ATE146304T1 - Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen - Google Patents

Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen

Info

Publication number
ATE146304T1
ATE146304T1 AT93480106T AT93480106T ATE146304T1 AT E146304 T1 ATE146304 T1 AT E146304T1 AT 93480106 T AT93480106 T AT 93480106T AT 93480106 T AT93480106 T AT 93480106T AT E146304 T1 ATE146304 T1 AT E146304T1
Authority
AT
Austria
Prior art keywords
tip
pen
heater
substrate
forming
Prior art date
Application number
AT93480106T
Other languages
English (en)
Inventor
Antoine Corbin
Jacques Foulu
Philippe Demoncy
Pierre Sudraud
Original Assignee
Ibm
Orsay Physics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm, Orsay Physics filed Critical Ibm
Application granted granted Critical
Publication of ATE146304T1 publication Critical patent/ATE146304T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0615—Solder feeding devices forming part of a soldering iron
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G03F1/74—Repair or correction of mask defects by charged particle beam [CPB], e.g. focused ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/067—Manufacture or treatment of conductive parts of the interconnections by modifying the pattern of conductive parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/849—Manufacture, treatment, or detection of nanostructure with scanning probe
    • Y10S977/855—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure
    • Y10S977/857—Manufacture, treatment, or detection of nanostructure with scanning probe for manufacture of nanostructure including coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT93480106T 1993-07-30 1993-07-30 Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen ATE146304T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93480106A EP0637057B1 (de) 1993-07-30 1993-07-30 Vorrichtung und Verfahren um feine Metal-linie auf einem Substrat abzulegen

Publications (1)

Publication Number Publication Date
ATE146304T1 true ATE146304T1 (de) 1996-12-15

Family

ID=8214842

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93480106T ATE146304T1 (de) 1993-07-30 1993-07-30 Vorrichtung und verfahren um feine metal-linie auf einem substrat abzulegen

Country Status (5)

Country Link
US (2) US5973295A (de)
EP (1) EP0637057B1 (de)
JP (1) JP2692781B2 (de)
AT (1) ATE146304T1 (de)
DE (1) DE69306565T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19608824A1 (de) * 1996-03-07 1997-09-18 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung von Mikrowärmetauschern
US6827979B2 (en) * 1999-01-07 2004-12-07 Northwestern University Methods utilizing scanning probe microscope tips and products therefor or produced thereby
NL1011081C2 (nl) * 1999-01-20 2000-07-21 Stichting Energie Werkwijze en inrichting voor het aanbrengen van een metallisatiepatroon op een substraat voor een fotovoltaïsche cel.
US6305000B1 (en) 1999-06-15 2001-10-16 International Business Machines Corporation Placement of conductive stripes in electronic circuits to satisfy metal density requirements
DE19931110A1 (de) * 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Druckkopf zum Ausspritzen eines heißen flüssigen Mediums und Verfahren zur Herstellung einer metallisches Lot umfassenden Verbindungsstelle
US6949756B2 (en) * 2000-01-21 2005-09-27 Fei Company Shaped and low density focused ion beams
JP4364420B2 (ja) * 2000-10-31 2009-11-18 エスアイアイ・ナノテクノロジー株式会社 垂直エッジのサブミクロン貫通孔を形成する方法
US6977386B2 (en) * 2001-01-19 2005-12-20 Fei Company Angular aperture shaped beam system and method
US6905736B1 (en) * 2001-02-28 2005-06-14 University Of Central Florida Fabrication of nano-scale temperature sensors and heaters
US20030000921A1 (en) * 2001-06-29 2003-01-02 Ted Liang Mask repair with electron beam-induced chemical etching
JP2003115650A (ja) 2001-10-03 2003-04-18 Yazaki Corp 回路体の製造方法および製造装置
US7091412B2 (en) * 2002-03-04 2006-08-15 Nanoset, Llc Magnetically shielded assembly
US7162302B2 (en) 2002-03-04 2007-01-09 Nanoset Llc Magnetically shielded assembly
US6916573B2 (en) * 2002-07-24 2005-07-12 General Motors Corporation PEM fuel cell stack without gas diffusion media
US20040060816A1 (en) * 2002-09-30 2004-04-01 The Regents Of The University Of California Method of connecting individual conducting layers of a nanolaminate structure
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
US7329361B2 (en) * 2003-10-29 2008-02-12 International Business Machines Corporation Method and apparatus for fabricating or altering microstructures using local chemical alterations
JP5067835B2 (ja) * 2006-11-24 2012-11-07 国立大学法人群馬大学 磁気記録媒体の製造方法
ATE509511T1 (de) * 2007-01-04 2011-05-15 Oticon As Verfahren zur herstellung einer elektrischen komponente eines elektrischen schaltkreises auf einem substrat
TWI330506B (en) * 2007-01-15 2010-09-11 Chimei Innolux Corp Method and apparatus for repairing metal line
EP2351472B1 (de) * 2008-10-30 2012-09-12 BAE Systems PLC Verbesserungen in bezug auf additive herstellungsprozesse
US8617668B2 (en) * 2009-09-23 2013-12-31 Fei Company Method of using nitrogen based compounds to reduce contamination in beam-induced thin film deposition
GB201003614D0 (en) * 2010-03-04 2010-04-21 Airbus Operations Ltd Water drain tool
US20110223354A1 (en) * 2010-03-12 2011-09-15 United Technologies Corporation High pressure pre-oxidation for deposition of thermal barrier coating
US20110223317A1 (en) * 2010-03-12 2011-09-15 United Technologies Corporation Direct thermal stabilization for coating application
US20110318503A1 (en) * 2010-06-29 2011-12-29 Christian Adams Plasma enhanced materials deposition system
CN105531795B (zh) * 2013-09-20 2019-08-27 应用材料公司 用于直接形成纳米尺度的特征结构的方法及设备
US20150307385A1 (en) 2014-04-25 2015-10-29 Massachusetts Institute Of Technology Methods and apparatus for additive manufacturing of glass
TWI524040B (zh) * 2014-10-03 2016-03-01 Handheld electronic cigarette lighter tools
US10546719B2 (en) 2017-06-02 2020-01-28 Fei Company Face-on, gas-assisted etching for plan-view lamellae preparation
DE102017118471A1 (de) 2017-08-14 2019-02-14 Universität Greifswald Verfahren zur Herstellung ultradünner bis dünner Schichten auf Substraten
US20240321548A1 (en) * 2023-03-22 2024-09-26 Nuvoton Technology Corporation Integrated Circuit with FIB-Ready Structures
KR102892736B1 (ko) * 2024-02-29 2025-11-27 성균관대학교산학협력단 기판 처리 방법 및 장치

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1335125A (en) * 1917-08-07 1920-03-30 Westinghouse Electric & Mfg Co Marking device
US1767607A (en) * 1927-09-17 1930-06-24 Lembert H Moulthrop Electric soldering device
US3103067A (en) * 1959-08-13 1963-09-10 Westinghouse Electric Corp Process of soldering to a ceramic or glass body
US3222776A (en) * 1961-12-04 1965-12-14 Ibm Method and apparatus for treating molten material
US3628982A (en) * 1968-12-05 1971-12-21 Charles C Krug Method of applying hot-melt glue
US3711211A (en) * 1971-02-01 1973-01-16 Magic Circle Corp Wax shaping tool
US3821513A (en) * 1972-11-13 1974-06-28 C Christensen Wax carving tool tip
DE2308189A1 (de) * 1973-02-20 1974-08-22 Philips Patentverwaltung Loeteinsatz fuer elektrische loetkolben
US4283443A (en) * 1977-01-27 1981-08-11 Polaroid Corporation Method and apparatus for coating webs
US4208145A (en) * 1977-12-17 1980-06-17 Pentel Kabushiki Kaisha Nib for writing instruments
US4255643A (en) * 1979-03-28 1981-03-10 C-R-O, Inc. Programmed welding machine with continuously monitored override control
US4458628A (en) * 1981-09-16 1984-07-10 Toyo Kogyo Co., Ltd. Apparatus for applying adhesive to automobile windshield glass panels
NL8202164A (nl) * 1982-05-27 1983-12-16 Philips Nv Werkwijze en inrichting voor het transproteren en afzetten van viskeuze stoffen.
US4451503A (en) * 1982-06-30 1984-05-29 International Business Machines Corporation Photo deposition of metals with far UV radiation
US4646676A (en) * 1982-11-15 1987-03-03 Usm Corporation Adhesive dispenser
GB2142257B (en) * 1983-07-02 1986-11-26 Gen Motors Overseas Adhesive application apparatus
US4584964A (en) * 1983-12-12 1986-04-29 Engel Harold J Viscous material dispensing machine having programmed positioning
JPS60219791A (ja) * 1984-04-16 1985-11-02 松下電器産業株式会社 厚膜回路の形成装置
JPS60219793A (ja) * 1984-04-17 1985-11-02 松下電器産業株式会社 厚膜回路描画方法
US4539089A (en) * 1984-06-29 1985-09-03 International Business Machines Corporation Method for depositing material with nanometer dimensions
US4606492A (en) * 1984-10-03 1986-08-19 Eastman Kodak Company Method and apparatus for soldering
US4959112A (en) * 1984-11-14 1990-09-25 Chronar Corp. Selective scribing of materials
US4572103A (en) * 1984-12-20 1986-02-25 Engel Harold J Solder paste dispenser for SMD circuit boards
US4720798A (en) * 1985-04-16 1988-01-19 Protocad, Inc. Process for use in rapidly producing printed circuit boards using a computer controlled plotter
US4661368A (en) * 1985-09-18 1987-04-28 Universal Instruments Corporation Surface locating and dispensed dosage sensing method and apparatus
US4871899A (en) * 1986-02-24 1989-10-03 Unitek Corporation Titiable electric thermode for multiple connection reflow soldering
DE3612341A1 (de) * 1986-04-11 1987-10-15 Franz Ummen Einhandloetgeraet mit lotinjektor
US4770633A (en) * 1986-08-06 1988-09-13 Molten Corporation Wax shaping tool
US4723086A (en) * 1986-10-07 1988-02-02 Micronix Corporation Coarse and fine motion positioning mechanism
US5049404A (en) * 1987-04-01 1991-09-17 Polaroid Corporation Method and apparatus for applying ultra-thin coatings to a substrate
JP2713953B2 (ja) * 1988-03-02 1998-02-16 株式会社日立製作所 配線形成方法
US5099090A (en) * 1988-05-11 1992-03-24 Ariel Electronics, Inc. Circuit writer
US4862827A (en) * 1988-06-28 1989-09-05 Wacker-Chemie Gmbh Apparatus for coating semiconductor components on a dielectric film
FI91373C (fi) * 1989-07-14 1994-06-27 Neste Oy Menetelmä ja laite jatkuvan kuitukimpun imeyttämiseksi
US5110615A (en) * 1990-01-31 1992-05-05 Asymptotic Technologies, Inc. Method for dispensing viscous materials a constant height above a workpiece surface
US5262617A (en) * 1990-08-17 1993-11-16 Kabushiki Kaisha Tokyo Horaisha Cutting means for fabrics and the like utilizing a heated cutting means mounted on a movable carriage
US5186982A (en) * 1990-09-18 1993-02-16 Minnesota Mining And Manufacturing Company Pin transfer applicator and method
FR2670505B1 (fr) * 1990-12-17 1994-03-25 Solems Procede et appareil pour apporter un compose metallique fondu a un substrat.
US5151377A (en) * 1991-03-07 1992-09-29 Mobil Solar Energy Corporation Method for forming contacts
JPH04288953A (ja) * 1991-03-18 1992-10-14 Alps Electric Co Ltd Ｆｅ系軟磁性合金薄帯の製造方法
NZ242595A (en) * 1991-05-23 1993-09-27 Ishikawajima Harima Heavy Ind Casting metal strip; delivery nozzle for delivering molten metal to nip rollers
FR2678632B1 (fr) * 1991-07-03 1994-09-02 Pharmascience Lab Procede de preparation de l'insaponifiable d'avocat permettant d'ameliorer sa teneur en l'une de ses fractions dite h.
US5159171A (en) * 1991-09-03 1992-10-27 Motorola, Inc. Method and apparatus for solder laser printing
US5520715A (en) * 1994-07-11 1996-05-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Directional electrostatic accretion process employing acoustic droplet formation

Also Published As

Publication number Publication date
EP0637057B1 (de) 1996-12-11
DE69306565D1 (de) 1997-01-23
DE69306565T2 (de) 1997-06-12
EP0637057A1 (de) 1995-02-01
US5973295A (en) 1999-10-26
JP2692781B2 (ja) 1997-12-17
JPH07235515A (ja) 1995-09-05
US5741557A (en) 1998-04-21

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