JP5942261B2 - プリプレグ、金属張積層板、プリント配線板 - Google Patents
プリプレグ、金属張積層板、プリント配線板 Download PDFInfo
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- JP5942261B2 JP5942261B2 JP2012217608A JP2012217608A JP5942261B2 JP 5942261 B2 JP5942261 B2 JP 5942261B2 JP 2012217608 A JP2012217608 A JP 2012217608A JP 2012217608 A JP2012217608 A JP 2012217608A JP 5942261 B2 JP5942261 B2 JP 5942261B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Textile Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Description
上記のようにして得られる引張り伸び率が5%以上であることによって、パッケージの反りをさらに低減することができるものである。
(A)成分のナフタレン型エポキシ樹脂として、DIC株式会社製「HP9500」を用いた。また(A)成分の非ナフタレン型エポキシ樹脂として、クレゾールノボラック型エポキシ樹脂であるDIC株式会社製「N673」を用いた。また(A)成分の非ナフタレン型フェノール性硬化剤として、ノボラック型フェノール性硬化剤であるDIC株式会社製「TD2090」を用いた。また(A)成分のナフタレン型フェノール性硬化剤として、DIC株式会社製「HPC9500」を用いた。
上記のプリプレグを2枚重ね、この両面に金属箔として銅箔(厚み12μm)を積層して、真空条件下、2.94MPa(30kgf/cm2)で加圧しながら、220℃で60分間加熱して成形することによって、金属張積層板として銅張積層板(CCL)を製造した。
上記のプリプレグを1枚用い、これを硬化状態とし、さらに50mm×5mmの大きさに切断して試料を作製した。この試料の損失正接は、動的粘弾性測定装置(エスアイアイ・ナノテクノロジー株式会社製「DMS6100」)を用いて、5℃/分の条件で昇温することにより測定した。
上記のプリプレグを1枚用い、これを硬化状態としたものを試料とした。引張り伸び率の測定は、次のような引張り試験により行った。まず、引張り試験前に縦糸又は横糸に対して斜め45°方向における試料の長さ(L0)を測定した。このとき試料の幅は5mmに調整しておいた。次に引張り試験機(株式会社島津製作所製「オートグラフAGS−X」)を用いて、速度5mm/minで縦糸又は横糸に対して斜め45°方向に試料を引張り、この試料が破断する直前の長さ(L)を測定した。そして、次の式によって引張り伸び率を算出した。
(PKG反り量)
まずフリップチップ(FC)を基板に補強材(パナソニック株式会社製「HCV5313HS」)で接着して実装することによって、PKG反り量を測定するための簡易的なFC実装PKG(大きさ16mm×16mm)を製造した。ここで、上記のFCとしては、15.06mm×15.06mm×0.1mmの大きさのSiチップに4356個のはんだボール(高さ80μm)を搭載したものを用いた。また上記の基板としては、上記の金属張積層板の金属箔を除去したものを用いた。
上記の金属張積層板の金属箔を除去し、50mm×50mmの大きさに切断して試料を作製した。次にこの試料を121℃、0.23MPa(2.3atm)、湿度100%RHの高温高湿雰囲気下に6時間放置してプレッシャークッカー試験(PCT)を行った。そして、試験前の試料の重量(Z0)と試験後の試料の重量(Z)とを測定し、次の式によって吸湿率を算出した。
(PCTはんだ耐熱性)
上記と同様にプレッシャークッカー試験(PCT)を行った後の試料を288℃に加温したはんだ槽に20秒間ディッピングした後、試料の外観を観察した。そして、外観に異常がない場合を「OK」、外観に膨れ等が発生した場合を「NG」として良否を判定した。
Claims (6)
- 前記樹脂組成物が、さらに(C)無機充填材を含有することを特徴とする請求項1に記載のプリプレグ。
- 硬化状態において、損失弾性率と貯蔵弾性率の比が60℃以下の温度域と200℃以上の温度域において0.05以上であることを特徴とする請求項1又は2に記載のプリプレグ。
- 硬化状態において、前記織布基材の縦糸又は横糸に対して斜め45°方向における引張り伸び率が5%以上であることを特徴とする請求項1乃至3のいずれか一項に記載のプリプレグ。
- 請求項1乃至4のいずれか一項に記載のプリプレグに金属箔を積層して形成されていることを特徴とする金属張積層板。
- 請求項5に記載の金属張積層板に導体パターンを設けて形成されていることを特徴とするプリント配線板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012217608A JP5942261B2 (ja) | 2012-09-28 | 2012-09-28 | プリプレグ、金属張積層板、プリント配線板 |
CN201380003638.4A CN103906797B (zh) | 2012-09-28 | 2013-09-19 | 预浸料、覆金属层叠板、印刷线路板 |
PCT/JP2013/005531 WO2014050034A1 (ja) | 2012-09-28 | 2013-09-19 | プリプレグ、金属張積層板、プリント配線板 |
US14/355,141 US9578734B2 (en) | 2012-09-28 | 2013-09-19 | Prepreg, metal-clad laminate, and printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012217608A JP5942261B2 (ja) | 2012-09-28 | 2012-09-28 | プリプレグ、金属張積層板、プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014070156A JP2014070156A (ja) | 2014-04-21 |
JP5942261B2 true JP5942261B2 (ja) | 2016-06-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012217608A Active JP5942261B2 (ja) | 2012-09-28 | 2012-09-28 | プリプレグ、金属張積層板、プリント配線板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9578734B2 (ja) |
JP (1) | JP5942261B2 (ja) |
CN (1) | CN103906797B (ja) |
WO (1) | WO2014050034A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109476862A (zh) * | 2016-07-29 | 2019-03-15 | 松下知识产权经营株式会社 | 预浸料、覆金属层压板和印刷线路板 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6327429B2 (ja) * | 2013-08-01 | 2018-05-23 | パナソニックIpマネジメント株式会社 | 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
JP6358533B2 (ja) * | 2014-03-27 | 2018-07-18 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板 |
US9944766B2 (en) | 2014-08-27 | 2018-04-17 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminated board, and printed wiring board |
JP6459343B2 (ja) * | 2014-09-26 | 2019-01-30 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板及びプリント配線板 |
JP6451204B2 (ja) * | 2014-10-22 | 2019-01-16 | 日立化成株式会社 | 樹脂組成物、プリプレグ、樹脂付き金属箔、及びこれらを用いた積層板及びプリント配線板 |
JP2016196556A (ja) * | 2015-04-03 | 2016-11-24 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板及びプリント配線板 |
TW201637464A (zh) * | 2015-04-09 | 2016-10-16 | Haka Ohara | 喇叭振動片布材及其製作方法 |
US9894761B2 (en) * | 2015-06-12 | 2018-02-13 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminated plate and printed wiring board |
JP6715472B2 (ja) * | 2015-09-15 | 2020-07-01 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板及びプリント配線板 |
TWI578803B (zh) * | 2016-01-20 | 2017-04-11 | 正崴精密工業股份有限公司 | 喇叭音膜及其製作方法 |
US11647583B2 (en) | 2016-04-19 | 2023-05-09 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminated board, and printed wiring board |
CN111378098B (zh) * | 2018-12-29 | 2023-04-07 | 广东生益科技股份有限公司 | 树脂组合物、预浸料、层压板以及覆金属箔层压板 |
TW202231146A (zh) * | 2021-01-25 | 2022-08-01 | 優顯科技股份有限公司 | 電子裝置及其製造方法 |
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JP2006137942A (ja) | 2004-10-14 | 2006-06-01 | Hitachi Chem Co Ltd | プリプレグ、積層板、金属箔張積層板及びこれを使用した印刷回路板 |
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JP2008007756A (ja) * | 2006-05-30 | 2008-01-17 | Hitachi Chem Co Ltd | 粘弾性樹脂組成物、プリプレグ、導体張積層板、樹脂付き金属箔及び樹脂フィルム |
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JP2008266513A (ja) * | 2007-04-24 | 2008-11-06 | Hitachi Chem Co Ltd | 硬化性樹脂組成物、プリプレグ、積層板、接着層付金属箔、フィルムシート及びこれらを使用したプリント配線板 |
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CN109476862A (zh) * | 2016-07-29 | 2019-03-15 | 松下知识产权经营株式会社 | 预浸料、覆金属层压板和印刷线路板 |
CN109476862B (zh) * | 2016-07-29 | 2021-07-16 | 松下知识产权经营株式会社 | 预浸料、覆金属层压板和印刷线路板 |
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CN103906797B (zh) | 2015-03-04 |
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US20140367150A1 (en) | 2014-12-18 |
US9578734B2 (en) | 2017-02-21 |
CN103906797A (zh) | 2014-07-02 |
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