ATE441160T1 - Datenträger mit integriertem schaltkreis - Google Patents

Datenträger mit integriertem schaltkreis

Info

Publication number
ATE441160T1
ATE441160T1 AT02021127T AT02021127T ATE441160T1 AT E441160 T1 ATE441160 T1 AT E441160T1 AT 02021127 T AT02021127 T AT 02021127T AT 02021127 T AT02021127 T AT 02021127T AT E441160 T1 ATE441160 T1 AT E441160T1
Authority
AT
Austria
Prior art keywords
integrated circuit
module
data carrier
wires
accommodating
Prior art date
Application number
AT02021127T
Other languages
English (en)
Inventor
Yahya Haghiri-Tehrani
Original Assignee
Giesecke & Devrient Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6517912&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE441160(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Giesecke & Devrient Gmbh filed Critical Giesecke & Devrient Gmbh
Application granted granted Critical
Publication of ATE441160T1 publication Critical patent/ATE441160T1/de

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/14Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
    • G11C5/142Contactless power supplies, e.g. RF, induction, or IR
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01068Erbium [Er]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
AT02021127T 1994-05-11 1995-05-10 Datenträger mit integriertem schaltkreis ATE441160T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4416697A DE4416697A1 (de) 1994-05-11 1994-05-11 Datenträger mit integriertem Schaltkreis

Publications (1)

Publication Number Publication Date
ATE441160T1 true ATE441160T1 (de) 2009-09-15

Family

ID=6517912

Family Applications (2)

Application Number Title Priority Date Filing Date
AT02021127T ATE441160T1 (de) 1994-05-11 1995-05-10 Datenträger mit integriertem schaltkreis
AT95107090T ATE236435T1 (de) 1994-05-11 1995-05-10 Datenträger mit integriertem schaltkreis und verfahren zur herstellung eines datenträgers

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT95107090T ATE236435T1 (de) 1994-05-11 1995-05-10 Datenträger mit integriertem schaltkreis und verfahren zur herstellung eines datenträgers

Country Status (6)

Country Link
US (1) US5880934A (de)
EP (2) EP0682321B1 (de)
JP (1) JP3795099B2 (de)
AT (2) ATE441160T1 (de)
DE (3) DE4416697A1 (de)
ES (2) ES2328337T3 (de)

Families Citing this family (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
FR2721732B1 (fr) 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式icカード及びその製造方法
DE19527359A1 (de) 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
WO1997005570A1 (de) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Kartenförmiger datenträger für kontaktlose anwendungen mit einem bauteil und mit einer übertragungseinrichtung für die kontaktlosen anwendungen und verfahren zum herstellen eines solchen kartenförmigen datenträgers sowie modul hierfür
EP0842491B1 (de) * 1995-08-01 2005-06-08 Austria Card Plastikkarten und Ausweissysteme Gesellschaft MBH Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers
KR19990035991A (ko) * 1995-08-01 1999-05-25 노버트 토마셰크, 요셉 발크너 비접촉 작용 전송 시스템 및 콤포넌트를 구비한 비접촉 작용카드형 데이터 캐리어와 이런 카드형 데이터 캐리어 및 그모듈의 생산 방법
AT1470U1 (de) * 1995-08-01 1997-05-26 Austria Card Laminierte karte und verfahren zu ihrer herstellung
DE19529640A1 (de) * 1995-08-11 1997-02-13 Giesecke & Devrient Gmbh Spulenelement für einen Datenträger mit integriertem Schaltkreis und nichtberührender Kopplung
DE19543426C1 (de) * 1995-11-21 1997-05-07 Siemens Ag Kontaktlose Chipkarte und Verfahren zur Herstellung derselben
PL327234A1 (en) * 1995-12-22 1998-12-07 Sempac Sa Method of making a chip card for contactless operation
DE19601391A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper zur Herstellung einer eine Spule enthaltenden Chipkarte
DE19604774A1 (de) * 1996-02-09 1997-08-14 Siemens Ag Kunststoffträger mit Induktionsspule
DE19609149C2 (de) * 1996-03-08 2000-05-31 Freudenberg Carl Fa Chipkarte
DE19609134A1 (de) 1996-03-08 1997-09-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
DE19609636C1 (de) * 1996-03-12 1997-08-14 Siemens Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE19633938A1 (de) * 1996-08-22 1998-02-26 Pav Card Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
EP0976104A2 (de) * 1996-03-14 2000-02-02 PAV Card GmbH Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte
DE19610507C2 (de) * 1996-03-15 1997-12-04 David Finn Chipkarte
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19613635A1 (de) * 1996-04-04 1997-10-09 Winter Wertdruck Gmbh Verfahren zum Herstellen eines Datenträgers sowie Datenträger
DE19621044A1 (de) * 1996-05-24 1997-11-27 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers
DE19639902C2 (de) * 1996-06-17 2001-03-01 Elke Zakel Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
WO1999023606A1 (de) * 1996-06-17 1999-05-14 Smart Pac Gmbh Technology Services Verfahren zur herstellung kontaktloser chipkarten und kontaktlose chipkarte
DE19627827A1 (de) * 1996-07-10 1998-01-22 Siemens Ag Chipkarte und Verfahren zu ihrer Herstellung
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
DE19630947C2 (de) * 1996-07-31 2000-08-24 Ods Landis & Gyr Gmbh & Co Kg Kontaktlose Chipkarte
US6301119B1 (en) 1996-08-02 2001-10-09 Schlumberger Systemes Integrated circuit card with two connection modes
FR2752077B1 (fr) * 1996-08-02 1998-09-18 Solaic Sa Carte a circuit integre a connexion mixte et module a circuit integre correspondant
DE19632113C1 (de) * 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
DE19632813C2 (de) * 1996-08-14 2000-11-02 Siemens Ag Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte
DE19632814A1 (de) * 1996-08-14 1998-02-19 Siemens Ag Kombikarte und Verfahren zu ihrer Herstellung
DE19641406C2 (de) * 1996-10-08 2001-03-08 Pav Card Gmbh Chipkarte
FR2753305B1 (fr) * 1996-09-12 1998-11-06 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire sans contact
DE19637306C1 (de) * 1996-09-13 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte
DE19640304C2 (de) 1996-09-30 2000-10-12 Siemens Ag Chipmodul insbesondere zur Implantation in einen Chipkartenkörper
DE19642378C2 (de) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Kontaktlose Chipkarte
DE19645083C2 (de) * 1996-11-01 2000-01-27 Austria Card Gmbh Wien Kontaktlose Chipkarte mit Transponderspule
AU718414B2 (en) * 1996-11-04 2000-04-13 Meto International Gmbh Identification element and method of manufacturing the same
DE19753619A1 (de) * 1997-10-29 1999-05-06 Meto International Gmbh Identifizierungselement und Verfahren zu seiner Herstellung
DE19647845C2 (de) * 1996-11-19 2002-01-10 Pav Card Gmbh Verfahren zum Herstellen einer Chipkarte
FR2756648B1 (fr) 1996-11-29 1999-01-08 Solaic Sa Carte a memoire du type sans contact
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
DE19703058C1 (de) * 1996-12-20 1998-06-10 Siemens Ag In einem Band oder Nutzen angeordnete Trägerelemente für kontaktlose und mit Kontakten versehenen Chipkarten
WO1998033143A1 (de) * 1997-01-28 1998-07-30 Siemens Aktiengesellschaft Trägerelement zum einbau in kombi-chipkarten und kombi-chipkarte
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
DE29706016U1 (de) * 1997-04-04 1998-08-06 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Elektronisches Gerät, insbesondere Chipkarte mit Nietverbindung
DE19716342C2 (de) * 1997-04-18 1999-02-25 Pav Card Gmbh Verfahren zur Herstellung einer Chipkarte
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19720226C5 (de) * 1997-05-14 2007-11-22 Künnecke Verwaltungs GmbH & Co. Holding KG Verfahren und Vorrichtung zur Herstellung von Chipkarten
JPH1111055A (ja) * 1997-06-20 1999-01-19 Toshiba Corp 無線モジュール及び無線カード
JPH1131784A (ja) * 1997-07-10 1999-02-02 Rohm Co Ltd 非接触icカード
DE19733777C2 (de) * 1997-07-28 2003-12-18 Microidentt Ges Fuer Identifik Modul und Verfahren zur Herstellung eines Moduls sowie eine Chipkarte
DE19732644C1 (de) * 1997-07-29 1998-11-12 Siemens Ag Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Chipkarte
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
DE69722403T2 (de) 1997-09-23 2004-01-15 St Microelectronics Srl Banknote mit einer integrierten Schaltung
DE19742268C1 (de) * 1997-09-25 1999-06-02 Orga Kartensysteme Gmbh Verfahren zur Ermittlung des Lageversatzes von mehrlagigen Verbundstrukturen
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
JP3687783B2 (ja) 1997-11-04 2005-08-24 エルケ ツァケル コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード
JPH11143616A (ja) 1997-11-10 1999-05-28 Sega Enterp Ltd 文字通信装置
JPH11161760A (ja) 1997-11-26 1999-06-18 Hitachi Ltd 薄型電子回路部品及びその製造方法及びその製造装置
US6551449B2 (en) 1997-11-26 2003-04-22 Hitachi, Ltd. Thin electronic circuit component and method and apparatus for producing the same
EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
DE19805282A1 (de) 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
EP0942392A3 (de) * 1998-03-13 2000-10-18 Kabushiki Kaisha Toshiba Chipkarte
DE19811577A1 (de) * 1998-03-17 1999-09-23 Siemens Ag Chipkarte mit Wickelspule
EP0998725A1 (de) * 1998-03-27 2000-05-10 Koninklijke Philips Electronics N.V. Datenträger mit implantierten modul basierend auf einem metall-leiterrahmen
FR2778475B1 (fr) 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
DE19932960C2 (de) * 1998-10-08 2002-09-12 Pav Card Gmbh Verfahren zur Herstellung eines Chipkartenmoduls, Positioniervorrichtung zur Durchführung eines derartigen Verfahrens und Positionierverfahren
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
DE19853018C1 (de) * 1998-11-18 2000-04-20 Prometron Gmbh Verfahren zum Herstellen und Aufbringen einer gestanzten Antennenspule mit mehreren Windungen auf eine Chipkarte sowie eine nach diesem Verfahren hergestellte Chipkarte
FR2787609B1 (fr) 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
US6262692B1 (en) * 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
WO2000043952A1 (en) * 1999-01-22 2000-07-27 Intermec Ip Corp. Rfid transponder
US6288905B1 (en) 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
US6353420B1 (en) 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
DE19920593B4 (de) 1999-05-05 2006-07-13 Assa Abloy Identification Technology Group Ab Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls
JP2001043336A (ja) * 1999-07-29 2001-02-16 Sony Chem Corp Icカード
DE19941637A1 (de) * 1999-09-01 2001-03-08 Orga Kartensysteme Gmbh Chipkarte und Verfahren zur Herstellung einer Chipkarte
JP2001084343A (ja) * 1999-09-16 2001-03-30 Toshiba Corp 非接触icカード及びicカード通信システム
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
JP3680676B2 (ja) * 2000-02-03 2005-08-10 松下電器産業株式会社 非接触データキャリア
DE60144452D1 (de) * 2000-02-22 2011-05-26 Toray Eng Co Ltd Verfahren zur Herstellung einer kontaktlosen ID Karte
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
FR2810638B1 (fr) * 2000-06-22 2002-12-06 Solvay Palette en matiere plastique
US7501954B1 (en) 2000-10-11 2009-03-10 Avante International Technology, Inc. Dual circuit RF identification tags
DE10058804C2 (de) * 2000-11-27 2002-11-28 Smart Pac Gmbh Technology Serv Chipmodul sowie Chipkartenmodul zur Herstellung einer Chipkarte
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
DE10105069C2 (de) * 2001-02-05 2003-02-20 Gemplus Gmbh Kopplungselement für Dual-Interface-Karte
JP2002259923A (ja) * 2001-03-05 2002-09-13 Tokyo Magnetic Printing Co Ltd 非接触icカードおよびその製造方法
DE10117994A1 (de) * 2001-04-10 2002-10-24 Orga Kartensysteme Gmbh Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
DE10122416A1 (de) 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Verfahren und Halbzeug zur Herstellung einer Chipkarte mit Spule
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
DE10148105A1 (de) * 2001-09-28 2003-04-17 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer elektrischen Verbindung zwischen Bauelementen einer Datenträgerkarte
DE10148525B4 (de) * 2001-10-01 2017-06-01 Morpho Cards Gmbh Chipkarte sowie ein Verfahren zur Herstellung einer derartigen Chipkarte
CN100334597C (zh) * 2002-03-11 2007-08-29 阿鲁策株式会社 Ic卡和读卡器
US6665193B1 (en) * 2002-07-09 2003-12-16 Amerasia International Technology, Inc. Electronic circuit construction, as for a wireless RF tag
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7102524B2 (en) * 2002-08-02 2006-09-05 Symbol Technologies, Inc. Die frame apparatus and method of transferring dies therewith
NL1022766C2 (nl) * 2003-02-24 2004-09-21 Enschede Sdu Bv Identiteitskaart alsmede reisdocument.
MY148205A (en) * 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
WO2004112096A2 (en) * 2003-06-12 2004-12-23 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
US20050196604A1 (en) * 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
FR2868987B1 (fr) * 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US20060146271A1 (en) * 2005-01-04 2006-07-06 Pennaz Thomas J Universal display module
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US7821794B2 (en) * 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
US20060238989A1 (en) * 2005-04-25 2006-10-26 Delaware Capital Formation, Inc. Bonding and protective method and apparatus for RFID strap
EP1739596A1 (de) * 2005-06-21 2007-01-03 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
EP1742173A3 (de) * 2005-06-21 2007-08-22 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
EP1796024A1 (de) * 2005-12-08 2007-06-13 Assa Abloy Identification Technology Group AB Verfahren zur Verbindung einer gedruckten Antenne mit einem RFID-Modul und mit diesem Verfahren hergestellte Einheit
US7777317B2 (en) 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
JP4855849B2 (ja) 2006-06-30 2012-01-18 富士通株式会社 Rfidタグの製造方法、およびrfidタグ
CN100412899C (zh) * 2006-08-21 2008-08-20 上海坤锐电子科技有限公司 一种用于制造射频识别电子标签的方法
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US9684861B2 (en) * 2007-12-24 2017-06-20 Dynamics Inc. Payment cards and devices with displays, chips, RFIDs, magnetic emulators, magnetic decoders, and other components
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
JP5461068B2 (ja) * 2009-06-02 2014-04-02 株式会社日本インフォメーションシステム 多層プリント配線板の製造方法および多層プリント配線板
DE102009023848B4 (de) 2009-06-04 2021-10-28 Giesecke+Devrient Mobile Security Gmbh Verfahren zur drucktechnischen Herstellung einer elektrischen Leiterbahn
FR2947392B1 (fr) * 2009-06-29 2019-05-10 Idemia France Procede de raccordement electrique de deux organes entre eux
WO2011024844A1 (ja) * 2009-08-26 2011-03-03 凸版印刷株式会社 非接触通信媒体
GB201012012D0 (en) * 2010-07-16 2010-09-01 Novalia Ltd Laminate
US20140211444A1 (en) * 2013-01-30 2014-07-31 Texas Instruments Incorporated Discrete component assembly
DE102016014994A1 (de) * 2016-12-16 2018-06-21 Veridos Gmbh Inlay für ein elektronisches Identifikationsdokument
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8503410A (nl) * 1985-12-11 1987-07-01 Philips Nv Inrichting voor het overdragen van informatie tussen een elektronische geheugenkaart en een dataverwerkende eenheid.
US4795898A (en) * 1986-04-28 1989-01-03 American Telephone And Telegraph Company Personal memory card having a contactless interface using differential data transfer
WO1988008592A1 (en) * 1987-04-27 1988-11-03 Soundcraft, Inc. Method for the manufacture of and structure of a laminated proximity card
FR2641102B1 (de) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JPH073808B2 (ja) * 1990-04-19 1995-01-18 アキュ グスタフソ プリント回路上へのコイル組立て方法
DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
JP2709223B2 (ja) * 1992-01-30 1998-02-04 三菱電機株式会社 非接触形携帯記憶装置
NL9200835A (nl) * 1992-05-11 1993-12-01 Nedap Nv Flexibele spoelconstructie in identificatiekaart.
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
US5544014A (en) * 1992-08-12 1996-08-06 Oki Electric Industry Co., Ltd. IC card having a built-in semiconductor integrated circuit device
US5361061A (en) * 1992-10-19 1994-11-01 Motorola, Inc. Computer card data receiver having a foldable antenna
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices

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EP0682321A3 (de) 2000-01-19
EP0682321A2 (de) 1995-11-15
EP0682321B1 (de) 2003-04-02
EP1271399B1 (de) 2009-08-26
DE59511102D1 (de) 2009-10-08
ES2328337T3 (es) 2009-11-12
JP3795099B2 (ja) 2006-07-12
ATE236435T1 (de) 2003-04-15
EP1271399A1 (de) 2003-01-02
US5880934A (en) 1999-03-09
DE4416697A1 (de) 1995-11-16
JPH0844840A (ja) 1996-02-16
ES2191690T3 (es) 2003-09-16

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