MY121310A - Multilayer printed wiring board and its manufacturing method,and resin composition for filling through-hole - Google Patents

Multilayer printed wiring board and its manufacturing method,and resin composition for filling through-hole

Info

Publication number
MY121310A
MY121310A MYPI98004685A MYPI9804685A MY121310A MY 121310 A MY121310 A MY 121310A MY PI98004685 A MYPI98004685 A MY PI98004685A MY PI9804685 A MYPI9804685 A MY PI9804685A MY 121310 A MY121310 A MY 121310A
Authority
MY
Malaysia
Prior art keywords
hole
wiring board
multilayer printed
printed wiring
filling
Prior art date
Application number
MYPI98004685A
Inventor
Motoo Asai
Kenichi Shimada
Kouta Noda
Takashi Kariya
Hiroshi Segawa
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34018297A external-priority patent/JP3564981B2/en
Priority claimed from JP6706598A external-priority patent/JP3408417B2/en
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of MY121310A publication Critical patent/MY121310A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A MULTILAYER PRINTED WIRING BOARD IS COMPOSED OF A SUBSTRATE PROVIDED WITH THROUGH-HOLES, AND A WIRING BOARD FORMED ON THE SUBSTRATE THROUGH THE INTERPOSITION OF AN INTERLAMINAR INSULATING RESIN LAYER, THE THROUGH-HOLES HAVING A ROUGHENED INTERNAL SURFACE AND BEING FILLED WITH A FILLER(108), AN EXPOSED PART OF THE FILLER IN THE THROUGH-HOLES BEING COVERED WITH A THROUGH-HOLE- COVERING CONDUCTOR LAYER, AND A VIAHOLE FORMED JUST THEREABOVE BEING CONNECTED TO THE THROUGH-HOLE-COVERING CONDUCTOR LAYER. WITHOUT PEELING BETWEEN THE THROUGH-HOLE AND THE FILLER, THIS WIRING BOARD HAS A SATISFACTORY CONNECTION REABILITY BETWEEN THE THROUGH-HOLE AND THE INTERNAL LAYER CIRCUIT AND PROVIDES A HIGH DENSITY WIRING.(FIG. 1).
MYPI98004685A 1997-10-14 1998-10-14 Multilayer printed wiring board and its manufacturing method,and resin composition for filling through-hole MY121310A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP28049997 1997-10-14
JP34018297A JP3564981B2 (en) 1997-10-14 1997-12-10 Multilayer printed wiring board and method of manufacturing the same
JP34018097A JPH11186728A (en) 1997-10-14 1997-12-10 Multilayered printed wiring board
JP6706598A JP3408417B2 (en) 1998-03-17 1998-03-17 Resin composition for filling through holes and multilayer printed wiring board

Publications (1)

Publication Number Publication Date
MY121310A true MY121310A (en) 2006-01-28

Family

ID=47257172

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98004685A MY121310A (en) 1997-10-14 1998-10-14 Multilayer printed wiring board and its manufacturing method,and resin composition for filling through-hole

Country Status (2)

Country Link
KR (2) KR100453437B1 (en)
MY (1) MY121310A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022887B1 (en) * 2008-11-18 2011-03-16 삼성전기주식회사 Method for manufacturing a printed circuit board having a landless via
KR20180003249U (en) 2017-05-11 2018-11-21 양병모 Installing device of plate lamp
CN115119416B (en) * 2022-06-14 2023-11-21 湖北龙腾电子科技股份有限公司 Method for solving problem of NPTH Kong Bianxian path oil thinning of PCB solder mask process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board
US7847318B2 (en) 1998-09-17 2010-12-07 Ibiden Co., Ltd. Multilayer build-up wiring board including a chip mount region

Also Published As

Publication number Publication date
KR20010030900A (en) 2001-04-16
KR20040053185A (en) 2004-06-23
KR100453437B1 (en) 2004-10-15
KR100452256B1 (en) 2004-10-16

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