CN103521871B - 用于在基板上分配无焊剂焊料的方法和设备 - Google Patents

用于在基板上分配无焊剂焊料的方法和设备 Download PDF

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Publication number
CN103521871B
CN103521871B CN201310269081.0A CN201310269081A CN103521871B CN 103521871 B CN103521871 B CN 103521871B CN 201310269081 A CN201310269081 A CN 201310269081A CN 103521871 B CN103521871 B CN 103521871B
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CN
China
Prior art keywords
solder
pressing part
substrate
dispensing head
welding wire
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Application number
CN201310269081.0A
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English (en)
Chinese (zh)
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CN103521871A (zh
Inventor
海因里希·贝希托尔德
勒内·贝特沙特
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Besi Switzerland AG
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Besi Switzerland AG
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Publication of CN103521871A publication Critical patent/CN103521871A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/025—Bits or tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01971—Cleaning, e.g. oxide removal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201310269081.0A 2012-07-05 2013-06-28 用于在基板上分配无焊剂焊料的方法和设备 Active CN103521871B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CH01044/12 2012-07-05

Publications (2)

Publication Number Publication Date
CN103521871A CN103521871A (zh) 2014-01-22
CN103521871B true CN103521871B (zh) 2016-12-28

Family

ID=49578377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310269081.0A Active CN103521871B (zh) 2012-07-05 2013-06-28 用于在基板上分配无焊剂焊料的方法和设备

Country Status (11)

Country Link
US (2) US9339885B2 (https=)
JP (1) JP6150205B2 (https=)
KR (1) KR102136896B1 (https=)
CN (1) CN103521871B (https=)
CH (2) CH706712A1 (https=)
DE (1) DE102013105931A1 (https=)
FR (1) FR2992879B1 (https=)
IT (1) ITAN20130119A1 (https=)
MX (1) MX362114B (https=)
MY (1) MY175176A (https=)
TW (1) TWI561324B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
CN108326390B (zh) * 2017-01-17 2021-03-23 白光株式会社 熔融控制装置及计算机可读存储介质
DE102019103140A1 (de) 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
CN110190001B (zh) * 2019-06-05 2020-11-03 扬州扬杰电子科技股份有限公司 一种轴向二极管的加工工艺

Citations (7)

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US5108023A (en) * 1989-11-14 1992-04-28 Esec Sa Device for forming electric circuits on a lead frame
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
CN1392816A (zh) * 2000-06-02 2003-01-22 株式会社日矿材料 钎焊材料的涂敷方法和装置
JP2004214354A (ja) * 2002-12-27 2004-07-29 Nec Machinery Corp ろう材供給ノズル
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
CN102259222A (zh) * 2010-02-23 2011-11-30 肖特太阳能股份公司 用于在工件上涂覆焊料的方法和装置
JP2012016744A (ja) * 2010-07-09 2012-01-26 Honda Motor Co Ltd 半田付け装置及び方法

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GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
JPS57188832A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Soldering method
JPS6334269Y2 (https=) * 1981-05-28 1988-09-12
US4577398A (en) 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4709849A (en) 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JPS6450595A (en) 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
JPH04178266A (ja) * 1990-11-08 1992-06-25 Apollo Seiko Kk はんだゴテのコテ先構造
GB9126530D0 (en) * 1991-12-13 1992-02-12 Spirig Ernest Soldering device
JPH0745646A (ja) 1993-07-28 1995-02-14 Hitachi Ltd はんだ塗布装置
EP0752294B1 (de) 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
JP2844330B2 (ja) * 1996-05-09 1999-01-06 黒田電気株式会社 超音波ハンダ付方法及び装置
DE59708121D1 (de) 1997-01-08 2002-10-10 Esec Trading Sa Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
JP2006315043A (ja) * 2005-05-13 2006-11-24 Toko Inc リフロー溶接装置
JP2008296265A (ja) * 2007-06-01 2008-12-11 Canon Inc はんだ付け装置
US7699208B2 (en) * 2007-11-30 2010-04-20 Nordson Corporation Soldering tip, soldering iron, and soldering system
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JP5411542B2 (ja) * 2008-10-27 2014-02-12 和仁 鬼頭 溶接装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108023A (en) * 1989-11-14 1992-04-28 Esec Sa Device for forming electric circuits on a lead frame
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
CN1392816A (zh) * 2000-06-02 2003-01-22 株式会社日矿材料 钎焊材料的涂敷方法和装置
JP2004214354A (ja) * 2002-12-27 2004-07-29 Nec Machinery Corp ろう材供給ノズル
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
CN102259222A (zh) * 2010-02-23 2011-11-30 肖特太阳能股份公司 用于在工件上涂覆焊料的方法和装置
JP2012016744A (ja) * 2010-07-09 2012-01-26 Honda Motor Co Ltd 半田付け装置及び方法

Also Published As

Publication number Publication date
TWI561324B (en) 2016-12-11
DE102013105931A1 (de) 2014-01-09
CH706738B1 (de) 2017-05-15
FR2992879A1 (fr) 2014-01-10
CN103521871A (zh) 2014-01-22
MX362114B (es) 2019-01-07
JP6150205B2 (ja) 2017-06-21
CH706712A1 (de) 2014-01-15
KR102136896B1 (ko) 2020-07-23
US9339885B2 (en) 2016-05-17
CH706738A2 (de) 2014-01-15
MX2013007925A (es) 2014-01-17
US20140008421A1 (en) 2014-01-09
US20160256949A1 (en) 2016-09-08
JP2014014868A (ja) 2014-01-30
MY175176A (en) 2020-06-12
ITAN20130119A1 (it) 2014-01-06
TW201408409A (zh) 2014-03-01
KR20140005784A (ko) 2014-01-15
FR2992879B1 (fr) 2016-12-16

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