstract

PURPOSE:To improve insulation between a conductive and a non-conductive board of a field through-hole by a method wherein printing marks made up of point symmetrical figures are provided near the four corners of a board in a process of forming wiring circuits of a board, the center of the printing marks is recognized using a picture-image recognition apparatus and drilled just before a guide pin is inserted. CONSTITUTION:When a switch of a control panel 16 is pressed, the image center of a CCD camera 5 is aligned with a mark design center point alpha which is obtained from a design value of a board 2. The center point (a) of the mark A printed in a wiring circuit formation process is sought and the coordinates of one end of the board 2 are determined. Next, the coordinates of the center point of other marks are determined and the core G and inclination theta of the board 2 are determined from a given calculation. Next, horizontal movement is made and the center of hole drilling data and the core G are aligned. After its inclination is corrected, a saddle 8 and a stable 1 are moved. A cylinder 13 is driven to make a spindle 6 move downward and a hole is drilled by a drill 7. As a result, even if a board is expanded or shrunk, horizontal position is stabilized and insulation is improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a lamination guide hole processing machine, particularly for processing guide holes for inserting guide pins in the pin lamination method of multilayer printed wiring boards (hereinafter referred to as multilayer boards). Regarding machines.

[Conventional technology]

Multilayer boards are manufactured by stacking multiple single-sided or double-sided printed wiring boards (hereinafter referred to as substrates) and integrally molding them with thermosetting adhesive.The pin lamination method satisfies the positional accuracy between the boards. In order to do this, a jig with guide pins is used, and the holes in the boards are inserted into the guide pins, and the boards are stacked horizontally and integrally molded. In recent years, multilayer boards with as many as 20 layers have been manufactured to stabilize conduction and insulation with non-conducting substrates when field through holes are provided.

[Problem to be solved by the invention]

However, in the conventional pin lamination method, holes in the substrate to be inserted into the guide pins are formed at the same time as holes for interstitial via holes are formed in a substrate drilling step, which is the first stage of the substrate manufacturing process. As a result, heat and mechanical stress are applied to the substrate while passing through the intermediate printing and etching and plating processes, causing dimensional expansion and contraction of the substrate. However, when a field through hole is provided due to horizontal positional deviation with other substrates, conductivity and insulation with non-conductive substrates may deteriorate.

An object of the present invention is to provide a laminated guide hole processing machine that solves the above problems.

[Differences between the invention and the prior art]

In contrast to the above-mentioned conventional method in which the hole in the board to be inserted into the guide pin is provided at the very beginning of the manufacturing process of the board, the present invention creates a printed mark consisting of a point-symmetrical figure near the four corners of the board during the wiring circuit formation process of the board. An image recognition device with a camera is provided as a means for recognizing the center of the printed mark, and dimensions are measured by moving the camera or the board. For drilling holes in the board, use the guide pin to drill holes in the board. Immediately before inserting, position the board by setting the center of the board as the midpoint of a line connecting the circumferences of two triangles formed by the side connecting the center of the printed mark and its diagonal, and set the coordinate axis at the center of the printed mark. The difference is that this is done by finding the bisector of the sides connecting the , and finding the inclination with the preset coordinate axes.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a laminated guide hole processing machine for drilling holes for inserting guide pins in printed wiring in the pin lamination method, which is a lamination method for printed wiring boards. a measuring mechanism that recognizes and measures the center of printed marks provided nearby and the dimensions between the marks using an image processing device having a camera;
and a mechanism for trilling and cutting the holes for inserting the guide pins in response to the expansion and contraction of the printed wiring board, and the measuring mechanism is configured to drill and cut holes for inserting the guide pins in response to expansion and contraction of the printed wiring board, and the measuring mechanism is configured to drill holes for inserting guide pins into holes corresponding to the expansion and contraction of the printed wiring board. The center of the printed wiring is calculated by calculating these values, and the bisector of the sides of the rectangle connecting the centers of the printed marks is found, and the inclination with the preset coordinate axes is calculated. It has a function of calculating the rotation angle of the printed wiring board by calculating these values.

〔Example〕

Hereinafter, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic perspective view showing a laminated guide hole processing machine according to the present invention.

Figures 2 (a) and (b) are diagrams of printed marks used for positioning the board, Figure 3 is a diagram showing how to find the center of the board, and Figure 4 is how to find the tilt of the board. FIG.

In FIG. 1, 1 is a table on which a substrate 2 is placed;
The table 1 includes a guide 3 disposed at the bottom of the table 1 that supports the table 1 and moves it horizontally, a ball screw 4 that converts rotational motion into linear motion, and a servo motor (not shown) that is connected to the ball screw 4 and serves as a rotational drive source. (omitted) is driven back and forth.

5 is a CCD camera with an objective lens directed toward the substrate 2, and 6 is a spindle for rotating the drill, with a drill 7 attached to its lower end and disposed so that the cutting edge of the drill 7 faces downward. A saddle 8 holds a CCD camera 5 and a spindle 6, and is disposed at the rear of the saddle.
A guide 9 that supports the saddle 8 and moves it horizontally, a ball screw 10 that converts rotational motion into linear motion, and a ball screw 1
0 and is driven in the left-right direction by a servo motor 11 which is a rotational drive source. The spindle 6 is fixed to an arm 14 via a hinge 12, which transmits the vertical movement of the cylinder 13.

Reference numeral 15 denotes a pedestal that supports the table 1, the saddle 8, etc., and is supported by legs 15a having a built-in damper (not shown) for vibration prevention.

1G is a control panel for signal processing from the CCD camera and drive sources such as servo motors.

Further, near the corners of the board 2, as shown in FIGS. 2(a) and 2(b), there is a base material part 17 made of polyimide resin or the like which is the base material of the board, and a copper foil 18 covering the surface of the board. A positioning mark, which is a point-symmetric figure, is provided. Next, the operation of the laminated guide hole processing machine of the present invention is shown in Figures 1 and 2 (
This will be explained using a), (b) and FIGS. 3 and 4.

As shown in FIG. 1, when the operator places the board 2 on the table and presses the star 1 switch (not shown) on the control panel 16, the saddle 8 and table 1 move forward and backward.
By moving left and right, the center of the image of the CCD camera 5 is aligned with the mark design center point α obtained from the design values of the board 2, as shown in FIG. At this time, the mark A provided on the substrate 2 is within the field of view of the CCD camera 5, and the coordinates of one end of the substrate 2 are determined by the control panel 16 searching for the center point a of the mark A. Similarly, after aligning the image center of the CCD camera 5 with the mark design center point β point, mark design center point γ point, and mark design center point Δ point, the center point of mark B, mark C, mark D, and center point C. By determining the center point d and the center point d by the control panel 16, the board 2
Find the coordinates of the square part.

Then, the control panel 16 determines the center G of the substrate 2 from the coordinates of the center points a, b, c, and d of the marks A, B, C, and D.

It is possible to find the center G by finding the bisecting point of the straight line EF connecting the circumcenter E point of the triangle obtained from center points a, b, and c and the circumcenter F point of the triangle obtained from center points a, c, and d. can get.

Furthermore, as shown in Figure 4, a straight line a connecting center points a and b
The line connecting the bisector H of b and the bisector ■ of the straight line cd connecting the center points c and d and the line connecting the mark design center points α and Δ, that is, the axis of movement of the saddle 8 or the table 1. The angle is determined, and the inclination θ of the substrate 2 is determined. Thereafter, the control panel 16 moves horizontally according to the drilling information stored in advance, and aligns the center of the drilling information with the core G of the board 2, and adjusts the axis of the drilling information so that the inclination of the board 2 is 0 to 1. /2
Perform calculation to rotate according to . Then, using the obtained results, the saddle 8 and the table 1 are driven horizontally, the spindle 6 is lowered by driving the cylinder 13, and the drill 7 is used to drill a hole in the substrate 2.
is reversely driven and the spindle 6 rises.

Subsequently, the operator takes out the substrate 2 from the table 1, and the series of operations is completed.

〔Effect of the invention〕

As explained above, even if the dimensions of the substrate expand and contract during the printing, etching and plating processes, the holes for inserting the guide pins are made according to the dimensions of the substrate, so the horizontal position stability in the pin lamination method is improved. This has the effect of improving the conduction of the field through hole and the insulation with the non-conductive substrate.

[Brief explanation of the drawing]

Figure 1 is a schematic perspective view showing the laminated guide hole processing machine of the present invention, Figures 2 (a) and (b) are diagrams showing printed marks used for positioning the substrate, and Figure 3 is how the center of the substrate is determined. FIG. 4 is a diagram showing how the inclination of the substrate is determined. 1...Table 2...Substrate 3.9...
・Guide 4, 10...Ball screw 5...
CCD camera 6...Spindle 7...Drill 8...Saddle 11...Servo motor 12...Hinge 13...Cylinder
14... Arm 15... Frame
15a・Foot 16...Control panel 17・
...Base material part 18...Copper foil

Claims (1)

[Claims] (1) Printed marks provided near the four corners of a printed wiring board in a laminated guide hole processing machine that drills holes for guide pin insertion into printed wiring in the pin lamination method, which is a lamination method for printed wiring boards. A measurement mechanism that recognizes and measures the center of the board and the dimensions between the marks using an image processing device having a camera, and drills and cuts holes for inserting the guide pins in response to expansion and contraction of the printed wiring board. and a mechanism, the measuring mechanism determines the center point of the circumcenter of two triangles connecting the centers of the printed marks, calculates the center of the printed wiring by calculating these values, and
A function that calculates the bisector of the sides of the rectangle connecting the centers of the printed marks, calculates the inclination with a preset coordinate axis, and calculates the rotation angle of the printed wiring board by calculating these values. A laminated guide hole processing machine comprising: