TW200607425A - Method for producing PCB - Google Patents

Method for producing PCB

Info

Publication number
TW200607425A
TW200607425A TW094116353A TW94116353A TW200607425A TW 200607425 A TW200607425 A TW 200607425A TW 094116353 A TW094116353 A TW 094116353A TW 94116353 A TW94116353 A TW 94116353A TW 200607425 A TW200607425 A TW 200607425A
Authority
TW
Taiwan
Prior art keywords
layer
treatment
stripping
conducting
plating
Prior art date
Application number
TW094116353A
Other languages
Chinese (zh)
Inventor
Masahiro Ohno
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200607425A publication Critical patent/TW200607425A/en

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The topic of this invention is to manufacture a PCB with a narrow pitch circuit. It also possesses excellent bend ability without passing a non- electrolysis plating process and a polishing process. The resolved method is that: Firstly, a stripping resin layer 3 possesses tolerance for plating treatment and conducting or treatment is formed in a substrate provided with a conductive layer 2 in both surfaces of an insulating layer 1. Further, the stripping layer 4 possesses tolerance for conducting treatment is formed on the peeling resist layer 3. Furthermore, the hole is formed in a portion connecting to each of the layers mutually. Moreover, the conducting treatment by plating is applied all over the substrate including the hole. Afterward, the stripping resin layer 4 is removed, and electrolytic copper plating treatment is carried out. Eventually, the conductive layer is exposed, by removing the stripping resin layer 3 and a circuit is formed in the conductive layer. By performing the aforementioned processes, since the PCB is formed upon the substrate in advance, it skips the last circuit formation process.
TW094116353A 2004-06-29 2005-05-19 Method for producing PCB TW200607425A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191088A JP2006013301A (en) 2004-06-29 2004-06-29 Manufacturing method of circuit board

Publications (1)

Publication Number Publication Date
TW200607425A true TW200607425A (en) 2006-02-16

Family

ID=35780152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116353A TW200607425A (en) 2004-06-29 2005-05-19 Method for producing PCB

Country Status (3)

Country Link
JP (1) JP2006013301A (en)
CN (1) CN1717152A (en)
TW (1) TW200607425A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269638A (en) * 2005-03-23 2006-10-05 Sumitomo Bakelite Co Ltd Method for manufacturing circuit board, circuit board and printed circuit board
TWI704852B (en) * 2018-11-28 2020-09-11 先豐通訊股份有限公司 Plating method for circuit board and circuit board made therefrom
CN110113866B (en) * 2019-05-27 2021-06-22 深圳市三德冠精密电路科技有限公司 Protection method for preventing flexible circuit board cross Mark from deforming
CN110536566B (en) * 2019-08-29 2021-04-02 江苏上达电子有限公司 Hole forming method for flexible double-sided board
CN111839503A (en) * 2020-06-29 2020-10-30 华中科技大学 Skin-attached electrocardiogram acceleration detection system and preparation method thereof

Also Published As

Publication number Publication date
CN1717152A (en) 2006-01-04
JP2006013301A (en) 2006-01-12

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