JPH0475807A - Guide hole drilling device for lamination - Google Patents

Abstract

PURPOSE:To prevent exercising of an adverse influence due to the change in size of an inner layer plate in a circuit forming process and to realize formation of a high density multilayer plate by forming a guide hole for lamination through optical recognition of a pattern after formation of a circuit pattern. CONSTITUTION:A circuit pattern 13 is previously formed on an inner layer plate 3 by an etching method, reference patterns 14 are formed on the four corners of the inner layer plate 3 simultaneously with formation of the circuit pattern 13, and the inner layer plate 3 is set to a guide hole drilling machine for lamination by using holes for machining origins 15. Machining information responding to a kind of the inner layer plate 3 set to a controller is called, and the position co-ordinates of the reference patterns 14 at the four corners of the inner layer plate 3 are measured by means of a CCD camera. In which case, displacement from the coordinate of a preprogrammed planning position 16 of the reference pattern 14 is calculated to determine a machining origin correction amount. Drilling data is delivered from a controller, and a guide hole 17 for lamination is formed through movement of a table in the direction of an X-axis and a direction theta and a spindle in the direction of an Y-axis.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a guide hole drilling device for lamination, which is a manufacturing equipment for printed wiring boards, and in particular, for drilling guide holes for laminating inner layers of multilayer printed wiring boards of six or more layers. Regarding equipment.

[Conventional technology]

Generally, in the production of high multilayer printed wiring boards with six or more layers,
In order to improve the relative positional accuracy of each inner layer plate during multilayer molding, a lamination jig with positioning bins is used, and inner layer plates with a circuit pattern formed in advance and prepreg are placed alternately on this jig. The bin lamination method is used.

FIGS. 3(a) and 3(b) are perspective views for explaining the manufacturing process of such a multilayer printed wiring board used in a conventional device. First, as shown in Figure (a), the inner layer plate 3 is set in an N/C drilling machine using the processing origin 15, which is a rough positioning hole. ration holes 2 and lamination guide holes 17 are formed.

Next, as shown in FIG. 6(b), after aligning the photomask with reference to the registration hole 2 for the photomask, a zero-order positioning bin for forming the circuit pattern 13 is planted 1 by the photoetching method. Lamination jig-L
Then, assemble the inner layer board 3 and the prive Y/goods by alternately arranging them, and obtain a multilayer board by thermo-compression (-).

[Problems that the invention attempts to solve]

-F In the conventional multilayer printed wiring board mentioned above, in the process of forming a circuit pattern on the inner layer board, there is a dimensional change in the inner layer board due to material deformation M'5 due to surface polishing treatment, machining, and soaking due to 4:l:. Occurs.

This may deteriorate the positional accuracy of the guide ball for lamination with respect to the circuit pattern, resulting in the inner layer board not being able to fit into the positioning groove during assembly on lamination oil, or to avoid this. As the diameter of the guide hole for lamination is increased, the relative position M of the inner layer plates after multilayer formation deteriorates, which is a drawback.

Therefore, attempts have been made to form a circuit pattern and then use an N/C hole puncher to drill guide balls for lamination, but with the N/C hole puncher, the hole position shifts in the θ direction (rotational direction). There is a problem that the positioning accuracy of the guide hole for lamination cannot be obtained due to the problem that the positioning accuracy of the guide hole for lamination cannot be obtained. The present invention provides a guide hole drilling device for laminating multilayer printed wiring boards that improves the relative positional accuracy of a multilayer printed wiring board.

[An easy way to solve problems]

The lamination guide hole drilling device of the present invention includes: a camera that measures each coordinate of an inner layer material reference pattern of a printed wiring board by optical recognition; a drill mechanism arranged with the camera at a predetermined dimensional pitch; Arranged below the drill mechanism!
- 7 X, ¥, θ movable A movable chile-pull camera measures the t nibbles and creates machining data for It is a device.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention. In the figure, 5 and 1 are the main body of the guide hole drilling machine for lamination.
Reference numeral 6 designates a table on which the inner layer plate 3 to be drilled is fixed, and which is movable in the X-axis direction by a moon guide 4 and a ball screw 5, and also rotates in the θ direction by a mechanism (not shown).

Further, the spindle 7 is arranged on the saddle 8 with a CCD camera 9 at a predetermined pitch. The saddle 8 is mounted by the guide 4, the ball IZ 5, and the servo motor 10.
It moves "T" in the axial direction.Furthermore, although not shown, a servo motor for rotating the table 6 in the θ direction is provided.

A drill 1 for machining guide balls for lamination is attached to the tip of the spindle 7, and is movable in the Y-axis direction by a servo motor 10. 12 performs arithmetic processing on the data measured by the CCD camera 9.

This is a controller that issues a command to the servo moder 10, etc. to determine the hole size ζl by creating machining data for X, Y, and θ.

Next, the operation of the present implementation@device will be explained. Figure 2 (a>,
(b) is a perspective view showing the manufacturing process of the multilayer printed wiring board used in this example.

First, as shown in FIG. 2(a), the circuit pattern 13 is formed by using the face etching method G to form the circuit pattern 13 on the inner layer plate 3. The circuit patterns 13 are formed at the same time at the four corners of the four corners, and this is done by adding a pattern corresponding to the reference patterns 1-4 on the mask of the four 1.

The inner layer plate 3 in this state is inserted into the first
Wl in the figure, fix the bottle to the station guide hole drilling machine and attach it to the cellar 1-6. Next, put it on the controller 12
: Corresponds to the type of inner layer plate 3 L f : : Call up the processing information and stir the star h. Then, the CCD camera 9 first detects the reference pattern of the four corners of the inner layer plate 3 at the W coordinate (X
i, Yi) (i=1z4>).

Here, the roughness of the reference pattern 14 is determined and the programmed design position ff16 (m layer phase guide hole H-17
displacement from the coordinates (ΔXi, ΔYi
) (i = 1 to 4) and calculate 1, the machining origin correction amount (Ax,
Find Ay).

12. Calculation method of machining origin correction amount in this case; There are methods using the average value, methods using the least square mean value, and methods using the maximum to minimum value, but here we will use the maximum to minimum value, which is easy to calculate.
The minimum value method is adopted.

That is, in this case, the processing origin correction amount <Ax.

Ay) is Ax= As a result of manufacturing an 8-layer board with a size of 500 m × 500 mm using a board with a thickness of 0.1 mm and a copper foil thickness of 35 μm (both sides), the amount of misalignment of each inner layer with respect to the - layer surface is shown in Table 1. It is as follows. Also, the results of the conventional device and this example will be compared and shown here.

Table 1 Unit = μ1 Next, the drilling data that takes into account the correction amounts (Ax, Ay) is sent from the controller 12, and
The table 6 is moved in the Y-axis direction, and the spindle 7 is moved in the Y-axis direction, and by moving the spindle 7 up and down, a guide hole 17 for lamination is bored as shown in FIG. 2(b).

In this example, the material of the inner layer plate 3 and the amount of positional deviation in Table 1 are calculated by assuming a certain position on the first layer surface, statistically processing the amount of positional deviation of each inner layer plate with respect to that position, and calculating the variation in the amount of deviation. (3σ) for comparison with the conventional method.

The amount of positional deviation is determined by the material direction (X direction) and the orthogonal direction of the material (X direction).
represents the absolute value of the vector direction obtained by combining X and Y.

For example, the conventional vector direction variation of the three-layer surface is 3σ
= 300 μ■, whereas according to this embodiment, 3σ =
The amount of fat was 240μ, which means that the accuracy has been improved by 60μ.

〔Effect of the invention〕

As explained above, the guide hole drilling device for lamination of the present invention forms the guide holes for lamination by optically recognizing the pattern after forming the circuit pattern, thereby eliminating the negative effects caused by dimensional changes of the inner layer board during the circuit forming process. This has the effect of eliminating the problem and realizing the formation of a high-density multilayer board.

1A and 1B are perspective views showing a multilayer printed wiring board used in a conventional device in the order of manufacturing steps.

1...Main body, 2...Registration hole, 3...
・Inner layer plate, 4... Guide, 5... Ball screw, 6.
...Table, 7...Spindle, 8...Saddle,
9... CCD camera, 10... Servo motor, 11
...Drill, 12...Controller 13...
Circuit pattern, 14... Reference pattern, 15... Processing origin, 16... Design position, 17... Guide hole for lamination.

Claims (1)

[Claims] A camera that measures each coordinate of the inner layer material reference pattern of the printed wiring board by optical recognition, a drill mechanism arranged at a dimensional pitch determined by the camera, and X, Y, A guide hole drilling device for lamination, comprising a θ movable table and a controller that processes data measured by a camera and creates X, Y, and θ machining data.