TW200607425A - Method for producing PCB - Google Patents
Method for producing PCBInfo
- Publication number
- TW200607425A TW200607425A TW094116353A TW94116353A TW200607425A TW 200607425 A TW200607425 A TW 200607425A TW 094116353 A TW094116353 A TW 094116353A TW 94116353 A TW94116353 A TW 94116353A TW 200607425 A TW200607425 A TW 200607425A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- treatment
- stripping
- conducting
- plating
- Prior art date
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The topic of this invention is to manufacture a PCB with a narrow pitch circuit. It also possesses excellent bend ability without passing a non- electrolysis plating process and a polishing process. The resolved method is that: Firstly, a stripping resin layer 3 possesses tolerance for plating treatment and conducting or treatment is formed in a substrate provided with a conductive layer 2 in both surfaces of an insulating layer 1. Further, the stripping layer 4 possesses tolerance for conducting treatment is formed on the peeling resist layer 3. Furthermore, the hole is formed in a portion connecting to each of the layers mutually. Moreover, the conducting treatment by plating is applied all over the substrate including the hole. Afterward, the stripping resin layer 4 is removed, and electrolytic copper plating treatment is carried out. Eventually, the conductive layer is exposed, by removing the stripping resin layer 3 and a circuit is formed in the conductive layer. By performing the aforementioned processes, since the PCB is formed upon the substrate in advance, it skips the last circuit formation process.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191088A JP2006013301A (en) | 2004-06-29 | 2004-06-29 | Manufacturing method of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200607425A true TW200607425A (en) | 2006-02-16 |
Family
ID=35780152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094116353A TW200607425A (en) | 2004-06-29 | 2005-05-19 | Method for producing PCB |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006013301A (en) |
CN (1) | CN1717152A (en) |
TW (1) | TW200607425A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269638A (en) * | 2005-03-23 | 2006-10-05 | Sumitomo Bakelite Co Ltd | Method for manufacturing circuit board, circuit board and printed circuit board |
TWI704852B (en) * | 2018-11-28 | 2020-09-11 | 先豐通訊股份有限公司 | Plating method for circuit board and circuit board made therefrom |
CN110113866B (en) * | 2019-05-27 | 2021-06-22 | 深圳市三德冠精密电路科技有限公司 | Protection method for preventing flexible circuit board cross Mark from deforming |
CN110536566B (en) * | 2019-08-29 | 2021-04-02 | 江苏上达电子有限公司 | Hole forming method for flexible double-sided board |
CN111839503A (en) * | 2020-06-29 | 2020-10-30 | 华中科技大学 | Skin-attached electrocardiogram acceleration detection system and preparation method thereof |
-
2004
- 2004-06-29 JP JP2004191088A patent/JP2006013301A/en active Pending
-
2005
- 2005-05-19 TW TW094116353A patent/TW200607425A/en unknown
- 2005-06-29 CN CN 200510081849 patent/CN1717152A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1717152A (en) | 2006-01-04 |
JP2006013301A (en) | 2006-01-12 |
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