CA2479794A1 - Electropolishing and/or electroplating apparatus and methods - Google Patents

Electropolishing and/or electroplating apparatus and methods Download PDF

Info

Publication number
CA2479794A1
CA2479794A1 CA002479794A CA2479794A CA2479794A1 CA 2479794 A1 CA2479794 A1 CA 2479794A1 CA 002479794 A CA002479794 A CA 002479794A CA 2479794 A CA2479794 A CA 2479794A CA 2479794 A1 CA2479794 A1 CA 2479794A1
Authority
CA
Canada
Prior art keywords
wafer
chuck
liquid
further including
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002479794A
Other languages
English (en)
French (fr)
Inventor
Hui Wang
Voha Nuch
Felix Gutman
Muhammed Afnan
Himanshu J. Chokshi
Mark Jacobus Van Kerkwyk
Damon L. Koehler
Peihaur Yih
My Hoang Nguyen
Ru Kao Chang
Frederick Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2479794A1 publication Critical patent/CA2479794A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/30—Polishing of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
CA002479794A 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods Abandoned CA2479794A1 (en)

Applications Claiming Priority (17)

Application Number Priority Date Filing Date Title
US37095602P 2002-04-08 2002-04-08
US37092902P 2002-04-08 2002-04-08
US37095502P 2002-04-08 2002-04-08
US37091902P 2002-04-08 2002-04-08
US60/370,929 2002-04-08
US60/370,955 2002-04-08
US60/370,956 2002-04-08
US60/370,919 2002-04-08
US37256702P 2002-04-14 2002-04-14
US37254202P 2002-04-14 2002-04-14
US37256602P 2002-04-14 2002-04-14
US60/372,567 2002-04-14
US60/372,566 2002-04-14
US60/372,542 2002-04-14
US39046002P 2002-06-21 2002-06-21
US60/390,460 2002-06-21
PCT/US2003/010725 WO2003087436A1 (en) 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods

Publications (1)

Publication Number Publication Date
CA2479794A1 true CA2479794A1 (en) 2003-10-23

Family

ID=29255769

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002479794A Abandoned CA2479794A1 (en) 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods

Country Status (10)

Country Link
US (1) US20050218003A1 (https=)
EP (1) EP1492907A4 (https=)
JP (5) JP2005522585A (https=)
KR (1) KR20040099407A (https=)
CN (2) CN101353810B (https=)
AU (1) AU2003226319A1 (https=)
CA (1) CA2479794A1 (https=)
SG (1) SG159384A1 (https=)
TW (1) TWI274393B (https=)
WO (1) WO2003087436A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114990549A (zh) * 2022-05-30 2022-09-02 高红霞 一种汽车冲压模具铸件表面拉毛装置及方法

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7323416B2 (en) 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US7232514B2 (en) 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
US7128825B2 (en) 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) 2001-04-10 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7997288B2 (en) 2002-09-30 2011-08-16 Lam Research Corporation Single phase proximity head having a controlled meniscus for treating a substrate
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
CN100419121C (zh) * 2004-05-12 2008-09-17 鸿富锦精密工业（深圳）有限公司 湿蚀刻设备
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
US7928366B2 (en) 2006-10-06 2011-04-19 Lam Research Corporation Methods of and apparatus for accessing a process chamber using a dual zone gas injector with improved optical access
CN101237027B (zh) * 2006-08-04 2011-05-11 E.I.内穆尔杜邦公司 用于在基底上沉积空气感光材料的方法
US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
US20080107509A1 (en) * 2006-11-07 2008-05-08 Whitcomb Preston X Vacuum end effector for handling highly shaped substrates
US20100183420A1 (en) * 2006-11-27 2010-07-22 Jakob Blattner Transfer device for an overhead conveying system
US8146902B2 (en) 2006-12-21 2012-04-03 Lam Research Corporation Hybrid composite wafer carrier for wet clean equipment
US7479463B2 (en) * 2007-03-09 2009-01-20 Tokyo Electron Limited Method for heating a chemically amplified resist layer carried on a rotating substrate
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
US8172989B2 (en) * 2007-11-26 2012-05-08 Sunpower Corporation Prevention of substrate edge plating in a fountain plating process
KR101571180B1 (ko) 2007-12-27 2015-11-23 램 리써치 코포레이션 위치 및 오프셋을 결정하는 장치 및 방법
KR101590655B1 (ko) 2007-12-27 2016-02-18 램 리써치 코포레이션 동적 정렬 빔 교정의 방법 및 시스템
US8229496B2 (en) * 2007-12-27 2012-07-24 Nec Corporation Mobile phone terminal
US8751047B2 (en) 2007-12-27 2014-06-10 Lam Research Corporation Systems and methods for calibrating end effector alignment in a plasma processing system
US8954287B2 (en) 2007-12-27 2015-02-10 Lam Research Corporation Systems and methods for calibrating end effector alignment using at least a light source
US7901475B2 (en) * 2008-01-18 2011-03-08 Gm Global Technology Operations, Inc. Diesel particulate filter with zoned resistive heater
CN101580945B (zh) * 2008-05-12 2012-12-05 盛美半导体设备（上海）有限公司 电沉积系统
US8369978B2 (en) * 2008-09-04 2013-02-05 Applied Materials Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
KR101689550B1 (ko) 2009-01-11 2016-12-26 어플라이드 머티어리얼스, 인코포레이티드 기판들을 운반하기 위한 정전기 엔드 이펙터 장치, 시스템들 및 방법들
CN101851776B (zh) * 2009-03-30 2011-10-05 昆山中辰矽晶有限公司 硅芯片边缘的处理方法
CN102251268B (zh) * 2010-05-19 2013-05-22 易生科技(北京)有限公司 电化学抛光中的支架抛光装置及抛光方法
TWI410532B (zh) * 2010-09-01 2013-10-01 Grand Plastic Technology Co Ltd 晶圓填孔垂直式電極電鍍設備
CN102140669B (zh) * 2011-03-17 2016-06-01 上海集成电路研发中心有限公司 硅片电镀铜后的清洗方法
CN102427047B (zh) * 2011-09-28 2014-03-12 上海华力微电子有限公司 晶圆背面清洁设备以及晶圆背面清洁方法
SG194239A1 (en) 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
CN102864486A (zh) * 2012-10-24 2013-01-09 哈尔滨电机厂有限责任公司 电解抛光装置
WO2014089731A1 (en) * 2012-12-10 2014-06-19 Acm Research (Shanghai) Inc. Semiconductor wafer polishing method
JP6114060B2 (ja) * 2013-02-27 2017-04-12 東京エレクトロン株式会社 基板搬送装置、基板受渡位置確認方法及び基板処理システム
CN103510149B (zh) * 2013-10-14 2015-11-18 陈功 一种带电解抛光液的湿式自动抛光方法及其设备
CN105316754B (zh) * 2014-07-29 2019-08-16 盛美半导体设备（上海）有限公司 电化学加工工艺及电化学加工装置
US9831110B2 (en) 2015-07-30 2017-11-28 Lam Research Corporation Vision-based wafer notch position measurement
WO2017092029A1 (en) * 2015-12-04 2017-06-08 Acm Research (Shanghai) Inc. Apparatus for holding substrate
CN105780101B (zh) * 2016-01-27 2018-06-26 杨继芳 一种新型电解抛光设备
FR3049940B1 (fr) * 2016-04-06 2018-04-13 Saint- Gobain Glass France Dispositif de support pour feuille de verre notamment dans une installation de lavage
US10460960B2 (en) * 2016-05-09 2019-10-29 Applied Materials, Inc. Gas panel apparatus and method for reducing exhaust requirements
JP6756540B2 (ja) 2016-08-08 2020-09-16 株式会社荏原製作所 めっき装置、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
CN106191983B (zh) * 2016-08-12 2018-06-29 厦门大学 一种用于电化学刻蚀加工的微流控装置及其应用方法
CN106737805A (zh) * 2016-12-13 2017-05-31 天津彼洋机器人系统工程有限公司 一种多功能机器人夹爪
GB201701166D0 (en) 2017-01-24 2017-03-08 Picofluidics Ltd An apparatus for electrochemically processing semiconductor substrates
CN111032923B (zh) * 2017-08-30 2021-12-28 盛美半导体设备(上海)股份有限公司 电镀装置
WO2019047086A1 (en) * 2017-09-07 2019-03-14 Acm Research (Shanghai) Inc. PLATE CHUCK
CN109560029B (zh) * 2017-09-26 2024-02-09 Tcl环鑫半导体(天津)有限公司 一种自动圆形硅片倒片机构
CN108406568B (zh) * 2018-05-21 2023-08-22 浙江工业大学 一种使用液态金属抛光液对叶片边缘抛光的装置及方法
CN108453651B (zh) * 2018-05-24 2024-05-07 明峰医疗系统股份有限公司 一种pet探测器轴定位工装
CN109652850B (zh) * 2018-11-23 2021-01-26 铜陵蓝盾丰山微电子有限公司 多通道片式电镀装置
CN109609996B (zh) * 2018-12-12 2020-12-18 东华大学 经编机槽针批量镀硬铬用组合挂具
CN109712923B (zh) * 2018-12-26 2020-12-11 上海福赛特机器人有限公司 一种晶圆周转装置及晶圆周转方法
CN109676274B (zh) * 2018-12-27 2021-01-15 深圳市大族数控科技有限公司 一种释压机构及具有该释压机构的真空吸附和吸尘装置
CN109759957A (zh) * 2019-02-21 2019-05-17 中国工程物理研究院激光聚变研究中心 环抛中抛光液的循环供液装置及供液方法
CN112017932B (zh) * 2019-05-31 2022-11-29 中微半导体设备(上海)股份有限公司 等离子体处理装置中气体输送系统的耐腐蚀结构
US11890718B2 (en) * 2020-01-17 2024-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Removable tray assembly for CMP systems
EP3851916A1 (en) * 2020-01-17 2021-07-21 ASML Netherlands B.V. Suction clamp, object handler, stage apparatus and lithographic apparatus
JP7422586B2 (ja) * 2020-03-30 2024-01-26 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN111693852B (zh) * 2020-06-23 2023-12-22 宏茂微电子(上海)有限公司 一种塑封装元器件开封方法及开封装置
CN113881986B (zh) * 2021-10-28 2025-03-18 惠州市本正智能设备有限公司 节能喷咀及电镀装置
CN116263515A (zh) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
CN114473818B (zh) * 2022-02-28 2023-05-02 南京尚吉增材制造研究院有限公司 用于义齿的组合式调节型抛光夹具
KR102848411B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517958A (en) * 1968-06-17 1970-06-30 Ibm Vacuum pick-up with air shield
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4430178A (en) * 1982-05-24 1984-02-07 Cominco Ltd. Method and apparatus for effecting current reversal in electro-deposition of metals
US4600229A (en) * 1984-08-03 1986-07-15 Oten Peter D Vacuum cup
DE69133413D1 (de) * 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps
JPH07136885A (ja) * 1993-06-30 1995-05-30 Toshiba Corp 真空チャック
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5900103A (en) * 1994-04-20 1999-05-04 Tokyo Electron Limited Plasma treatment method and apparatus
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US5937993A (en) * 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
US6439824B1 (en) * 2000-07-07 2002-08-27 Semitool, Inc. Automated semiconductor immersion processing system
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6187152B1 (en) * 1998-07-17 2001-02-13 Cutek Research, Inc. Multiple station processing chamber and method for depositing and/or removing material on a substrate
US6183611B1 (en) * 1998-07-17 2001-02-06 Cutek Research, Inc. Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
JP2002531702A (ja) * 1998-11-28 2002-09-24 エーシーエム リサーチ，インコーポレイティド 半導体ワークの電気めっきおよび／または電解研磨中に半導体ワークを保持して位置決めする方法および装置
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
US6279976B1 (en) * 1999-05-13 2001-08-28 Micron Technology, Inc. Wafer handling device having conforming perimeter seal
KR100773165B1 (ko) * 1999-12-24 2007-11-02 가부시키가이샤 에바라 세이사꾸쇼 반도체기판처리장치 및 처리방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114990549A (zh) * 2022-05-30 2022-09-02 高红霞 一种汽车冲压模具铸件表面拉毛装置及方法
CN114990549B (zh) * 2022-05-30 2024-01-12 东莞海雅特汽车科技有限公司 一种汽车冲压模具铸件表面拉毛处理装置及方法

Also Published As

Publication number Publication date
JP2006319348A (ja) 2006-11-24
AU2003226319A1 (en) 2003-10-27
CN100430526C (zh) 2008-11-05
CN101353810B (zh) 2012-02-15
JP2007051377A (ja) 2007-03-01
WO2003087436A1 (en) 2003-10-23
EP1492907A4 (en) 2008-01-09
CN101353810A (zh) 2009-01-28
EP1492907A1 (en) 2005-01-05
TW200402821A (en) 2004-02-16
JP2005522585A (ja) 2005-07-28
KR20040099407A (ko) 2004-11-26
US20050218003A1 (en) 2005-10-06
JP2006328543A (ja) 2006-12-07
TWI274393B (en) 2007-02-21
JP2007077501A (ja) 2007-03-29
CN1653211A (zh) 2005-08-10
SG159384A1 (en) 2010-03-30

Similar Documents

Publication Publication Date Title
US20050218003A1 (en) Electropolishing and/or electroplating apparatus and methods
JP4108941B2 (ja) 基板の把持装置、処理装置、及び把持方法
US12226807B2 (en) Cleaning device for cleaning electroplating substrate holder
CN100497748C (zh) 电解抛光组件以及对导电层执行电解抛光的方法
US7223323B2 (en) Multi-chemistry plating system
KR100804715B1 (ko) 반도체기판회전유지장치 및 반도체기판처리장치
US6899111B2 (en) Configurable single substrate wet-dry integrated cluster cleaner
JPWO2001084621A1 (ja) 回転保持装置及び半導体基板処理装置
KR20110042245A (ko) 도금방법
US20060081478A1 (en) Plating apparatus and plating method
US7967960B2 (en) Fluid-confining apparatus
US9640384B2 (en) Substrate cleaning apparatus and substrate cleaning method
CN116153801A (zh) 一种光学测量装置和减薄设备
EP1697969A1 (en) Edge wheel dry manifold
WO2004094702A2 (en) Multi-chemistry plating system
CN114203590A (zh) 晶圆清洗系统及其清洗方法
CN101435100B (zh) 流体区域控制装置及其操作方法
JP2021136418A (ja) 基板処理装置および基板処理方法
CN114959843B (zh) 后电填充模块及用于后电填充模块的校准方法

Legal Events

Date Code Title Description
FZDE Discontinued