JP6150205B2 - フラックスフリーのハンダを基板に供給する方法および装置 - Google Patents
フラックスフリーのハンダを基板に供給する方法および装置 Download PDFInfo
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- JP6150205B2 JP6150205B2 JP2013130895A JP2013130895A JP6150205B2 JP 6150205 B2 JP6150205 B2 JP 6150205B2 JP 2013130895 A JP2013130895 A JP 2013130895A JP 2013130895 A JP2013130895 A JP 2013130895A JP 6150205 B2 JP6150205 B2 JP 6150205B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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Description
A)ディスペンサーヘッドを、ハンダを供給すべき次の基板箇所の上の所定位置に移動し、
B)スタンプを:
B1)スタンプの作業面が基板箇所に接触するまで、または
B2)スタンプの作業面が基板箇所の上の所定の高さの位置に来るまで、または
B3)スタンプの作業面が基板箇所に接触するまで下げ、それからスタンプを基板箇所の上の所定の高さに上げ、
B2およびB3に述べる高さは、以下の手順Dでスタンプの作業面がハンダで濡れるように設定し、
C)フラックスフリーのハンダを:
C1)糸ハンダの先端がスタンプの凹部内で基板箇所に接触するように、糸ハンダが基板箇所に接触するまで糸ハンダを送り出し、
C2)所定量のハンダが溶けるように、糸ハンダをさらに送り出し、それから
C3)糸ハンダを引き戻す
という方法で基板箇所に供給し、
D)基板箇所上にハンダを配置するために、ディスペンサーヘッドを所定の経路に沿って移動させ、同時にスタンプに超音波を照射し、さらに
E)スタンプを上げ、
手順Dは手順C3の後に実施するか、または手順C2の間に開始する。
水平二方向に、および任意で垂直方向に移動可能なディスペンサーヘッドを備え、このディスペンサーヘッドが、
超音波ヘッド、
スタンプの外側面に向かって開いている凹部を有する作業面を有するスタンプであって、超音波ヘッドに固定可能なスタンプ、
それを通して糸ハンダをガイドすることができる長手方向の孔を有するノズルを有する糸送り機構であって、ノズルの長手方向の孔を通って伸びる糸送り機構の縦軸がスタンプの外側面で凹部に入り、凹部で囲まれた作業面の一部内で基板に達する糸送り機構、および
スタンプの作業温度を所定温度に保つよう構成された冷却装置を備える。
A)ディスペンサーヘッド2を、ハンダを供給すべき次の基板箇所の上の所定位置に移動し、
B)スタンプを:
B1)スタンプ5の作業面11が基板箇所に接触するまで、または
B2)スタンプ5の作業面11が基板箇所の上の所定の高さの位置に来るまで、または
B3)スタンプ5の作業面11が基板箇所に接触するまで下げ、それからスタンプ5を基板箇所の上の所定の高さに上げ、
B2およびB3に述べる高さは、以下の手順Dでスタンプ5の作業面11がハンダで濡れるように設定し、
C)フラックスフリーのハンダを:
C1)糸ハンダ8の先端がスタンプ5の凹部12内で基板箇所に接触するように、糸ハンダ8が基板箇所に接触するまで糸ハンダ8を送り出し、
C2)所定量のハンダが溶けるように、糸ハンダ8をさらに送り出し、それから
C3)糸ハンダ8を引き戻す
という方法で基板箇所に供給し、
D)基板箇所上にハンダを配置するために、ディスペンサーヘッド2を所定の経路に沿って移動させ、同時にスタンプ5に超音波を照射し、さらに
E)スタンプ5を上げ、
手順Dは手順C3の後に実施するか、または手順C2の間に開始する。
Claims (8)
- スタンプ(5)、前記スタンプ(5)に超音波を照射するよう構成された超音波ヘッド(4)および糸送り機構(6)を備えるディスペンサーヘッド(2)を備える供給装置を用いる、フラックスフリーのハンダを基板(1)の基板箇所上に供給するための方法であって、前記スタンプ(5)が前記スタンプ(5)の外側面(13)に向かって開いている凹部(12)を有する作業面(11)を有し、前記糸送り機構(6)が糸ハンダ(8)を前記基板(1)の表面に対して斜めに傾けて送り出し、加熱可能な支持台(3)で、基板(1)をハンダの溶融温度より高温に加熱し、前記方法は以下の手順を含む:
A)前記ディスペンサーヘッド(2)を、ハンダを供給すべき次の基板箇所の上の所定位置に移動し、
B)前記スタンプ(5)を:
B1)前記スタンプ(5)の前記作業面(11)が前記基板箇所に接触するまで、または
B2)前記スタンプ(5)の前記作業面(11)が前記基板箇所の上の所定の高さの位置に来るまで、または
B3)前記スタンプ(5)の前記作業面(11)が前記基板箇所に接触するまで下げ、それから前記スタンプ(5)を前記基板箇所の上の所定の高さに上げ、
B2およびB3に述べる前記高さは、以下の手順Dで前記スタンプ(5)の前記作業面(11)がハンダで濡れるように設定し、
C)フラックスフリーのハンダを:
C1)前記糸ハンダ(8)の先端が前記スタンプ(5)の前記凹部(12)内で前記基板箇所に接触するように、前記糸ハンダ(8)が基板箇所に接触するまで前記糸ハンダ(8)を送り出し、
C2)所定量のハンダが溶けるように、前記糸ハンダ(8)をさらに送り出し、それから
C3)前記糸ハンダ(8)を引き戻す
という方法で前記基板箇所に供給し、
D)前記基板箇所上にハンダを配置するために、前記ディスペンサーヘッド(2)を所定の経路に沿って移動させ、同時に前記スタンプ(5)に超音波を照射し、さらに
E)前記スタンプ(5)を上げ、
手順Dは手順C3の後に実施するか、または手順C2の間に開始する、方法。 - ノズル(7)を通しての前記糸ハンダ(8)の送り出しおよび前記ノズル(7)の積極的な冷却をさらに含む、請求項1に記載の方法。
- 前記経路(19)の開始点は前記基板箇所の中心の近くにあり、さらに前記経路(19)が前記基板箇所の内側から外側に進んでいる、請求項1または2に記載の方法。
- 前記スタンプ(5)の前記凹部(12)はフラックスフリーのハンダで濡れにくい材料でコーティングされている、請求項1から3のうちいずれか一項に記載の方法。
- ハンダの溶融温度より高温に、基板(1)を加熱するための加熱可能な支持台(3)、および、水平二方向に、および任意で垂直方向に移動可能なディスペンサーヘッド(2)を備えるフラックスフリーのハンダを基板(1)の基板箇所上に供給するための装置であって、
前記ディスペンサーヘッド(2)が、
超音波ヘッド(4)、
作業面(11)を有するスタンプ(5)であって、前記作業面(11)が前記スタンプ(5)の外側面(13)に向かって開いている凹部(12)を有し、前記超音波ヘッド(4)に固定可能なスタンプ(5)、
それを通して糸ハンダをガイドすることができる長手方向の孔を有するノズル(7)を有する糸送り機構(6)であって、前記ノズル(7)の長手方向の孔を通って伸びる前記糸送り機構(6)の縦軸(14)が前記スタンプ(5)の前記外側面(13)で前記凹部(12)に入り、前記スタンプ(5)の前記凹部(12)内で、前記糸ハンダが基板(1)に達するように、前記凹部(12)で囲まれた前記作業面(11)の一部内で前記基板(1)に達する前記糸送り機構(6)、
および、前記スタンプ(5)の作業温度を所定温度に保つよう構成された冷却装置(16)を備える、装置。 - 前記糸送り機構(6)の前記ノズル(7)を冷却するための冷却装置(15)をさらに備える、請求項5に記載の装置。
- 前記スタンプ(5)とともに前記超音波ヘッド(4)を垂直方向に上下移動させるよう構成された、前記ディスペンサーヘッド(2)に固定された駆動部(17)をさらに備える、請求項5または6に記載の装置。
- 前記スタンプ(5)の前記凹部(12)はフラックスフリーのハンダによって濡れにくい材料でコーティングされている、請求項5から7のうちいずれか一項に記載の装置。
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CH01044/12 | 2012-07-05 | ||
CH01044/12A CH706712A1 (de) | 2012-07-05 | 2012-07-05 | Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. |
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DE102014109934A1 (de) * | 2014-07-15 | 2016-01-21 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots |
CN108326390B (zh) * | 2017-01-17 | 2021-03-23 | 白光株式会社 | 熔融控制装置及计算机可读存储介质 |
DE102019103140A1 (de) | 2019-02-08 | 2020-08-13 | Jenoptik Optical Systems Gmbh | Verfahren zum Löten eines oder mehrerer Bauteile |
CN110190001B (zh) * | 2019-06-05 | 2020-11-03 | 扬州扬杰电子科技股份有限公司 | 一种轴向二极管的加工工艺 |
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2012
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- 2013-06-05 FR FR1355167A patent/FR2992879B1/fr not_active Expired - Fee Related
- 2013-06-07 DE DE102013105931.7A patent/DE102013105931A1/de active Pending
- 2013-06-12 US US13/916,079 patent/US9339885B2/en not_active Expired - Fee Related
- 2013-06-17 MY MYPI2013002241A patent/MY175176A/en unknown
- 2013-06-17 TW TW102121334A patent/TWI561324B/zh active
- 2013-06-21 JP JP2013130895A patent/JP6150205B2/ja active Active
- 2013-06-28 CN CN201310269081.0A patent/CN103521871B/zh active Active
- 2013-07-01 IT IT000119A patent/ITAN20130119A1/it unknown
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Publication number | Publication date |
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FR2992879A1 (fr) | 2014-01-10 |
CN103521871A (zh) | 2014-01-22 |
DE102013105931A1 (de) | 2014-01-09 |
KR20140005784A (ko) | 2014-01-15 |
KR102136896B1 (ko) | 2020-07-23 |
FR2992879B1 (fr) | 2016-12-16 |
CN103521871B (zh) | 2016-12-28 |
TWI561324B (en) | 2016-12-11 |
ITAN20130119A1 (it) | 2014-01-06 |
US20160256949A1 (en) | 2016-09-08 |
US9339885B2 (en) | 2016-05-17 |
CH706738A2 (de) | 2014-01-15 |
CH706738B1 (de) | 2017-05-15 |
MX2013007925A (es) | 2014-01-17 |
TW201408409A (zh) | 2014-03-01 |
US20140008421A1 (en) | 2014-01-09 |
CH706712A1 (de) | 2014-01-15 |
MX362114B (es) | 2019-01-07 |
MY175176A (en) | 2020-06-12 |
JP2014014868A (ja) | 2014-01-30 |
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