JP6643791B2 - 中空封止用樹脂シート及び中空パッケージの製造方法 - Google Patents
中空封止用樹脂シート及び中空パッケージの製造方法 Download PDFInfo
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- H—ELECTRICITY
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Description
動的粘弾性測定による60〜130℃での最低溶融粘度が2000Pa・s以上20000Pa・s以下であり、
150℃で1時間熱硬化させた後の常温(20℃)における貯蔵弾性率が1GPa以上20GPa以下であり、
150℃で1時間熱硬化させた後のガラス転移温度以下における線膨張係数が5ppm/K以上15ppm/K以下である。
前記中空封止用樹脂シートを硬化させて封止体を形成する封止体形成工程
を含む中空パッケージの製造方法も含まれる。
[中空封止用樹脂シート]
シリカは通常、比重2.2g/cm3であるので、シリカの含有量(重量%)の好適範囲は以下のとおりである。すなわち、樹脂シート11中のシリカの含有量は、81重量%以上が好ましく、84重量%以上がより好ましい。樹脂シート11中のシリカの含有量は、94重量%以下が好ましく、91重量%以下がより好ましい。
樹脂シート11の製造方法は特に限定されないが、混練物を調製し、得られた混練物をシート状に加工する方法が好ましい。具体的には、上述の各成分をミキシングロール、加圧式ニーダー、押出機などの公知の混練機で溶融混練することにより混練物を調製し、得られた混練物をシート状に加工する。混練条件として、温度は、上述の各成分の軟化点以上であることが好ましく、例えば30〜150℃、エポキシ樹脂の熱硬化性を考慮すると、好ましくは40〜140℃、さらに好ましくは60〜120℃である。時間は、例えば1〜30分間、好ましくは5〜15分間である。
図2A〜2Cはそれぞれ、本発明の一実施形態に係る中空パッケージの製造方法の一工程を模式的に示す図である。中空封止方法としては特に限定されず、従来公知の方法で封止できる。例えば、被着体上の電子デバイスを覆うように未硬化の樹脂シート11を基板上に中空構造を維持しながら積層(載置)し、次いで樹脂シート11を硬化させて封止する方法などが挙げられる。被着体としては特に限定されず、例えば、プリント配線基板、セラミック基板、シリコン基板、金属基板等が挙げられる。本実施形態では、プリント配線基板12上に搭載されたSAWチップ13を樹脂シート11により中空封止して中空パッケージを作製する。
SAWチップ搭載基板準備工程では、複数のSAWチップ13が搭載されたプリント配線基板12を準備する(図2A参照)。SAWチップ13は、所定の櫛形電極が形成された圧電結晶を公知の方法でダイシングして個片化することにより形成できる。SAWチップ13のプリント配線基板12への搭載には、フリップチップボンダーやダイボンダーなどの公知の装置を用いることができる。SAWチップ13とプリント配線基板12とはバンプなどの突起電極13aを介して電気的に接続されている。また、SAWチップ13とプリント配線基板12との間は、SAWフィルタ表面での表面弾性波の伝播を阻害しないように中空部分14を維持するようになっている。SAWチップ13とプリント配線基板12との間の距離は適宜設定でき、一般的には10〜100μm程度である。
封止工程では、SAWチップ13を覆うようにプリント配線基板12へ樹脂シート11を積層し、SAWチップ13を樹脂シート11で樹脂封止する(図2B参照)。樹脂シート11は、SAWチップ13及びそれに付随する要素を外部環境から保護するための封止樹脂として機能する。
封止体形成工程では、樹脂シート11を熱硬化処理して封止体15を形成する(図2B参照)。熱硬化処理の条件として、加熱温度が好ましくは100℃以上、より好ましくは120℃以上である。一方、加熱温度の上限が、好ましくは200℃以下、より好ましくは180℃以下である。加熱時間が、好ましくは10分以上、より好ましくは30分以上である。一方、加熱時間の上限が、好ましくは180分以下、より好ましくは120分以下である。また、必要に応じて加圧してもよく、好ましくは0.1MPa以上、より好ましくは0.5MPa以上である。一方、上限は好ましくは10MPa以下、より好ましくは5MPa以下である。
続いて、封止体15のダイシングを行ってもよい(図2C参照)。これにより、SAWチップ13単位での中空パッケージ18を得ることができる。
必要に応じて、中空パッケージ18に対して再配線及びバンプを形成し、これを別途の基板(図示せず)に実装する基板実装工程を行うことができる。中空パッケージ18の基板への実装には、フリップチップボンダーやダイボンダーなどの公知の装置を用いることができる。
第1実施形態では、各配合成分をニーダー等で混練して混練物を調製し、この混練物を押出成形してシート状に形成している。これに対し、本実施形態では、各成分を有機溶剤等に溶解又は分散したワニスを塗工してシート状に形成する。
エポキシ樹脂1:新日鐵化学(株)製のYSLV−80XY(ビスフェノールF型エポキシ樹脂、エポキン当量200g/eq.、軟化点80℃)
エポキシ樹脂2:日本化薬社製のEPPN−501HY(エポキシ当量169g/eq.、軟化点60℃)
フェノール樹脂1:明和化成社製のMEH−7851−SS(ビフェニルアラルキル骨格を有するフェノール樹脂、水酸基当量203g/eq.、軟化点67℃)
フェノール樹脂2:明和化成社製のMEH−7500(フェノール当量97g/eq.、軟化点111℃)
熱可塑性樹脂:(株)カネカ製のSIBSTER 072T(スチレン−イソブチレン−スチレンブロック共重合体)
無機充填剤1:電気化学工業社製のFB−9454FC(溶融球状シリカ、平均粒子径20μm)
無機充填剤2:(株)トクヤマ製のSE−40(溶融球状シリカ、平均粒子径38μm)
無機充填剤3:電気化学工業社製のFB−5SDC(溶融球状シリカ、平均粒子径5μm)
無機充填剤4:(株)アドマテックス製のSO−25R(溶融球状シリカ、平均粒子径0.5μm)
シランカップリング剤:信越化学社製のKBM−403(3−グリシドキシプロピルトリメトキシシラン)
カーボンブラック:三菱化学社製の#20
難燃剤:伏見製薬所製のFP−100(ホスファゼン系難燃剤:式(4)で表される化
合物)
硬化促進剤:四国化成工業社製の2PHZ−PW(2−フェニル−4,5−ジヒドロキシメチルイミダゾール)
表1に記載の配合比に従い、各成分を配合し、ロール混練機により60〜120℃、10分間、減圧条件下(0.01kg/cm2)で溶融混練し、混練物を調製した。次いで、得られた混練物を平板プレス法によりシート状(50mm×50mm)に成形して、表1に示す厚さの中空封止用樹脂シートを作製した。
表1に記載の配合比に従い、各成分をメチルエチルケトンとトルエンとの1:1混合溶剤に溶解ないし分散し、固形分40重量%のワニスを作製した。次に、離型処理を施したPETフィルム上に、溶剤乾燥後の塗膜の厚さが50μmになるようにワニスを塗工し、その後、乾燥条件を120℃、3分として塗膜を乾燥させて、厚さ50μmの樹脂シートを得た。得られた樹脂シートを、ラミネータを用いて厚み200μmになるまで積層し、厚さ200μmの中空封止用樹脂シートを作製した。
各中空封止用樹脂シートの最低溶融粘度を、TAインスツルメント社製の粘弾性測定装置「ARES」(測定条件:測定温度範囲60〜130℃、昇温速度10℃/min、周波数0.1Hz)で粘度変化を追跡した際、粘度の最低値を測定した結果を表1に示す。
線膨張係数の測定は、熱機械分析装置((株)リガク社製:形式:TMA8310)を用いて行った。具体的には、各中空封止用樹脂シートを150℃で1時間加熱して熱硬化させ、この硬化物からサンプルサイズを長さ25mm×幅4.9mm×厚さ200μmとして測定試料を得た後、測定試料をフィルム引っ張り測定用治具にセットし、引張荷重4.9mN、昇温速度10℃/minの条件下で測定し、線膨張係数を得た。結果を表1に示す。
各中空封止用樹脂シートを150℃で1時間加熱して熱硬化させ、この硬化物からサンプルサイズを長さ25mm×幅4.9mm×厚さ200μmとして測定試料を得た。この測定試料の貯蔵弾性率をTAインスツルメント製RSA3で測定した。具体的には、−50〜300℃の温度域での貯蔵弾性率及び損失弾性率を、周波数1Hz、昇温速度10℃/minの条件下で測定し、20℃での貯蔵弾性率(E’)を読み取ることにより得た。また、当該測定におけるtanδ(G”(損失弾性率)/G’(貯蔵弾性率))の値を算出することによりガラス転移温度(Tg)を得た。それぞれの結果を表1に示す。
アルミニウム櫛形電極が形成された以下の仕様のSAWチップを下記ボンディング条件にて長さ50mm×幅50mm×厚さ0.5mmのガラス基板に実装したSAWチップ実装基板を作製した。実施例1〜3、5及び比較例1〜4ではSAWチップとガラス基板との間のギャップ幅は30μm、実施例4では90μmであった。
チップサイズ:1.2mm□(厚さ150μm)
バンプ材質(実施例1〜3、5及び比較例1〜4):Auバンプ、高さ30μm
バンプ材質(実施例4):半田(鉛フリータイプ)バンプ、高さ90μm
バンプ数:6バンプ
チップ数:100個(10個×10個)
装置:パナソニック電工(株)製
ボンディング条件:200℃、3N、1sec、超音波出力2W
温度:60℃
加圧力:4MPa
真空度:1.6kPa
プレス時間:1分
11a 支持体
13 SAWチップ
15 封止体
18 中空パッケージ
Claims (2)
- 無機充填剤を70体積%以上90体積%以下の含有量で含み、
動的粘弾性測定による60〜130℃での最低溶融粘度が3000Pa・s以上20000Pa・s以下であり、
150℃で1時間熱硬化させた後の20℃における貯蔵弾性率が1GPa以上20GPa以下であり、
150℃で1時間熱硬化させた後のガラス転移温度以下における線膨張係数が5ppm/K以上12ppm/K以下である中空封止用樹脂シート。 - 被着体上に配置された1又は複数の電子デバイスを覆うように請求項1に記載の中空封止用樹脂シートを前記電子デバイス上に前記被着体と前記電子デバイスとの間の中空部を維持しながら積層する積層工程、及び
前記中空封止用樹脂シートを硬化させて封止体を形成する封止体形成工程
を含む中空パッケージの製造方法。
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JP2014022313A JP6643791B2 (ja) | 2013-03-28 | 2014-02-07 | 中空封止用樹脂シート及び中空パッケージの製造方法 |
CN201480019057.4A CN105074906B (zh) | 2013-03-28 | 2014-03-18 | 中空密封用树脂片及中空封装体的制造方法 |
PCT/JP2014/057339 WO2014156837A1 (ja) | 2013-03-28 | 2014-03-18 | 中空封止用樹脂シート及び中空パッケージの製造方法 |
SG11201507891RA SG11201507891RA (en) | 2013-03-28 | 2014-03-18 | Hollow sealing resin sheet and production method for hollow package |
TW103111252A TWI621225B (zh) | 2013-03-28 | 2014-03-26 | 中空密封用樹脂薄片及中空封裝之製造方法 |
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JP6379051B2 (ja) * | 2015-01-23 | 2018-08-22 | 日東電工株式会社 | 中空型電子デバイス封止用シート |
JP6422370B2 (ja) * | 2015-03-03 | 2018-11-14 | 日東電工株式会社 | 中空型電子デバイス封止用シート、及び、中空型電子デバイスパッケージの製造方法 |
JP6883937B2 (ja) * | 2015-03-19 | 2021-06-09 | 日東電工株式会社 | 封止用シートおよび中空パッケージの製造方法 |
JP6283624B2 (ja) * | 2015-05-28 | 2018-02-21 | 日東電工株式会社 | 中空型電子デバイス封止用シート、中空型電子デバイスパッケージの製造方法、及び、中空型電子デバイスパッケージ |
JP6174292B1 (ja) * | 2016-04-05 | 2017-08-02 | リンテック株式会社 | 三次元集積積層回路製造用シートおよび三次元集積積層回路の製造方法 |
JP2018104649A (ja) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | 樹脂シート |
SG11202003540PA (en) * | 2017-10-31 | 2020-05-28 | Nagase Chemtex Corp | Manufacturing method of mounting structure, and sheet therefor |
US11685102B2 (en) * | 2017-11-08 | 2023-06-27 | Hytech Worldwide, Inc. | Three dimensional thermoforming and lamination |
WO2019098078A1 (ja) * | 2017-11-17 | 2019-05-23 | リンテック株式会社 | 樹脂シート |
CN109148680B (zh) * | 2018-09-26 | 2024-05-21 | 深圳市麦捷微电子科技股份有限公司 | 环氧树脂封装陶瓷基板翘曲度辅修工艺方法及辅修夹具 |
WO2021010204A1 (ja) * | 2019-07-12 | 2021-01-21 | 日東電工株式会社 | 封止用樹脂シート |
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JP2008103700A (ja) * | 2006-09-19 | 2008-05-01 | Hitachi Chem Co Ltd | 多層ダイボンドシート、半導体用接着フィルム付き半導体装置、半導体装置および半導体装置の製造方法 |
JP4872587B2 (ja) * | 2006-10-12 | 2012-02-08 | 日立化成工業株式会社 | 封止フィルム、及びこれを用いた半導体装置 |
JP5133598B2 (ja) * | 2007-05-17 | 2013-01-30 | 日東電工株式会社 | 封止用熱硬化型接着シート |
JP2013006893A (ja) * | 2011-06-22 | 2013-01-10 | Hitachi Chemical Co Ltd | 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置 |
JP5712884B2 (ja) * | 2011-09-28 | 2015-05-07 | 日立化成株式会社 | フィルム状接着剤およびこれを用いた半導体装置の製造方法 |
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CN105074906A (zh) | 2015-11-18 |
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WO2014156837A1 (ja) | 2014-10-02 |
SG11201507891RA (en) | 2015-10-29 |
CN105074906B (zh) | 2018-06-29 |
TW201448135A (zh) | 2014-12-16 |
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