DE3688255D1 - Verfahren zur herstellung von mehrschichtleiterplatten. - Google Patents

Verfahren zur herstellung von mehrschichtleiterplatten.

Info

Publication number
DE3688255D1
DE3688255D1 DE8787903756T DE3688255T DE3688255D1 DE 3688255 D1 DE3688255 D1 DE 3688255D1 DE 8787903756 T DE8787903756 T DE 8787903756T DE 3688255 T DE3688255 T DE 3688255T DE 3688255 D1 DE3688255 D1 DE 3688255D1
Authority
DE
Germany
Prior art keywords
metal
layer
producing multi
layer boards
sites
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787903756T
Other languages
English (en)
Other versions
DE3688255T2 (de
Inventor
Harold Lake
E Grandmont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric Systems USA Inc
Original Assignee
Foxboro Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxboro Co filed Critical Foxboro Co
Application granted granted Critical
Publication of DE3688255D1 publication Critical patent/DE3688255D1/de
Publication of DE3688255T2 publication Critical patent/DE3688255T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
DE8787903756T 1986-12-17 1986-12-17 Verfahren zur herstellung von mehrschichtleiterplatten. Expired - Fee Related DE3688255T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1986/002710 WO1988004877A1 (en) 1986-12-17 1986-12-17 Multilayer circuit board fabrication process

Publications (2)

Publication Number Publication Date
DE3688255D1 true DE3688255D1 (de) 1993-05-13
DE3688255T2 DE3688255T2 (de) 1993-07-22

Family

ID=22195757

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787903756T Expired - Fee Related DE3688255T2 (de) 1986-12-17 1986-12-17 Verfahren zur herstellung von mehrschichtleiterplatten.

Country Status (9)

Country Link
EP (1) EP0337986B1 (de)
JP (1) JPH0710029B2 (de)
KR (1) KR950003244B1 (de)
AT (1) ATE88050T1 (de)
AU (1) AU622100B2 (de)
DE (1) DE3688255T2 (de)
DK (1) DK457688A (de)
NO (1) NO883642L (de)
WO (1) WO1988004877A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04504332A (ja) * 1989-10-30 1992-07-30 ザ・フォックスボロ・カンパニー ミクロ孔の層を有する多層回路板及びその製造方法
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
DE69311277T2 (de) * 1992-12-15 1998-01-15 Asulab Sa Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen
FR2699323B1 (fr) * 1992-12-15 1995-01-13 Asulab Sa Contacteur "reed" et procédé de fabrication de microstructures métalliques tridimensionnelles suspendues.
JP2775585B2 (ja) * 1994-03-25 1998-07-16 日本メクトロン株式会社 両面配線基板の製造法
JP3112059B2 (ja) 1995-07-05 2000-11-27 株式会社日立製作所 薄膜多層配線基板及びその製法
KR100368868B1 (ko) * 1999-05-17 2003-01-24 주식회사 화승알앤에이 테프론 시트 부착형 전해조 개스킷과 그 제조 방법
CN100392809C (zh) * 2004-12-21 2008-06-04 联华电子股份有限公司 晶片绝缘层内连线的制造方法与结构
EP3606300A4 (de) * 2017-03-31 2020-04-29 Mitsubishi Gas Chemical Company, Inc. Verfahren zur herstellung einer leiterplatte
US10349532B2 (en) * 2017-07-20 2019-07-09 International Business Machines Corporation Method for implementing stub-less printed circuit board vias

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352730A (en) * 1964-08-24 1967-11-14 Sanders Associates Inc Method of making multilayer circuit boards
US3471631A (en) * 1968-04-03 1969-10-07 Us Air Force Fabrication of microminiature multilayer circuit boards
DE1937508C3 (de) * 1969-07-23 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Verfahren zur Herstellung eines mit elektrischen Leitungsbahnen und/oder elektrischen Durchkontaktierungen versehenen Isolierstoffträgers
DE2716545A1 (de) * 1977-04-14 1978-10-19 Siemens Ag Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen
EP0096701B1 (de) * 1981-12-11 1989-08-30 Western Electric Company, Incorporated Zu vergrössertem aufnahmevermögen führende leiterplattenherstellung

Also Published As

Publication number Publication date
KR950003244B1 (ko) 1995-04-06
DK457688D0 (da) 1988-08-16
NO883642L (no) 1988-10-14
JPH02501175A (ja) 1990-04-19
DK457688A (da) 1988-08-16
ATE88050T1 (de) 1993-04-15
EP0337986B1 (de) 1993-04-07
NO883642D0 (no) 1988-08-16
KR890701304A (ko) 1989-03-11
JPH0710029B2 (ja) 1995-02-01
DE3688255T2 (de) 1993-07-22
WO1988004877A1 (en) 1988-06-30
EP0337986A1 (de) 1989-10-25
AU622100B2 (en) 1992-04-02
AU7486787A (en) 1988-07-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee