KR920011306A - 고밀도 다층 인쇄회로기판의 제조방법 - Google Patents

고밀도 다층 인쇄회로기판의 제조방법 Download PDF

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Publication number
KR920011306A
KR920011306A KR1019900018260A KR900018260A KR920011306A KR 920011306 A KR920011306 A KR 920011306A KR 1019900018260 A KR1019900018260 A KR 1019900018260A KR 900018260 A KR900018260 A KR 900018260A KR 920011306 A KR920011306 A KR 920011306A
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KR
South Korea
Prior art keywords
pattern
forming
circuit board
printed circuit
manufacturing
Prior art date
Application number
KR1019900018260A
Other languages
English (en)
Other versions
KR930000639B1 (ko
Inventor
김용길
Original Assignee
김용길
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김용길 filed Critical 김용길
Priority to KR1019900018260A priority Critical patent/KR930000639B1/ko
Publication of KR920011306A publication Critical patent/KR920011306A/ko
Application granted granted Critical
Publication of KR930000639B1 publication Critical patent/KR930000639B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

내용 없음

Description

고밀도 다층 인쇄회로기판의 제조방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제조공정을 도시한 것이다.

Claims (3)

  1. 세라믹 또는 전도성 제료로된 모재에 절연피막층을 형성시키고; 절연피막층이 형성된 모재와 제1동박판에 접착제를 도포하여 열간압착시켜 기재를 제조하고; 상기 기재의 동박면에 레지스트에 의한 배선패턴을 형성한후 배선패턴을 위한 동박면의 전면에 감광제 및 내부식성 코팅제를 도포하여 노광 및 에칭하여 도체층을 형성시키고; 상기의 도체층위에 절연층을 접착시킨후 인쇄하여 패턴을 형성시키며; 상기의 절연층위에 무전해 도금 공법으로 도체층을 형성하는 단계로 구성됨을 특징으로 하는 고밀도 다층 인쇄회로기판의 제조방법.
  2. 제1항에 있어서, 상기의 패턴 형성단계는 절연층이 형성된 기재전체를 진공로에서 스파터링 방식을 이용하여 동을 1-3㎛정도 증착한후 2차에칭 공정을 수행하여 이루어짐을 특징으로 하는 고밀도 다층 인쇄회로기판의 제조방법.
  3. 제1항에 있어서, 상기의 패턴 형성단계는 휘발성 접차제와 폴라디움 클로라이드 용액의 혼합물을 사용하여 패턴을 부분적으로 감광처리하여 2차에칭 공정없이 1회에 패턴을 형성시킴을 특징으로 하는 고밀도 다층 인쇄회로기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900018260A 1990-11-12 1990-11-12 고밀도 다층 인쇄회로기판의 제조방법 KR930000639B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900018260A KR930000639B1 (ko) 1990-11-12 1990-11-12 고밀도 다층 인쇄회로기판의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900018260A KR930000639B1 (ko) 1990-11-12 1990-11-12 고밀도 다층 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
KR920011306A true KR920011306A (ko) 1992-06-27
KR930000639B1 KR930000639B1 (ko) 1993-01-28

Family

ID=19305897

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900018260A KR930000639B1 (ko) 1990-11-12 1990-11-12 고밀도 다층 인쇄회로기판의 제조방법

Country Status (1)

Country Link
KR (1) KR930000639B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115066103A (zh) * 2022-06-30 2022-09-16 刘芝兰 一种led线路板线路蚀刻设备及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101140890B1 (ko) * 2010-09-14 2012-05-03 삼성전기주식회사 인쇄회로기판용 코어 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115066103A (zh) * 2022-06-30 2022-09-16 刘芝兰 一种led线路板线路蚀刻设备及方法
CN115066103B (zh) * 2022-06-30 2024-05-03 深圳市科诚达科技股份有限公司 一种led线路板线路蚀刻设备及方法

Also Published As

Publication number Publication date
KR930000639B1 (ko) 1993-01-28

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