BRPI0507307A - método de fabricação de um portador de circuito e o uso do método - Google Patents
método de fabricação de um portador de circuito e o uso do métodoInfo
- Publication number
- BRPI0507307A BRPI0507307A BRPI0507307-3A BRPI0507307A BRPI0507307A BR PI0507307 A BRPI0507307 A BR PI0507307A BR PI0507307 A BRPI0507307 A BR PI0507307A BR PI0507307 A BRPI0507307 A BR PI0507307A
- Authority
- BR
- Brazil
- Prior art keywords
- dielectric
- primer layer
- vias
- trenches
- deposited onto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Digital Transmission Methods That Use Modulated Carrier Waves (AREA)
- Exchange Systems With Centralized Control (AREA)
Abstract
MéTODO DE FABRICAçãO DE UM PORTADOR DE CIRCUITO E O USO DO MéTODO. Método de fabricação de um portador de circuito e o uso do referido método são propostos, o referido método compreendendo, após o fornecimento uma placa de circuito impresso (a); revestimento da placa de circuito em pelo menos um de seus lados com um dielétrico (b); estruturação do dielétrico para produção de sulcos e furos de passagem existentes, usando ablação de laser (c) é realizada. A seguir, uma camada de base é depositada sobre o dielétrico, sobre toda a sua superfície ou nos sulcos e furos de passagem produzidos apenas (d). Uma camada de metal é depositada na camada de base, com os sulcos e os furos de passagem sendo cheios, completamente, com metal para formação de estruturas de condutores existentes (e). Finalmente, o metal em excesso e a camada de base são removidos até que o dielétrico seja exposto, se a camada de base foi depositada sobre toda a sua superfície, com as estruturas de condutores permanecendo intactas (f).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004005300A DE102004005300A1 (de) | 2004-01-29 | 2004-01-29 | Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens |
PCT/EP2005/000698 WO2005076681A1 (en) | 2004-01-29 | 2005-01-20 | Method of manufacturing a circuit carrier and the use of the method |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0507307A true BRPI0507307A (pt) | 2007-06-26 |
Family
ID=34832500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0507307-3A BRPI0507307A (pt) | 2004-01-29 | 2005-01-20 | método de fabricação de um portador de circuito e o uso do método |
Country Status (13)
Country | Link |
---|---|
US (1) | US8927899B2 (pt) |
EP (1) | EP1709849B1 (pt) |
JP (2) | JP2007520070A (pt) |
KR (1) | KR101156256B1 (pt) |
CN (1) | CN1914965B (pt) |
AT (1) | ATE369727T1 (pt) |
BR (1) | BRPI0507307A (pt) |
CA (1) | CA2549314C (pt) |
DE (2) | DE102004005300A1 (pt) |
HK (1) | HK1092998A1 (pt) |
MY (1) | MY140133A (pt) |
TW (1) | TWI403240B (pt) |
WO (1) | WO2005076681A1 (pt) |
Families Citing this family (51)
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US7028400B1 (en) * | 2002-05-01 | 2006-04-18 | Amkor Technology, Inc. | Integrated circuit substrate having laser-exposed terminals |
DE10228716A1 (de) * | 2002-06-27 | 2004-01-29 | Carl Freudenberg Kg | Verfahren zur Herstellung eines flächigen Schaltungsträgers |
-
2004
- 2004-01-29 DE DE102004005300A patent/DE102004005300A1/de not_active Withdrawn
-
2005
- 2005-01-20 AT AT05701162T patent/ATE369727T1/de active
- 2005-01-20 BR BRPI0507307-3A patent/BRPI0507307A/pt not_active IP Right Cessation
- 2005-01-20 DE DE602005001932T patent/DE602005001932T2/de active Active
- 2005-01-20 WO PCT/EP2005/000698 patent/WO2005076681A1/en active IP Right Grant
- 2005-01-20 US US10/587,691 patent/US8927899B2/en active Active
- 2005-01-20 KR KR1020067013429A patent/KR101156256B1/ko active IP Right Grant
- 2005-01-20 JP JP2006550071A patent/JP2007520070A/ja active Pending
- 2005-01-20 CN CN2005800034420A patent/CN1914965B/zh active Active
- 2005-01-20 CA CA2549314A patent/CA2549314C/en active Active
- 2005-01-20 EP EP05701162A patent/EP1709849B1/en active Active
- 2005-01-26 MY MYPI20050285A patent/MY140133A/en unknown
- 2005-01-28 TW TW094102735A patent/TWI403240B/zh active
-
2007
- 2007-01-03 HK HK07100052A patent/HK1092998A1/xx unknown
-
2012
- 2012-11-16 JP JP2012252028A patent/JP5568618B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW200539774A (en) | 2005-12-01 |
DE602005001932D1 (de) | 2007-09-20 |
JP2007520070A (ja) | 2007-07-19 |
US20070163887A1 (en) | 2007-07-19 |
TWI403240B (zh) | 2013-07-21 |
DE102004005300A1 (de) | 2005-09-08 |
CN1914965B (zh) | 2011-03-30 |
CA2549314A1 (en) | 2005-08-18 |
HK1092998A1 (en) | 2007-02-16 |
KR20060133544A (ko) | 2006-12-26 |
CN1914965A (zh) | 2007-02-14 |
JP5568618B2 (ja) | 2014-08-06 |
EP1709849A1 (en) | 2006-10-11 |
CA2549314C (en) | 2013-03-12 |
US8927899B2 (en) | 2015-01-06 |
KR101156256B1 (ko) | 2012-06-13 |
MY140133A (en) | 2009-11-30 |
DE602005001932T2 (de) | 2008-04-24 |
JP2013065874A (ja) | 2013-04-11 |
EP1709849B1 (en) | 2007-08-08 |
ATE369727T1 (de) | 2007-08-15 |
WO2005076681A1 (en) | 2005-08-18 |
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