BR112018000603A2 - fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides - Google Patents

fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides

Info

Publication number
BR112018000603A2
BR112018000603A2 BR112018000603A BR112018000603A BR112018000603A2 BR 112018000603 A2 BR112018000603 A2 BR 112018000603A2 BR 112018000603 A BR112018000603 A BR 112018000603A BR 112018000603 A BR112018000603 A BR 112018000603A BR 112018000603 A2 BR112018000603 A2 BR 112018000603A2
Authority
BR
Brazil
Prior art keywords
nanowires
electrode
nanopiramids
light
reflective layer
Prior art date
Application number
BR112018000603A
Other languages
English (en)
Inventor
Ove M Fimland Bjørn
L Dheeraj Dasa
Chul Kim Dong
Weman Helge
Original Assignee
Crayonano As
Norwegian Univ Sci & Tech Ntnu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB1512231.0A external-priority patent/GB201512231D0/en
Priority claimed from GBGB1600164.6A external-priority patent/GB201600164D0/en
Application filed by Crayonano As, Norwegian Univ Sci & Tech Ntnu filed Critical Crayonano As
Publication of BR112018000603A2 publication Critical patent/BR112018000603A2/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035209Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
    • H01L31/035227Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/103Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type
    • H01L31/1035Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PN homojunction type the devices comprising active layers formed only by AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/105Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1852Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/0008Devices characterised by their operation having p-n or hi-lo junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H01L33/325Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Optical Head (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Geophysics And Detection Of Objects (AREA)

Abstract

a presente invenção refere-se a um dispositivo de diodo de emissão de luz compreendendo: uma pluralidade de nanofios ou nanopirâmides crescidos sobre um substrato grafítico, os ditos nanofios ou nanopirâmides tendo uma junção p-n ou p-i-n, um primeiro eletrodo em contato elétrico com o dito substrato grafítico; uma camada refletora de luz em contato com a parte superior de pelo menos uma porção dos ditos nanofios ou nanopirâmides, a dita camada refletora de luz opcionalmente atuando como um segundo eletrodo; opcionalmente um segundo eletrodo em contato elétrico com a parte superior de pelo menos uma porção dos ditos nanofios ou nanopirâmides, o dito segundo eletrodo sendo essencial onde a dita camada refletora de luz não atua como um eletrodo; em que os ditos nanofios ou nanopirâmides compreendem pelo menos um semicondutor de composto de grupo iii-v; e em que em uso luz é emitida do dito dispositivo em uma direção substancialmente oposta à dita camada refletora de luz.
BR112018000603A 2015-07-13 2016-07-13 fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides BR112018000603A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1512231.0A GB201512231D0 (en) 2015-07-13 2015-07-13 Device
GBGB1600164.6A GB201600164D0 (en) 2016-01-05 2016-01-05 Device
PCT/EP2016/066694 WO2017009394A1 (en) 2015-07-13 2016-07-13 Nanowires/nanopyramids shaped light emitting diodes and photodetectors

Publications (1)

Publication Number Publication Date
BR112018000603A2 true BR112018000603A2 (pt) 2018-09-11

Family

ID=56409619

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018000603A BR112018000603A2 (pt) 2015-07-13 2016-07-13 fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides

Country Status (13)

Country Link
US (1) US11594657B2 (pt)
EP (1) EP3323152B1 (pt)
JP (1) JP7066610B2 (pt)
KR (1) KR20180055803A (pt)
CN (1) CN108292694A (pt)
AU (1) AU2016292849B2 (pt)
BR (1) BR112018000603A2 (pt)
CA (1) CA2992154A1 (pt)
DK (1) DK3323152T3 (pt)
EA (1) EA201890167A1 (pt)
ES (1) ES2901111T3 (pt)
TW (1) TWI772266B (pt)
WO (1) WO2017009394A1 (pt)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201021112D0 (en) 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
US11830954B2 (en) * 2013-05-22 2023-11-28 W&wsens Devices Inc. Microstructure enhanced absorption photosensitive devices
TWI711072B (zh) * 2015-07-31 2020-11-21 挪威商卡亞奈米公司 生長奈米線或奈米角錐體之方法
JP7011278B2 (ja) * 2017-01-27 2022-01-26 国立大学法人秋田大学 窒化物半導体の製造方法
GB201701829D0 (en) 2017-02-03 2017-03-22 Norwegian Univ Of Science And Tech (Ntnu) Device
FR3064109A1 (fr) * 2017-03-20 2018-09-21 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure a nanofils et procede de realisation d'une telle structure
GB201705755D0 (en) * 2017-04-10 2017-05-24 Norwegian Univ Of Science And Tech (Ntnu) Nanostructure
TWI627317B (zh) * 2017-04-12 2018-06-21 光鋐科技股份有限公司 柱狀微發光二極體及其製造方法
JP6972665B2 (ja) * 2017-05-31 2021-11-24 セイコーエプソン株式会社 発光装置、プロジェクター、および発光装置の製造方法
JP7147132B2 (ja) * 2017-05-31 2022-10-05 セイコーエプソン株式会社 発光装置、プロジェクター、および発光装置の製造方法
JP6947386B2 (ja) * 2017-06-29 2021-10-13 学校法人 名城大学 半導体発光素子および半導体発光素子の製造方法
EP3431867A1 (en) 2017-07-18 2019-01-23 Koninklijke Philips N.V. Light guides with coating for use in water
KR102345618B1 (ko) * 2017-09-01 2021-12-31 삼성전자주식회사 발광 다이오드 및 그의 제조 방법
GB2570126B (en) * 2018-01-11 2022-07-27 Paragraf Ltd Graphene based contact layers for electronic devices
US11177243B2 (en) * 2018-03-22 2021-11-16 Intel Corporation Micro light-emitting diode display fabrication and assembly
EP3546077A1 (en) 2018-03-27 2019-10-02 Koninklijke Philips N.V. System for planar uv-c based biofouling prevention
US10312047B1 (en) * 2018-06-01 2019-06-04 Eagle Technology, Llc Passive local area saturation of electron bombarded gain
FR3082657B1 (fr) * 2018-06-19 2021-01-29 Aledia Procede de fabrication d’un dispositif optoelectronique a parois de confinement lumineux auto alignes
CN108807617A (zh) * 2018-06-30 2018-11-13 华南理工大学 生长在硅/石墨烯复合衬底上的GaN基纳米柱LED外延片及其制备方法
CN109003883A (zh) * 2018-06-30 2018-12-14 华南理工大学 生长在硅/石墨烯复合衬底上的InGaN/GaN多量子阱纳米柱及其制备方法
CN108807622B (zh) * 2018-07-16 2020-10-30 河源市众拓光电科技有限公司 一维InGaN/AlGaN多量子阱型的紫外LED及其制备方法
TWI684681B (zh) * 2018-07-18 2020-02-11 進化光學有限公司 電子裝置、發光元件、成長基板及其製造方法
CN109003888A (zh) * 2018-07-20 2018-12-14 华南理工大学 硅/石墨烯复合衬底上外延生长GaN纳米柱及制备方法
GB201814693D0 (en) * 2018-09-10 2018-10-24 Crayonano As Semiconductor devices
US20200091388A1 (en) * 2018-09-19 2020-03-19 Vuereal Inc. Highly efficient microdevices
KR102620159B1 (ko) 2018-10-08 2024-01-02 삼성전자주식회사 반도체 발광 소자
CN109768111A (zh) * 2018-12-13 2019-05-17 华南理工大学 一种GaAs纳米柱-石墨烯肖特基结太阳能电池及其制备方法
CN111326610A (zh) * 2018-12-14 2020-06-23 中国科学院半导体研究所 基于绝缘衬底的纳米柱led芯片及其制备方法
US10978632B2 (en) 2019-01-18 2021-04-13 Microsoft Technology Licensing, Llc Fabrication of a device
US10777728B2 (en) 2019-01-18 2020-09-15 Microsoft Technology Licensing, Llc Fabrication of a quantum device
CN110473941A (zh) * 2019-05-24 2019-11-19 华南师范大学 一种AlGaN基紫外LED外延结构
JP6968122B2 (ja) * 2019-06-06 2021-11-17 日機装株式会社 窒化物半導体発光素子
CN110364582A (zh) * 2019-06-20 2019-10-22 华南理工大学 一种基于石墨烯模板上AlGaN纳米柱基MSM型紫外探测器及其制备方法
CN110246913A (zh) * 2019-06-21 2019-09-17 华南理工大学 一种InGaN纳米柱阵列基GSG型可调谐光电探测器及其制备方法
FR3098019B1 (fr) 2019-06-25 2022-05-20 Aledia Dispositif optoélectronique comprenant des éléments semi-conducteurs tridimensionnels et procédé pour sa fabrication
FR3098013B1 (fr) * 2019-06-25 2021-07-02 Commissariat Energie Atomique Procédé de fabrication d'un dispositif optoélectronique à diodes électroluminescentes de type axial
CN110616408B (zh) * 2019-09-18 2022-05-17 北京工业大学 基于二维材料的多层金属纳米结构的制备方法
GB201913701D0 (en) 2019-09-23 2019-11-06 Crayonano As Composition of matter
KR102348967B1 (ko) 2019-12-10 2022-01-10 고려대학교 산학협력단 페로브스카이트 광검출 소자 및 이의 제조방법
KR20220148833A (ko) 2020-02-10 2022-11-07 라시움, 아이엔씨. 디스플레이 장치 및 그 관련 방법
JP7485278B2 (ja) 2020-03-09 2024-05-16 セイコーエプソン株式会社 発光装置およびプロジェクター
US11271138B2 (en) * 2020-03-18 2022-03-08 The Boeing Company Light emitting device and method of making the same
KR20210156624A (ko) 2020-06-18 2021-12-27 삼성전자주식회사 나노 막대 발광 소자 및 그 제조 방법
WO2022016006A1 (en) * 2020-07-17 2022-01-20 Nevada Research & Innovation Corporation Photocatalytic and photo(electro)catalytic approaches for viral decontamination
CN112216772B (zh) * 2020-09-07 2022-03-08 深圳远芯光路科技有限公司 一种iii族氮化物纳米线柔性发光二极管及其制备方法
WO2023282177A1 (ja) * 2021-07-08 2023-01-12 株式会社小糸製作所 半導体発光素子および半導体発光素子の製造方法
KR20240005286A (ko) * 2022-07-04 2024-01-12 삼성전자주식회사 발광 소자, 이를 포함하는 디스플레이 장치 및 그 제조 방법
WO2024035969A1 (en) * 2022-08-12 2024-02-15 The Regents Of The University Of Michigan Light emitting devices and methods of manufacture
CN115207182B (zh) * 2022-09-15 2022-12-13 南昌凯捷半导体科技有限公司 具有P面薄膜导电层的红光mini LED及其制备方法

Family Cites Families (135)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213801A (en) 1979-03-26 1980-07-22 Bell Telephone Laboratories, Incorporated Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers
JP3631157B2 (ja) 2001-03-21 2005-03-23 日本電信電話株式会社 紫外発光ダイオード
EP1374309A1 (en) 2001-03-30 2004-01-02 The Regents Of The University Of California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
JP3823784B2 (ja) 2001-09-06 2006-09-20 富士ゼロックス株式会社 ナノワイヤーおよびその製造方法、並びにそれを用いたナノネットワーク、ナノネットワークの製造方法、炭素構造体、電子デバイス
FR2840452B1 (fr) * 2002-05-28 2005-10-14 Lumilog Procede de realisation par epitaxie d'un film de nitrure de gallium separe de son substrat
JP3679097B2 (ja) 2002-05-31 2005-08-03 株式会社光波 発光素子
US7594982B1 (en) 2002-06-22 2009-09-29 Nanosolar, Inc. Nanostructured transparent conducting electrode
US7335908B2 (en) * 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
US7608147B2 (en) 2003-04-04 2009-10-27 Qunano Ab Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them
AU2003257713A1 (en) * 2003-08-08 2005-02-25 Vichel Inc. Nitride micro light emitting diode with high brightness and method of manufacturing the same
US7354850B2 (en) 2004-02-06 2008-04-08 Qunano Ab Directionally controlled growth of nanowhiskers
US7528002B2 (en) 2004-06-25 2009-05-05 Qunano Ab Formation of nanowhiskers on a substrate of dissimilar material
KR100533645B1 (ko) * 2004-09-13 2005-12-06 삼성전기주식회사 발광 효율을 개선한 발광 다이오드
GB2418532A (en) * 2004-09-28 2006-03-29 Arima Optoelectronic Textured light emitting diode structure with enhanced fill factor
US20070240757A1 (en) 2004-10-15 2007-10-18 The Trustees Of Boston College Solar cells using arrays of optical rectennas
CA2588548A1 (en) 2004-12-09 2006-06-15 Nanosys, Inc. Nanowire-based membrane electrode assemblies for fuel cells
US7939218B2 (en) 2004-12-09 2011-05-10 Nanosys, Inc. Nanowire structures comprising carbon
EP1727216B1 (en) 2005-05-24 2019-04-24 LG Electronics, Inc. Rod type light emitting diode and method for fabricating the same
JP4425194B2 (ja) 2005-08-18 2010-03-03 株式会社神戸製鋼所 成膜方法
CN101563801B (zh) 2005-11-21 2013-03-27 纳米系统公司 含碳的纳米线结构体
US7570355B2 (en) 2006-01-27 2009-08-04 Hewlett-Packard Development Company, L.P. Nanowire heterostructures and methods of forming the same
US7643136B2 (en) 2006-02-02 2010-01-05 Optilia Instrument Ab Device for inspection of narrow spaces and objects in narrow spaces
WO2008048704A2 (en) * 2006-03-10 2008-04-24 Stc.Unm Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices
FR2904146B1 (fr) 2006-07-20 2008-10-17 Commissariat Energie Atomique Procede de fabrication d'une nanostructure a base de nanofils interconnectes,nanostructure et utilisation comme convertisseur thermoelectrique
JP4106397B2 (ja) 2006-09-14 2008-06-25 株式会社島津製作所 光または放射線検出器の製造方法
US7442575B2 (en) 2006-09-29 2008-10-28 Texas Christian University Method of manufacturing semiconductor nanowires
JP2008130877A (ja) 2006-11-22 2008-06-05 Sharp Corp 窒化物半導体発光素子の製造方法
WO2008140611A2 (en) 2006-12-18 2008-11-20 The Regents Of The University Of California Nanowire array-based light emitting diodes and lasers
US20080191317A1 (en) 2007-02-13 2008-08-14 International Business Machines Corporation Self-aligned epitaxial growth of semiconductor nanowires
US8890117B2 (en) 2007-03-28 2014-11-18 Qunano Ab Nanowire circuit architecture
JP2009010012A (ja) 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 半導体発光素子、その製造方法及び発光装置
KR100904588B1 (ko) 2007-07-05 2009-06-25 삼성전자주식회사 코어/쉘 형태의 나노와이어를 제조하는 방법, 그에 의해제조된 나노와이어 및 이를 포함하는 나노와이어 소자
US7714317B2 (en) 2007-08-30 2010-05-11 Brookhaven Science Associates, Llc Assembly of ordered carbon shells on semiconducting nanomaterials
KR101541560B1 (ko) 2007-10-26 2015-08-03 큐나노 에이비 이종 재료상의 나노와이어 성장
US8273983B2 (en) 2007-12-21 2012-09-25 Hewlett-Packard Development Company, L.P. Photonic device and method of making same using nanowires
US8435676B2 (en) 2008-01-09 2013-05-07 Nanotek Instruments, Inc. Mixed nano-filament electrode materials for lithium ion batteries
US7871653B2 (en) 2008-01-30 2011-01-18 Ocean Duke Corporation Double-stack shrimp tray
US8129763B2 (en) 2008-02-07 2012-03-06 International Business Machines Corporation Metal-oxide-semiconductor device including a multiple-layer energy filter
JP5386747B2 (ja) 2008-02-21 2014-01-15 公益財団法人神奈川科学技術アカデミー 半導体基板、半導体素子、発光素子及び電子素子
KR101445877B1 (ko) 2008-03-24 2014-09-29 삼성전자주식회사 산화아연 나노와이어의 제조방법
US7781780B2 (en) * 2008-03-31 2010-08-24 Bridgelux, Inc. Light emitting diodes with smooth surface for reflective electrode
TW200952184A (en) 2008-06-03 2009-12-16 Univ Nat Taiwan Structure of mixed type heterojunction thin film solar cells and its manufacturing method
JP5836122B2 (ja) * 2008-07-07 2015-12-24 グロ アーベーGlo Ab ナノ構造のled
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
WO2010056064A2 (ko) 2008-11-13 2010-05-20 주식회사 엘지화학 리튬 이차전지용 비수 전해액 및 이를 구비한 리튬 이차전지
KR101071906B1 (ko) 2008-11-14 2011-10-11 한국과학기술원 단결정 게르마늄코발트 나노와이어, 게르마늄코발트 나노와이어 구조체, 및 이들의 제조방법
JP5453045B2 (ja) 2008-11-26 2014-03-26 株式会社日立製作所 グラフェン層が成長された基板およびそれを用いた電子・光集積回路装置
CN101504961B (zh) * 2008-12-16 2010-08-11 华中科技大学 面发射多色发光二极管及其制造方法
US8389387B2 (en) 2009-01-06 2013-03-05 Brookhaven Science Associates, Llc Segmented nanowires displaying locally controllable properties
KR101650310B1 (ko) 2009-01-16 2016-08-24 삼성전자주식회사 도광부재 및 이를 구비하는 제전유닛, 화상형성장치, 화상독취장치
US20110220171A1 (en) 2009-01-30 2011-09-15 Mathai Sagi V Photovoltaic Structure and Solar Cell and Method of Fabrication Employing Hidden Electrode
FR2941688B1 (fr) 2009-01-30 2011-04-01 Commissariat Energie Atomique Procede de formation de nano-fils
KR100995394B1 (ko) 2009-02-18 2010-11-19 한국과학기술원 박막 태양전지의 박막 형성장치
WO2010096035A1 (en) 2009-02-23 2010-08-26 Nanosys, Inc. Nanostructured catalyst supports
US20120135158A1 (en) 2009-05-26 2012-05-31 Sharp Kabushiki Kaisha Methods and systems for electric field deposition of nanowires and other devices
WO2010141348A1 (en) 2009-05-31 2010-12-09 College Of William And Mary Method for making polymer composites containing graphene sheets
JP5299105B2 (ja) 2009-06-16 2013-09-25 ソニー株式会社 二酸化バナジウムナノワイヤとその製造方法、及び二酸化バナジウムナノワイヤを用いたナノワイヤデバイス
CN102868498B (zh) 2009-06-18 2015-12-09 华为技术有限公司 码本生成方法、数据传输方法及装置
US8409366B2 (en) 2009-06-23 2013-04-02 Oki Data Corporation Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof
US9290388B2 (en) 2009-08-03 2016-03-22 Inje University Industry-Academic Cooperation Foundation Carbonaceous nanocomposite having novel structure and fabrication method thereof
US8507797B2 (en) 2009-08-07 2013-08-13 Guardian Industries Corp. Large area deposition and doping of graphene, and products including the same
US10164135B2 (en) 2009-08-07 2018-12-25 Guardian Glass, LLC Electronic device including graphene-based layer(s), and/or method or making the same
US20110081500A1 (en) 2009-10-06 2011-04-07 Tokyo Electron Limited Method of providing stable and adhesive interface between fluorine-based low-k material and metal barrier layer
CN102326266B (zh) 2009-10-20 2015-07-01 松下电器产业株式会社 发光二极管元件及其制造方法
WO2011048809A1 (ja) 2009-10-21 2011-04-28 パナソニック株式会社 太陽電池およびその製造方法
KR20110057989A (ko) 2009-11-25 2011-06-01 삼성전자주식회사 그래핀과 나노구조체의 복합 구조체 및 그 제조방법
CN101710567A (zh) 2009-11-27 2010-05-19 晶能光电(江西)有限公司 具有复合碳基衬底的氮化镓基半导体器件及其制造方法
US9306099B2 (en) 2009-12-01 2016-04-05 Samsung Electronics Co., Ltd. Material including graphene and an inorganic material and method of manufacturing the material
KR101736972B1 (ko) 2009-12-01 2017-05-19 삼성전자주식회사 그라펜 및 무기물의 적층 구조체 및 이를 구비한 전기소자
JP4806475B2 (ja) 2009-12-04 2011-11-02 パナソニック株式会社 基板およびその製造方法
WO2011081440A2 (ko) 2009-12-30 2011-07-07 성균관대학교산학협력단 그래핀 필름의 롤투롤 도핑 방법 및 도핑된 그래핀 필름
US8212236B2 (en) 2010-01-19 2012-07-03 Eastman Kodak Company II-VI core-shell semiconductor nanowires
US8377729B2 (en) 2010-01-19 2013-02-19 Eastman Kodak Company Forming II-VI core-shell semiconductor nanowires
WO2011090863A1 (en) 2010-01-19 2011-07-28 Eastman Kodak Company Ii-vi core-shell semiconductor nanowires
US20110240099A1 (en) 2010-03-30 2011-10-06 Ellinger Carolyn R Photovoltaic nanowire device
TWI440074B (zh) 2010-04-02 2014-06-01 Univ Nat Chiao Tung 一種在三族氮化物磊晶過程中降低缺陷產生的方法
US9985150B2 (en) 2010-04-07 2018-05-29 Shimadzu Corporation Radiation detector and method of manufacturing the same
US9718054B2 (en) 2010-05-24 2017-08-01 Siluria Technologies, Inc. Production of ethylene with nanowire catalysts
JP4949540B2 (ja) 2010-06-07 2012-06-13 パナソニック株式会社 太陽電池及びその製造法
WO2011160051A2 (en) 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same
KR101781552B1 (ko) 2010-06-21 2017-09-27 삼성전자주식회사 보론 및 질소로 치환된 그라핀 및 제조방법과, 이를 구비한 트랜지스터
US9947829B2 (en) 2010-06-24 2018-04-17 Glo Ab Substrate with buffer layer for oriented nanowire growth
CN103155174B (zh) 2010-08-07 2017-06-23 宸鸿科技控股有限公司 具有表面嵌入的添加剂的装置组件和相关的制造方法
CN102376817A (zh) 2010-08-11 2012-03-14 王浩 一种半导体光电器件的制备方法
US9478699B2 (en) 2010-08-26 2016-10-25 The Ohio State University Nanoscale emitters with polarization grading
US9190590B2 (en) 2010-09-01 2015-11-17 Sharp Kabushiki Kaisha Light emitting element and production method for same, production method for light-emitting device, illumination device, backlight, display device, and diode
WO2012029381A1 (ja) 2010-09-01 2012-03-08 シャープ株式会社 発光素子およびその製造方法、発光装置の製造方法、照明装置、バックライト、表示装置、並びにダイオード
KR101636915B1 (ko) 2010-09-03 2016-07-07 삼성전자주식회사 그래핀 또는 탄소나노튜브를 이용한 반도체 화합물 구조체 및 그 제조방법과, 반도체 화합물 구조체를 포함하는 반도체 소자
KR101691906B1 (ko) * 2010-09-14 2017-01-02 삼성전자주식회사 Ⅲ족 질화물 나노로드 발광 소자 제조방법
FR2975532B1 (fr) 2011-05-18 2013-05-10 Commissariat Energie Atomique Connexion electrique en serie de nanofils emetteurs de lumiere
US8901536B2 (en) 2010-09-21 2014-12-02 The United States Of America, As Represented By The Secretary Of The Navy Transistor having graphene base
KR101802374B1 (ko) 2010-10-05 2017-11-29 삼성전자주식회사 도핑된 그래핀 함유 투명전극, 그의 제조방법, 및 이를 구비하는 표시소자와 태양전지
KR101217209B1 (ko) * 2010-10-07 2012-12-31 서울대학교산학협력단 발광소자 및 그 제조방법
US8321961B2 (en) 2010-10-07 2012-11-27 International Business Machines Corporation Production scale fabrication method for high resolution AFM tips
KR101142545B1 (ko) * 2010-10-25 2012-05-08 서울대학교산학협력단 태양전지 및 그 제조 방법
ES2694239T3 (es) 2010-11-12 2018-12-19 Gentium S.R.L. Defibrótido para su uso en profilaxis y/o tratamiento de la enfermedad de Injerto contra huésped (GVHD)
US20120141799A1 (en) * 2010-12-03 2012-06-07 Francis Kub Film on Graphene on a Substrate and Method and Devices Therefor
GB201021112D0 (en) * 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
KR20120065792A (ko) 2010-12-13 2012-06-21 삼성전자주식회사 나노 센서 및 그의 제조 방법
KR20120083084A (ko) 2011-01-17 2012-07-25 삼성엘이디 주식회사 나노 로드 발광 소자 및 그 제조 방법
KR101227600B1 (ko) 2011-02-11 2013-01-29 서울대학교산학협력단 그래핀-나노와이어 하이브리드 구조체에 기반한 광센서 및 이의 제조방법
US8591990B2 (en) 2011-03-25 2013-11-26 GM Global Technology Operations LLC Microfiber supported metal silicide nanowires
JP2012230969A (ja) 2011-04-25 2012-11-22 Sumitomo Electric Ind Ltd GaN系半導体デバイスの製造方法
JP6139511B2 (ja) 2011-05-06 2017-05-31 ザ・リサーチ・ファウンデーション・フォー・ザ・ステイト・ユニヴァーシティ・オブ・ニューヨーク 磁性グラフェン様ナノ粒子あるいは黒鉛ナノまたは微小粒子、およびそれらの生産および使用方法
KR20140040169A (ko) 2011-05-27 2014-04-02 유니버시티 오브 노스 텍사스 그라핀 자기터널접합 스핀 필터 및 그 제조방법
JP2012250868A (ja) 2011-06-01 2012-12-20 Sumitomo Electric Ind Ltd Iii族窒化物層の成長方法およびiii族窒化物基板
WO2012167282A1 (en) 2011-06-02 2012-12-06 Brown University High-efficiency silicon-compatible photodetectors based on ge quantumdots and ge/si hetero-nanowires
KR101305705B1 (ko) 2011-07-12 2013-09-09 엘지이노텍 주식회사 터치 패널 및 전극 제조 방법
US20130020623A1 (en) 2011-07-18 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for single gate non-volatile memory device
CN102254969B (zh) * 2011-08-17 2012-11-14 中国科学院苏州纳米技术与纳米仿生研究所 基于纳米柱阵列的光电器件及其制作方法
KR101217216B1 (ko) 2011-08-31 2012-12-31 서울대학교산학협력단 전자 소자 및 그 제조 방법
US9202867B2 (en) 2011-10-04 2015-12-01 Arizona Board Of Regents Nanocrystals containing CdTe core with CdS and ZnS coatings
US8440350B1 (en) 2011-11-10 2013-05-14 GM Global Technology Operations LLC Lithium-ion battery electrodes with shape-memory-alloy current collecting substrates
BR112014012795B1 (pt) 2011-11-29 2022-04-12 Siluria Technologies, Inc Material catalítico na forma de uma microesfera prensada, extrusado ou monólito e método para o acoplamento oxidativo de metano
KR20130069035A (ko) 2011-12-16 2013-06-26 삼성전자주식회사 그래핀상의 하이브리드 나노구조체 형성 방법
JP5795527B2 (ja) 2011-12-20 2015-10-14 日本電信電話株式会社 ナノワイヤの作製方法
GB201200355D0 (en) 2012-01-10 2012-02-22 Norwegian Univ Sci & Tech Ntnu Nanowires
US9653286B2 (en) * 2012-02-14 2017-05-16 Hexagem Ab Gallium nitride nanowire based electronics
TW201344749A (zh) 2012-04-23 2013-11-01 Nanocrystal Asia Inc 以塡膠燒結方式製造選擇性成長遮罩之方法
US20130311363A1 (en) 2012-05-15 2013-11-21 Jonathan E. Ramaci Dynamically re-programmable transaction card
US20140014171A1 (en) 2012-06-15 2014-01-16 Purdue Research Foundation High optical transparent two-dimensional electronic conducting system and process for generating same
GB201211038D0 (en) * 2012-06-21 2012-08-01 Norwegian Univ Sci & Tech Ntnu Solar cells
US9401452B2 (en) 2012-09-14 2016-07-26 Palo Alto Research Center Incorporated P-side layers for short wavelength light emitters
FR2997558B1 (fr) 2012-10-26 2015-12-18 Aledia Dispositif opto-electrique et son procede de fabrication
CN104781305B (zh) 2012-11-26 2018-04-17 麻省理工学院 纳米线修饰的石墨烯及其制造和使用方法
JP5876408B2 (ja) 2012-12-14 2016-03-02 日本電信電話株式会社 ナノワイヤの作製方法
CN103050498B (zh) * 2012-12-28 2015-08-26 中山大学 一种微纳米线阵列结构紫外雪崩光电探测器及其制备方法
GB201311101D0 (en) 2013-06-21 2013-08-07 Norwegian Univ Sci & Tech Ntnu Semiconducting Films
GB2517186A (en) 2013-08-14 2015-02-18 Norwegian University Of Science And Technology Radial P-N junction nanowire solar cells
KR101517551B1 (ko) 2013-11-14 2015-05-06 포항공과대학교 산학협력단 발광소자의 제조방법 및 그에 의해 제조된 발광소자
CN103903973B (zh) 2014-03-05 2017-03-29 复旦大学 利用旋涂液态金属种子层在石墨烯上生长高k介质的方法
KR102198694B1 (ko) * 2014-07-11 2021-01-06 삼성전자주식회사 반도체 발광소자 및 반도체 발광소자 제조방법
US9577176B1 (en) * 2015-06-18 2017-02-21 Raytheon Bbn Technologies Corp. Josephson junction readout for graphene-based single photon detector
EP3311410A1 (en) * 2015-06-18 2018-04-25 Nanoco 2D Materials Limited Heterostructures and electronic devices derived therefrom
US9978808B2 (en) 2016-05-04 2018-05-22 Glo Ab Monolithic multicolor direct view display containing different color LEDs and method of making thereof

Also Published As

Publication number Publication date
AU2016292849B2 (en) 2019-05-16
ES2901111T3 (es) 2022-03-21
DK3323152T3 (da) 2021-12-20
US20180204977A1 (en) 2018-07-19
US11594657B2 (en) 2023-02-28
CA2992154A1 (en) 2017-01-19
JP2018521516A (ja) 2018-08-02
AU2016292849A1 (en) 2018-02-15
TW201712891A (zh) 2017-04-01
WO2017009394A1 (en) 2017-01-19
EA201890167A1 (ru) 2018-07-31
CN108292694A (zh) 2018-07-17
KR20180055803A (ko) 2018-05-25
EP3323152B1 (en) 2021-10-27
JP7066610B2 (ja) 2022-05-13
TWI772266B (zh) 2022-08-01
EP3323152A1 (en) 2018-05-23

Similar Documents

Publication Publication Date Title
BR112018000603A2 (pt) fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides
JP2015122525A5 (pt)
BR112015024407A2 (pt) diodo eletroluminescente
EP2362450A3 (en) Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system
JP2018505567A5 (pt)
EA201201243A1 (ru) ГЕТЕРОСТРУКТУРА НА ОСНОВЕ ТВЁРДОГО РАСТВОРА GaInAsSb, СПОСОБ ЕЁ ИЗГОТОВЛЕНИЯ И СВЕТОДИОД НА ОСНОВЕ ЭТОЙ ГЕТЕРОСТРУКТУРЫ
EP2669946A3 (en) Light emitting element, illumination device and device frame thereof
TW200742126A (en) Semiconductor light emitting device and its manufacturing method
WO2014167455A3 (en) Top emitting semiconductor light emitting device
US20140293594A1 (en) Lamp structure
WO2013049415A3 (en) P-type doping layers for use with light emitting devices
WO2011135471A3 (en) Light emitting diode with trenches and a top contact
WO2013083528A3 (de) Halbleiterleuchte
EP4235826A3 (en) Interconnects for light emitting diode chips
TW200943589A (en) Light emitting diode chip with overvoltage protection
EP2372790A3 (en) Light emitting diode, light emitting diode package, and lighting system
JP2011510511A5 (pt)
WO2010098896A3 (en) Illumination device
TW200711180A (en) Light emitting diode and light emitting diode lamp
WO2015008189A3 (en) Dicing a wafer of light emitting devices
MY165794A (en) Light emitting diode and fabrication method thereof
CN203746891U (zh) 一种氮化镓基发光二极管
US9190568B2 (en) Light emitting diode structure
EP2613368A3 (en) Light emitting diode
PL408429A1 (pl) Dioda superluminescencyjna na bazie AlInGaN

Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements