IT8921783A0 - Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici. - Google Patents

Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici.

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Publication number
IT8921783A0
IT8921783A0 IT8921783A IT2178389A IT8921783A0 IT 8921783 A0 IT8921783 A0 IT 8921783A0 IT 8921783 A IT8921783 A IT 8921783A IT 2178389 A IT2178389 A IT 2178389A IT 8921783 A0 IT8921783 A0 IT 8921783A0
Authority
IT
Italy
Prior art keywords
terminals
electronic components
semiconductor material
integrated device
material plate
Prior art date
Application number
IT8921783A
Other languages
English (en)
Other versions
IT1233008B (it
Inventor
Carlo Cini
Angelo Massironi
Luigi Sisti
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8921783A priority Critical patent/IT1233008B/it
Publication of IT8921783A0 publication Critical patent/IT8921783A0/it
Priority to DE69023858T priority patent/DE69023858T2/de
Priority to EP90117744A priority patent/EP0418749B1/en
Priority to US07/583,271 priority patent/US5113239A/en
Priority to KR1019900014960A priority patent/KR910007118A/ko
Priority to JP2254039A priority patent/JPH03131043A/ja
Application granted granted Critical
Publication of IT1233008B publication Critical patent/IT1233008B/it
Priority to US07/867,646 priority patent/US5165590A/en

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    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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IT8921783A 1989-09-21 1989-09-21 Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici IT1233008B (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT8921783A IT1233008B (it) 1989-09-21 1989-09-21 Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici
DE69023858T DE69023858T2 (de) 1989-09-21 1990-09-14 Integrierte Schaltungsanordnung mit verbesserten Verbindungen zwischen den Steckerstiften und den Halbleitermaterial-Chips.
EP90117744A EP0418749B1 (en) 1989-09-21 1990-09-14 Integrated device with improved connections between the pins and the semiconductor material chip
US07/583,271 US5113239A (en) 1989-09-21 1990-09-17 Integrated device with improved connections between the pins and the semiconductor material chip
KR1019900014960A KR910007118A (ko) 1989-09-21 1990-09-20 핀과 반도체 칩사이에 개선된 연결을 갖는 집적 장치 및 그의 제조 방법
JP2254039A JPH03131043A (ja) 1989-09-21 1990-09-20 改良された接続を有する集積素子
US07/867,646 US5165590A (en) 1989-09-21 1992-04-13 Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip

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IT8921783A IT1233008B (it) 1989-09-21 1989-09-21 Dispositivo integrato con connessioni perfezionate fra i terminali e la piastrina di materiale semiconduttore integrante componenti elettronici

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JPH0760839B2 (ja) * 1990-03-15 1995-06-28 株式会社東芝 半導体装置
US5281772A (en) * 1991-10-28 1994-01-25 Delco Electronics Corporation Electrical connector having energy-formed solder stops and methods of making and using the same
JP2783133B2 (ja) * 1993-09-29 1998-08-06 松下電器産業株式会社 ワイヤボンディング前処理方法
EP0722198A3 (en) * 1995-01-10 1996-10-23 Texas Instruments Inc Bond wire with integrated contact area
US5530284A (en) * 1995-03-06 1996-06-25 Motorola, Inc. Semiconductor leadframe structure compatible with differing bond wire materials
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6534878B1 (en) * 1996-11-11 2003-03-18 Siemens Aktiengesellschaft Optimizing the power connection between chip and circuit board for a power switch
US6997931B2 (en) * 2001-02-02 2006-02-14 Lsi Solutions, Inc. System for endoscopic suturing
US20030155635A1 (en) * 2002-02-21 2003-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded
US7304393B1 (en) * 2004-03-24 2007-12-04 Microtune (Texas), L.P. System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
US8105932B2 (en) * 2004-08-19 2012-01-31 Infineon Technologies Ag Mixed wire semiconductor lead frame package
JP5340912B2 (ja) 2006-03-23 2013-11-13 台灣積體電路製造股▲ふん▼有限公司 電気的に強化されたワイヤボンドパッケージ
JP5011879B2 (ja) * 2006-08-09 2012-08-29 サンケン電気株式会社 半導体装置及びリードフレーム組立体の製法
US8125060B2 (en) * 2006-12-08 2012-02-28 Infineon Technologies Ag Electronic component with layered frame
US7960845B2 (en) 2008-01-03 2011-06-14 Linear Technology Corporation Flexible contactless wire bonding structure and methodology for semiconductor device
JP2008235911A (ja) * 2008-03-26 2008-10-02 Murata Mfg Co Ltd 低温焼成セラミック回路基板及びその製造方法
US7902665B2 (en) 2008-09-02 2011-03-08 Linear Technology Corporation Semiconductor device having a suspended isolating interconnect
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2018128487A (ja) * 2017-02-06 2018-08-16 セイコーエプソン株式会社 電気光学パネル、電気光学装置および電子機器

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JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
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EP0418749A2 (en) 1991-03-27
US5113239A (en) 1992-05-12
KR910007118A (ko) 1991-04-30
US5165590A (en) 1992-11-24
JPH03131043A (ja) 1991-06-04
DE69023858D1 (de) 1996-01-11
IT1233008B (it) 1992-03-14
EP0418749B1 (en) 1995-11-29
DE69023858T2 (de) 1996-08-22

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