AU2003226319A1 - Electropolishing and/or electroplating apparatus and methods - Google Patents

Electropolishing and/or electroplating apparatus and methods

Info

Publication number
AU2003226319A1
AU2003226319A1 AU2003226319A AU2003226319A AU2003226319A1 AU 2003226319 A1 AU2003226319 A1 AU 2003226319A1 AU 2003226319 A AU2003226319 A AU 2003226319A AU 2003226319 A AU2003226319 A AU 2003226319A AU 2003226319 A1 AU2003226319 A1 AU 2003226319A1
Authority
AU
Australia
Prior art keywords
electropolishing
methods
electroplating apparatus
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003226319A
Other languages
English (en)
Inventor
Muhammed Afnan
Ru Kao Chang
Himanshu J. Chokshi
Felix Gutman
Frederick Ho
Damon L. Koehler
My Hoang Nguyen
Voha Nuch
Mark Jacobus Van Kerkwyk
Hui Wang
Peihaur Yih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Inc
Original Assignee
ACM Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Inc filed Critical ACM Research Inc
Publication of AU2003226319A1 publication Critical patent/AU2003226319A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/16—Polishing
    • C25F3/30—Polishing of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
AU2003226319A 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods Abandoned AU2003226319A1 (en)

Applications Claiming Priority (17)

Application Number Priority Date Filing Date Title
US37095602P 2002-04-08 2002-04-08
US37092902P 2002-04-08 2002-04-08
US37095502P 2002-04-08 2002-04-08
US37091902P 2002-04-08 2002-04-08
US60/370,929 2002-04-08
US60/370,955 2002-04-08
US60/370,956 2002-04-08
US60/370,919 2002-04-08
US37256702P 2002-04-14 2002-04-14
US37254202P 2002-04-14 2002-04-14
US37256602P 2002-04-14 2002-04-14
US60/372,567 2002-04-14
US60/372,566 2002-04-14
US60/372,542 2002-04-14
US39046002P 2002-06-21 2002-06-21
US60/390,460 2002-06-21
PCT/US2003/010725 WO2003087436A1 (en) 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods

Publications (1)

Publication Number Publication Date
AU2003226319A1 true AU2003226319A1 (en) 2003-10-27

Family

ID=29255769

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003226319A Abandoned AU2003226319A1 (en) 2002-04-08 2003-04-08 Electropolishing and/or electroplating apparatus and methods

Country Status (10)

Country Link
US (1) US20050218003A1 (https=)
EP (1) EP1492907A4 (https=)
JP (5) JP2005522585A (https=)
KR (1) KR20040099407A (https=)
CN (2) CN101353810B (https=)
AU (1) AU2003226319A1 (https=)
CA (1) CA2479794A1 (https=)
SG (1) SG159384A1 (https=)
TW (1) TWI274393B (https=)
WO (1) WO2003087436A1 (https=)

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Also Published As

Publication number Publication date
JP2006319348A (ja) 2006-11-24
CN100430526C (zh) 2008-11-05
CN101353810B (zh) 2012-02-15
JP2007051377A (ja) 2007-03-01
WO2003087436A1 (en) 2003-10-23
EP1492907A4 (en) 2008-01-09
CN101353810A (zh) 2009-01-28
EP1492907A1 (en) 2005-01-05
TW200402821A (en) 2004-02-16
JP2005522585A (ja) 2005-07-28
KR20040099407A (ko) 2004-11-26
US20050218003A1 (en) 2005-10-06
CA2479794A1 (en) 2003-10-23
JP2006328543A (ja) 2006-12-07
TWI274393B (en) 2007-02-21
JP2007077501A (ja) 2007-03-29
CN1653211A (zh) 2005-08-10
SG159384A1 (en) 2010-03-30

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