JP5605724B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
- Publication number
- JP5605724B2 JP5605724B2 JP2012536565A JP2012536565A JP5605724B2 JP 5605724 B2 JP5605724 B2 JP 5605724B2 JP 2012536565 A JP2012536565 A JP 2012536565A JP 2012536565 A JP2012536565 A JP 2012536565A JP 5605724 B2 JP5605724 B2 JP 5605724B2
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- resin
- resin composition
- inorganic filler
- epoxy resin
- semiconductor module
- Prior art date
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- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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Description
前記樹脂組成物における前記無機フィラーの配合割合が、前記樹脂組成物全体の質量に対し、0.1〜10重量%であることが好ましい。
また、前記無機フィラーが、Al2O3、SiO2、BN、AlN、及びSi3N4からなる群から選択される少なくとも1つであり、1〜1000nmの平均粒径を有することが好ましい。
特には、前記エポキシ樹脂が、3官能型のエポキシ樹脂であることが好ましい。
前記樹脂組成物による封止が、ポッティング、トランスファー成形、または液状トランスファー成形のいずれかにより行われたものであることが好ましい。
また、前記絶縁層が、エポキシ樹脂と、前記エポキシ樹脂に分散されており、1〜99nmの平均粒径を有する第1の無機フィラーと、前記エポキシ樹脂に分散されており、0.1〜100μmの平均粒径を有する第2の無機フィラーと、を含む絶縁材であって、前記第1及び第2の無機フィラーが、互いに独立して、Al2O3、SiO2、BN、AlN及びSi3N4からなる群から選択される少なくとも1つであり、前記絶縁材における前記第1及び第2の無機フィラーの配合割合が、それぞれ、0.1〜7重量%及び80〜95重量%である絶縁材であることが好ましい。
本発明は、さらにまた別の態様によれば、半導体モジュールの製造方法であって、金属ブロックの一方の表面に、絶縁層を張り合わせるステップと、前記金属ブロックの他方の表面に、少なくとも1つの回路素子を実装するステップと、前記回路素子を実装して得られる組立体を、前述の樹脂組成物を用いて封止するステップとを含む。 前記封止するステップが、ポッティング、トランスファー成形、液状トランスファー成形、圧縮成型、または射出成型のいずれかの方法により行われることが好ましい。
前記樹脂組成物における前記無機フィラーの配合割合が、前記樹脂組成物全体の質量に対し、0.1〜10重量%であることが好ましい。
前記無機フィラーが、Al2O3、SiO2、BN、AlN、及びSi3N4からなる群から選択される少なくとも1つであり、1〜100nmの平均粒径を有することが好ましい。
前記エポキシ樹脂が、3官能型のエポキシ樹脂であることが好ましい。
本発明はまた、前記半導体モジュール用絶縁封止樹脂組成物を加熱硬化させることにより得られるナノコンポジット樹脂硬化物にも関する。
本発明はさらには、金属ブロックと、前記金属ブロックの一方の表面に張り合わされた絶縁層と、前記金属ブロックの他方の表面に実装された少なくとも1つの回路素子とを含んでなる組立体を、前述の半導体モジュール用絶縁封止樹脂組成物により封止してなる半導体モジュールにも関する。
前記半導体モジュール用絶縁封止樹脂組成物による封止が、ポッティング、トランスファー成形、または液状トランスファー成形のいずれかにより行われたものであることが好ましい。
前記絶縁層が、エポキシ樹脂と、前記エポキシ樹脂に分散されており、1〜99nmの平均粒径を有する第1の無機フィラーと、前記エポキシ樹脂に分散されており、0.1〜100μmの平均粒径を有する第2の無機フィラーと、を含む絶縁材であって、前記第1及び第2の無機フィラーが、互いに独立して、Al2O3、SiO2、BN、AlN及びSi3N4からなる群から選択される少なくとも1つであり、前記絶縁材における前記第1及び第2の無機フィラーの配合割合が、それぞれ、0.1〜7重量%及び80〜95重量%である絶縁材であることが好ましい。
本発明はさらにまた、金属ブロックの一方の表面に、絶縁層を張り合わせるステップと、前記金属ブロックの他方の表面に、少なくとも1つの回路素子を実装するステップと、前記回路素子を実装して得られる組立体を、前述の半導体モジュール用絶縁封止樹脂組成物を用いて封止するステップとを含む半導体モジュールの製造方法にも関する。
前記封止するステップが、ポッティング、トランスファー成形、または液状トランスファー成形のいずれかの方法により行われることが好ましい。
2 金属ブロック
3 絶縁層
4 回路素子
5 リードフレーム
6 ボンディングワイヤ
10 半導体モジュール
エポキシ樹脂、無機フィラーを、表1にそれぞれ示す割合で混合し、オリフィス加圧通過型分散機を用いて、無機フィラーを分散させた。無機フィラーを分散させた混合物に、硬化剤を表1にそれぞれ示す割合で添加した。これをさらに混練し、樹脂組成物、及び比較例の組成物を得た。なお、表1中の配合割合(重量%)は、硬化前の樹脂組成物全体の重量を100%としたときの、各成分の配合割合(重量%)で示している。
・エポキシ樹脂1(商品名「JER828」三菱化学製 BisA型エポキシ樹脂 エポキシ当量194)
・エポキシ樹脂2(商品名「JER630」三菱化学製 多官能型エポキシ樹脂 エポキシ当量105)
・無機フィラー(商品名「AEROSIL200」日本アエロジル製 シリカ 平均粒径12nm)
・硬化剤1(商品名「JERキュア113」三菱化学製 変性アミン型硬化剤)
・硬化剤2(商品名「JERキュア307」三菱化学製 酸無水物硬化剤)
・硬化助剤1(商品名「EMI24」三菱化学製 イミダゾール硬化促進剤)
Claims (9)
- 3官能型以上の多官能型のエポキシ樹脂と、
分子構造中に−NH3、−NH2、−NH、のいずれか一種または複数が含まれる分子を含んでなる硬化剤または酸無水物系硬化剤と、
5〜30nmの平均粒径を有する、Al 2 O 3 またはSiO 2 である無機フィラーと
を含んでなる、半導体モジュールの絶縁封止のための樹脂組成物であって、
前記無機フィラーが、樹脂組成物の重量を100%として、0.1〜10重量%含まれる、樹脂組成物。 - 前記樹脂組成物における前記無機フィラーの配合割合が、前記樹脂組成物全体の質量に対し、1.5〜6重量%である、請求項1に記載の樹脂組成物。
- 請求項1または2に記載の樹脂組成物を加熱硬化させることにより得られるナノコンポジット樹脂硬化物。
- フィラー間の平均距離が、1〜200nmである、請求項3に記載のナノコンポジット樹脂硬化物。
- 金属ブロックと、
前記金属ブロックの一方の表面に張り合わされた絶縁層と、
前記金属ブロックの他方の表面に実装された少なくとも1つの回路素子と
を含んでなる組立体を、請求項1または2に記載の樹脂組成物により封止してなる半導体モジュール。 - 前記樹脂組成物による封止が、ポッティング、トランスファー成形、または液状トランスファー成形のいずれかにより行われたものである、請求項5に記載の半導体モジュール。
- 前記絶縁層が、エポキシ樹脂と、前記エポキシ樹脂に分散されており、1〜99nmの平均粒径を有する第1の無機フィラーと、前記エポキシ樹脂に分散されており、0.1〜100μmの平均粒径を有する第2の無機フィラーと、を含む絶縁材であって、前記第1及び第2の無機フィラーが、互いに独立して、Al2O3、SiO2、BN、AlN及びSi3N4からなる群から選択される少なくとも1つであり、前記絶縁材における前記第1及び第2の無機フィラーの配合割合が、それぞれ、0.1〜7重量%及び80〜95重量%である絶縁材である、請求項5または6に記載の半導体モジュール。
- 金属ブロックの一方の表面に、絶縁層を張り合わせるステップと、
前記金属ブロックの他方の表面に、少なくとも1つの回路素子を実装するステップと、
前記回路素子を実装して得られる組立体を、請求項1または2に記載の樹脂組成物を用いて封止するステップと
を含む半導体モジュールの製造方法。 - 前記封止するステップが、ポッティング、トランスファー成形、液状トランスファー成形、圧縮成型、または射出成型のいずれかの方法により行われる、請求項8に記載の製造方法。
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DE112011103323T5 (de) | 2013-07-11 |
CN102985486A (zh) | 2013-03-20 |
JPWO2012043751A1 (ja) | 2014-02-24 |
WO2012043751A1 (ja) | 2012-04-05 |
US20130105929A1 (en) | 2013-05-02 |
US9051450B2 (en) | 2015-06-09 |
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