ATE449145T1 - Wärmehärtende klebefolie für verkapselung - Google Patents

Wärmehärtende klebefolie für verkapselung

Info

Publication number
ATE449145T1
ATE449145T1 AT08008531T AT08008531T ATE449145T1 AT E449145 T1 ATE449145 T1 AT E449145T1 AT 08008531 T AT08008531 T AT 08008531T AT 08008531 T AT08008531 T AT 08008531T AT E449145 T1 ATE449145 T1 AT E449145T1
Authority
AT
Austria
Prior art keywords
encapsulation
adhesive film
adhesive sheet
heat curing
curing adhesive
Prior art date
Application number
AT08008531T
Other languages
English (en)
Inventor
Eiji Toyoda
Hiroshi Noro
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE449145T1 publication Critical patent/ATE449145T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
AT08008531T 2007-05-17 2008-05-06 Wärmehärtende klebefolie für verkapselung ATE449145T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007131994A JP5133598B2 (ja) 2007-05-17 2007-05-17 封止用熱硬化型接着シート

Publications (1)

Publication Number Publication Date
ATE449145T1 true ATE449145T1 (de) 2009-12-15

Family

ID=39720241

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08008531T ATE449145T1 (de) 2007-05-17 2008-05-06 Wärmehärtende klebefolie für verkapselung

Country Status (8)

Country Link
US (2) US20080286562A1 (de)
EP (1) EP1992671B1 (de)
JP (1) JP5133598B2 (de)
KR (1) KR101284374B1 (de)
CN (2) CN101307221A (de)
AT (1) ATE449145T1 (de)
DE (1) DE602008000293D1 (de)
TW (1) TWI424040B (de)

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JP5133598B2 (ja) * 2007-05-17 2013-01-30 日東電工株式会社 封止用熱硬化型接着シート
CN102549091A (zh) * 2009-09-16 2012-07-04 住友电木株式会社 粘合膜、多层电路基板、电子部件和半导体装置
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US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
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JP2013007028A (ja) * 2011-05-20 2013-01-10 Nitto Denko Corp 封止用シートおよび電子部品装置
US9343430B2 (en) * 2011-09-02 2016-05-17 Maxim Integrated Products, Inc. Stacked wafer-level package device
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JP2013147589A (ja) * 2012-01-20 2013-08-01 Nitto Denko Corp 電子部品封止用樹脂組成物シートおよびそれを用いた電子部品装置の製法
JP5425975B2 (ja) * 2012-06-28 2014-02-26 日東電工株式会社 接着フィルム、半導体装置の製造方法及び半導体装置
JP5961055B2 (ja) * 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
JP5768023B2 (ja) 2012-08-29 2015-08-26 日東電工株式会社 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP5942261B2 (ja) * 2012-09-28 2016-06-29 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板、プリント配線板
JP6456027B2 (ja) * 2013-03-27 2019-01-23 日東電工株式会社 封止シート、封止シートの製造方法及び電子部品パッケージの製造方法
JP5793160B2 (ja) * 2013-03-28 2015-10-14 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP6434181B2 (ja) * 2013-03-28 2018-12-05 日東電工株式会社 中空型電子デバイス封止用シート、及び、中空型電子デバイスパッケージの製造方法
JP2014209563A (ja) * 2013-03-28 2014-11-06 日東電工株式会社 中空型電子デバイス封止用シート、及び、中空型電子デバイスパッケージの製造方法
JP6302692B2 (ja) * 2013-03-28 2018-03-28 日東電工株式会社 中空封止用樹脂シート及び中空パッケージの製造方法
JP5735030B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP6643791B2 (ja) * 2013-03-28 2020-02-12 日東電工株式会社 中空封止用樹脂シート及び中空パッケージの製造方法
JP2014225635A (ja) * 2013-04-26 2014-12-04 日東電工株式会社 中空封止シート及び中空パッケージの製造方法
CN107946477B (zh) 2013-05-21 2020-09-25 Lg化学株式会社 包封薄膜和使用该包封薄膜包封有机电子装置的方法
US10224260B2 (en) * 2013-11-26 2019-03-05 Infineon Technologies Ag Semiconductor package with air gap
JP6547221B2 (ja) * 2014-12-16 2019-07-24 リンテック株式会社 ダイ接着用接着剤
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JP7154732B2 (ja) 2016-03-31 2022-10-18 味の素株式会社 樹脂組成物
JP6706995B2 (ja) * 2016-08-05 2020-06-10 三井化学東セロ株式会社 アンダーフィル用絶縁フィルム
JP2018104649A (ja) * 2016-12-28 2018-07-05 日東電工株式会社 樹脂シート
TWI761501B (zh) * 2017-04-28 2022-04-21 日商昭和電工材料股份有限公司 密封用薄膜、密封結構體、及密封結構體的製造方法
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JP7343988B2 (ja) * 2019-03-19 2023-09-13 日東電工株式会社 封止用シート
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Also Published As

Publication number Publication date
JP2008285593A (ja) 2008-11-27
DE602008000293D1 (de) 2009-12-31
US8922031B2 (en) 2014-12-30
EP1992671B1 (de) 2009-11-18
JP5133598B2 (ja) 2013-01-30
TWI424040B (zh) 2014-01-21
KR20080101704A (ko) 2008-11-21
CN104371578A (zh) 2015-02-25
KR101284374B1 (ko) 2013-07-09
US20080286562A1 (en) 2008-11-20
TW200916549A (en) 2009-04-16
EP1992671A1 (de) 2008-11-19
CN101307221A (zh) 2008-11-19
US20120153513A1 (en) 2012-06-21

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