AU2049901A - Method of cleaning and conditioning plasma reaction chamber - Google Patents

Method of cleaning and conditioning plasma reaction chamber

Info

Publication number
AU2049901A
AU2049901A AU20499/01A AU2049901A AU2049901A AU 2049901 A AU2049901 A AU 2049901A AU 20499/01 A AU20499/01 A AU 20499/01A AU 2049901 A AU2049901 A AU 2049901A AU 2049901 A AU2049901 A AU 2049901A
Authority
AU
Australia
Prior art keywords
cleaning
reaction chamber
plasma reaction
conditioning plasma
conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU20499/01A
Other languages
English (en)
Inventor
Duane Outka
Brett C. Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2049901A publication Critical patent/AU2049901A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32477Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853Hygiene
    • H01J37/32862In situ cleaning of vessels and/or internal parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
AU20499/01A 1999-12-22 2000-12-08 Method of cleaning and conditioning plasma reaction chamber Abandoned AU2049901A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/469,286 US6350697B1 (en) 1999-12-22 1999-12-22 Method of cleaning and conditioning plasma reaction chamber
US09469286 1999-12-22
PCT/US2000/032441 WO2001046490A1 (en) 1999-12-22 2000-12-08 Method of cleaning and conditioning plasma reaction chamber

Publications (1)

Publication Number Publication Date
AU2049901A true AU2049901A (en) 2001-07-03

Family

ID=23863210

Family Applications (1)

Application Number Title Priority Date Filing Date
AU20499/01A Abandoned AU2049901A (en) 1999-12-22 2000-12-08 Method of cleaning and conditioning plasma reaction chamber

Country Status (9)

Country Link
US (1) US6350697B1 (enExample)
EP (1) EP1252361B1 (enExample)
JP (1) JP4995390B2 (enExample)
KR (1) KR100789684B1 (enExample)
CN (1) CN1252313C (enExample)
AU (1) AU2049901A (enExample)
DE (1) DE60042892D1 (enExample)
TW (1) TW487988B (enExample)
WO (1) WO2001046490A1 (enExample)

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US6350697B1 (en) 2002-02-26
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TW487988B (en) 2002-05-21
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