AU2003261622A1 - Photopolymerizable resin composition for sandblast resist - Google Patents

Photopolymerizable resin composition for sandblast resist

Info

Publication number
AU2003261622A1
AU2003261622A1 AU2003261622A AU2003261622A AU2003261622A1 AU 2003261622 A1 AU2003261622 A1 AU 2003261622A1 AU 2003261622 A AU2003261622 A AU 2003261622A AU 2003261622 A AU2003261622 A AU 2003261622A AU 2003261622 A1 AU2003261622 A1 AU 2003261622A1
Authority
AU
Australia
Prior art keywords
resin composition
photopolymerizable resin
sandblast resist
sandblast
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261622A
Other languages
English (en)
Inventor
Jun-Hyeak Choi
Kook-Hyeon Han
Jung-Hyun Noh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kolon Industries Inc
Original Assignee
Kolon Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Industries Inc filed Critical Kolon Industries Inc
Publication of AU2003261622A1 publication Critical patent/AU2003261622A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
AU2003261622A 2002-09-03 2003-09-02 Photopolymerizable resin composition for sandblast resist Abandoned AU2003261622A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2002-0052692A KR100521999B1 (ko) 2002-09-03 2002-09-03 샌드블래스트 레지스트용 감광성수지 조성물
KR10-2002-0052692 2002-09-03
PCT/KR2003/001791 WO2004023212A1 (en) 2002-09-03 2003-09-02 Photopolymerizable resin composition for sandblast resist

Publications (1)

Publication Number Publication Date
AU2003261622A1 true AU2003261622A1 (en) 2004-03-29

Family

ID=36461777

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261622A Abandoned AU2003261622A1 (en) 2002-09-03 2003-09-02 Photopolymerizable resin composition for sandblast resist

Country Status (8)

Country Link
US (1) US20060111493A1 (https=)
EP (1) EP1546808A4 (https=)
JP (1) JP2005537514A (https=)
KR (1) KR100521999B1 (https=)
CN (1) CN1678957A (https=)
AU (1) AU2003261622A1 (https=)
TW (1) TWI258057B (https=)
WO (1) WO2004023212A1 (https=)

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KR101073620B1 (ko) * 2004-05-07 2011-10-14 주식회사 동진쎄미켐 감광성 수지 조성물
JP2007101863A (ja) * 2005-10-04 2007-04-19 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
KR101369268B1 (ko) * 2006-04-24 2014-03-04 코오롱인더스트리 주식회사 내화학성이 우수한 감광성 수지 조성물
JP2007316298A (ja) * 2006-05-25 2007-12-06 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物
KR101356573B1 (ko) * 2007-01-16 2014-01-29 코오롱인더스트리 주식회사 감광성 수지 조성물
KR100814407B1 (ko) * 2007-02-08 2008-03-18 삼성전자주식회사 미세 패턴 형성용 조성물 및 이를 이용한 패턴의 형성 방법
DE102008024214A1 (de) * 2008-05-19 2009-11-26 Flint Group Germany Gmbh Fotopolymerisierbare Flexodruckelemente für den Druck mit UV-Farben
TWI474918B (zh) * 2010-05-26 2015-03-01 Hon Hai Prec Ind Co Ltd 具預定圖案的滾輪之製作方法
CN102262355A (zh) * 2010-05-28 2011-11-30 鸿富锦精密工业（深圳）有限公司 具预定图案的滚轮的制作方法
CN102964761A (zh) * 2011-09-02 2013-03-13 田菱精细化工（昆山）有限公司 喷砂加工立体保护膜用树脂组合物
KR20130073509A (ko) * 2011-12-23 2013-07-03 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
JP6273690B2 (ja) * 2013-04-08 2018-02-07 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性フィルム
WO2014200138A1 (ko) * 2013-06-14 2014-12-18 (주) 엘지화학 에스테르계 가소제의 제조방법 및 이로부터 제조된 에스테르계 가소제
KR101675822B1 (ko) * 2013-08-07 2016-11-15 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
TWI687769B (zh) 2015-05-12 2020-03-11 日商三菱製紙股份有限公司 噴砂用感光性樹脂組成物及噴砂處理方法
US10574014B2 (en) * 2017-03-27 2020-02-25 Aptiv Technologies Limited Method for sealing electric terminal assembly
TWI874662B (zh) 2020-06-05 2025-03-01 日商三菱製紙股份有限公司 噴砂用感光性樹脂組成物及噴砂用感光性薄膜
WO2022030014A1 (ja) * 2020-08-07 2022-02-10 株式会社ダイセル セルロースアセテート樹脂組成物
KR102825901B1 (ko) * 2021-04-09 2025-06-25 코오롱인더스트리 주식회사 감광성 수지 조성물 및 이를 이용한 드라이 필름 포토레지스트, 감광성 엘리먼트, 레지스터 패턴, 회로기판, 및 디스플레이 장치
CN120215209A (zh) * 2025-05-28 2025-06-27 杭州福斯特电子材料有限公司 感光性树脂组合物、层压体和应用

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248958A (en) * 1979-05-23 1981-02-03 Hoechst Aktiengesellschaft Photopolymerizable mixture containing polyurethanes
US4822705A (en) * 1987-02-24 1989-04-18 Ricoh Company, Ltd. Electrophotographic photoconductor with layer preventing charge injection
JP3638660B2 (ja) * 1995-05-01 2005-04-13 松下電器産業株式会社 感光性樹脂組成物、それを用いたサンドブラスト用感光性ドライフィルム及びそれを用いた食刻方法
JP3468959B2 (ja) * 1995-11-30 2003-11-25 東京応化工業株式会社 感光性樹脂組成物及びそれを用いた感光性樹脂積層フィルム
TW475098B (en) * 1995-10-27 2002-02-01 Tokyo Ohka Kogyo Co Ltd Photosensitive resin composition and photosensitive resin laminated film containing the same
JPH09204044A (ja) * 1996-01-25 1997-08-05 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体
KR100504313B1 (ko) * 1997-09-09 2005-11-25 제이에스알 가부시끼가이샤 감방사선성조성물
JPH11174667A (ja) * 1997-12-09 1999-07-02 Asahi Chem Ind Co Ltd 光重合性樹脂組成物及び積層体
JP2000066391A (ja) * 1998-08-17 2000-03-03 Tokyo Ohka Kogyo Co Ltd サンドブラスト用感光性組成物及びそれを用いた感光性フィルム
JP3473696B2 (ja) * 1999-03-03 2003-12-08 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP4108243B2 (ja) * 1999-04-14 2008-06-25 旭化成エレクトロニクス株式会社 感光性樹脂積層体
WO2001098832A1 (fr) * 2000-06-22 2001-12-27 Hitachi Chemical Co., Ltd. Composition de resine photosensible, element photosensible la contenant, procede de production d'un motif de resist et procede de production d'une carte a circuit imprime
JP2002148802A (ja) * 2000-11-07 2002-05-22 Tokyo Ohka Kogyo Co Ltd サンドブラスト用感光性組成物及びそれを用いた感光性フィルム
JP2002148796A (ja) * 2001-08-06 2002-05-22 Hitachi Chem Co Ltd 印刷回路板およびそれに用いる感光性樹脂組成物、感光性フィルム
EP1324139A3 (en) * 2001-12-06 2003-10-22 Ricoh Company, Ltd. Electrophotographic photoconductor, process cartridge, image forming apparatus and image forming method

Also Published As

Publication number Publication date
KR20040021185A (ko) 2004-03-10
WO2004023212A1 (en) 2004-03-18
TWI258057B (en) 2006-07-11
CN1678957A (zh) 2005-10-05
US20060111493A1 (en) 2006-05-25
JP2005537514A (ja) 2005-12-08
EP1546808A1 (en) 2005-06-29
TW200421021A (en) 2004-10-16
KR100521999B1 (ko) 2005-10-18
EP1546808A4 (en) 2007-07-25

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase