KR100525558B1 - Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Cirucit Board manufactured by the method thereof - Google Patents
Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Cirucit Board manufactured by the method thereof Download PDFInfo
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- KR100525558B1 KR100525558B1 KR10-2003-0055425A KR20030055425A KR100525558B1 KR 100525558 B1 KR100525558 B1 KR 100525558B1 KR 20030055425 A KR20030055425 A KR 20030055425A KR 100525558 B1 KR100525558 B1 KR 100525558B1
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- circuit board
- film
- laminate
- flexible printed
- film member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
본 발명은 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판에 관한 것으로, 도금층이 필요없는 굴곡부에 도금층을 구성시키지 않음으로써 연성회로기판의 굴곡성과 유연성을 향상시킴과 동시에, 비용절감을 이룰 수 있도록 한 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판을 제공하는데 그 목적이 있다.The present invention relates to a flexible printed circuit board manufacturing method and a flexible printed circuit board manufactured thereby, by improving the flexibility and flexibility of the flexible printed circuit board, and at the same time can be achieved by not forming the plating layer in the bent portion that does not require the plating layer It is an object of the present invention to provide a flexible circuit board manufacturing method and a flexible circuit board manufactured thereby.
상기 목적을 달성하기 위한 본 발명은, 베이스 필름 상면에 동박을 적층 고정시켜 적층체를 형성하는 적층단계; 상기 동박에 회로 및 비아홀을 형성하는 비아홀 형성단계; 상기 비아홀이 형성된 이외의 적층체 상면에 필름부재를 적층시키는 필름부재 적층단계; 상기 필름부재가 위치된 부분 이외의 적층체 상면에 무전해 동도금하는 무전해 도금단계; 상기 상기 필름부재가 위치된 부분 이외의 무전해 동도금 상면에 전해 도금하는 전해도금단계; 상기 적층체로부터 필름부재를 제거하는 필름부재 제거단계; 및 상기 필름부재가 제거된 적층체 및 전해도금 상면에 상부필름을 적층 고정시키는 상부필름 적층단계를 포함하는 연성회로기판 제조방법을 제공한다.The present invention for achieving the above object, laminating step of forming a laminate by laminating and fixing the copper foil on the upper surface of the base film; A via hole forming step of forming a circuit and a via hole in the copper foil; A film member laminating step of laminating a film member on an upper surface of the laminate other than the via hole is formed; An electroless copper plating step of electroless copper plating on the upper surface of the laminate other than the portion where the film member is located; An electroplating step of electroplating on an upper surface of the electroless copper plating other than the portion where the film member is located; A film member removing step of removing the film member from the laminate; And an upper film laminating step of laminating and fixing the upper film on the laminate and the electroplating upper surface from which the film member is removed.
Description
본 발명은 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판에 관한 것으로, 보다 상세하게는 비아홀이 형성되는 도금층 이외의 부분에는 도금층을 형성시키지 않음으로써 연성회로기판의 굴곡성을 향상시킬 수 있고, 비용을 절감할 수 있도록 한 연성회로기판 제조방법 및 그에 의해 제조된 연성회로기판에 관한 것이다.The present invention relates to a flexible printed circuit board manufacturing method and a flexible printed circuit board manufactured by the same, and more particularly, it is possible to improve the flexibility of the flexible printed circuit board by not forming a plating layer in portions other than the plating layer in which the via holes are formed. It relates to a flexible circuit board manufacturing method and a flexible circuit board manufactured thereby to reduce the cost.
일반적으로 여러 전자기기에서 굴곡이 많은 부위에 전기적으로 두 구간을 연결시키는 위하여 연성회로기판(FPCB: Flexible Printed Cirucit Board)이 이용된다. 이러한 연성회로기판의 주요 특징부는 굴곡성에 관련된다.In general, a flexible printed circuit board (FPCB) is used to electrically connect two sections to a bent portion of various electronic devices. The main feature of such flexible circuit boards relates to flexibility.
종래 기술에 따른 연성인쇄회로기판의 제조방법을 도1을 참조하여 설명하면 다음과 같다. 도1은 종래 기술에 따른 연성인쇄회로기판의 제조방법에 의하여 구성된 연성인쇄회로기판을 도시한 구성도이다.A method of manufacturing a flexible printed circuit board according to the prior art will now be described with reference to FIG. 1. 1 is a block diagram showing a flexible printed circuit board constructed by a method of manufacturing a flexible printed circuit board according to the prior art.
종래 기술에 따른 연성인쇄회로기판의 제조과정은, 폴리이미드(polymide) 재질의 베이스 필름(1)과 동박(2) 사이를 접착제(3)로 접착하여 적층체를 형성하는 단계와; 상기 동박(2)에 에칭 및 드라이필름(dry film) 박리를 통하여 회로를 형성하는 단계와; 상기 적층체에 비아홀(4)을 형성하는 단계와; 상기 적층체의 상면, 즉 상기 동박(2)의 상면 및 비아홀(4)에 무전해 동도금(5)하는 단계와; 상기 무전해 동도금 상면 및 비아홀(5)에 전해 도금(6)하는 단계; 및 상기 전해도금(6) 상면에 접착제(7)로 접착하여 폴리이미드 재질의 상부 필름(8)을 접착하는 단계로 이루어진다. 이와 같은 제조공정을 통해 완성된 연성회로기판은 도1에 도시한 바와 같은 구조를 갖는다.The manufacturing process of the flexible printed circuit board according to the prior art includes the steps of: forming a laminate by adhering a polyimide base film (1) and a copper foil (2) with an adhesive (3); Forming a circuit through the etching and dry film peeling on the copper foil; Forming via holes (4) in the laminate; Electroless copper plating (5) on the upper surface of the laminate, that is, the upper surface of the copper foil (2) and the via hole (4); Electroplating (6) the electroless copper plating upper surface and the via hole (5); And adhering the upper film 8 made of polyimide by adhering to the upper surface of the electroplating 6 with an adhesive 7. The flexible circuit board completed through such a manufacturing process has a structure as shown in FIG.
여기에서, 상기 연성인쇄회로기판은 상기 비아홀(4)을 통해 각 층 간을 도통시키고 비아홀(4) 내부를 두 가지 도금, 즉 무전해 동도금 및 전해 도금을 통해 도통된다. Herein, the flexible printed circuit board is electrically connected between the layers through the via holes 4 and the inside of the via holes 4 through two plating processes, namely, electroless copper plating and electrolytic plating.
또한, 상기 베이스 필름(1)은 부도체임으로 전해도금을 할 수 없기 때문에 촉매를 바른 후 무전해 동도금을 하게 된다. 이 때, 무전해 동도금(5)은 시간이 오래걸리며 공정이 까다로워 신뢰성을 얻을 만큼의 도금층을 적층할 수 없기 때문에, 이미 무전해 동도금(5)으로 도금된 비아홀(4) 내부를 전해도금(6)을 통해 한번 더 두껍게 도금해준다.In addition, since the base film 1 cannot be electroplated because it is a non-conductor, electroless copper plating is performed after applying a catalyst. At this time, since the electroless copper plating 5 takes a long time and the process is difficult, it is impossible to laminate the plating layer to obtain reliability, and thus electroplating the inside of the via hole 4 already plated with the electroless copper plating 5. ) To thicken once more.
상기 동박(2)에 회로를 형성한 후 회로보호를 위해 경질 인쇄회로기판의 경우 솔더 레지스트 잉크를 도포해 주지만, 연성인쇄회로기판의 경우 굴곡부에 사용되기 때문에 솔더 레지스트 잉크를 사용할 수 없어, 연성회로기판의 경우에는 회로보호를 위하여 접착제(70)를 매개로 상기 상부 필름(8)을 형성시킨다.After forming the circuit on the copper foil (2), the solder resist ink is applied to the hard printed circuit board to protect the circuit, but in the case of the flexible printed circuit board, the solder resist ink cannot be used because the flexible printed circuit board is used in the bent portion. In the case of the substrate, the upper film 8 is formed through the adhesive 70 to protect the circuit.
그러나, 상기와 같은 종래 기술에 따른 연성인쇄회로기판의 제조방법은, 비아홀의 전기적 도통을 위한 도금시 비아홀의 내벽뿐만 아니라 자재 전반에 걸쳐 도금이 이루어진다. 따라서, 도금이 필요없는 부분까지 도금되기 때문에 연성회로기판의 장점인 굴곡성을 저해시키는 문제점이 있다.However, in the method of manufacturing a flexible printed circuit board according to the related art as described above, plating is performed not only on the inner wall of the via hole but also on the entire material during plating for electrical conduction of the via hole. Therefore, there is a problem of inhibiting the flexibility, which is an advantage of the flexible printed circuit board, because the plating is performed to a portion where plating is not required.
이러한 문제점을 극복하기 위하여 다른 변형된 공법들이 사용될 수 있으나, 이러한 공법에 맞는 설비 및 공정형태를 갖춰야 하기 때문에 새로운 설비 및 공정형태에 대한 투자부담이 발생하는 문제점이 있다.In order to overcome this problem, other modified methods may be used, but there is a problem in that an investment burden for new equipment and process types is generated because it is necessary to have equipment and process types suitable for these methods.
따라서, 본 발명은 상기의 제반 문제점을 해결하기 위하여 제안된 것으로서, 비아홀이 형성되는 도금층 이외의 부분에는 도금층을 형성시키지 않음으로써 연성회로기판의 굴곡성 및 유연성을 향상시킬 수 있는 연성인쇄회로기판의 제조방법 및 이에 의해 제조된 연성회로기판을 제공하는데 그 목적이 있다.Therefore, the present invention has been proposed to solve the above problems, the manufacturing of a flexible printed circuit board that can improve the flexibility and flexibility of the flexible circuit board by not forming a plating layer in the portion other than the plating layer in which the via hole is formed It is an object of the present invention to provide a method and a flexible circuit board manufactured thereby.
또한, 불필요한 부분에 도금층을 형성하지 않아 굴곡성을 향상시킬 수 있어, 값비싼 자재를 사용할 필요가 없어 자재 비용을 절감시킬 수 있고, 별도의 특정설비 및 공정형태를 필요로 하지 않기 때문에 동일 성능의 제품을 저비용으로 제조할 수 있는 연성인쇄회로기판의 제조방법 및 이에 의해 제조된 연성인쇄회로기판을 제공하는데 다른 목적이 있다. In addition, it is possible to improve the flexibility by not forming a plating layer on unnecessary parts, and thus it is not necessary to use expensive materials, thereby reducing the material cost, and it does not require a separate specific equipment and process type. Another object is to provide a method of manufacturing a flexible printed circuit board, which can be manufactured at low cost, and a flexible printed circuit board manufactured thereby.
상기 목적을 달성하기 위하여 본 발명은, 베이스 필름 상면에 동박을 적층 고정시켜 적층체를 형성하는 적층단계; 상기 동박에 회로 및 비아홀을 형성하는 비아홀형성단계; 상기 비아홀이 형성된 이외의 적층체 상면에 필름부재를 적층시키는 필름부재 적층단계; 상기 필름부재가 위치된 부분 이외의 적층체 상면에 무전해 동도금하는 무전해 도금단계; 상기 상기 필름부재가 위치된 부분 이외의 무전해 동도금 상면에 전해 도금하는 전해도금단계; 상기 적층체로부터 필름부재를 제거하는 필름부재 제거단계; 및 상기 필름부재가 제거된 적층체 및 전해도금 상면에 상부필름을 적층 고정시키는 상부필름 적층단계를 포함하는 연성회로기판 제조방법을 제공한다.In order to achieve the above object, the present invention, laminating step of forming a laminate by laminating and fixing the copper foil on the upper surface of the base film; A via hole forming step of forming a circuit and a via hole in the copper foil; A film member laminating step of laminating a film member on an upper surface of the laminate other than the via hole is formed; An electroless copper plating step of electroless copper plating on the upper surface of the laminate other than the portion where the film member is located; An electroplating step of electroplating on an upper surface of the electroless copper plating other than the portion where the film member is located; A film member removing step of removing the film member from the laminate; And an upper film laminating step of laminating and fixing the upper film on the laminate and the electroplating upper surface from which the film member is removed.
상기 필름부재는 설계시 연성회로기판이 굴곡되는 굴곡부에 대응하여 위치되며, 상기 무전해 도금 및 전해 도금이 적층되지 않는 도금 비접촉성 재질로 이루어지거나, 드라이 필름 또는 캡톤 필름 중 어느 하나로 이루어진다.The film member is positioned in correspondence with the bent portion in which the flexible circuit board is bent in design, and is made of a non-plated non-contact material that is not laminated with the electroless plating and the electrolytic plating, or is made of any one of a dry film or a Kapton film.
상술한 목적, 특징들 및 장점은 첨부된 도면과 관련한 다음의 상세한 설명을 통하여 보다 분명해질 것이다. 이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 일실시예를 상세히 설명한다. The above objects, features and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도2는 본 발명에 따른 연성인쇄회로기판의 제조방법에 따른 공정을 순서대로 도시한 공정도이고, 도3은 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판을 도시한 구성도이며, 도4는 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판의 평면도이다.FIG. 2 is a process diagram sequentially showing a process according to a method of manufacturing a flexible printed circuit board according to the present invention, and FIG. 3 is a diagram of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board according to the present invention. 4 is a plan view of a flexible printed circuit board manufactured by a method of manufacturing a flexible printed circuit board according to the present invention.
본 발명에 따른 연성인쇄회로기판의 제조방법은 도2에 도시된 바와 같이, 부도체의 베이스 필름(10)상면에 접착제(11)를 매개로 동박(12)를 접착시켜 적층체(20)를 형성하는 제1단계와; 상기 동박(12)에 에칭 및 드라이필름(dry film) 박리를 통하여 회로 및 비아홀을 형성하는 제2단계와; 상기 비아홀(30)이 형성된 이외의 적층체(20) 상면에 도금 비접착성재질의 필름부재(40)를 적층시키는 제3단계와; 상기 적층체(20)의 상면 및 비아홀(30) 내벽, 즉 상기 필름부재(40)가 위치된 이외의 적층체(20) 상면에 무전해 동도금(50)하는 제4단계와; 상기 무전해 동도금(50)의 상면 및 비아홀(40) 내측, 즉 상기 필름부재(40)가 위치된 이외의 무전해 동도금(50) 상면에 전해 도금(60)하는 제5단계와; 상기 필름부재(40)를 제거하는 제6단계; 및 상기 필름부재(40)가 제거된 적층체(20) 및 전해도금(60) 상면에 접착제(71)를 매개로 부도체의 상부필름(70)을 접착하는 제7단계를 포함한다. In the method of manufacturing the flexible printed circuit board according to the present invention, as shown in FIG. 2, the copper foil 12 is adhered to the upper surface of the base film 10 of the non-conductor by the adhesive 11 to form the laminate 20. A first step of doing; A second step of forming a circuit and a via hole through etching and dry film peeling on the copper foil 12; A third step of laminating a film member 40 of a non-plated non-stick material on an upper surface of the laminate 20 other than the via hole 30 is formed; A fourth step of electroless copper plating the upper surface of the laminate 20 and the inner wall of the via hole 30, that is, the upper surface of the laminate 20 other than the film member 40 is located; A fifth step of electroplating (60) the upper surface of the electroless copper plating (50) and the inside of the via hole (40), that is, the upper surface of the electroless copper plating (50) other than the film member (40); A sixth step of removing the film member 40; And a seventh step of adhering the upper film 70 of the non-conductor to the upper surface of the laminate 20 and the electroplating 60 from which the film member 40 is removed via the adhesive 71.
상기 베이스 필름(10) 및 상부 필름(70)은 폴리이미드(polymide) 재질로 이루어진다.The base film 10 and the upper film 70 are made of a polyimide material.
상기 도금 비접착성 재질의 필름부재(40)는 비아홀(30)이 형성되지 않은 적층체(20)의 상면에 적층되되, 도3 및 도4에 예시한 바와 같이 설계시 연성회로기판이 굴곡되는 굴곡부(A)에 대응하는 위치에 적층되는 것이 바람직하다.The film member 40 of the non-plating non-stick material is laminated on the upper surface of the laminate 20 in which the via hole 30 is not formed, and the flexible circuit board is bent during design as illustrated in FIGS. 3 and 4. It is preferable to stack at the position corresponding to the bend A.
상기 필름부재(40)는 적층체(20)에 도금되지 않도록 하기 위하여 제공되는 것으로, 도금 욕조에서 이물질이 생기지 않는 드라이 필름(dry film) 또는 캡톤 필름 등으로 이루어진다.The film member 40 is provided so as not to be plated on the laminate 20, and is made of a dry film or a Kapton film or the like in which foreign matter does not occur in the plating bath.
상기 무전해 동도금(50)과 전해도금(60)이 도금될 때, 상기 필름부재(40)가 도금 비접촉성 재질로 이루어지기 때문에, 상기 필름부재(40)의 상면으로 무전해 동도금(50) 및 전해 도금(60)이 도금되지 않고, 이후 상부필름(70)을 접착시키기 전에 용이하게 제거된다. When the electroless copper plating 50 and the electroplating 60 is plated, since the film member 40 is made of a non-plating material, the electroless copper plating 50 and the upper surface of the film member 40 The electroplating 60 is not plated and is then easily removed before adhering the top film 70.
여기에서, 상기 필름부재(40)는 도금 비접촉성 재질로 이루어지는 것을 설명하고 있으나, 필름부재(40) 위로 무전해 동도금(50) 및 전해 도금(60)이 도금되어어도 무방하다. 이는 상기 무전해 동도금(50) 및 전해 도금(60)이 도금된 이후에도 상기 필름부재(40)를 적층체(20)로부터 제거할 수 있기 때문에, 결국 상기 필름부재(40)가 위치된 적층체(20) 상면에는 도금층이 형성되지 않는다.Here, although the film member 40 is described as being made of a non-plating material, the electroless copper plating 50 and the electrolytic plating 60 may be plated on the film member 40. Since the film member 40 can be removed from the laminate 20 even after the electroless copper plating 50 and the electrolytic plating 60 are plated, the laminate in which the film member 40 is positioned ( 20) The plating layer is not formed on the upper surface.
이와 같이 형성된 연성회로기판은 도4에 도시된 바와 같이, 굴곡부(A) 이외의 부분은 고정되어 움직이지 않는 부분이다. 비아홀(30)이 형성되어 무전해 동도금 및 전해 도금이 필요한 부분 또한 굴곡부(A) 이외의 부분이다. 도면에서와 같이, 비아홀(30)은 굴곡부(A) 이외의 부분에만 형성되는 것으로, 비아홀(30)의 신뢰성 문제를 감안하여 굴곡부(A)에는 형성될 수 없다.As shown in FIG. 4, the flexible circuit board formed as described above is a portion other than the bent portion A, which is fixed and does not move. The via hole 30 is formed to require electroless copper plating and electroplating, and the portion other than the bent portion A is also provided. As shown in the drawing, the via hole 30 is formed only in the portion other than the bent portion A, and cannot be formed in the bent portion A in view of the reliability problem of the via hole 30.
따라서, 비아홀(30)의 도통을 위하여 무전해 및 전해 도금이 반드시 필요하기 때문에 필요한 부분만 부분 동도금 하게 되는 반면, 굴곡부(A)에는 도금층을 형성시키기 않음으로써 굴곡성과 유연성을 갖게 된다.Therefore, since electroless plating and electroplating are necessary for conduction of the via hole 30, only necessary portions are copper plated, whereas flexure A is not formed, thereby providing flexibility and flexibility.
이와 같은 연성회로기판 제조방법은 층 수가 많아질수록 현격한 효과를 구현할 수 있으며. 굴곡성의 확보로 도금층을 구비하면서도 굴곡성을 좋게 하는 값비싼 자재를 필요로 하지 않는다.Such a flexible circuit board manufacturing method can realize a dramatic effect as the number of layers increases. Securing flexibility does not require expensive materials to provide a good flexibility even with a coating layer.
이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible in the art without departing from the technical spirit of the present invention. It will be clear to those of ordinary knowledge.
상기한 바와 같은 본 발명에 따르면, 비아홀이 형성되는 도금층 이외의 부분에는 도금층을 형성시키지 않음으로써 연성회로기판의 굴곡성 및 유연성을 향상시키는 효과가 있다.According to the present invention as described above, there is an effect of improving the flexibility and flexibility of the flexible printed circuit board by not forming a plating layer in portions other than the plating layer in which the via holes are formed.
또한, 불필요한 부분에 도금층을 형성하지 않아 굴곡성을 향상시킬 수 있어, 도금층을 포함하면서 굴곡성이 좋은 값비싼 자재를 사용할 필요가 없어 자재 비용을 절감시키는 효과가 있다.In addition, it is possible to improve the flexibility by not forming a plating layer in the unnecessary portion, there is no need to use expensive materials having good flexibility while including the plating layer has the effect of reducing the material cost.
또한, 본 발명은, 별도의 특정설비 및 공정형태를 필요로 하지 않고, 기존의 설비를 이용할 수 있기 때문에 동일 성능의 제품을 저비용으로 제조할 수 있는 효과가 있다. In addition, the present invention does not require a separate specific equipment and process form, and since the existing equipment can be used, there is an effect that a product having the same performance can be manufactured at low cost.
도1은 종래 기술에 따른 연성인쇄회로기판의 제조방법에 의하여 구성된 연성인쇄회로기판을 도시한 구성도. 1 is a block diagram showing a flexible printed circuit board constructed by a method of manufacturing a flexible printed circuit board according to the prior art.
도2는 본 발명에 따른 연성인쇄회로기판의 제조방법에 따른 공정을 순서대로 도시한 공정도.2 is a process diagram sequentially showing a process according to a method of manufacturing a flexible printed circuit board according to the present invention.
도3은 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판을 도시한 구성도.Figure 3 is a block diagram showing a flexible printed circuit board manufactured by a method for manufacturing a flexible printed circuit board according to the present invention.
도4는 본 발명에 따른 연성인쇄회로기판의 제조방법에 의하여 제조된 연성인쇄회로기판의 평면도.4 is a plan view of a flexible printed circuit board manufactured by the method of manufacturing a flexible printed circuit board according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10: 베이스 필름 11: 접착제10: base film 11: adhesive
12: 동박 20: 적층체12: copper foil 20: laminate
30: 비아홀 40: 필름부재30: via hole 40: film member
50: 무전해 도금 60: 전해도금50: electroless plating 60: electroplating
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-2003-0055425A KR100525558B1 (en) | 2003-08-11 | 2003-08-11 | Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Cirucit Board manufactured by the method thereof |
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| KR10-2003-0055425A KR100525558B1 (en) | 2003-08-11 | 2003-08-11 | Manufacturing method for a Flexible Printed Cirucit Board and Flexible Printed Cirucit Board manufactured by the method thereof |
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| KR100910847B1 (en) * | 2007-12-27 | 2009-08-06 | 주식회사 코리아써키트 | Display method in printed circuit board |
| KR100986290B1 (en) * | 2008-07-29 | 2010-10-07 | 삼성전기주식회사 | Manufacturing method for printed circuit board |
| KR101108730B1 (en) | 2010-06-23 | 2012-02-29 | 삼성전기주식회사 | Optical fexible printed circuit board having optical waveguides and method manufacturing the same |
| CN104837301A (en) * | 2014-02-12 | 2015-08-12 | 富葵精密组件(深圳)有限公司 | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board |
| KR102489612B1 (en) * | 2016-07-22 | 2023-01-18 | 엘지이노텍 주식회사 | Flexible circuit board, cof module and electronic device comprising the same |
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