ATE176959T1 - Kontaktlose speicherkarte mit ic-modul - Google Patents
Kontaktlose speicherkarte mit ic-modulInfo
- Publication number
- ATE176959T1 ATE176959T1 AT95401458T AT95401458T ATE176959T1 AT E176959 T1 ATE176959 T1 AT E176959T1 AT 95401458 T AT95401458 T AT 95401458T AT 95401458 T AT95401458 T AT 95401458T AT E176959 T1 ATE176959 T1 AT E176959T1
- Authority
- AT
- Austria
- Prior art keywords
- module
- support
- memory card
- printed circuit
- circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9407657A FR2721732B1 (fr) | 1994-06-22 | 1994-06-22 | Carte à mémoire sans contact dont le circuit électronique comporte un module. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE176959T1 true ATE176959T1 (de) | 1999-03-15 |
Family
ID=9464513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT95401458T ATE176959T1 (de) | 1994-06-22 | 1995-06-20 | Kontaktlose speicherkarte mit ic-modul |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5640306A (de) |
| EP (1) | EP0689165B2 (de) |
| JP (1) | JPH0855206A (de) |
| AT (1) | ATE176959T1 (de) |
| DE (1) | DE69507915T3 (de) |
| FR (1) | FR2721732B1 (de) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4431604A1 (de) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule |
| FR2734983B1 (fr) | 1995-05-29 | 1997-07-04 | Sgs Thomson Microelectronics | Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant |
| AT1470U1 (de) * | 1995-08-01 | 1997-05-26 | Austria Card | Laminierte karte und verfahren zu ihrer herstellung |
| JPH0944576A (ja) * | 1995-08-02 | 1997-02-14 | Hitachi Ltd | 電子財布貸付システム |
| DE19528730A1 (de) * | 1995-08-04 | 1997-02-06 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgers |
| FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
| AU2155697A (en) * | 1996-03-14 | 1997-10-01 | Pav Card Gmbh | Smart card, connection arrangement and method of producing smart card |
| AU4379897A (en) * | 1996-08-22 | 1998-03-06 | Pav Card Gmbh | Method for manufacturing an electric and mechanical connexion in a chip card module placed in a card holder recess |
| US5892661A (en) * | 1996-10-31 | 1999-04-06 | Motorola, Inc. | Smartcard and method of making |
| FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
| JP3687783B2 (ja) * | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
| FR2778997B1 (fr) * | 1998-05-20 | 2000-06-23 | Bull Cp8 | Support pour un circuit electronique, comprenant des moyens anti-arrachement |
| US6297789B2 (en) | 1998-07-09 | 2001-10-02 | Tyco Electronics Corporation | Integrated circuit card with liquid crystal display for viewing at least a portion of the information stored in the card |
| DE29824520U1 (de) * | 1998-09-10 | 2001-06-28 | Skidata Ag, Gartenau | Kartenförmiger Datenträger |
| US6337836B1 (en) | 1999-06-01 | 2002-01-08 | Arthur F. Eidelson | Programmable electronic label |
| US6612852B1 (en) * | 2000-04-13 | 2003-09-02 | Molex Incorporated | Contactless interconnection system |
| US6362972B1 (en) | 2000-04-13 | 2002-03-26 | Molex Incorporated | Contactless interconnection system |
| US6588660B1 (en) | 2000-09-29 | 2003-07-08 | Hewlett-Packard Development Company, L.P. | Passive contactless smartcard security system |
| EP1942391B1 (de) | 2001-03-28 | 2017-01-18 | Irdeto B.V. | Computerlesbare Mediumvorrichtung und Verfahren zum Abspielen von verschlüsselten digitalen Videos |
| KR20030076274A (ko) * | 2002-03-18 | 2003-09-26 | 도레 엔지니아린구 가부시키가이샤 | 비접촉 아이디 카드류 및 그 제조방법 |
| US7094633B2 (en) * | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
| US8055910B2 (en) | 2003-07-07 | 2011-11-08 | Rovi Solutions Corporation | Reprogrammable security for controlling piracy and enabling interactive content |
| KR100723493B1 (ko) * | 2005-07-18 | 2007-06-04 | 삼성전자주식회사 | 와이어 본딩 및 플립 칩 본딩이 가능한 스마트 카드 모듈기판 및 이를 포함하는 스마트 카드 모듈 |
| JP6090006B2 (ja) * | 2013-06-25 | 2017-03-08 | 凸版印刷株式会社 | Icモジュール、デュアルicカードおよびicモジュールの製造方法 |
| WO2017176506A1 (en) * | 2016-04-05 | 2017-10-12 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
| DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
| JPS61137335A (ja) * | 1984-12-10 | 1986-06-25 | Toshiba Corp | 半導体装置 |
| DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
| JPH0687486B2 (ja) * | 1989-10-25 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
| US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
| CA2051836C (en) * | 1990-11-30 | 1996-07-23 | Richard Michael Flynn | Personal data card construction |
| FR2686996B1 (fr) * | 1992-01-31 | 1996-02-02 | Solaic Sa | Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue. |
| DE4416697A1 (de) † | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
-
1994
- 1994-06-22 FR FR9407657A patent/FR2721732B1/fr not_active Expired - Fee Related
-
1995
- 1995-06-20 DE DE69507915T patent/DE69507915T3/de not_active Expired - Fee Related
- 1995-06-20 US US08/492,483 patent/US5640306A/en not_active Expired - Lifetime
- 1995-06-20 AT AT95401458T patent/ATE176959T1/de not_active IP Right Cessation
- 1995-06-20 EP EP95401458A patent/EP0689165B2/de not_active Expired - Lifetime
- 1995-06-20 JP JP7153530A patent/JPH0855206A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE69507915T3 (de) | 2003-11-13 |
| EP0689165B1 (de) | 1999-02-24 |
| FR2721732B1 (fr) | 1996-08-30 |
| DE69507915D1 (de) | 1999-04-01 |
| EP0689165B2 (de) | 2003-01-29 |
| EP0689165A1 (de) | 1995-12-27 |
| FR2721732A1 (fr) | 1995-12-29 |
| DE69507915T2 (de) | 1999-08-12 |
| JPH0855206A (ja) | 1996-02-27 |
| US5640306A (en) | 1997-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |