US20060000637A1 - Printed circuit board and method for manufacturing printed circuit board - Google Patents

Printed circuit board and method for manufacturing printed circuit board Download PDF

Info

Publication number
US20060000637A1
US20060000637A1 US11/173,126 US17312605A US2006000637A1 US 20060000637 A1 US20060000637 A1 US 20060000637A1 US 17312605 A US17312605 A US 17312605A US 2006000637 A1 US2006000637 A1 US 2006000637A1
Authority
US
United States
Prior art keywords
thin copper
copper film
film
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/173,126
Inventor
Kei Nakamura
Takeshi Yamato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAMURA, KEI, YAMATO, TAKESHI
Publication of US20060000637A1 publication Critical patent/US20060000637A1/en
Priority to US11/955,432 priority Critical patent/US8092696B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Definitions

  • the present invention relates to printed circuit boards and a method for manufacturing such printed circuit boards.
  • a printed circuit board such as flexible printed circuit boards are widely used in a variety of electrical and electronic devices.
  • a printed circuit board includes, for example, an insulating layer of, e.g., polyimide, having on one side or both sides thereof conductor layers of, e.g., a copper foil with prescribed patterns.
  • conductor layers having prescribed patterns in printed circuit boards such as flexible printed circuit boards are formed by the known methods such as the semi-additive, substractive, and full-additive methods (refer to JP 2002-176259, for example).
  • FIGS. 4 ( a ), 4 ( b ), 4 ( c ), 4 ( d ), 4 ( e ), and 4 ( f ) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board by the semi additive method.
  • an insulating layer 11 of a resin film is first prepared, as shown in FIG. 4 ( a ).
  • a thin conductive film 12 is formed on the insulating layer 11 by sputtering or electroless plating.
  • a plating resist 13 is formed on the thin conductive film 12 using a dry film resist or the like.
  • the plating resist 13 has patterns opposite to the prescribed patterns of a conductor layer formed in a step shown below.
  • a conductor layer 14 is formed by electrolytic plating on the surfaces of the thin conductive film 12 where the plating resist 13 is not formed.
  • side etching of the thin conductive film 12 under the conductor layer 14 may occur during the removal of the thin conductive film 12 except the portions under the conductor layer 14 by chemical etching or the like.
  • side etching is described now with reference to the figure below.
  • FIG. 5 is a magnified view of the region B in FIG. 4 ( f ).
  • the thin conductive film 12 under the conductor layer 14 was etched together with both ends thereof being gouged as shown in FIG. 5 . This results in a deterioration of the adhesion of the conductor layer 14 to the thin conductive film 12 . In the case of a significant decrease in the adhesion, the conductor layer 14 may be stripped off.
  • a printed circuit board comprises, in sequence, an insulating layer, a thin copper film, and a conductor layer, wherein the conductor layer and the thin copper film have prescribed patterns, and the thin copper film has a first surface in contact with the insulating layer and a second surface in contact with the conductor layer, and contains a grain of a size that extends between the first surface and the second surface.
  • the thin copper film and conductor layer with the prescribed patterns are formed in sequence on the insulating layer.
  • the thin copper film contains a grain of a size that extends between the first surface in contact with the insulating layer and the second surface in contact with the conductor layer. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. In this manner, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion.
  • the thin copper film preferably has a thickness of not less than 50 nm and not more than 300 nm. This further improves the adhesion of the conductor layer to the thin copper film.
  • the conductor layer may include copper. This even further improves the adhesion of the conductor layer to the thin copper film.
  • the printed circuit board may further comprise a thin metal film between the insulating layer and the thin copper film. In this manner, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • the thin metal film may include at least one of chromium and nickel. This further improves the adhesion between the insulating layer and the thin copper film.
  • the thin metal film preferably has a thickness of not less than 5 nm and not more than 50 nm. This still further improves the adhesion between the insulating layer and the thin copper film.
  • the insulating layer may include a flexible substrate.
  • the flexible substrate having flexibility allows the flexibility of the printed circuit board to be improved.
  • a method for manufacturing a printed circuit board by a semi-additive method comprises the steps of forming a thin copper film on an insulating layer, forming a conductor layer having prescribed patterns on the thin copper film, removing the thin copper film except portions on which the conductor layer is formed, and applying a thermal treatment to the thin copper film between the step of forming the thin copper film and the step of forming the conductor layer or between the step of forming the conductor layer and the step of removing the thin copper film.
  • the thin copper film is thermally treated between the step of forming the thin copper film and the step of forming the conductor layer or between the step of forming the conductor layer and the step of removing the thin copper film, which increases the size of grains contained in the thin copper film. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. Thus, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion. In addition, where a thin metal film is present between the insulating layer and the thin copper film, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • a temperature during the thermal treatment of the thin copper film may be not less than 200° C. and not more than 300° C. This allows the size of grains contained in the thin copper film to be sufficiently increased.
  • the method for manufacturing a printed circuit board may include the steps of forming a resist on the thin copper film that has patterns opposite to the prescribed patterns, forming a conductor layer on the thin copper film except portions on which the resist is formed, and removing the resist after forming the conductor layer, and wherein the step of applying the thermal treatment to the thin copper film is provided between the step of forming the thin copper film and the step of forming the resist or between the step of removing the resist and the step of removing the thin copper film.
  • the step of applying the thermal treatment to the thin copper film is provided between the step of forming the thin copper film and the step of forming the resist or between the step of removing the resist and the step of removing the thin copper film. This prevents the resist from dissolving by the thermal treatment of the thin copper film.
  • the manufacturing method may further comprise the step of forming a thin metal film between the insulating film and the thin copper film. In this manner, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • the step of forming the thin metal film may include the step of forming at least one of chromium and nickel as the thin metal film. This further improves the adhesion between the insulating layer and the thin copper film.
  • the step of forming the thin metal film may include the step of forming the thin metal film having a thickness of not less than 5 nm and not more than 50 nm. This still further improves the adhesion between the insulating layer and the thin copper film.
  • the step of forming the thin copper film on the insulating layer may include the step of forming the thin copper film on a flexible substrate that serves as the insulating layer.
  • the flexible substrate having flexibility allows the flexibility of the printed circuit board to be improved.
  • the thin copper film contains a grain of the size that extends between the first surface in contact with the insulating layer and the second surface in contact with the conductor layer. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. In this manner, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion. In addition, where the thin metal film is present between the insulating layer and the thin copper film, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • FIGS. 1 ( a ), 1 ( b ), 1 ( c ), and 1 ( d ) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention
  • FIGS. 2 ( e ), 2 ( f ), and 2 ( g ) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention
  • FIG. 3 is a magnified view of the region A in FIG. 2 ( f )
  • FIGS. 4 ( a ), 4 ( b ), 4 ( c ), 4 ( d ), 4 ( e ), and 4 ( f ) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board by the semi additive method.
  • FIG. 5 is a magnified view of the region B in FIG. 4 ( f )
  • FIGS. 1 ( a ), 1 ( b ), 1 ( c ), and 1 ( d ) as well as FIGS. 2 ( e ), 2 ( f ), and 2 ( g ) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention.
  • an insulator film is made of polyimide or polyester, for example.
  • the insulating layer 1 may be formed by applying a resin onto a substrate made of a metal foil.
  • a thin metal film 2 and a thin copper film 3 are formed in sequence on the insulating layer 1 , as shown in FIG. 1 ( b ).
  • the thin metal film 2 which is provided to improve the adhesion between the insulating layer 1 and the thin copper film 3 , may only be provided when necessary.
  • Each of the thin metal film 2 and thin copper film 3 is formed by sputtering, electroless plating, or other suitable means.
  • the thin metal film 2 as used here includes at least either of chromium and nickel.
  • the thin metal film 2 may be made of a single layer of chromium, a laminated film of chromium and nickel, or a film of a chromium-nickel alloy.
  • the thickness of the thin metal film 2 is preferably in the range of not less than 5 nm and not more than 50 nm, for example. This further improves the adhesion of the thin copper film 3 to the insulating layer 1 .
  • the thickness of the thin copper film 3 is preferably in the range of not less than 50 nm and not more than 300 nm, for example. This further improves the adhesion of conductor patterns 5 described below to the thin copper film 3 .
  • the thin copper film 3 is laminated with, e.g., a dry film, and exposed and developed to form plating resist 4 thereon.
  • the plating resist 4 have patterns opposite to the conductor patterns 5 which are formed in a step shown below.
  • the conductor patterns 5 are formed on the surfaces of the thin copper film 3 where the plating resist 4 is not formed by electrolytic plating using, e.g., a copper sulfate electrolytic plating solution.
  • a metal or an alloy other than copper may also be used as the material of the conductor patterns 5 .
  • the plating resist 4 is subsequently removed by, for example, stripping, as shown in FIG. 2 ( e ). Then, a thermal treatment is applied to the thin copper film 3 . During the thermal treatment, the thin copper film 3 is held at a temperature of not less than 200° C. and not more then 300° for approximately an hour, preferably not less than half an hour and not more than two hours. Setting the time to not less than half an hour and not more than two hours as described above allows the grain size to be sufficiently increased while preventing consumption of an excessive energy.
  • the above-described thermal treatment allows the grain size of the thin copper film 3 to be increased.
  • the grain size of the thin copper film 3 is as large as approximately not less than 40 nm and not more than 300 nm.
  • the thin copper film 3 and thin metal film 2 are removed, by chemical etching using, e.g., a mixed solution of a sulfuric acid and oxygenated water, except the portions on which the conductor patterns 5 are formed.
  • a protective insulating layer 6 of polyimide or the like having prescribed patterns is formed.
  • a terminal is provided on the portion of each conductor pattern 5 that is not covered with the protective insulating layer 6 ( i.e., an aperture).
  • the thermal treatment is possible without a plating resist being formed.
  • the thermal treatment may be performed between the step of FIG. 1 ( b ) and the step of FIG. 1 ( c ).
  • FIG. 3 is a magnified view of the region A in FIG. 2 ( f ). As shown in FIG. 3 , thermally treating the thin copper layer 3 allows the size of grains contained in the thin copper layer 3 to be increased.
  • the thermally treated thin copper film 3 contains a grain 21 of such size as to extend between one surface of the thin copper film 3 in contact with the insulating layer 1 and the other surface of the thin copper film 3 in contact with the conductor pattern 5 . That is, the thin copper film 3 has a point where only a single grain 21 is present in the thickness direction V. This reduces or prevents the incidence of side etching of the thin copper film 3 under the conductor pattern 5 during the removal of the thin copper film 3 except the portion on which the conductor pattern 5 is formed. This ensures a sufficient adhesion area of the thin copper film 3 to the insulating layer 1 to improve the adhesion. Where the thin metal film 2 is present between the insulating layer 1 and the thin copper film 3 , a sufficient adhesion area of the thin copper film 2 to the thin metal film 2 is ensured to improve the adhesion.
  • any other highly insulating films of plastics may also be used as the insulating layer 1 .
  • a polyethylene terephthalate film, a polyethylene naphthalate film, a polyether nitril film, polyethersulfone film, a polyvinyl chloride film or the like may be used.
  • a polyimide film it is preferred to use, in particular, a polyimide film, a polyethylene terephthalate film, or a polyethylene naphthalate film, since they are superior in such properties as thermal resistance, dimensional stability, electrical properties, mechanical properties, and chemical resistant properties.
  • a printed circuit board according to Inventive Example and the method for manufacturing the printed circuit board will be described below.
  • the manufacturing method according to Inventive Example is based upon the manufacturing method according to the above-described embodiment, and therefore the description of drawings is omitted.
  • an insulating layer 1 made of a 25- ⁇ m polyimide insulator film was prepared.
  • a thin metal film 2 made of 30-nm nichrome and a 200-nm thin copper film 3 were formed in sequence on the insulating layer 1 by sputtering.
  • the thin copper film 3 was laminated with a dry film, and then exposed and developed to form a plating resist 4 thereon having patterns opposite to conductor patterns that are formed in a step shown below.
  • conductor patterns 5 of copper with a thickness of 8 ⁇ m, a width of 15 ⁇ m, and a pitch of 15 ⁇ m were formed, by electrolytic plating using a copper sulfate electrolytic plating solution, on the surfaces of the thin copper film 3 where the plating resist 4 was not formed.
  • the plating resist 4 was then stripped off, after which the thin copper film 3 was held at 250° C. for an hour to be thermally treated.
  • the thin copper film 3 and thin metal film 2 were removed except the portions under the conductor patterns 5 by chemical etching using a mixed solution of a sulfuric acid/oxygenated water. This was followed by the formation of a protective insulating film 6 of polyimide having prescribed patterns.
  • the thin copper film 3 contained grains of the size equal to the thickness of the thin copper film 3 , 200 nm; i.e., grains of such size as to extend between one surface of the thin copper film 3 in contact with the thin metal film 2 and the other surface of the thin copper film 3 in contact with the conductor patterns 5 in the thickness direction V.
  • the thin copper film 3 under the conductor patterns 5 did not show any side etching.
  • the method for manufacturing a printed circuit board according to Comparative Example differed from the above-described method according to Inventive Example in that the thin copper film 3 was not thermally treated.
  • the sizes of all of grains contained in the thin copper film 3 were less than 200 nm, and there always existed two or more grains between one surface of the thin copper film 3 in contact with the thin metal film 2 and the other surface of the thin copper film 3 in contact with the conductor patterns 5 in the thickness direction V.
  • the thin copper film 3 under the conductor patterns 5 showed side etching.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Transmitters (AREA)

Abstract

An insulating layer made of an insulator film or the like is prepared. Then, a thin metal film and a thin copper film are formed in sequence on the insulating layer. The thin copper film is subsequently laminated with a dry film or the like, and exposed and developed to form a plating resist thereon that have patterns opposite to conductor patterns which are formed in a subsequent step. This is followed by forming conductor patterns made of copper, by electrolytic plating using an electrolytic copper sulfate plating solution, on the surfaces of the thin copper film where the plating resist is not formed. The plating resist is then removed by, for example, stripping. After this, the thin copper film is held at a temperature of not less than 200° C. and not more than 300° C. for approximately an hour to be thermally treated. Then, the thin copper film and the thin metal film are removed by chemical etching except the portions under the conductor patterns.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to printed circuit boards and a method for manufacturing such printed circuit boards.
  • 2. Description of the Background Art
  • Printed circuit boards such as flexible printed circuit boards are widely used in a variety of electrical and electronic devices. A printed circuit board includes, for example, an insulating layer of, e.g., polyimide, having on one side or both sides thereof conductor layers of, e.g., a copper foil with prescribed patterns.
  • Conventionally, conductor layers having prescribed patterns in printed circuit boards such as flexible printed circuit boards are formed by the known methods such as the semi-additive, substractive, and full-additive methods (refer to JP 2002-176259, for example).
  • The above-mentioned semi additive method is now described with reference to the drawings.
  • FIGS. 4 (a), 4 (b), 4 (c), 4 (d), 4 (e), and 4 (f) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board by the semi additive method.
  • In the semi-additive method, for example, an insulating layer 11 of a resin film is first prepared, as shown in FIG. 4 (a).
  • Next, as shown in FIG. 4 (b), a thin conductive film 12 is formed on the insulating layer 11 by sputtering or electroless plating.
  • Then, as shown in FIG. 4 (c), a plating resist 13 is formed on the thin conductive film 12 using a dry film resist or the like. The plating resist 13 has patterns opposite to the prescribed patterns of a conductor layer formed in a step shown below.
  • After this, as shown in FIG. 4 (d), a conductor layer 14 is formed by electrolytic plating on the surfaces of the thin conductive film 12 where the plating resist 13 is not formed.
  • This is followed by removing the plating resist 13 by, e.g., stripping, as shown in FIG. 4 (e). Then, the thin conductive film 12 except the portions on which the conductor layer 14 is formed is removed by chemical etching or the like, as shown in FIG. 4 (f). In this manner, the conductor layer 14 with prescribed patters is formed on the insulating layer 11.
  • However, in the conventional method for forming a printed circuit board, side etching of the thin conductive film 12 under the conductor layer 14 may occur during the removal of the thin conductive film 12 except the portions under the conductor layer 14 by chemical etching or the like. The term “side etching” is described now with reference to the figure below.
  • FIG. 5 is a magnified view of the region B in FIG. 4 (f). During the removal of the thin conductive film 12 by chemical etching or the like, the thin conductive film 12 under the conductor layer 14 was etched together with both ends thereof being gouged as shown in FIG. 5. This results in a deterioration of the adhesion of the conductor layer 14 to the thin conductive film 12. In the case of a significant decrease in the adhesion, the conductor layer 14 may be stripped off.
  • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide printed circuit boards that provide improved adhesion of conductor layers and a method for manufacturing such printed circuit boards.
  • A printed circuit board according to one aspect of the invention comprises, in sequence, an insulating layer, a thin copper film, and a conductor layer, wherein the conductor layer and the thin copper film have prescribed patterns, and the thin copper film has a first surface in contact with the insulating layer and a second surface in contact with the conductor layer, and contains a grain of a size that extends between the first surface and the second surface.
  • In the printed circuit board, the thin copper film and conductor layer with the prescribed patterns are formed in sequence on the insulating layer. The thin copper film contains a grain of a size that extends between the first surface in contact with the insulating layer and the second surface in contact with the conductor layer. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. In this manner, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion.
  • The thin copper film preferably has a thickness of not less than 50 nm and not more than 300 nm. This further improves the adhesion of the conductor layer to the thin copper film.
  • The conductor layer may include copper. This even further improves the adhesion of the conductor layer to the thin copper film.
  • The printed circuit board may further comprise a thin metal film between the insulating layer and the thin copper film. In this manner, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • The thin metal film may include at least one of chromium and nickel. This further improves the adhesion between the insulating layer and the thin copper film.
  • The thin metal film preferably has a thickness of not less than 5 nm and not more than 50 nm. This still further improves the adhesion between the insulating layer and the thin copper film.
  • The insulating layer may include a flexible substrate. The flexible substrate having flexibility allows the flexibility of the printed circuit board to be improved.
  • A method for manufacturing a printed circuit board by a semi-additive method according to another aspect of the invention comprises the steps of forming a thin copper film on an insulating layer, forming a conductor layer having prescribed patterns on the thin copper film, removing the thin copper film except portions on which the conductor layer is formed, and applying a thermal treatment to the thin copper film between the step of forming the thin copper film and the step of forming the conductor layer or between the step of forming the conductor layer and the step of removing the thin copper film.
  • In the method for manufacturing the printed circuit board, the thin copper film is thermally treated between the step of forming the thin copper film and the step of forming the conductor layer or between the step of forming the conductor layer and the step of removing the thin copper film, which increases the size of grains contained in the thin copper film. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. Thus, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion. In addition, where a thin metal film is present between the insulating layer and the thin copper film, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • A temperature during the thermal treatment of the thin copper film may be not less than 200° C. and not more than 300° C. This allows the size of grains contained in the thin copper film to be sufficiently increased.
  • The method for manufacturing a printed circuit board may include the steps of forming a resist on the thin copper film that has patterns opposite to the prescribed patterns, forming a conductor layer on the thin copper film except portions on which the resist is formed, and removing the resist after forming the conductor layer, and wherein the step of applying the thermal treatment to the thin copper film is provided between the step of forming the thin copper film and the step of forming the resist or between the step of removing the resist and the step of removing the thin copper film.
  • In this manner, the step of applying the thermal treatment to the thin copper film is provided between the step of forming the thin copper film and the step of forming the resist or between the step of removing the resist and the step of removing the thin copper film. This prevents the resist from dissolving by the thermal treatment of the thin copper film.
  • The manufacturing method may further comprise the step of forming a thin metal film between the insulating film and the thin copper film. In this manner, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • The step of forming the thin metal film may include the step of forming at least one of chromium and nickel as the thin metal film. This further improves the adhesion between the insulating layer and the thin copper film.
  • The step of forming the thin metal film may include the step of forming the thin metal film having a thickness of not less than 5 nm and not more than 50 nm. This still further improves the adhesion between the insulating layer and the thin copper film.
  • The step of forming the thin copper film on the insulating layer may include the step of forming the thin copper film on a flexible substrate that serves as the insulating layer. The flexible substrate having flexibility allows the flexibility of the printed circuit board to be improved.
  • According to the invention, the thin copper film contains a grain of the size that extends between the first surface in contact with the insulating layer and the second surface in contact with the conductor layer. This reduces or prevents the incidence of side etching of the thin copper film under the conductor layer during the removal of the thin copper film except the portions on which the conductor layer is formed. In this manner, a sufficient adhesion area of the thin copper film to the insulating layer is ensured to improve the adhesion. In addition, where the thin metal film is present between the insulating layer and the thin copper film, a sufficient adhesion area of the thin copper film to the thin metal film is ensured to improve the adhesion.
  • The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1 (a), 1 (b), 1 (c), and 1 (d) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention;
  • FIGS. 2 (e), 2 (f), and 2 (g) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention;
  • FIG. 3 is a magnified view of the region A in FIG. 2 (f)
  • FIGS. 4 (a), 4 (b), 4 (c), 4 (d), 4 (e), and 4 (f) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board by the semi additive method; and
  • FIG. 5 is a magnified view of the region B in FIG. 4 (f)
  • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • A printed circuit board according to an embodiment of the invention and a method for manufacturing the printed circuit board will be described below with reference to the drawings.
  • A method for manufacturing a printed circuit board according to an embodiment will be described first. FIGS. 1 (a), 1 (b), 1 (c), and 1 (d) as well as FIGS. 2 (e), 2 (f), and 2 (g) are schematic cross sectional views showing the steps of a method for manufacturing a printed circuit board according to an embodiment of the invention.
  • To begin with, as shown in FIG. 1 (a), an insulating layer 1 made of, e.g., an insulator film, is prepared. Such an insulator film is made of polyimide or polyester, for example. Alternatively, the insulating layer 1 may be formed by applying a resin onto a substrate made of a metal foil.
  • Next, a thin metal film 2 and a thin copper film 3 are formed in sequence on the insulating layer 1, as shown in FIG. 1 (b). The thin metal film 2, which is provided to improve the adhesion between the insulating layer 1 and the thin copper film 3, may only be provided when necessary. Each of the thin metal film 2 and thin copper film 3 is formed by sputtering, electroless plating, or other suitable means.
  • The thin metal film 2 as used here includes at least either of chromium and nickel. For example, the thin metal film 2 may be made of a single layer of chromium, a laminated film of chromium and nickel, or a film of a chromium-nickel alloy. The thickness of the thin metal film 2 is preferably in the range of not less than 5 nm and not more than 50 nm, for example. This further improves the adhesion of the thin copper film 3 to the insulating layer 1.
  • The thickness of the thin copper film 3 is preferably in the range of not less than 50 nm and not more than 300 nm, for example. This further improves the adhesion of conductor patterns 5 described below to the thin copper film 3.
  • Then, as shown in FIG. 1 (c), the thin copper film 3 is laminated with, e.g., a dry film, and exposed and developed to form plating resist 4 thereon. The plating resist 4 have patterns opposite to the conductor patterns 5 which are formed in a step shown below.
  • After this, as shown in FIG. 1 (d), the conductor patterns 5 are formed on the surfaces of the thin copper film 3 where the plating resist 4 is not formed by electrolytic plating using, e.g., a copper sulfate electrolytic plating solution. A metal or an alloy other than copper may also be used as the material of the conductor patterns 5.
  • The plating resist 4 is subsequently removed by, for example, stripping, as shown in FIG. 2 (e). Then, a thermal treatment is applied to the thin copper film 3. During the thermal treatment, the thin copper film 3 is held at a temperature of not less than 200° C. and not more then 300° for approximately an hour, preferably not less than half an hour and not more than two hours. Setting the time to not less than half an hour and not more than two hours as described above allows the grain size to be sufficiently increased while preventing consumption of an excessive energy.
  • The above-described thermal treatment allows the grain size of the thin copper film 3 to be increased. For example, in this embodiment, the grain size of the thin copper film 3 is as large as approximately not less than 40 nm and not more than 300 nm.
  • After this, as shown in FIG. 2 (f), the thin copper film 3 and thin metal film 2 are removed, by chemical etching using, e.g., a mixed solution of a sulfuric acid and oxygenated water, except the portions on which the conductor patterns 5 are formed.
  • Then, as shown in FIG. 2 (g), a protective insulating layer 6 of polyimide or the like having prescribed patterns is formed. In this case, a terminal is provided on the portion of each conductor pattern 5 that is not covered with the protective insulating layer 6 (i.e., an aperture).
  • Note that the above-described thermal treatment is possible without a plating resist being formed. For example, the thermal treatment may be performed between the step of FIG. 1 (b) and the step of FIG. 1 (c).
  • Now, advantageous effects provided by the above-described thermal treatment of the thin copper film 3 will be described.
  • FIG. 3 is a magnified view of the region A in FIG. 2 (f). As shown in FIG. 3, thermally treating the thin copper layer 3 allows the size of grains contained in the thin copper layer 3 to be increased.
  • That is, in this embodiment, the thermally treated thin copper film 3 contains a grain 21 of such size as to extend between one surface of the thin copper film 3 in contact with the insulating layer 1 and the other surface of the thin copper film 3 in contact with the conductor pattern 5. That is, the thin copper film 3 has a point where only a single grain 21 is present in the thickness direction V. This reduces or prevents the incidence of side etching of the thin copper film 3 under the conductor pattern 5 during the removal of the thin copper film 3 except the portion on which the conductor pattern 5 is formed. This ensures a sufficient adhesion area of the thin copper film 3 to the insulating layer 1 to improve the adhesion. Where the thin metal film 2 is present between the insulating layer 1 and the thin copper film 3, a sufficient adhesion area of the thin copper film 2 to the thin metal film 2 is ensured to improve the adhesion.
  • Although in this embodiment, the use of polyimide, polyester, or the like as the material of the insulating layer 1 is described, any other highly insulating films of plastics may also be used as the insulating layer 1. For example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyether nitril film, polyethersulfone film, a polyvinyl chloride film or the like may be used.
  • It is preferred to use, in particular, a polyimide film, a polyethylene terephthalate film, or a polyethylene naphthalate film, since they are superior in such properties as thermal resistance, dimensional stability, electrical properties, mechanical properties, and chemical resistant properties.
  • EXAMPLES Inventive Example
  • A printed circuit board according to Inventive Example and the method for manufacturing the printed circuit board will be described below. The manufacturing method according to Inventive Example is based upon the manufacturing method according to the above-described embodiment, and therefore the description of drawings is omitted.
  • First, an insulating layer 1 made of a 25-μm polyimide insulator film was prepared.
  • Next, a thin metal film 2 made of 30-nm nichrome and a 200-nm thin copper film 3 were formed in sequence on the insulating layer 1 by sputtering.
  • Then, the thin copper film 3 was laminated with a dry film, and then exposed and developed to form a plating resist 4 thereon having patterns opposite to conductor patterns that are formed in a step shown below.
  • After this, conductor patterns 5 of copper with a thickness of 8 μm, a width of 15 μm, and a pitch of 15 μm were formed, by electrolytic plating using a copper sulfate electrolytic plating solution, on the surfaces of the thin copper film 3 where the plating resist 4 was not formed.
  • The plating resist 4 was then stripped off, after which the thin copper film 3 was held at 250° C. for an hour to be thermally treated.
  • Then, the thin copper film 3 and thin metal film 2 were removed except the portions under the conductor patterns 5 by chemical etching using a mixed solution of a sulfuric acid/oxygenated water. This was followed by the formation of a protective insulating film 6 of polyimide having prescribed patterns.
  • A cross section of thus fabricated printed circuit board was observed with a scanning electron microscope (SEM).
  • The results showed that the thin copper film 3 contained grains of the size equal to the thickness of the thin copper film 3, 200 nm; i.e., grains of such size as to extend between one surface of the thin copper film 3 in contact with the thin metal film 2 and the other surface of the thin copper film 3 in contact with the conductor patterns 5 in the thickness direction V.
  • In addition, the thin copper film 3 under the conductor patterns 5 did not show any side etching.
  • Stripping tests using an adhesive tape were also conducted in order to check the conductor patterns 5 for adhesion to the thin copper film 3. The results confirmed that the conductor patterns 5 were not stripped at all, and possessed good adhesion.
  • Comparative Example
  • The method for manufacturing a printed circuit board according to Comparative Example differed from the above-described method according to Inventive Example in that the thin copper film 3 was not thermally treated.
  • After the fabrication of the printed circuit board, a cross section of the printed circuit board was observed with SEM, as in the above-described Inventive Example.
  • The results showed that the sizes of all of grains contained in the thin copper film 3 were less than 200 nm, and there always existed two or more grains between one surface of the thin copper film 3 in contact with the thin metal film 2 and the other surface of the thin copper film 3 in contact with the conductor patterns 5 in the thickness direction V.
  • Further, the thin copper film 3 under the conductor patterns 5 showed side etching.
  • Stripping tests using an adhesive tape were also conducted in order to check the conductor patterns 5 for adhesion to the thin copper film 3. The results confirmed that part of the conductor patterns 5 was stripped off, and did not possess good adhesion.
  • Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.

Claims (14)

1. A printed circuit board comprising, in sequence, an insulating layer, a thin copper film, and a conductor layer, wherein
said conductor layer and said thin copper film have prescribed patterns, and
said thin copper film has a first surface in contact with said insulating layer and a second surface in contact with said conductor layer, and contains a grain of a size that extends between said first surface and said second surface.
2. The printed circuit board according to claim 1, wherein said thin copper film has a thickness of not less than 50 nm and not more than 300 nm.
3. The printed circuit board according to claim 1, wherein said conductor layer includes copper.
4. The printed circuit board according to claim 1, further comprising a thin metal film between said insulating layer and said thin copper film.
5. The printed circuit board according to claim 4, wherein said thin metal film includes at least one of chromium and nickel.
6. The printed circuit board according to claim 4, wherein said thin metal film has a thickness of not less than 5 nm and not more than 50 nm.
7. The printed circuit board according to claim 1, wherein said insulating layer includes a flexible substrate.
8. A method for manufacturing a printed circuit board by a semi-additive method, comprising the steps of:
forming a thin copper film on an insulating layer;
forming a conductor layer having prescribed patterns on said thin copper film;
removing said thin copper film except portions on which said conductor layer is formed; and
applying a thermal treatment to said thin copper film between said step of forming said thin copper film and said step of forming said conductor layer or between said step of forming said conductor layer and said step of removing said thin copper film.
9. The method for manufacturing a printed circuit board according to claim 8, wherein
a temperature during said thermal treatment of said thin copper film is not less than 200° C. and not more than 300° C.
10. The method for manufacturing a printed circuit board according to claim 8, wherein
said step of forming said conductor layer includes the steps of:
forming a resist on said thin copper film that has patterns opposite to said prescribed patterns;
forming a conductor layer on said thin copper film except portions on which said resist is formed; and
removing said resist after forming said conductor layer, and wherein
said step of applying said thermal treatment to said thin copper film is provided between said step of forming said thin copper film and said step of forming said resist or between said step of removing said resist and said step of removing said thin copper film.
11. The method for manufacturing a printed circuit board according to claim 8, further comprising the step of forming a thin metal film between said insulating film and said thin copper film.
12. The method for manufacturing a printed circuit board according to claim 11, wherein
said step of forming said thin metal film includes the step of forming at least one of chromium and nickel as said thin metal film.
13. The method for manufacturing a printed circuit board according to claim 11, wherein
said step of forming said thin metal film includes the step of forming said thin metal film having a thickness of not less than 5 nm and not more than 50 nm.
14. The method for manufacturing a printed circuit board according to claim 8, wherein
said step of forming said thin copper film on said insulating layer includes the step of forming said thin copper film on a flexible substrate that serves as said insulating layer.
US11/173,126 2004-07-01 2005-07-01 Printed circuit board and method for manufacturing printed circuit board Abandoned US20060000637A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/955,432 US8092696B2 (en) 2004-07-01 2007-12-13 Method for manufacturing printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004195939A JP4298597B2 (en) 2004-07-01 2004-07-01 Wiring circuit board and method for manufacturing wiring circuit board
JP2004-195939 2004-07-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/955,432 Division US8092696B2 (en) 2004-07-01 2007-12-13 Method for manufacturing printed circuit board

Publications (1)

Publication Number Publication Date
US20060000637A1 true US20060000637A1 (en) 2006-01-05

Family

ID=34941781

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/173,126 Abandoned US20060000637A1 (en) 2004-07-01 2005-07-01 Printed circuit board and method for manufacturing printed circuit board
US11/955,432 Expired - Fee Related US8092696B2 (en) 2004-07-01 2007-12-13 Method for manufacturing printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/955,432 Expired - Fee Related US8092696B2 (en) 2004-07-01 2007-12-13 Method for manufacturing printed circuit board

Country Status (8)

Country Link
US (2) US20060000637A1 (en)
EP (1) EP1613135B1 (en)
JP (1) JP4298597B2 (en)
KR (1) KR101156915B1 (en)
CN (1) CN100593964C (en)
AT (1) ATE431699T1 (en)
DE (1) DE602005014421D1 (en)
TW (1) TWI363589B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103298263A (en) * 2012-02-28 2013-09-11 深南电路有限公司 Printed circuit board and processing method thereof
CN109661114A (en) * 2017-10-11 2019-04-19 欣兴电子股份有限公司 The method for manufacturing conducting wire

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844730B2 (en) * 2006-05-22 2011-12-28 住友金属鉱山株式会社 Evaluation method for metal-coated polyimide substrates
US8877074B2 (en) * 2006-12-15 2014-11-04 The Regents Of The University Of California Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
TW200847867A (en) * 2007-04-26 2008-12-01 Mitsui Mining & Smelting Co Printed wire board and manufacturing method thereof, and electrolytic copper foil for copper-clad lamination board used for manufacturing the same
JP5736722B2 (en) * 2010-10-22 2015-06-17 大日本印刷株式会社 Suspension substrate, method for manufacturing suspension substrate, suspension, suspension with element, and hard disk drive
CN102427058B (en) * 2011-11-09 2015-07-22 深南电路有限公司 Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip
JP5812845B2 (en) 2011-12-19 2015-11-17 新光電気工業株式会社 Light-emitting element mounting package, light-emitting element package, and manufacturing method thereof
CN103906364B (en) * 2012-12-25 2017-07-14 上海美维科技有限公司 A kind of processing method of buried resistor in printed circuit board
CN103966601B (en) * 2013-02-05 2018-05-18 汉达精密电子(昆山)有限公司 Production method of nonmetal basal body conducting wire and products thereof
JP6337909B2 (en) 2014-02-04 2018-06-06 株式会社村田製作所 Manufacturing method of electronic component module
KR101893503B1 (en) * 2016-05-27 2018-08-30 (주) 화인켐 Flexible circiut board for forming fine wiring and method therefor
CN113630977B (en) * 2020-05-06 2023-01-17 鹏鼎控股(深圳)股份有限公司 Thick copper circuit board and manufacturing method thereof

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3328275A (en) * 1963-12-18 1967-06-27 Revere Copper & Brass Inc Treatment of copper to form a dendritic surface
US3674656A (en) * 1969-06-19 1972-07-04 Circuit Foil Corp Bonding treatment and products produced thereby
US5366814A (en) * 1992-11-19 1994-11-22 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits and process for producing the same
US5437914A (en) * 1993-03-19 1995-08-01 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate and printed wiring board
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6278185B1 (en) * 1998-05-27 2001-08-21 Intel Corporation Semi-additive process (SAP) architecture for organic leadless grid array packages
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board
US20020171151A1 (en) * 2001-01-04 2002-11-21 International Business Machines Corporation Method for forming interconnects on semiconductor substrates and structures formed
US6689268B2 (en) * 2000-03-10 2004-02-10 Olin Corporation Copper foil composite including a release layer

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352716A (en) * 1980-12-24 1982-10-05 International Business Machines Corporation Dry etching of copper patterns
MY101308A (en) 1986-06-09 1991-09-05 Minnesota Mining & Mfg Presensitized circuit material.
JPH0783168B2 (en) * 1988-04-13 1995-09-06 株式会社日立製作所 Printed board manufacturing method
DE4113261A1 (en) 1991-04-23 1992-10-29 Siemens Ag Electroless application of copper@ base coat to reinforced teflon substrate - by removing copper@ lining on substrates with caustic ammonia etching bath, purifying substrate, catalysing substrate, chemical copper@ plating, drying and annealing
JPH06120630A (en) 1992-10-07 1994-04-28 Ulvac Japan Ltd Copper foil for printed wiring board
JPH0732544A (en) 1993-07-22 1995-02-03 Mitsui Mining & Smelting Co Ltd Coppered laminate with paper base and its manufacture
JPH0951163A (en) 1995-05-31 1997-02-18 Mitsui Toatsu Chem Inc Flexible circuit board
JPH0955575A (en) * 1995-08-10 1997-02-25 Mitsui Toatsu Chem Inc Laminate
CN1090200C (en) * 1996-02-13 2002-09-04 日东电工株式会社 Circuit substrate, circuit-formed suspension substrate, and prodn. method thereof
US6458694B2 (en) * 2000-01-24 2002-10-01 Ebara Corporation High energy sputtering method for forming interconnects
JP3633422B2 (en) * 2000-02-22 2005-03-30 ソニーケミカル株式会社 Connecting material
JP2002176259A (en) 2000-09-27 2002-06-21 Hitachi Ltd Multilayer printed wiring board and method of manufacturing the same
JP2002268905A (en) * 2001-03-07 2002-09-20 Canon Inc Program operating device, program write controller, program write control method and storage medium
TW587103B (en) 2001-04-06 2004-05-11 Phoenix Prec Technology Corp Circuit board Ni/Au electroplating process without electroplated wires
JP2003318532A (en) * 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd Flexible printed wiring board
JP2003324258A (en) 2002-05-01 2003-11-14 Nippon Mektron Ltd Copper-clad board for printed wiring board
JP2004039771A (en) 2002-07-02 2004-02-05 Nitto Denko Corp Production of wiring circuit substrate
JP2004082444A (en) * 2002-08-26 2004-03-18 Dainippon Printing Co Ltd Resin body with metal layer and wiring body
JP2004335807A (en) * 2003-05-08 2004-11-25 Nitto Denko Corp Manufacturing method of wiring circuit substrate

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3328275A (en) * 1963-12-18 1967-06-27 Revere Copper & Brass Inc Treatment of copper to form a dendritic surface
US3674656A (en) * 1969-06-19 1972-07-04 Circuit Foil Corp Bonding treatment and products produced thereby
US5366814A (en) * 1992-11-19 1994-11-22 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits and process for producing the same
US5437914A (en) * 1993-03-19 1995-08-01 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate and printed wiring board
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6278185B1 (en) * 1998-05-27 2001-08-21 Intel Corporation Semi-additive process (SAP) architecture for organic leadless grid array packages
US6689268B2 (en) * 2000-03-10 2004-02-10 Olin Corporation Copper foil composite including a release layer
US20020056192A1 (en) * 2000-09-27 2002-05-16 Tokihito Suwa Method of producing multilayer printed wiring board and multilayer printed wiring board
US20020171151A1 (en) * 2001-01-04 2002-11-21 International Business Machines Corporation Method for forming interconnects on semiconductor substrates and structures formed

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103298263A (en) * 2012-02-28 2013-09-11 深南电路有限公司 Printed circuit board and processing method thereof
CN109661114A (en) * 2017-10-11 2019-04-19 欣兴电子股份有限公司 The method for manufacturing conducting wire
US10615054B2 (en) 2017-10-11 2020-04-07 Unimicron Technology Corp. Method for manufacturing conductive line

Also Published As

Publication number Publication date
KR101156915B1 (en) 2012-06-21
JP2006019522A (en) 2006-01-19
ATE431699T1 (en) 2009-05-15
US20080164236A1 (en) 2008-07-10
CN1717161A (en) 2006-01-04
CN100593964C (en) 2010-03-10
JP4298597B2 (en) 2009-07-22
TWI363589B (en) 2012-05-01
DE602005014421D1 (en) 2009-06-25
KR20060048744A (en) 2006-05-18
EP1613135B1 (en) 2009-05-13
TW200603707A (en) 2006-01-16
US8092696B2 (en) 2012-01-10
EP1613135A1 (en) 2006-01-04

Similar Documents

Publication Publication Date Title
US8092696B2 (en) Method for manufacturing printed circuit board
US8522427B2 (en) Method of manufacturing a printed circuit board
EP1592290A1 (en) Wired circuit board and production method thereof
US20070101571A1 (en) Printed wiring board, its manufacturing method and circuit device
JP3570802B2 (en) Copper thin film substrate and printed wiring board
EP1594352B1 (en) Method for manufacturing a double-sided printed circuit board
EP3386282A1 (en) Multilayer printed wiring board and method for manufacturing same
KR20180037343A (en) Flexible Copper Clad Laminate of Low Rate of Dimensional Change and Method for Manufacturing The Same
US8017309B2 (en) Method of manufacturing wiring circuit board
KR20170028047A (en) Flexible Copper Clad Laminate, Method for Manufacturing The Same, and Method for Manufacturing Flexible Printed Circuit Board
JP2009501433A (en) Flexible circuit board
WO2004042814A1 (en) Film carrier tape for mounting electronic component
KR20170071205A (en) Flexible copper clad laminate fim and method of manufacturing the same
JP2001168485A (en) Wiring board and transfer medium and manufacturing method for them
US7955485B2 (en) Planar laminate substrate and method for fabricating organic laminate substrate PCBS, semiconductors, semiconductor wafers and semiconductor devices having miniaturized electrical pathways
JPH01321687A (en) Flexible printed wiring board
JPH05245432A (en) Polyimide resin-coated plate and its manufacture
JPH07273466A (en) Manufacturing method of multilayer-wiring board
JP2000049440A (en) Manufacture of printed wiring multilayer board
US20240206057A1 (en) Wiring substrate and method for manufacturing the same
JP2006222217A (en) Process for producing wiring circuit board
CN115968112A (en) Circuit board preparation method and circuit board
JPH07123178B2 (en) Flexible wiring board and manufacturing method thereof
JP2002198399A (en) Method for manufacturing semiconductor carrier film
JPS62242389A (en) Manufacture of flexible printed wiring board

Legal Events

Date Code Title Description
AS Assignment

Owner name: NITTO DENKO CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NAKAMURA, KEI;YAMATO, TAKESHI;REEL/FRAME:016456/0569

Effective date: 20050822

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION