CH627877A5 - Substrat d'interconnexion de composants electroniques a circuits integres. - Google Patents

Substrat d'interconnexion de composants electroniques a circuits integres. Download PDF

Info

Publication number
CH627877A5
CH627877A5 CH1028178A CH1028178A CH627877A5 CH 627877 A5 CH627877 A5 CH 627877A5 CH 1028178 A CH1028178 A CH 1028178A CH 1028178 A CH1028178 A CH 1028178A CH 627877 A5 CH627877 A5 CH 627877A5
Authority
CH
Switzerland
Prior art keywords
conductive
insulating
pad
substrate
repair
Prior art date
Application number
CH1028178A
Other languages
English (en)
French (fr)
Inventor
Bernard Badet
Karel Kurzweil
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of CH627877A5 publication Critical patent/CH627877A5/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CH1028178A 1977-10-03 1978-10-03 Substrat d'interconnexion de composants electroniques a circuits integres. CH627877A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729687A FR2404990A1 (fr) 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation

Publications (1)

Publication Number Publication Date
CH627877A5 true CH627877A5 (fr) 1982-01-29

Family

ID=9196039

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1028178A CH627877A5 (fr) 1977-10-03 1978-10-03 Substrat d'interconnexion de composants electroniques a circuits integres.

Country Status (11)

Country Link
US (1) US4371744A (enExample)
JP (1) JPS5461669A (enExample)
BE (1) BE870879A (enExample)
CA (1) CA1115853A (enExample)
CH (1) CH627877A5 (enExample)
DE (1) DE2843144A1 (enExample)
FR (1) FR2404990A1 (enExample)
GB (1) GB2009516B (enExample)
IT (1) IT1159117B (enExample)
NL (1) NL7809276A (enExample)
SE (1) SE441880B (enExample)

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US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
JPS5946740A (ja) * 1982-09-09 1984-03-16 Ricoh Co Ltd 光書込デバイス
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BR8407221A (pt) * 1983-12-15 1985-11-26 Laserpath Corp Circuito eletrico e processo para proporcionar um circuito eletrico
US4546413A (en) * 1984-06-29 1985-10-08 International Business Machines Corporation Engineering change facility on both major surfaces of chip module
US4584625A (en) * 1984-09-11 1986-04-22 Kellogg Nelson R Capacitive tactile sensor
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
JPS61131497A (ja) * 1984-11-29 1986-06-19 富士通株式会社 多層プリント基板
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4789760A (en) * 1985-04-30 1988-12-06 Advanced Micro Devices, Inc. Via in a planarized dielectric and process for producing same
US4659931A (en) * 1985-05-08 1987-04-21 Grumman Aerospace Corporation High density multi-layered integrated circuit package
JPS61296800A (ja) * 1985-06-25 1986-12-27 日本電気株式会社 設計変更用電極
JPS6253000A (ja) * 1985-08-31 1987-03-07 日本電気株式会社 半導体の実装構造
DE3679627D1 (de) * 1985-09-24 1991-07-11 Contraves Ag Mehrschichtige gedruckte schaltungsplatte.
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes
US4652974A (en) * 1985-10-28 1987-03-24 International Business Machines Corporation Method and structure for effecting engineering changes in a multiple device module package
JPS62136098A (ja) * 1985-12-09 1987-06-19 富士通株式会社 高密度配線基板
JPS63170994A (ja) * 1986-05-30 1988-07-14 古河電気工業株式会社 多層プリント配線板及びその製造方法
US5229548A (en) * 1986-10-27 1993-07-20 Black & Decker Inc. Circuit board having a stamped substrate
US4829404A (en) * 1987-04-27 1989-05-09 Flexmark, Inc. Method of producing a flexible circuit and master grid therefor
US4935584A (en) * 1988-05-24 1990-06-19 Tektronix, Inc. Method of fabricating a printed circuit board and the PCB produced
ATE115335T1 (de) * 1988-09-30 1994-12-15 Raychem Ltd Verbindungsartikel für hybrid-mikrochip.
KR930010076B1 (ko) * 1989-01-14 1993-10-14 티디케이 가부시키가이샤 다층혼성집적회로
JPH02265243A (ja) * 1989-04-05 1990-10-30 Nec Corp 多層配線およびその形成方法
US5231304A (en) * 1989-07-27 1993-07-27 Grumman Aerospace Corporation Framed chip hybrid stacked layer assembly
MY105486A (en) * 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5224022A (en) * 1990-05-15 1993-06-29 Microelectronics And Computer Technology Corporation Reroute strategy for high density substrates
US5132648A (en) * 1990-06-08 1992-07-21 Rockwell International Corporation Large array MMIC feedthrough
US5093708A (en) * 1990-08-20 1992-03-03 Grumman Aerospace Corporation Multilayer integrated circuit module
US5220490A (en) * 1990-10-25 1993-06-15 Microelectronics And Computer Technology Corporation Substrate interconnect allowing personalization using spot surface links
US5338900A (en) * 1991-03-06 1994-08-16 International Business Machines Corporation Structures for electrically conductive decals filled with inorganic insulator material
US5306872A (en) * 1991-03-06 1994-04-26 International Business Machines Corporation Structures for electrically conductive decals filled with organic insulator material
US5128749A (en) * 1991-04-08 1992-07-07 Grumman Aerospace Corporation Fused high density multi-layer integrated circuit module
JP3197022B2 (ja) * 1991-05-13 2001-08-13 ティーディーケイ株式会社 ノイズサプレッサ用積層セラミック部品
US5209798A (en) * 1991-11-22 1993-05-11 Grunman Aerospace Corporation Method of forming a precisely spaced stack of substrate layers
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5436412A (en) * 1992-10-30 1995-07-25 International Business Machines Corporation Interconnect structure having improved metallization
US5308926A (en) * 1992-12-08 1994-05-03 Premisys Communications, Inc. Compact isolating backplane for routing electronic signals
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
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US5909011A (en) * 1996-08-01 1999-06-01 International Business Machines Corporation Method and apparatus for modifying circuit having ball grid array interconnections
US6329594B1 (en) 1998-01-16 2001-12-11 Bae Systems Information And Electronic Systems Integration, Inc. Integrated circuit package
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US3691290A (en) * 1970-12-14 1972-09-12 Ibm Deletable conductor line structure
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FR2241946B1 (enExample) * 1973-08-24 1976-11-19 Honeywell Bull Soc Ind
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat

Also Published As

Publication number Publication date
SE7810314L (sv) 1979-04-04
DE2843144C2 (enExample) 1989-07-13
DE2843144A1 (de) 1979-04-12
JPS5461669A (en) 1979-05-18
FR2404990B1 (enExample) 1980-02-15
BE870879A (fr) 1979-01-15
IT1159117B (it) 1987-02-25
GB2009516A (en) 1979-06-13
NL7809276A (nl) 1979-04-05
US4371744A (en) 1983-02-01
IT7828018A0 (it) 1978-09-25
GB2009516B (en) 1982-03-24
CA1115853A (fr) 1982-01-05
SE441880B (sv) 1985-11-11
FR2404990A1 (fr) 1979-04-27

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