ATE431699T1 - Leiterplatte und verfahren zur herstellung einer leiterplatte - Google Patents

Leiterplatte und verfahren zur herstellung einer leiterplatte

Info

Publication number
ATE431699T1
ATE431699T1 AT05254062T AT05254062T ATE431699T1 AT E431699 T1 ATE431699 T1 AT E431699T1 AT 05254062 T AT05254062 T AT 05254062T AT 05254062 T AT05254062 T AT 05254062T AT E431699 T1 ATE431699 T1 AT E431699T1
Authority
AT
Austria
Prior art keywords
film
thin copper
thin
circuit board
copper film
Prior art date
Application number
AT05254062T
Other languages
English (en)
Inventor
Kei Nakamura
Takeshi Yamato
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE431699T1 publication Critical patent/ATE431699T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Transmitters (AREA)
AT05254062T 2004-07-01 2005-06-29 Leiterplatte und verfahren zur herstellung einer leiterplatte ATE431699T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004195939A JP4298597B2 (ja) 2004-07-01 2004-07-01 配線回路基板および配線回路基板の製造方法

Publications (1)

Publication Number Publication Date
ATE431699T1 true ATE431699T1 (de) 2009-05-15

Family

ID=34941781

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05254062T ATE431699T1 (de) 2004-07-01 2005-06-29 Leiterplatte und verfahren zur herstellung einer leiterplatte

Country Status (8)

Country Link
US (2) US20060000637A1 (de)
EP (1) EP1613135B1 (de)
JP (1) JP4298597B2 (de)
KR (1) KR101156915B1 (de)
CN (1) CN100593964C (de)
AT (1) ATE431699T1 (de)
DE (1) DE602005014421D1 (de)
TW (1) TWI363589B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844730B2 (ja) * 2006-05-22 2011-12-28 住友金属鉱山株式会社 金属被覆ポリイミド基板の評価方法
US8877074B2 (en) * 2006-12-15 2014-11-04 The Regents Of The University Of California Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
TW200847867A (en) * 2007-04-26 2008-12-01 Mitsui Mining & Smelting Co Printed wire board and manufacturing method thereof, and electrolytic copper foil for copper-clad lamination board used for manufacturing the same
JP5736722B2 (ja) * 2010-10-22 2015-06-17 大日本印刷株式会社 サスペンション用基板、サスペンション用基板の製造方法、サスペンション、素子付サスペンション、およびハードディスクドライブ
CN102427058B (zh) * 2011-11-09 2015-07-22 深南电路有限公司 通过溅射工艺制作线路图形的方法和芯片的重新布线方法
JP5812845B2 (ja) * 2011-12-19 2015-11-17 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
CN103298263B (zh) * 2012-02-28 2016-09-21 深南电路有限公司 一种印制线路板及其加工方法
CN103906364B (zh) * 2012-12-25 2017-07-14 上海美维科技有限公司 一种印制电路板中隐埋电阻的加工方法
CN103966601B (zh) * 2013-02-05 2018-05-18 汉达精密电子(昆山)有限公司 非金属基体导电线路的制作方法及其产品
EP3104400B1 (de) 2014-02-04 2022-08-31 Murata Manufacturing Co., Ltd. Herstellungsverfahren für ein elektronisches komponentenmodul
KR101893503B1 (ko) * 2016-05-27 2018-08-30 (주) 화인켐 미세배선용 연성 회로 기판 및 이의 제조방법
TWI658763B (zh) * 2017-10-11 2019-05-01 欣興電子股份有限公司 製造導線之方法
CN113630977B (zh) * 2020-05-06 2023-01-17 鹏鼎控股(深圳)股份有限公司 厚铜电路板及其制作方法

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US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3328275A (en) * 1963-12-18 1967-06-27 Revere Copper & Brass Inc Treatment of copper to form a dendritic surface
US3674656A (en) * 1969-06-19 1972-07-04 Circuit Foil Corp Bonding treatment and products produced thereby
US4352716A (en) * 1980-12-24 1982-10-05 International Business Machines Corporation Dry etching of copper patterns
MY101308A (en) 1986-06-09 1991-09-05 Minnesota Mining & Mfg Presensitized circuit material.
JPH0783168B2 (ja) * 1988-04-13 1995-09-06 株式会社日立製作所 プリント板の製造方法
DE4113261A1 (de) 1991-04-23 1992-10-29 Siemens Ag Verfahren zum aufbringen einer basiskupferschicht auf glasfaserverstaerktem oder keramikpulvergefuelltem teflonsubstrat und verfahren zur herstellung sehr feiner leiterbahnstrukturen darauf
JPH06120630A (ja) 1992-10-07 1994-04-28 Ulvac Japan Ltd プリント配線基板用の銅箔
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
JPH0732544A (ja) 1993-07-22 1995-02-03 Mitsui Mining & Smelting Co Ltd 紙基材銅張積層板およびその製造方法
JPH0951163A (ja) 1995-05-31 1997-02-18 Mitsui Toatsu Chem Inc フレキシブル回路基板
JPH0955575A (ja) * 1995-08-10 1997-02-25 Mitsui Toatsu Chem Inc 積層体
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US5858518A (en) * 1996-02-13 1999-01-12 Nitto Denko Corporation Circuit substrate, circuit-formed suspension substrate, and production method thereof
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6278185B1 (en) 1998-05-27 2001-08-21 Intel Corporation Semi-additive process (SAP) architecture for organic leadless grid array packages
US6458694B2 (en) * 2000-01-24 2002-10-01 Ebara Corporation High energy sputtering method for forming interconnects
JP3633422B2 (ja) * 2000-02-22 2005-03-30 ソニーケミカル株式会社 接続材料
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
US6772515B2 (en) * 2000-09-27 2004-08-10 Hitachi, Ltd. Method of producing multilayer printed wiring board
JP2002176259A (ja) 2000-09-27 2002-06-21 Hitachi Ltd 多層プリント配線板の製造方法および多層プリント配線板
US6429523B1 (en) 2001-01-04 2002-08-06 International Business Machines Corp. Method for forming interconnects on semiconductor substrates and structures formed
JP2002268905A (ja) * 2001-03-07 2002-09-20 Canon Inc プログラム動作装置、プログラム書込制御装置、プログラム書込制御方法及び記憶媒体
TW587103B (en) 2001-04-06 2004-05-11 Phoenix Prec Technology Corp Circuit board Ni/Au electroplating process without electroplated wires
JP2003318532A (ja) * 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
JP2003324258A (ja) 2002-05-01 2003-11-14 Nippon Mektron Ltd プリント配線板用銅張板
JP2004039771A (ja) 2002-07-02 2004-02-05 Nitto Denko Corp 配線回路基板の製造方法
JP2004082444A (ja) * 2002-08-26 2004-03-18 Dainippon Printing Co Ltd 金属層付き樹脂体および配線体
JP2004335807A (ja) * 2003-05-08 2004-11-25 Nitto Denko Corp 配線回路基板の製造方法

Also Published As

Publication number Publication date
KR101156915B1 (ko) 2012-06-21
EP1613135A1 (de) 2006-01-04
EP1613135B1 (de) 2009-05-13
CN100593964C (zh) 2010-03-10
US20080164236A1 (en) 2008-07-10
US20060000637A1 (en) 2006-01-05
KR20060048744A (ko) 2006-05-18
CN1717161A (zh) 2006-01-04
JP4298597B2 (ja) 2009-07-22
US8092696B2 (en) 2012-01-10
DE602005014421D1 (de) 2009-06-25
TW200603707A (en) 2006-01-16
TWI363589B (en) 2012-05-01
JP2006019522A (ja) 2006-01-19

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